Silicon wafer transmission line body track changing mechanism and line body transmission device

Abstract

The utility model provides a silicon wafer transmission line body track changing mechanism and a line body transmission device, and relates to the field of silicon wafer transportation. The silicon wafer transmission line body track changing mechanism comprises a base; the adjusting assembly comprises an adjusting air cylinder and a sliding rail which are arranged on the base, the adjusting air cylinder is connected with a telescopic rod, and the sliding rail is provided with a sliding seat in a sliding mode; the first conveying assembly is connected with the telescopic rod and the sliding seat, a first feeding line body is arranged above the first conveying assembly, and a first discharging line body is arranged below the first conveying assembly; the first conveying assembly can be driven by the adjusting assembly to move in the direction perpendicular to the conveying direction of the first feeding line body and the first discharging line body. The line body transmission device comprises a silicon wafer transmission line body track changing mechanism and a second transmission assembly. The device can be matched with different distances between the AGV transportation device and rails of other devices at the same time, and accurate butt joint is carried out.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer transportation, specifically a silicon wafer transmission line track changing mechanism and transmission line device. Background Technology

[0002] Silicon wafers are thin sheets made of high-purity silicon and are the basic material for manufacturing semiconductor devices and integrated circuits. During transportation, silicon wafers are typically transported using automated equipment such as AGVs (Automated Guided Vehicles) and conveyor belts to reduce the risks associated with manual handling.

[0003] In the prior art, the distance between the two tracks at the outlet of the AGV docking channel for transporting silicon wafer frames is fixed. However, the distance between the track of the device for subsequent processing of silicon wafers in the silicon wafer frames is significantly different from the distance between the two tracks of the AGV. The line transmission device needs to transfer the silicon wafer frames on the AGV to the track of the device for subsequent processing. Usually, multi-segment transfer line transmission is used to adjust the distance, which increases the space requirement and is inconvenient to set up the line. Utility Model Content

[0004] This invention addresses the problem that existing line transport devices use multi-segment transport lines for spacing adjustment, which increases space requirements and makes line setup inconvenient. It provides a silicon wafer transport line variable track mechanism and line transport device with low structural complexity, enabling the line transport device to accurately connect with the different track spacings of the AGV transport device for silicon wafers and other subsequent devices.

[0005] The technical solution adopted in this utility model is:

[0006] A silicon wafer transmission line body track changing mechanism, comprising:

[0007] Base;

[0008] The adjustment assembly includes an adjustment cylinder and a slide rail mounted on the base; the adjustment cylinder is connected to a telescopic rod, and the slide rail is slidably fitted with a slide block; and

[0009] A first transmission component is connected to the telescopic rod and the slide block. A first feeding line is provided above the first transmission component, and a first discharging line is provided below it.

[0010] The first transmission component can move perpendicular to the transmission direction of the first feed line and the first discharge line under the drive of the adjustment component.

[0011] Furthermore, the base has a fixed frame; the adjusting cylinder is located above the crossbar in the middle of the fixed frame; there are two slide rails, which are respectively arranged along the two crossbars on both sides of the fixed frame; and each slide rail is provided with two slide seats.

[0012] Furthermore, four hydraulic dampers are provided above the two crossbars on both sides of the fixed frame and at the ends of the two slide rails.

[0013] Furthermore, two position sensors are provided on the inner side of one side crossbar of the fixed frame, at the positions of both ends of one of the slide rails.

[0014] Furthermore, the first transmission component also has a first mounting bracket, the bottom of which is connected to the slide block, and the side plate of the first discharge line body is connected to the telescopic rod via a connecting plate.

[0015] Furthermore, it also includes a positioning control component disposed on the first feed line and the first discharge line, the positioning control component being capable of stopping the silicon wafer storage device on the first feed line and the first discharge line.

[0016] Furthermore, the positioning control component includes a blocking cylinder, which is located below the conveyor belts of the first feeding line and the first discharging line. When the blocking cylinder extends upward, it can block the silicon wafer storage device on the first feeding line and the first discharging line to stop.

[0017] Furthermore, the positioning control component also has multiple positioning sensors, which are spaced apart below the conveyor belts of the first feeding line and the first discharging line. The multiple positioning sensors on the first feeding line are electrically connected to the blocking cylinder and the adjusting cylinder. The multiple positioning sensors on the first discharging line are signal connected to the AGV transmission device and electrically connected to the adjusting cylinder.

[0018] A silicon wafer line transport device, comprising:

[0019] The silicon wafer transmission line body variable track mechanism as described above; and

[0020] Second transmission component;

[0021] When the adjustment component drives the first transmission component, the distance between the second transmission component and the first transmission component changes.

[0022] Further, the second transmission component includes:

[0023] The second mounting bracket is configured to surround the variable track mechanism of the silicon wafer transmission line.

[0024] The second feeding line is mounted on the second mounting frame and is set at the same height as the first feeding line.

[0025] The second discharge line is mounted on the second mounting frame and is parallel to the first discharge line at the same height.

[0026] The beneficial effects of this utility model are:

[0027] 1. The variable track mechanism of this utility model allows the first feeding line and the first discharging line on the first transmission component to move along a direction perpendicular to their transmission direction by setting an adjustment component between the base and the first transmission component. This adjusts the distance between the two lines on the first transmission component and the line on the transmission component fixed on the other side of the transmission device, thereby adapting to the two track spacings of the AGV transportation device and the tracks of other subsequent devices under different conditions. At the same time, it achieves precise front and rear end docking and solves the problem that the existing line transmission device uses multiple transfer lines for spacing adjustment, which increases space requirements and is inconvenient for setting up the line.

[0028] 2. The line transmission device of this utility model utilizes the function of the variable track mechanism and is equipped with a second transmission component for synchronous transportation, which solves the problem that the existing line transmission device uses multi-segment transfer line transmission for spacing adjustment, which increases space requirements and is inconvenient for setting up the line. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a three-dimensional schematic diagram of the variable track mechanism according to an embodiment of the present utility model;

[0031] Figure 2 This is a front view of the variable track mechanism according to an embodiment of the present utility model;

[0032] Figure 3 This is a side view of the track-changing mechanism according to an embodiment of the present utility model;

[0033] Figure 4 This is a top view of the track-changing mechanism according to an embodiment of the present utility model;

[0034] Figure 5 for Figure 1 Enlarged view of point A;

[0035] Figure 6 for Figure 1 Enlarged view of point B;

[0036] Figure 7 This is a three-dimensional schematic diagram of the line transmission device according to an embodiment of the present utility model.

[0037] Reference numerals: 100-base, 120-fixed frame, 122-hydraulic damper, 124-position sensor, 140-support leg;

[0038] 200-Adjustment component, 210-Adjustment cylinder, 220-Telescopic rod, 230-Slide rail, 240-Slide base;

[0039] 300 - First transmission component; 310 - First mounting bracket; 320 - First feeding line; 330 - First discharging line; 338 - Connecting plate;

[0040] 410 - Blocking cylinder; 420 - Positioning sensor;

[0041] 500 - Second transmission component, 510 - Second mounting bracket, 520 - Second feed line, 530 - Second discharge line. Detailed Implementation

[0042] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0043] The following disclosure provides many different embodiments or examples for implementing various structures of this invention. To simplify the disclosure, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the scope of this invention.

[0044] The embodiments of the utility model will now be described in detail with reference to the accompanying drawings.

[0045] Example 1

[0046] Please see Figures 1-6This embodiment provides a variable track mechanism for a silicon wafer transport line, used to control and adjust the spacing between two tracks on a transport line that docks with an AGV transport device to transport silicon wafer frames (a type of silicon wafer storage device). This variable track mechanism has low structural complexity and allows the transport line to simultaneously adapt to different track spacings of the AGV transport device transporting silicon wafers and other subsequent devices, enabling accurate docking. The variable track mechanism mainly includes: a base 100, an adjustment component 200, and a first transport component 300.

[0047] The base 100 is used to set and support the adjustment assembly 200 and the first transmission assembly 300. For example... Figures 1-4 As shown, the base 100 mainly consists of a roughly rectangular fixed frame 120 and two legs 140 on both sides of the fixed frame 120. The fixed frame 120 forms a roughly rectangular outer frame through two longer horizontal bars (perpendicular to the linear transmission direction of the first transmission component 300) and two shorter vertical bars (parallel to the linear transmission direction of the first transmission component 300). Another longer horizontal bar is located in the middle of the fixed frame 120. The two legs 140 are located symmetrically on the outside of the two longer horizontal bars on both sides of the fixed frame 120. The upper part of the legs 140 is a shorter horizontal tube connected to the two longer horizontal bars on both sides of the fixed frame 120; the lower part of the legs 140 is a longer horizontal tube for contact with the ground for support; a curved tube connects the upper and lower tubes in the middle of the legs 140.

[0048] An adjustment component 200 is disposed above the fixed frame 120 of the base 100 and is used to adjust the first transmission component 300, allowing the first transmission component 300 to move in a horizontal direction perpendicular to its transmission direction, i.e., along the direction of the longer horizontal bar on the fixed frame 120. The adjustment component 200 mainly includes an adjustment cylinder 210, a telescopic rod 220, a slide rail 230, and a slide block 240. The adjustment cylinder 210 is disposed above the longer horizontal bar in the middle of the fixed frame 120. The telescopic rod 220 is connected to the adjustment cylinder 210 and can be controlled by the adjustment cylinder 210 to extend and retract. The telescopic rod 220 is arranged along the longer horizontal bar in the middle of the fixed frame 120, and its extension and retraction direction is perpendicular to the transmission direction of the first transmission component 300. The other end of the telescopic rod 220 is connected to the first transmission component 300, thereby controlling the movement of the first transmission component 300 and adjusting the distance between the first transmission component 300 and the fixed track on the other side of the transmission line device. Meanwhile, two slide rails 230 are respectively set along the two longer horizontal bars on both sides of the fixed frame 120 and located above the horizontal bars. There are four slide blocks 240 in total, and their bottoms are provided with slide grooves that are adapted to the shape of the slide rails 230. The slide blocks 240 are slidably fitted on the slide rails 230 through the slide grooves. There are two slide blocks 240 on each slide rail 230, and the top of the slide blocks 240 is connected to the bottom of the first transmission component 300, providing multi-point support for the first transmission component 300 so that it can maintain balance and stability during movement.

[0049] The first transmission assembly 300 is positioned above the adjustment assembly 200 and is used for transporting silicon wafer frames. The first transmission assembly 300 mainly includes a first mounting frame 310, a first feeding line 320, and a first discharging line 330. The first mounting frame 310 is roughly rectangular in shape and mainly consists of two relatively slender base plates on both sides of the bottom, two top rods on both sides of the top, and four support rods connecting the base plates and the top rods. The four support rods are connected in the middle by four connecting rods. The two base plates are respectively positioned along two longer horizontal bars on both sides of the fixed frame 120, and the lower part of each base plate is connected to two slides 240, thereby fixing the entire first mounting frame 310 onto the slides 240. The first feeding line 320 is positioned above the two top rods of the first mounting frame 310. The first feeding line 320 mainly consists of side plates on both sides, two rotating shafts at both ends, four rotating wheels, two conveyor belts fitted onto the rotating wheels, and a motor driving the rotating shafts. It is used to connect with the AGV and transport the silicon wafer frame to the tracks of other subsequent devices. Simultaneously, the first discharging line 330 is positioned above the two base plates of the first mounting frame 310. The first discharging line 330 also mainly consists of side plates on both sides, two rotating shafts at both ends, four rotating wheels, two conveyor belts fitted onto the rotating wheels, and a motor driving the rotating shafts. It is used to connect with the AGV and transport the silicon wafer frame to the AGV. A vertical connecting plate 338 is also connected to the side plate of the first discharging line 330. The first discharging line 330 is connected to the other end of the telescopic rod 220 of the adjusting assembly 200 through the connecting plate 338, allowing the entire first transmission assembly 300 to be driven by the adjusting assembly 200.

[0050] One specific operating method of this embodiment is as follows: During feeding, the adjusting cylinder 210 of the adjusting component 200 controls the first transmission component 300 to move closer to the second transmission component 500 located on the other side of the line transmission device. After the distance between the two is adapted to the AGV transport device, they dock with the two discharge ports of the AGV transport device. Then, the silicon wafer box on the AGV transport device is transferred to the conveyor belt of the feeding line through the upper feeding line. Next, the adjusting cylinder 210 of the adjusting component 200 again controls the first transmission component 300 to move away from the fixed line of the second transmission component 500 located on the other side of the line transmission device. After the distance between the two is adapted to the subsequent device tracks, they dock with the subsequent device tracks. Finally, the silicon wafer box on the conveyor belt of the feeding line is transferred to the subsequent device tracks through the upper feeding line for subsequent operations. During discharging, the silicon wafer box needs to be conveyed to the AGV transport device, which can be achieved by reversing the operation of the lower discharging line.

[0051] In summary, in this embodiment, the silicon wafer transmission line variable track mechanism, by setting an adjustment component 200 between the base 100 and the first transmission component 300, allows the first feed line 320 and the first discharge line 330 on the first transmission component 300 to move along a direction perpendicular to their transmission direction. This adjusts the distance between the two lines on the first transmission component 300 and the lines on the transmission component fixed on the other side of the transmission device, thereby adapting to the two distances of the AGV transportation device and the tracks of other subsequent devices under different conditions. At the same time, it achieves precise front-end and back-end docking, solving the problem in the prior art where the line transmission device uses multiple transfer lines for distance adjustment, which increases space requirements and is inconvenient for setting up the lines.

[0052] In addition, in this embodiment, four hydraulic buffers 122 are installed above the two longer crossbars on both sides of the fixed frame 120, and at the ends of the two slide rails 230 of the adjusting component 200, so that the first transmission component 300 can be buffered and decelerated when it reaches the limit position, avoiding device damage caused by sudden stop. At the same time, two position sensors 124 are installed on the inner side of one of the two longer crossbars on both sides of the fixed frame 120, and at the ends of the slide rails 230 on that crossbar, to detect and provide feedback on the movement of the first transmission component 300 in a timely manner, determine the distance between the moving line track on the first transmission component 300 and the fixed line track on the other side of the line transmission device, thereby improving the accuracy of the track docking between the line transmission device, the AGV transportation device, and other subsequent devices.

[0053] In this embodiment, to ensure that the three silicon wafer frames are grouped together and accurately positioned on the production line for convenient forward or backward transport, positioning control components are also provided on the first feeding line 320 and the first discharging line 330. These positioning control components mainly include a blocking cylinder 410 and a positioning sensor 420. Figure 5 , Figure 6As shown, the blocking cylinder 410 on the first feeding line 320 is positioned near the end of the track connecting to other subsequent devices, and the blocking cylinder 410 on the first discharging line 330 is positioned near the end of the AGV transport device connecting to it. The blocking cylinder 410 is positioned between the side plates on both sides of the line and below the conveyor belt. The blocking cylinder 410 can extend and retract vertically. When it extends upward, it can block the silicon wafer frames on the line and stop their movement. At the same time, four positioning sensors 420 are installed on each of the two lines. The four positioning sensors 420 are spaced apart and positioned inside the side plate on one side of the line and below the conveyor belt. They can detect the number of silicon wafer frames stopped above the line. In operation, when the number of silicon wafer frames on the first feeding line 320 reaches three, the four positioning sensors 420 can determine the position of the three silicon wafer frames relative to each other. Since the positioning sensors 420 are electrically connected to the blocking cylinder 410 and the adjusting cylinder 210, the positioning sensors 420 can control the blocking cylinder 410 on the first feeding line 320 to retract downwards and control the adjusting component 200 to drive the first transmission component 300 to dock with the tracks of other subsequent devices, so that the silicon wafer frames in groups of three are transmitted to the tracks of other subsequent devices. When the number of silicon wafer frames on the first discharging line 330 reaches three, the position is determined in the same way. Since the positioning sensors 420 are signal connected to the AGV transmission device and electrically connected to the adjusting cylinder 210, the positioning sensors 420 can call the AGV transmission device to travel to the docking position and control the adjusting component 200 to drive the first transmission component 300 to dock with the AGV transmission device, so that the silicon wafer frames in groups of three are transmitted to the AGV transmission device.

[0054] It should be noted that in this embodiment, the silicon wafer frame can also be replaced by other silicon wafer storage devices, and the number of silicon wafer frames in each group can also be more than three. For example, in one or more other embodiments, the number of positioning sensors 420 and the corresponding line length can be changed to adapt to other numbers of silicon wafer frames or other silicon wafer storage devices in each group.

[0055] Example 2

[0056] As one application of the silicon wafer transmission line body variable track mechanism in the above embodiments, a second embodiment is provided below.

[0057] Please see Figure 7 The second embodiment provides a silicon wafer line transport device for docking with an AGV transport device and transporting silicon wafer frames to subsequent device tracks. This silicon wafer line transport device has low structural complexity and can adapt to different track spacings between the AGV transport device and subsequent device tracks for accurate docking. The silicon wafer line transport device mainly includes: the silicon wafer transport line variable track mechanism and the second transport component 500 as described in the above embodiments.

[0058] like Figure 7 As shown, the second transmission component 500 is used to connect to another discharge port of the AGV transport device and another track on the subsequent device track. The second transmission component 500 mainly includes a second mounting frame 510, a second feeding line 520, and a second discharge line 530. The second mounting frame 510, to facilitate connection to subsequent devices and be compatible with the silicon wafer transmission line track-changing mechanism, has a large frame that surrounds the entire silicon wafer transmission line track-changing mechanism. The second mounting frame 510 has a three-layer structure (upper, middle, and lower), with each layer connected by multiple support rods. Furthermore, the second feeding line 520 is located in the middle layer of the second mounting frame 510, with the same height as the first feeding line 320, and is arranged parallel to the first feeding line 320; the second discharging line 530 is located in the lower layer of the second mounting frame 510, with the same height as the first discharging line 330, and is arranged parallel to the first discharging line 330. The structures of the second feeding line 520 and the second discharging line 530 are the same as those of the first feeding line 320 and the first discharging line 330, respectively, and are used for synchronous conveying of the silicon wafer cassette on the other side.

[0059] In this embodiment, the silicon wafer line transport device utilizes the function of the silicon wafer transport line variable track mechanism and cooperates with the second transport component 500 for synchronous transport, which solves the problem in the prior art where the line transport device uses multi-segment transport line for spacing adjustment, which increases space requirements and is inconvenient to set up the line.

[0060] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer transfer track body orbit mechanism, characterized by, The utility model relates to a silicon wafer conveying device, which comprises a base (100), an adjusting assembly (200) and a first conveying assembly (300). The adjusting assembly (200) comprises an adjusting cylinder (210) and a slide rail (230) arranged on the base (100), the adjusting cylinder (210) is connected with a telescopic rod (220), and the slide rail (230) is slidably provided with a slide base (240). The first conveying assembly (300) is connected with the telescopic rod (220) and the slide base (240), and a first feeding line body (320) is arranged above the first conveying assembly (300), and a first discharging line body (330) is arranged below the first conveying assembly (300). The first conveying assembly (300) can move vertically to the conveying direction of the first feeding line body (320) and the first discharging line body (330) under the driving of the adjusting assembly (200). The base (100) has a fixed frame (120), the adjusting cylinder (210) is arranged above the crossbar in the middle of the fixed frame (120), the slide rail (230) is arranged along two crossbars on both sides of the fixed frame (120), and two slide bases (240) are arranged on each slide rail (230).

2. The silicon wafer transfer track mechanism as described in claim 1, wherein, Four oil pressure buffers (122) are arranged above the two crossbars on both sides of the fixed frame (120) and at the positions of the two ends of the two slide rails (230).

3. The silicon wafer transfer track mechanism as set forth in claim 2, wherein, Two position sensors (124) are arranged on the inner side of the crossbar on one side of the fixed frame (120) and at the positions of the two ends of one slide rail (230).

4. The silicon wafer transfer track mechanism as set forth in claim 2, wherein, The first conveying assembly (300) further has a first mounting rack (310), the bottom of the first mounting rack (310) is connected with the slide base (240), and the side plate of the first discharging line body (330) is connected with the telescopic rod (220) through a connecting plate (338).

5. The silicon wafer transfer track mechanism as described in claim 1, wherein, A positioning control assembly is arranged on the first feeding line body (320) and the first discharging line body (330), and the positioning control assembly can stop the silicon wafer storage device on the first feeding line body (320) and the first discharging line body (330).

6. The silicon wafer transfer track mechanism of claim 1, wherein, The positioning control assembly has a blocking cylinder (410) arranged below the conveying belt of the first feeding line body (320) and the first discharging line body (330), and when the blocking cylinder (410) extends upward, the silicon wafer storage device on the first feeding line body (320) and the first discharging line body (330) can be stopped.

7. The silicon wafer transfer track mechanism as set forth in claim 6, wherein, The positioning control assembly further has a plurality of positioning sensors (420) arranged below the conveying belt of the first feeding line body (320) and the first discharging line body (330), the plurality of positioning sensors (420) on the first feeding line body (320) are electrically connected with the blocking cylinder (410) and the adjusting cylinder (210), the plurality of positioning sensors (420) on the first discharging line body (330) are signal-connected with an AGV conveying device and electrically connected with the adjusting cylinder (210).

8. The silicon wafer transfer track mechanism as set forth in claim 7, wherein, The utility model relates to a silicon wafer conveying device, which comprises a base (100), an adjusting assembly (200) and a first conveying assembly (300).

9. A silicon wafer line transport apparatus, comprising: ​ The silicon wafer conveying track body variable orbit mechanism according to any one of claims 1-8; and A second conveying assembly (500); Wherein, when the adjusting assembly (200) drives the first conveying assembly (300), the distance between the second conveying assembly (500) and the first conveying assembly (300) changes.

10. The silicon wafer line transport apparatus of claim 9 wherein, The second conveying assembly (500) comprises: A second mounting frame (510) surrounding the silicon wafer conveying track body variable orbit mechanism; A second feeding track body (520) disposed on the second mounting frame (510) and arranged in parallel with the first feeding track body (320) at the same height; And a second discharging track body (530) disposed on the second mounting frame (510) and arranged in parallel with the first discharging track body (330) at the same height.

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