Cold plate radiator

Abstract

The utility model relates to the technical field of thermal management, in particular to a cold plate radiator which comprises a vacuum soaking substrate and a fin assembly. The surface of the side, away from the fin assembly, of the vacuum soaking substrate makes contact with a heat source, a 3D heat pipe is arranged on the surface of the side, close to the fin assembly, of the vacuum soaking substrate, and the 3D heat pipe extends towards the fin assembly and is inserted into the fin assembly. Heat generated by the heat source passes through the vacuum soaking substrate and then is transmitted to the fin assembly through the 3D heat pipe. Diffusion heat resistance is reduced through the 3D heat pipe, so that heat generated by the heat source can be transmitted to the farther fin assembly, and the heat dissipation efficiency of the cold plate radiator is effectively improved.

Description

Technical Field

[0001] This application relates to the field of thermal management technology, and more specifically, to a cold plate heat sink. Background Technology

[0002] During the heat transfer process from the liquid-cooled substrate to the toothed fins, the thermal resistance increases upwards, and the higher the fins, the lower the heat dissipation efficiency, leading to higher costs. Therefore, the height of the toothed fins on the liquid-cooled substrate cannot be set too high in current technologies. With the continuous increase in the power density of electronic components, the performance bottleneck of traditional cold plate heat sinks is becoming increasingly apparent. Therefore, current technologies cannot meet the thermal management and heat dissipation requirements of high-power-density chips. Utility Model Content

[0003] The purpose of this application is to provide a cold plate heat sink that reduces diffusion thermal resistance through 3D heat pipes, enabling the heat generated by the heat source to be transferred to the fin assembly further away, thereby effectively improving the heat dissipation efficiency of the cold plate heat sink.

[0004] The embodiments of this application are implemented as follows:

[0005] This application provides a cold plate heat sink, including a vacuum heat exchange substrate and a fin assembly; the surface of the vacuum heat exchange substrate facing away from the fin assembly is in contact with a heat source, and a 3D heat pipe is provided on the surface of the vacuum heat exchange substrate near the fin assembly. The 3D heat pipe extends toward the fin assembly and is inserted into the fin assembly; the heat generated by the heat source is transferred to the fin assembly through the vacuum heat exchange substrate and then through the 3D heat pipe.

[0006] As an optional implementation, it also includes a substrate cover; the vacuum heat-equalizing substrate and the substrate cover are fastened together to form a liquid-cooled chamber, the fin assembly is disposed in the liquid-cooled chamber, and the liquid-cooled chamber is filled with a coolant for cooling the fin assembly.

[0007] As an optional implementation, the fin assembly includes a plurality of first fins arranged at intervals along the extension path of the 3D heat pipe; the first fins intersect the central axis of the 3D heat pipe.

[0008] As an optional implementation, the end face of the free end of the 3D heat pipe is in contact with the inner wall of the substrate cover.

[0009] As an optional implementation, there are multiple 3D heat pipes distributed at intervals on the vacuum heat exchange substrate, and the first fin is provided with multiple insertion holes; the multiple 3D heat pipes are inserted into the multiple insertion holes one by one.

[0010] As an optional implementation, the fin assembly further includes a plurality of second fins arranged at intervals in sequence, the plurality of second fins being disposed between the vacuum heat exchange substrate and the first fins, and the plane of the second fins intersecting with the first fins and the vacuum heat exchange substrate.

[0011] As an optional implementation, the fin assembly is in contact with the surface of the vacuum heat exchanger substrate facing away from the heat source.

[0012] As an optional implementation, the chamber inside the 3D heat pipe is connected to the chamber inside the vacuum heat spreader to form a vacuum liquid cooling chamber; a capillary structure is formed inside the vacuum liquid cooling chamber.

[0013] As an optional implementation, the substrate cover is provided with a liquid inlet and a liquid outlet communicating with the liquid cooling chamber; the liquid inlet and the liquid outlet are respectively provided with adapters, and the adapters are connected to an external cooling system.

[0014] As an optional implementation, it also includes a mounting plate; the mounting plate has a cutout portion; the vacuum heat exchange substrate is fixed to the mounting plate and covers the cutout portion, so that the heat source can pass through the cutout portion and contact the vacuum heat exchange substrate.

[0015] As an optional implementation, the mounting plate is provided with a plurality of locking structures arranged at intervals, and the mounting plate is connected to an external circuit board through the locking structures.

[0016] The beneficial effects of the embodiments of this application include:

[0017] This application provides a cold plate heat sink, including a vacuum vapor chamber substrate and a fin assembly. The surface of the vacuum vapor chamber substrate facing away from the fin assembly is in contact with a heat source, while the surface of the vacuum vapor chamber substrate closest to the fin assembly has a 3D heat pipe extending towards and inserted into the fin assembly. Heat generated by the heat source is transferred to the fin assembly via the 3D heat pipe after passing through the vacuum vapor chamber substrate. This application achieves efficient heat dissipation for the chip by absorbing heat generated by a high-power-density chip through the vacuum vapor chamber substrate and then transferring it to the fin assembly via the 3D heat pipe. This application helps reduce the operating temperature of the chip, decreases the risk of failure due to overheating, and thus improves the reliability and operational stability of the entire electronic system. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is one of the structural schematic diagrams of the cold plate heat sink according to an embodiment of this application;

[0020] Figure 2 This is a second schematic diagram of the structure of the cold plate heat sink according to an embodiment of this application;

[0021] Figure 3 This is the third schematic diagram of the cold plate heat sink according to the embodiments of this application;

[0022] Figure 4 This is the fourth schematic diagram of the cold plate heat sink according to an embodiment of this application;

[0023] Figure 5 This is the fifth schematic diagram of the cold plate heat sink according to the embodiments of this application;

[0024] Figure 6 This is the sixth schematic diagram of the cold plate heat sink in the embodiment of this application.

[0025] Icons: 100-Vacuum heat spreader substrate; 101-Fin assembly; 102-3D heat pipe; 103-Substrate top cover; 104-Liquid cooling chamber; 105-First fin; 106-Free end; 107-Insertion hole; 108-Second fin; 109-Vacuum liquid cooling chamber; 110-Adapter; 111-Mounting plate; 112-Kuttered part; 113-Locking structure. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0028] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0029] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0030] During the heat transfer process from the liquid-cooled substrate to the toothed fins, the thermal resistance increases upwards, and the higher the fins, the lower the heat dissipation efficiency, leading to higher costs. Therefore, the height of the toothed fins on the liquid-cooled substrate cannot be set too high in current technologies. With the continuous increase in the power density of electronic components, the performance bottleneck of traditional cold plate heat sinks is becoming increasingly apparent. Therefore, current technologies cannot meet the thermal management and heat dissipation requirements of high-power-density chips.

[0031] To address the aforementioned technical problems, this application provides a cold plate heat sink.

[0032] Reference Figure 1 As shown, this application embodiment provides a cold plate heat sink, including a vacuum heat dissipation substrate 100 and a fin assembly 101; the surface of the vacuum heat dissipation substrate 100 away from the fin assembly 101 is in contact with a heat source, and a 3D heat pipe 102 is provided on the surface of the vacuum heat dissipation substrate 100 near the fin assembly 101. The 3D heat pipe 102 extends toward the fin assembly 101 and is inserted into the fin assembly 101; the heat generated by the heat source is transferred to the fin assembly 101 through the vacuum heat dissipation substrate 100 and then through the 3D heat pipe 102.

[0033] It should be noted that, in this embodiment, a heat source is provided on one side of the vacuum heat spreader substrate 100, and a 3D heat pipe 102 is provided on the other side of the vacuum heat spreader substrate 100. The heat source can be a high-power-density chip or other heating element, which can be selected by those skilled in the art as needed.

[0034] It should be noted that the specific structure of the fin assembly 101 and the 3D heat pipe 102 is not specifically limited in this application embodiment, and those skilled in the art can make settings as needed.

[0035] The 3D heat pipe 102 is inserted into the fin assembly 101 at one end away from the vacuum heat spreader substrate 100, which means that the 3D heat pipe 102 is in contact with the fin assembly 101.

[0036] It should be noted that the fin assembly 101 can be in contact with the vacuum heat exchange substrate 100 or the fin assembly 101 and the vacuum heat exchange substrate 100 can be spaced at a predetermined distance.

[0037] In this embodiment, the heat generated by the high-power-density chip is absorbed by the vacuum heat dissipation substrate 100 and then transferred to the fin assembly 101 via the 3D heat pipe 102, achieving efficient heat dissipation for the chip. It should be noted that, compared to the prior art, this embodiment, by inserting the 3D heat pipe 102 onto the fin assembly 101, eliminates the limitation caused by increased thermal resistance due to excessive fin height.

[0038] The 3D heat pipe 102 of this application embodiment is a three-dimensional heat conduction device that can more flexibly transfer heat from one location to another. Unlike traditional two-dimensional heat pipes, the 3D heat pipe 102 can be customized in shape as needed, making it better adaptable to different heat dissipation requirements and space constraints.

[0039] The heat generated by the chip is transferred to the vacuum heat spreader substrate 100 through thermal conduction, causing a small amount of liquid in the vacuum chamber to vaporize into water vapor. This process absorbs a large amount of heat and forms a high-pressure area. Driven by pressure, the water vapor diffuses into the low-temperature area of ​​the vacuum heat spreader substrate 100 and transfers the heat to the fin assembly 101 with a large heat dissipation area through thermal conduction.

[0040] It should be noted that the vacuum heat spreader substrate 100 in this embodiment is a highly efficient heat-conducting element capable of uniformly distributing heat across a large surface. The vacuum heat spreader substrate 100 utilizes an internal phase change material, typically water or a liquid medium, to absorb heat from a heat source and rapidly transfer it to the entire substrate surface.

[0041] The fin assembly 101 in this embodiment is used to increase the heat dissipation area and improve heat dissipation efficiency. In this design of this embodiment, the fin assembly 101 serves as the main heat dissipation pathway, and it enhances heat transfer efficiency through direct contact with the 3D heat pipe 102.

[0042] The technical effects that the embodiments of this application can produce are as follows:

[0043] In this embodiment, by using a vacuum heat spreader 100, heat can be rapidly and evenly dispersed from the heat source, avoiding the problem of localized overheating. The 3D heat pipe 102 further improves the heat transfer efficiency, enabling heat to be quickly transferred from the heat source to the fin assembly 101 for dissipation.

[0044] In this embodiment, since the 3D heat pipe 102 can be customized in shape and path according to actual needs, heat can be distributed to different parts of the fin assembly 101 more effectively, thereby maximizing the utilization efficiency of the heat dissipation area.

[0045] Traditional toothed fins suffer from height limitations due to increased diffusion thermal resistance, but this design effectively solves this problem by integrating a vacuum vapor chamber substrate 100 and a 3D heat pipe 102. This enables efficient heat transfer and dissipation even within a limited space.

[0046] This application provides a more effective thermal management method that helps reduce the operating temperature of the chip, reduces the risk of failure due to overheating, and thus improves the reliability and operational stability of the entire electronic system.

[0047] Reference Figure 1 As shown, as an optional embodiment, it also includes a substrate cover 103; the vacuum heat-equalizing substrate 100 and the substrate cover 103 are fastened together to form a liquid-cooled chamber 104, the fin assembly 101 is disposed in the liquid-cooled chamber 104, and the liquid-cooled chamber 104 is filled with a coolant for cooling the fin assembly 101.

[0048] Furthermore, in this embodiment, the substrate cover 103 is fastened to the vacuum heat-spreading substrate 100 to form a sealed liquid-cooled chamber 104. This design not only provides a container for the coolant but also ensures the airtightness and stability of the entire system.

[0049] In this embodiment, a liquid-cooled chamber 104 is formed by the fastening between the vacuum heat-spreading substrate 100 and the substrate cover 103, and a fin assembly 101 is disposed inside. The presence of the liquid-cooled chamber 104 allows the use of liquid as a cooling medium. Compared with air cooling, liquid has a higher specific heat capacity and thermal conductivity, and can more effectively remove heat.

[0050] The liquid-cooled chamber 104 is filled with coolant, such as water, ethylene glycol, or a special coolant. The coolant is used to directly cool the fin assembly 101. It should be noted that the coolant circulates, absorbing the heat dissipated by the fin assembly 101 and transferring it to the outside of the system for heat dissipation.

[0051] The technical effects that the embodiments of this application can produce are as follows:

[0052] The coolant in this embodiment has better thermal conductivity than air, which can significantly improve heat dissipation efficiency. Especially in high power density applications, the liquid cooling system can effectively reduce the chip operating temperature and improve system stability and reliability.

[0053] This embodiment of the application makes full use of the limited space by placing the fin assembly 101 within the liquid cooling chamber 104, while maintaining a compact structure. This approach ensures efficient heat dissipation without occupying excessive additional space.

[0054] The liquid cooling solution adopted in this application embodiment can adjust the type and flow rate of the coolant according to different heat dissipation requirements, and can even adapt to different application scenarios by changing the design of the liquid cooling chamber 104, thereby improving the customizability and flexibility of the system.

[0055] The integrated heat dissipation design of this application combines the rapid heat transfer characteristics of the vacuum heat spreader 100, the efficient heat conduction path of the 3D heat pipe 102, and the powerful heat dissipation capability of the liquid cooling system, providing a comprehensive solution for handling high heat loads.

[0056] In addition, the improved thermal management of the embodiments of this application helps to maintain the operation of electronic components within a safe operating temperature range, reducing the risk of aging and failure due to overheating, thereby extending the service life of the equipment.

[0057] Reference Figure 2 , Figure 3 As shown, in one optional implementation, the fin assembly 101 includes a plurality of first fins 105 arranged sequentially at intervals along the extension path of the 3D heat pipe 102; the first fins 105 intersect the central axis of the 3D heat pipe 102.

[0058] It should be noted that multiple first fins 105 are arranged sequentially and at intervals along the extension path of the 3D heat pipe 102, ensuring that each first fin 105 can contact the 3D heat pipe 102. The first fins 105 intersect with the central axis of the 3D heat pipe 102, which means that the 3D heat pipe 102 penetrates or at least partially penetrates each first fin 105, which increases the directness and effectiveness of the heat conduction path.

[0059] By designing the 3D heat pipe 102 to intersect with each first fin 105, close contact between them is ensured, thereby improving the heat transfer efficiency from the 3D heat pipe 102 to the first fin 105. The presence of multiple 3D heat pipes 102 creates multiple contact areas, further increasing the contact area and promoting more efficient heat transfer.

[0060] The fin assembly 101 is manufactured using a stamping process, and pre-drilled holes are provided for the 3D heat pipe 102 to pass through.

[0061] Specifically, refer to Figure 2 , Figure 3 As shown, there are multiple 3D heat pipes 102 distributed at intervals on the vacuum heat exchange substrate 100, and multiple insertion holes 107 are provided on the first fin 105; the multiple 3D heat pipes 102 are inserted one-to-one with the multiple insertion holes 107.

[0062] The embodiments of this application have the following technical effects:

[0063] The direct and extensive contact surface allows heat to be transferred from the 3D heat pipe 102 to the first fin 105 more quickly, reducing thermal resistance and improving overall heat dissipation efficiency.

[0064] By intersecting the 3D heat pipe 102 with each first fin 105 and using multiple 3D heat pipes 102 to form multiple contact points, the contact area is greatly increased, which helps to distribute heat more evenly and efficiently and avoid local overheating.

[0065] The efficient heat transfer mechanism allows the first fin 105 to dissipate heat more effectively. Combined with the liquid cooling system, it can significantly reduce the temperature of the entire system, especially performing well in high power density applications.

[0066] Reference Figure 1 , Figure 2 As shown, this application provides a preferred structural arrangement:

[0067] In this embodiment, the 3D heat pipe 102 is vertically disposed on the vacuum heat exchange substrate 100, and the plane of the first fin 105 is parallel to the vacuum heat exchange substrate 100, so that the 3D heat pipe 102 is vertically inserted through the first fin 105.

[0068] Among them, the end face of the free end 106 of the 3D heat pipe 102 is in contact with the inner wall of the substrate cover 103, and the fin assembly 101 is in contact with the surface of the vacuum heat-spreading substrate 100 away from the heat source.

[0069] In this embodiment, the 3D heat pipe 102 is vertically positioned on the vacuum vapor chamber substrate 100 and extends through the first fin 105. This arrangement reduces the space occupied by the system, making the entire heat dissipation structure more compact. This helps save internal space and frees up room for other components, making it particularly suitable for high-performance electronic devices with limited space.

[0070] The design of vertically inserting the 3D heat pipe 102 into the first fin 105 in this embodiment ensures the shortest and most direct heat transfer path from the vacuum heat spreader substrate 100 to the first fin 105, reducing energy loss in intermediate links and improving overall heat transfer efficiency.

[0071] Furthermore, because the 3D heat pipe 102 can effectively distribute heat from the heat source to the multiple first fins 105, heat can be dissipated more evenly, avoiding localized overheating. The 3D heat pipe 102 is perpendicularly inserted into the first fins 105, increasing the contact area between them and thus enhancing the heat transfer efficiency from the 3D heat pipe 102 to the first fins 105. Simultaneously, it also facilitates more effective cooling of the first fins 105 by the coolant.

[0072] Reference Figure 4 , Figure 5As shown, in an optional embodiment, the fin assembly 101 further includes a plurality of second fins 108 arranged sequentially at intervals. The plurality of second fins 108 are disposed between the vacuum heat exchange substrate 100 and the first fin 105, and the plane in which the second fins 108 are located intersects with the first fin 105 and the vacuum heat exchange substrate 100.

[0073] It should be noted that the second fin 108 is located between the vacuum heat exchange substrate 100 and the first fin 105, forming an intermediate layer. The plane containing them intersects with both the first fin 105 and the vacuum heat exchange substrate 100. This means that the second fin 108 not only increases the overall surface area but also directly contacts the vacuum heat exchange substrate 100. By adding the second fin 108, the surface area of ​​the entire fin assembly 101 is effectively increased, providing more surface area for heat dissipation and helping to improve heat dissipation efficiency.

[0074] In addition, the second fin 108 is in direct contact with the vacuum heat exchange substrate 100, providing a direct heat conduction path from the heat source to the heat dissipation surface, reducing thermal resistance and accelerating the heat transfer speed. At the same time, since the second fin 108 is in direct contact with the vacuum heat exchange substrate 100, heat can be more evenly distributed in all directions, avoiding the problem of local overheating and improving the stability of the heat dissipation system.

[0075] In this embodiment, a multi-level heat dissipation system is formed by providing a second fin 108 between the first fin 105 and the vacuum heat dissipation substrate 100. Each level participates in the absorption and dissipation of heat, further enhancing the heat dissipation capability.

[0076] Reference Figure 5 As shown, in one optional implementation, the chamber in the 3D heat pipe 102 is connected to the chamber in the vacuum heat spreader 100 to form a vacuum liquid cooling chamber 109; a capillary structure is formed in the vacuum liquid cooling chamber 109.

[0077] It should be noted that a dense capillary structure is formed inside the vacuum liquid cooling chamber 109 by sintering copper powder to achieve directional reflux of the condensed liquid.

[0078] Reference Figure 3 , Figure 6 As shown, in one optional implementation, the substrate cover 103 is provided with an inlet and an outlet that communicate with the liquid cooling chamber 104; the inlet and outlet are respectively provided with adapters 110, which are connected to an external cooling system.

[0079] In this embodiment, the adapter 110 enables the liquid cooling chamber 104 to be connected to the external cooling system to form a loop, thereby realizing the circulation of coolant.

[0080] Reference Figure 3, Figure 6 As shown, as an optional embodiment, it also includes a mounting plate 111; the mounting plate 111 has a cutout portion 112; the vacuum heat exchange substrate 100 is fixed on the mounting plate 111 and covers the cutout portion 112, so that the heat source can pass through the cutout portion 112 and contact the vacuum heat exchange substrate 100.

[0081] The mounting plate 111 is provided with multiple locking structures 113 arranged at intervals, and the mounting plate 111 is connected to the external circuit board through the locking structures 113.

[0082] It should be noted that those skilled in the art can arrange the locking structure 113 in any way they need, and no special limitation is made in this regard.

[0083] For example, the locking structure 113 may be a snap ring, a combination screw, or other types of quick-release structure.

[0084] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A cold plate heat sink, characterized in that, It includes a vacuum heat exchange substrate (100) and a fin assembly (101); the surface of the vacuum heat exchange substrate (100) facing away from the fin assembly (101) is in contact with a heat source, and a 3D heat pipe (102) is provided on the surface of the vacuum heat exchange substrate (100) near the fin assembly (101). The 3D heat pipe (102) extends toward the fin assembly (101) and is inserted into the fin assembly (101); the heat generated by the heat source is transferred to the fin assembly (101) through the 3D heat pipe (102) after passing through the vacuum heat exchange substrate (100).

2. The cold plate heat sink according to claim 1, characterized in that, It also includes a substrate cover (103); the vacuum heat-equalizing substrate (100) and the substrate cover (103) are fastened together to form a liquid-cooled chamber (104), the fin assembly (101) is disposed in the liquid-cooled chamber (104), and the liquid-cooled chamber (104) is filled with a coolant for cooling the fin assembly (101).

3. The cold plate heat sink according to claim 2, characterized in that, The fin assembly (101) includes a plurality of first fins (105) arranged at intervals along the extension path of the 3D heat pipe (102); the first fins (105) intersect the central axis of the 3D heat pipe (102).

4. The cold plate heat sink according to claim 3, characterized in that, The end face of the free end (106) of the 3D heat pipe (102) is in contact with the inner wall of the substrate cover (103).

5. The cold plate heat sink according to claim 3, characterized in that, There are multiple 3D heat pipes (102) and they are spaced apart on the vacuum heat exchange substrate (100). The first fin (105) is provided with multiple insertion holes (107). The multiple 3D heat pipes (102) are inserted into the multiple insertion holes (107) one by one.

6. The cold plate heat sink according to claim 3, characterized in that, The fin assembly (101) further includes a plurality of second fins (108) arranged at intervals in sequence. The plurality of second fins (108) are disposed between the vacuum heat exchange substrate (100) and the first fin (105), and the plane of the second fins (108) intersects with the first fin (105) and the vacuum heat exchange substrate (100).

7. The cold plate heat sink according to any one of claims 1-6, characterized in that, The fin assembly (101) is in contact with the surface of the vacuum heat exchange substrate (100) on the side away from the heat source.

8. The cold plate heat sink according to any one of claims 1-6, characterized in that, The chamber inside the 3D heat pipe (102) is connected to the chamber inside the vacuum heat spreader substrate (100) to form a vacuum liquid cooling chamber (109); a capillary structure is formed inside the vacuum liquid cooling chamber (109).

9. The cold plate heat sink according to any one of claims 2-6, characterized in that, The substrate cover (103) is provided with an inlet and an outlet that communicate with the liquid cooling chamber (104); the inlet and outlet are respectively provided with adapters (110), and the adapters (110) are connected to an external cooling system.

10. The cold plate heat sink according to any one of claims 1-6, characterized in that, It also includes a mounting plate (111); the mounting plate (111) has a cutout portion (112); the vacuum heat exchange substrate (100) is fixed on the mounting plate (111) and covers the cutout portion (112) so that the heat source can pass through the cutout portion (112) and contact the vacuum heat exchange substrate (100).

11. The cold plate heat sink according to claim 10, characterized in that, The mounting plate (111) is provided with a plurality of locking structures (113) arranged at intervals, and the mounting plate (111) is connected to the external circuit board through the locking structures (113).

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