Mould for accurately aligning interlayers of multilayer printed circuit board

Abstract

The utility model relates to the technical field of multi-layer printed circuit board alignment dies, in particular to a multi-layer printed circuit board interlayer accurate alignment die which comprises a base, a support is fixedly connected to the lower inner wall of the base, a first bidirectional lead screw is rotationally connected to the upper inner wall of the support, and first connecting frames are in threaded connection with the front end and the rear end of the first bidirectional lead screw. The upper surface of the first connecting frame is fixedly connected with a first clamping plate, the lower inner wall of the support is rotationally connected with a second bidirectional lead screw, and the left end and the right end of the bidirectional lead screw are in threaded connection with second connecting frames. According to the multi-layer circuit board stacking device, the first clamping plate, the second clamping plate, the air cylinder, the connecting frame and the pressing roller are arranged, so that the multi-layer circuit boards can be tidied through a tool when being stacked, the alignment precision of the multi-layer circuit boards is improved, and the problems that when the multi-layer circuit boards are manually placed and stacked, the stacking precision is poor, and more waste materials are generated are solved; and the processing precision of the multilayer circuit board is further improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to multilayer printed wiring board alignment mould technical field especially multilayer printed wiring board interlayer precision alignment mould. BACKGROUND

[0002] Multilayer printed wiring board is a kind of key component widely used in electronic equipment, is pressed from the conductive layer (such as copper foil) and insulating layer alternately, has complex circuit structure, the design height integration of multilayer printed wiring board, can realize high-density wiring in limited space, greatly reduces the volume of electronic product, improves performance. It is widely used in computer, communication equipment, aerospace and other fields, is the basic support for modern electronic product realization miniaturization, multifunction and high performance.

[0003] In the process of producing multilayer printed wiring board, the existing multilayer printed wiring board is placed by manual operation in the process of stacking, and in the process of placing, although the operator can align the stacked wiring board to a certain extent, there will be a certain range of error after stacking, and since the error area needs to be cut after stacking, the area of the wiring board stacked manually needs to be cut, which leads to the problem of more material waste in the processing process. UTILITY MODEL CONTENTS

[0004] The utility model discloses a multilayer printed wiring board interlayer precision alignment mould, which solves the problem of error range after stacking in the prior art, and the area of the wiring board stacked manually needs to be cut, which leads to the problem of more material waste in the processing process.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a multilayer printed wiring board interlayer precision alignment mould, comprising a base, a bracket is fixedly connected to the lower inner wall of the base, a bidirectional screw rod one is rotatably connected to the upper inner wall of the bracket, an adapter frame one is threadedly connected to the front and rear ends of the bidirectional screw rod one, a clamping plate one is fixedly connected to the upper surface of the adapter frame one, a bidirectional screw rod two is rotatably connected to the lower inner wall of the bracket, an adapter frame two is threadedly connected to the left and right ends of the bidirectional screw rod, a clamping plate two is fixedly connected to the upper surface of the adapter frame two, and a cover plate is installed on the inner wall of the base.

[0006] The upper surface of the base is fixedly connected with an assembly frame, the upper surface of the assembly frame is provided with a pneumatic cylinder, the driving end of the pneumatic cylinder is provided with a connecting frame, and the inner wall of the connecting frame is rotatably connected with a compression roller.

[0007] Preferably, the front surface of the bidirectional screw rod one is fixedly connected with a rotating disc one, the rotating disc one is in contact with the front surface of the base, and the rotating disc one can be held by an operator to facilitate rotation of the bidirectional screw rod one.

[0008] Preferably, the right surface of the bidirectional screw rod two is fixedly connected with a rotating disc two, the rotating disc two is in contact with the right surface of the base, and the rotating disc two can be held by an operator to facilitate rotation of the bidirectional screw rod two.

[0009] Preferably, the bidirectional screw rod one is located in the interior of the base, and the bidirectional screw rod one is rotatably connected with the inner wall of the base; through cooperation of the bidirectional screw rod one and the adapter frame one, the clamping plate one is driven to move in a specified direction during rotation of the bidirectional screw rod one.

[0010] Preferably, the bidirectional screw rod two is located in the interior of the base, and the bidirectional screw rod two is rotatably connected with the inner wall of the base; through cooperation of the bidirectional screw rod two and the adapter frame two, the clamping plate two is driven to move in a specified direction through operation of an operator.

[0011] Preferably, the adapter frame one is in contact with the lower inner wall of the base, the adapter frame one is slidably connected with the inner wall of the cover plate, the adapter frame two is in contact with the lower inner wall of the base, and the adapter frame two is slidably connected with the inner wall of the cover plate; the upper portion of the base can be sealed by the cover plate to ensure safety of the internal structure of the base, and the cover plate can be used by an operator to place a circuit board.

[0012] Preferably, the clamping plate one is located above the cover plate and in contact with the upper surface of the cover plate, and the clamping plate two is located above the cover plate and in contact with the upper surface of the cover plate; through cooperation of the clamping plate one and the clamping plate two, the circuit board placed above the cover plate can be clamped and arranged under operation of an operator, so that the stacking precision of the multilayer circuit board is ensured.

[0013] Compared with the prior art, the utility model has the advantages and positive effects that:

[0014] In the utility model, through the setting of the clamping plate one, the clamping plate two, the air cylinder, the connecting frame and the compression roller, when the multilayer circuit board is stacked, it can be arranged through tools, so that the alignment precision of the multilayer circuit board is increased, thereby reducing the problem that the stacking precision is poor when the multilayer circuit board is placed manually, resulting in more waste, and further improving the processing precision of the multilayer circuit board. DRAWINGS

[0015] Figure 1 A three-dimensional structure schematic view of a multilayer printed circuit board interlayer accurate alignment mold is provided for the utility model;

[0016] Figure 2The utility model provides a multi -layer printed wiring board interlayer precision alignment mould's elevation structure schematic view is proposed to the utility model;

[0017] Figure 3 The utility model provides a multi -layer printed wiring board interlayer precision alignment mould's partial structure schematic view is proposed to the utility model;

[0018] Figure 4 The utility model provides a multi -layer printed wiring board interlayer precision alignment mould's local structure schematic view is proposed to the utility model.

[0019] Legend:

[0020] 1, base; 2, support; 3, bidirectional screw rod one; 4, carousel one; 5, link frame one; 6, clamping plate one; 7, bidirectional screw rod two; 8, carousel two; 9, link frame two; 10, clamping plate two; 11, cover plate; 12, assembly frame; 13, air cylinder; 14, connecting frame; 15, compression roller. Specific implementation

[0021] Please refer to Figures 1-4 The utility model provides a technical scheme: multi -layer printed wiring board interlayer precision alignment mould, including base 1, the lower inner wall fixed connection of base 1 has support 2, the upper inner wall rotationally connected of support 2 has bidirectional screw rod one 3, and the front and rear two ends of bidirectional screw rod one 3 are all screw connection and have link frame one 5, and the upper surface fixed connection of link frame one 5 has clamping plate one 6, and the lower inner wall rotationally connected of support 2 has bidirectional screw rod two 7, and the left and right two ends of bidirectional screw rod are all screw connection and have link frame two 9, and the upper surface fixed connection of link frame two 9 has clamping plate two 10, and the inner wall of base 1 is installed with cover plate 11;

[0022] The upper surface fixed connection of base 1 has assembly frame 12, and the upper surface of assembly frame 12 is installed with air cylinder 13, and the drive end of air cylinder 13 is installed with connecting frame 14, and the inner wall rotationally connected of connecting frame 14 has compression roller 15.

[0023] Specifically, the front surface fixed connection of bidirectional screw rod one 3 has carousel one 4, and carousel one 4 is in contact with the front surface of base 1, and the operator can hold carousel one 4 to facilitate the operator to rotate bidirectional screw rod one 3.

[0024] Specifically, the right side surface fixed connection of bidirectional screw rod two 7 has carousel two 8, and carousel two 8 is in contact with the right side surface of base 1.

[0025] In the embodiment: the operator can hold carousel two 8 to facilitate the operator to rotate bidirectional screw rod two 7.

[0026] Specifically, the bidirectional screw rod one 3 is located inside the base 1, and the bidirectional screw rod one 3 is rotationally connected with the inner wall of the base 1. Through cooperation of the bidirectional screw rod one 3 and the adapter frame one 5, the bidirectional screw rod one 3 drives the clamping plate one 6 to displace along a specified direction in the process of rotation.

[0027] In the embodiment, the bidirectional screw rod two 7 is located inside the base 1, and the bidirectional screw rod two 7 is rotationally connected with the inner wall of the base 1.

[0028] In the embodiment, through the bidirectional screw rod two 7, the clamping plate two 10 is driven to move along a specified direction under cooperation of the adapter frame two 9 and operation of an operator.

[0029] Specifically, the adapter frame one 5 is in contact with the lower inner wall of the base 1, the adapter frame one 5 is slidingly connected with the inner wall of the cover plate 11, the adapter frame two 9 is in contact with the lower inner wall of the base 1, and the adapter frame two 9 is slidingly connected with the inner wall of the cover plate 11. The cover plate 11 can seal the upper part of the base 1 to ensure the safety of the internal structure of the base 1, and can be used by an operator to place a circuit board.

[0030] Specifically, the clamping plate one 6 is located above the cover plate 11, and the clamping plate one 6 is in contact with the upper surface of the cover plate 11. The clamping plate two 10 is located above the cover plate 11, and the clamping plate two 10 is in contact with the upper surface of the cover plate 11.

[0031] In the embodiment, through cooperation of the clamping plate one 6 and the clamping plate two 10, the circuit board placed above the cover plate 11 can be clamped and arranged under operation of an operator, so as to ensure the stacking precision between the multiple circuit boards.

[0032] Working principle: when the circuit board is stacked, the stacking materials are placed on the cover plate 11 in the designed production mode. After the placing operation is completed, the power supply of the air cylinder 13 is turned on, the air cylinder 13 is controlled to push the connecting frame 14 downward, the connecting frame 14 pushes the compression roller 15, the compression roller 15 moves downward and abuts against the surface of the uppermost material, and downward pressure is applied to the stacking materials. When the stacking materials are pressed, the rotating disc one 4 is rotated clockwise, the rotating disc one 4 drives the bidirectional screw rod one 3 to rotate, the bidirectional screw rod one 3 is engaged with the two adapter frames one 5, the two adapter frames one 5 move toward each other and approach the stacking materials under the guidance of the base 1 and the cover plate 11, the two clamping plates one 6 synchronously push the stacking materials when the clamping plates one 6 contact the stacking materials, so that the stacking materials are arranged flat in the front-rear direction, and then the rotating disc one 4 is stopped.

[0033] After the above operation is completed, rotate the dial two 8 clockwise, the dial two 8 rotates the two-way screw rod two 7, the two-way screw rod two 7 is engaged with the two sides of the adapter frame two 9, the two sides of the adapter frame two 9 is guided under the base 1 and the cover plate 11, the clamping plate two 10 is driven to move down and close to the stacked material, when the clamping plate two 10 and the stacked material contact, the two sides of the clamping plate two 10 synchronously push the stacked material, so that the stacked material is also arranged flat in the left and right directions, then stop rotating the dial two 8, when the above all operations are completed, the multi-layer circuit board is accurately aligned, then the stacked multi-layer circuit board is clamped by the clamping tool, after clamping, the mold is unlocked, and the circuit board is transferred to the next working area, through the setting of the clamping plate one 6, the clamping plate two 10, the air cylinder 13, the connecting frame 14 and the pressure roller 15, when the multi-layer circuit board is stacked, it can be arranged by the tool, so that the alignment accuracy of the multi-layer circuit board is increased, thereby reducing the problem that the stacking accuracy is poor when the multi-layer circuit board is placed manually, resulting in more waste, and further improving the processing accuracy of the multi-layer circuit board.

Claims

1. A multilayer printed circuit board interlayer precision alignment mold, including a base (1), characterized in that: A bracket (2) is fixedly connected to the lower inner wall of the base (1). A two-way screw rod (3) is rotatably connected to the upper inner wall of the bracket (2). A connecting frame (5) is threaded to both the front and rear ends of the two-way screw rod (3). A clamping plate (6) is fixedly connected to the upper surface of the connecting frame (5). A two-way screw rod (7) is rotatably connected to the lower inner wall of the bracket (2). A connecting frame (9) is threaded to both the left and right ends of the two-way screw rod. A clamping plate (10) is fixedly connected to the upper surface of the connecting frame (9). A cover plate (11) is installed on the inner wall of the base (1). An assembly frame (12) is fixedly connected to the upper surface of the base (1). A cylinder (13) is installed on the upper surface of the assembly frame (12). A connecting frame (14) is installed at the drive end of the cylinder (13). A pressure roller (15) is rotatably connected to the inner wall of the connecting frame (14).

2. The multilayer printed circuit board interlayer precision alignment mold according to claim 1, characterized in that: The front surface of the bidirectional lead screw (3) is fixedly connected to a turntable (4), which is in contact with the front surface of the base (1).

3. The multilayer printed circuit board interlayer precision alignment mold according to claim 1, characterized in that: The right side surface of the bidirectional lead screw 2 (7) is fixedly connected to the turntable 2 (8), and the turntable 2 (8) is in contact with the right side surface of the base (1).

4. The multilayer printed circuit board interlayer precision alignment mold according to claim 1, characterized in that: The bidirectional lead screw (3) is located inside the base (1) and is rotatably connected to the inner wall of the base (1).

5. The multilayer printed circuit board interlayer precision alignment mold according to claim 1, characterized in that: The bidirectional lead screw 2 (7) is located inside the base (1), and the bidirectional lead screw 2 (7) is rotatably connected to the inner wall of the base (1).

6. The multilayer printed circuit board interlayer precision alignment mold according to claim 1, characterized in that: The first connecting frame (5) is in contact with the lower inner wall of the base (1), the first connecting frame (5) is slidably connected to the inner wall of the cover plate (11), the second connecting frame (9) is in contact with the lower inner wall of the base (1), and the second connecting frame (9) is slidably connected to the inner wall of the cover plate (11).

7. The multilayer printed circuit board interlayer precision alignment mold according to claim 1, characterized in that: The first clamp (6) is located above the cover plate (11), and the first clamp (6) is in contact with the upper surface of the cover plate (11). The second clamp (10) is located above the cover plate (11), and the second clamp (10) is in contact with the upper surface of the cover plate (11).

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