Notebook computer and heat dissipation module thereof

Abstract

The utility model provides a notebook computer and a heat dissipation module thereof. The heat dissipation module comprises a radiator, a copper coating, a welding material and a heat pipe. The heat sink includes a heat sink surface. The copper coating is coated on the surface of the radiator. The heat pipe is connected with the copper coating through the welding material.

Description

Technical Field

[0001] The embodiments of this utility model relate to a heat dissipation module, and more particularly to a heat dissipation module employing a copper coating. Background Technology

[0002] The basic cooling method for laptops primarily involves transferring waste heat generated by heat sources (such as the CPU, GPU, and VRAM) to the cooling fins via heat pipes. Utilizing the efficient thermal conductivity of the heat pipes, heat is rapidly transferred to all parts of the cooling fins. The cooling fins, through their increased surface area design, effectively distribute heat across a larger surface area. Combined with the airflow generated by the fan, the waste heat absorbed by the cooling fins is quickly carried away from the entire laptop system, thus achieving the purpose of cooling and heat dissipation.

[0003] In traditional technologies, heat sink fins are mostly made of aluminum (such as AL1050). Aluminum has good thermal conductivity and is lightweight, making it the mainstream material choice for heat sink fins. However, the surface of aluminum itself is not solderable, so when welding it to heat pipes, it must first undergo a chemical nickel plating process. The main purpose of this process is to form a nickel plating layer on the aluminum surface. This plating layer not only improves the solderability of aluminum but also provides a certain degree of oxidation resistance.

[0004] However, electroless nickel plating has certain drawbacks, such as its complex process and environmental pollution, which has gradually become a limiting factor in today's increasingly environmentally conscious industrial environment. Furthermore, nickel's thermal conductivity is only one-quarter that of copper; using nickel plating increases thermal resistance, thus negatively impacting heat dissipation efficiency. Therefore, improving existing technologies to enhance the heat transfer efficiency of heat dissipation modules and reduce manufacturing costs has become an important research topic in the current technological field. Utility Model Content

[0005] The present invention provides a heat dissipation module to address the problems of known technologies, comprising a heat sink, a copper coating, a welding material, and a heat pipe. The heat sink includes a heat sink surface. The copper coating is applied to the heat sink surface. The heat pipe is connected to the copper coating through the welding material.

[0006] In one embodiment, the heat sink includes a plurality of heat dissipation fins, at least some of which are arranged in a parallel manner to each other.

[0007] In one embodiment, the heat sink comprises aluminum.

[0008] In one embodiment, the heat sink surface includes a roughened surface.

[0009] In one embodiment, the copper coating is formed on the surface of the heat sink by hot melt spraying.

[0010] In one embodiment, each heat dissipation fin includes a folded section and an extension section, the folded section being connected to one end of the extension section.

[0011] In one embodiment, each folded segment includes an outer surface, and the plurality of outer surfaces together constitute the roughened surface.

[0012] In one embodiment, the plurality of heat dissipation fins are cut from an aluminum foil that has been roughened before cutting.

[0013] In one embodiment, the aluminum foil is roughened, then the copper coating is formed by hot melt spraying, and then cut into the plurality of heat dissipation fins.

[0014] In another embodiment, the present invention provides a laptop computer including a circuit board, a heat source, the aforementioned heat dissipation module, and a fan. The heat source is disposed on the circuit board. The heat pipe is thermally connected to the heat source. The fan is connected to the heat sink and dissipates heat from the heat sink.

[0015] In an embodiment of this invention, a copper coating is applied to the surface of the heat sink. The heat pipe is welded to the heat sink surface through the welding material and the copper coating. Specifically, the copper coating is applied using a hot melt spraying technique. This technique heats copper particles to a molten state and then sprays them at high speed onto an aluminum surface that cannot be directly welded, making it weldable. This embodiment of the invention uses this technique to replace the traditional chemical nickel plating process, allowing the heat pipe to be directly welded to the heat sink surface, which enhances structural performance and reduces the environmental burden of the process. Furthermore, since the thermal conductivity of copper is approximately four times that of nickel, this design significantly reduces thermal resistance and improves heat dissipation efficiency. Experimental data shows that the heat dissipation performance of the heat dissipation module using this embodiment of the invention is improved by approximately 3% to 5%. More importantly, the material cost of copper is lower than that of nickel, thus reducing the overall manufacturing cost of the heat dissipation module and achieving a more environmentally friendly manufacturing process. Attached Figure Description

[0016] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings, wherein:

[0017] Figure 1 This is a perspective view showing the heat dissipation module of an embodiment of the present utility model.

[0018] Figure 2 This is an exploded view showing a partial structure of the heat dissipation module according to an embodiment of the present invention.

[0019] Figure 3 This shows the detailed structure of the heat pipe in an embodiment of the present invention.

[0020] Figure 4 This describes the manufacturing process of the heat dissipation module according to an embodiment of the present invention.

[0021] Figure 5 This is a schematic diagram of a circuit board showing an embodiment of the present invention.

[0022] Figure label:

[0023] M: Heat dissipation module

[0024] 1: Radiator

[0025] 10: Radiator surface

[0026] 11: Heat dissipation fins

[0027] 111: Folded Section

[0028] 112: Extension Section

[0029] 2: Copper coating

[0030] 3: Welding materials

[0031] 4: Heat pipe

[0032] 5: Circuit board

[0033] 6: Heat source

[0034] 7: Fan

[0035] S1, S2, S3, S4: Steps Detailed Implementation

[0036] Figure 1 This is a perspective view showing the heat dissipation module of an embodiment of the present utility model. Figure 2 This is an exploded view showing a partial structure of the heat dissipation module according to an embodiment of the present invention. Figure 3 This is a detailed structural diagram of the heat pipe according to an embodiment of the present invention. See reference. Figure 1 and Figure 2 The heat dissipation module M of this embodiment includes a heat sink 1, a copper coating 2, a welding material 3, and a heat pipe 4. The heat sink 1 includes a heat sink surface 10. The copper coating 2 is uniformly coated on the heat sink surface 10, and the heat pipe 4 is securely connected to the copper coating 2 through the welding material 3. This design ensures that the heat dissipation module has good structural stability and thermal conductivity.

[0037] Reference Figure 2In one embodiment of this invention, the heat sink 1 further includes a plurality of heat dissipation fins 11. These fins are arranged parallel to each other, forming a regular structure that effectively increases the total heat dissipation area of ​​the heat sink, thereby improving heat dissipation efficiency. This design is particularly important under high heat load conditions, significantly reducing system temperature and ensuring stable equipment operation. The above disclosure does not limit the invention; for example, in another embodiment, at least some of the fins 11 may be arranged or stacked in other irregular ways.

[0038] Reference Figure 2 In one embodiment, the radiator 1 is made of aluminum. Aluminum has high thermal conductivity, low density, and low manufacturing cost, making it an ideal material for radiator fabrication. Furthermore, the malleability of aluminum allows it to be processed into complex structures, further enhancing the performance of the radiator. The above disclosure does not limit the present invention; in another embodiment, the radiator 1 may also be made of other materials.

[0039] Reference Figure 2 In one embodiment, the heat sink surface 10 is a roughened surface. This roughening significantly enhances the adhesion of the copper coating 2, ensuring its stability and durability over long-term use. Furthermore, the roughened surface increases the surface area, further improving the heat dissipation performance of the heat sink.

[0040] Reference Figure 2 In one embodiment, the copper coating 2 is formed on the surface 10 of the heat sink using a hot-melt spraying technique. This technique achieves a high-quality coating effect by heating the copper material to a molten state and uniformly spraying it onto the heat sink surface using a high-pressure gas flow. Compared to traditional chemical nickel plating processes, this method has the advantages of being environmentally friendly, efficient, and lower in cost.

[0041] Reference Figure 2 In one embodiment of this invention, each heat dissipation fin 11 includes a folded section 111 and an extended section 112. The folded section 111 is connected to one end of the extended section 112, forming a stable and efficient structural configuration. This design not only increases the mechanical strength of the heat dissipation fins but also improves heat dissipation efficiency, especially maintaining stability when the heat sink is subjected to high-speed airflow.

[0042] Reference Figure 2 In one embodiment of the present invention, each folded segment 111 includes an outer surface, and the plurality of outer surfaces together constitute the roughened surface 10 of the heat sink.

[0043] Figure 4 This is a flowchart illustrating the manufacturing process of the heat dissipation module according to an embodiment of the present invention. (Refer to...) Figure 4In one embodiment, an aluminum foil is first provided (S1). Next, the aluminum foil is roughened (S2) to enhance its surface structure and adhesion. Subsequently, a uniform copper coating is formed on the surface of the aluminum foil using a hot melt spraying technique (S3). Finally, the aluminum foil is cut into the desired heat dissipation fin shape (S4). In other words, the multiple heat dissipation fins are cut from the roughened and copper-coated aluminum foil, a process that ensures the heat dissipation module has excellent structural robustness and superior functionality.

[0044] In one embodiment of this invention, the aforementioned heat dissipation fins 11 are assembled into the heat sink 1 in a series connection. The heat pipe 4 is securely fixed to the copper coating 2 via the welding material 3, achieving efficient heat conduction. This combination fully utilizes the overall performance of the heat dissipation module and is suitable for the heat dissipation needs of various high-performance laptops.

[0045] Figure 5 This is a schematic diagram showing a circuit board according to an embodiment of the present invention. (See attached reference.) Figure 1 and Figure 5 In another embodiment, the present invention provides a laptop computer including a circuit board 5, a heat source 6, the aforementioned heat dissipation module M, and a fan 7. The heat source 6 is disposed on the circuit board 5 and achieves efficient thermal connection with the heat dissipation module M through the heat pipe 4. The fan 7 is fixed to the heat sink 1 and continuously performs heat dissipation operations, ensuring that the laptop computer maintains stability and performance even under high load. This heat dissipation module design is simple in structure, highly efficient, and low in cost, providing an optimized heat dissipation solution for modern laptop computers.

[0046] In an embodiment of this invention, a copper coating is applied to the surface of the heat sink. The heat pipe is welded to the heat sink surface through the welding material and the copper coating. Specifically, the copper coating is applied using a hot melt spraying technique. This technique heats copper particles to a molten state and then sprays them at high speed onto an aluminum surface that cannot be directly welded, making it weldable. This embodiment of the invention uses this technique to replace the traditional chemical nickel plating process, allowing the heat pipe to be directly welded to the heat sink surface, which enhances structural performance and reduces the environmental burden of the process. Furthermore, since the thermal conductivity of copper is approximately four times that of nickel, this design significantly reduces thermal resistance and improves heat dissipation efficiency. Experimental data shows that the heat dissipation performance of the heat dissipation module using this embodiment of the invention is improved by approximately 3% to 5%. More importantly, the material cost of copper is lower than that of nickel, thus reducing the overall manufacturing cost of the heat dissipation module and achieving a more environmentally friendly manufacturing process.

[0047] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the claims.

Claims

1. A heat dissipation module, characterized by, The heat sink includes: a heat sink surface; a copper coating applied to the heat sink surface; a solder material; and a heat pipe, wherein the heat pipe is connected to the copper coating through the solder material. The heat sink includes a plurality of heat sink fins, at least some of the plurality of heat sink fins are arranged in parallel to each other.

2. The heat dissipating module of claim 1, wherein, The heat sink includes aluminum.

3. The heat dissipating module of claim 2, wherein, The heat sink surface includes a roughened surface.

4. The heat dissipating module of claim 2, wherein, The copper coating is formed on the heat sink surface by thermal spraying.

5. The heat dissipating module of claim 4, wherein, Each heat sink fin includes a folded section and an extended section, the folded section is connected to one end of the extended section.

6. The heat dissipating module of claim 5, wherein, Each folded section includes an outer surface, the plurality of outer surfaces collectively form the roughened surface.

7. The heat dissipating module of claim 6, wherein, The plurality of heat sink fins are cut from an aluminum foil, the aluminum foil is roughened before being cut.

8. The heat dissipating module of claim 7, wherein, The aluminum foil is roughened, the copper coating is formed on the aluminum foil by thermal spraying, and the aluminum foil is cut into the plurality of heat sink fins.

9. The heat dissipating module of claim 8, wherein, The heat sink includes:

10. A notebook computer, comprising: a circuit board; a heat source disposed on the circuit board; the heat sink module of any one of claims 1 to 4, wherein the heat pipe is thermally connected to the heat source; and a fan coupled to the circuit board and connected to the heat sink to dissipate heat from the heat sink. ​ ​

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