Feeding and discharging workbench of groove type RCA cleaning equipment for silicon wafer processing

Abstract

The utility model provides a feeding and discharging workbench of groove type RCA cleaning equipment for silicon wafer processing. The feeding and discharging workbench comprises a workbench plane, a lifting translation mechanism, a clamping mechanism and a bearing mechanism. The clamping mechanism comprises a clamping arm, an upper driven clamping jaw and a lower driving clamping jaw, the clamping arm is driven by the lifting translation mechanism, the lower driving clamping jaw is arranged at the lower end of the clamping arm, the upper driven clamping jaw is hinged to the upper end of the clamping arm through a hinge shaft, and the upper driven clamping jaw and the clamping arm are elastically supported through a torsional spring; and when the lifting translation mechanism drives the lower driving clamping jaw on the clamping arm to cooperatively clamp the bearing bottom plate, the lower driving clamping jaw rotates along the hinge shaft and is in friction fit with the bearing side plate. The silicon wafer cleaning device is reasonable in structural design, the clamping mechanism can effectively clamp the bearing mechanism, shaking in the feeding and discharging process is avoided, and the silicon wafer cleaning quality is effectively guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer processing technology, and in particular to a loading and unloading worktable for a tank-type RCA cleaning equipment for silicon wafer processing. Background Technology

[0002] Tank-type RCA cleaning equipment is a specialized cleaning system designed for silicon wafer processing. Through specific cleaning solutions and process steps, it effectively removes organic and inorganic impurities from the surface of silicon wafers, ensuring surface cleanliness and providing high-quality wafers for subsequent semiconductor manufacturing processes. Existing tank-type RCA cleaning equipment typically has multiple cleaning tanks, each containing cleaning solutions according to the RCA process requirements. Simultaneously, tank-type RCA cleaning equipment also requires loading and unloading workbenches to quickly, accurately, and safely transport silicon wafers to each cleaning tank for cleaning operations.

[0003] Existing loading and unloading workbenches typically include a lifting and translating mechanism, a clamping mechanism, and a carrying mechanism. During loading and unloading, the operating position usually arranges the silicon wafers on a basket, which is then placed on the carrying mechanism. Under the control of the lifting and translating mechanism, the clamping mechanism moves up and down to the position of the carrying mechanism, effectively clamping the basket or the carrying mechanism containing the basket, and then moves it to the corresponding cleaning tank for cleaning. After cleaning, the clamping mechanism continues to effectively clamp the basket or the carrying mechanism containing the basket, and the lifting and translating mechanism resets the basket or the carrying mechanism.

[0004] In this process, the lifting and translation mechanism is generally driven by electric or pneumatic means, and uses transmission devices such as lead screws and slide rails to move in the height and horizontal directions. In this lifting and translation driving process, the ordinary clamping mechanism usually retracts inward from both sides of the basket or the carrying mechanism to clamp from the bottom of the basket or the carrying mechanism. There is no special clamping and positioning operation for the upper part of the basket or the carrying mechanism. If both the upper and lower parts involve active clamping mechanisms, the clamping mechanism design will be cumbersome and the linkage mechanism will be complicated. Utility Model Content

[0005] The technical problem to be solved by this utility model is: in order to overcome the shortcomings of the prior art, this utility model provides a loading and unloading worktable for a tank-type RCA cleaning equipment for silicon wafer processing. The bearing mechanism is effectively designed to facilitate stable clamping by the clamping mechanism and avoid shaking during the loading and unloading process. In addition, a flow stabilizing hole is opened on the bearing base plate, which can effectively reduce the impact of the cleaning fluid on the silicon wafers in the basket during the loading and unloading process, and effectively ensure the cleaning quality of the silicon wafers.

[0006] The technical solution adopted by this utility model to solve its technical problem is: a loading and unloading worktable for a tank-type RCA cleaning equipment for silicon wafer processing, installed on a tank-type RCA cleaning machine, including a worktable plane, a lifting and translating mechanism, a clamping mechanism, and a carrying mechanism; the carrying mechanism is placed on the worktable plane, and the silicon wafer is placed inside the carrying mechanism; the lifting and translating mechanism drives the clamping mechanism to move in the horizontal and vertical directions; the carrying mechanism includes a carrying base plate and carrying side plates fixed on both sides of the carrying base plate; the clamping mechanism includes clamping arms and an upper... The clamping arm comprises a passive gripper and a lower active gripper. The clamping arm is driven by a lifting and translating mechanism. The lower active gripper is located at the lower end of the clamping arm. The upper passive gripper is hinged to the upper end of the clamping arm via a hinge shaft. The upper passive gripper and the clamping arm are elastically supported by a torsion spring. One end of the torsion spring is fixed to the upper passive gripper, and the other end is fixed to the clamping arm. The axis of the torsion spring is the axis of the hinge shaft. When the lower active gripper on the clamping arm is engaged with the bearing base plate by the lifting and translating mechanism, it rotates along the hinge shaft and engages with the bearing side plate through friction.

[0007] In the above scheme, when the clamping mechanism clamps the bearing mechanism, the lower active gripper effectively positions and clamps the bearing base plate, and the clamping action drives the upper passive gripper to position with the bearing side plate. The bearing mechanism is positioned from both the upper and lower ends, which can effectively avoid the bearing mechanism shaking during loading and unloading when only the lower side is positioned, and further improves the reliability and stability of clamping.

[0008] Preferably, the movement direction of the upper passive gripper relative to the supporting base plate is opposite to the movement direction of the corresponding lower active gripper. That is, for one side of the supporting mechanism, the supporting mechanism is clamped and positioned from both sides of the supporting side plate, further improving the reliability of clamping.

[0009] Furthermore, the reverse movement of the upper passive gripper and the lower active gripper is achieved through the U-shaped structure of the upper passive gripper. When the upper passive gripper engages with the bearing side plate, it forms an inverted U-shape. This U-shape includes an arc-shaped connector, a long side, and a short side. The long and short sides are connected to the two ends of the arc-shaped connector to form the U-shape, with the length of the long side being greater than the length of the short side. The outer inner surface of the short side protrudes to form an auxiliary gripping portion, which abuts against the bearing side plate during frictional engagement. When the lower active gripper moves relative to the bearing side plate, the long side of the upper passive gripper first contacts the outer surface of the bearing side plate and is pushed outward by the bearing side plate during this contact, causing it to rotate in the opposite direction along the hinge axis. This, in turn, causes the auxiliary gripping portion of the short side to rotate and abut against the inner surface of the bearing side plate, completing the clamping and positioning of the bearing mechanism by the upper passive gripper.

[0010] Furthermore, the inner surface of the outer end of the long side portion has a protruding contact portion, and the outer edge of the contact portion has a spherical structure. The spherical structure allows the inner surface of the long side portion to effectively transmit and convert pressure into rotation of the hinge shaft when subjected to pressure from the outer surface of the bearing side plate, and effectively overcome the torsion spring force.

[0011] Furthermore, the side of the clamping arm connected to the lower active gripper contacts and engages with the outer side of the corresponding bearing side plate when the lower active gripper engages with the bearing base plate. During clamping, the clamping arm engages with the bearing side plate from the outside, forming a clamping operation of the lower active gripper, clamping arm, and upper passive gripper from bottom to top on the bearing device, further ensuring the reliability of clamping and reducing possible shaking during loading and unloading.

[0012] Furthermore, the workbench surface is a grid support, and a receiving tank for collecting waste liquid is located below the grid support. The cooperation between the grid support and the receiving tank can collect the cleaning liquid remaining on the support device after cleaning.

[0013] Furthermore, the support base plate is spaced apart with several flow-stabilizing holes, which are tapered through-holes that are wider at the top and narrower at the bottom. Through this tapered through-hole design, when the support device is lowered into the cleaning tank, the cleaning fluid enters the support device through the tapered holes. At this time, due to the design of the larger diameter at the top and smaller diameter at the bottom, the pressure of the cleaning fluid entering the support device from bottom to top is lower than the pressure of a normal straight hole, thereby reducing the impact on the silicon wafer.

[0014] The beneficial effects of this utility model are that the loading and unloading worktable of the trough-type RCA cleaning equipment for silicon wafer processing provided by this utility model, through reasonable structural design, the clamping mechanism can effectively clamp the carrying mechanism, avoiding the shaking of the carrying mechanism during loading and unloading after the basket is loaded, thus affecting the cleaning quality of the silicon wafer. At the same time, a flow stabilizing hole is opened on the carrying base plate of the carrying mechanism. When the carrying base plate falls, the tapered hole with a larger top and a smaller bottom can avoid excessive impact of the cleaning fluid on the silicon wafer, effectively ensuring the cleaning quality of the silicon wafer. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0016] Figure 1 This is a schematic diagram of the clamping action in an embodiment of the present invention (the arrow indicates the direction of movement).

[0017] Figure 2 This is a schematic diagram of an embodiment of the present invention when it is not clamped.

[0018] Figure 3 yes Figure 1 Enlarged diagram of point A in the middle.

[0019] Figure 4This is a side view of an embodiment of the present utility model.

[0020] In the figure: 1. Lifting and translation mechanism; 2. Clamping mechanism; 21. Upper passive gripper; 211. Short side; 212. Hinge shaft; 213. Arc-shaped connector; 214. Auxiliary clamping part; 215. Long side; 216. Contact part; 22. Clamping arm; 23. Lower active gripper; 3. Bearing mechanism; 31. Bearing side plate; 32. Bearing base plate; 321. Conical through hole; 4. Workbench plane; 5. Liquid receiving tank; 6. Silicon wafer. Detailed Implementation

[0021] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the present invention. Therefore, they only show the components relevant to the present invention. Orientations and references (e.g., up, down, left, right, etc.) are only used to aid in the description of the features in the drawings. Therefore, the following specific embodiments are not intended to be restrictive, and the scope of the claimed subject matter is defined solely by the appended claims and their equivalents.

[0022] Example 1:

[0023] like Figures 1 to 4 The loading and unloading worktable of a tank-type RCA cleaning equipment for silicon wafer processing shown is an embodiment of this utility model. The loading and unloading worktable is installed on a tank-type RCA cleaning machine and includes a worktable plane 4, a lifting and translating mechanism 1, a clamping mechanism 2, and a bearing mechanism 3.

[0024] like Figure 1 As shown, the workbench plane 4 is the workbench of a tank-type RCA cleaning machine. In this embodiment, the workbench plane 4 is a grid support, and a liquid receiving tank 5 is located below the grid support to collect waste liquid. The cooperation between the grid support and the liquid receiving tank 5 can collect the cleaning liquid remaining on the carrier device after cleaning. The carrier mechanism 3 in this embodiment includes a carrier base plate 32 and carrier side plates 31 fixed on both sides of the carrier base plate 32. The bottom surface of the carrier base plate 32 has clamping grooves on both sides corresponding to the clamping mechanism 1, allowing the lower active gripper 23 to enter and engage. The carrier mechanism 3 is used to place silicon wafers. The carrier mechanism 3, which carries silicon wafers, is placed on the workbench plane 4, awaiting the next process, whether it is to be cleaned, transferred during cleaning, or after cleaning.

[0025] The lifting and translating mechanism 1 drives the clamping mechanism 2 to move horizontally and vertically. In this embodiment, the lifting and translating mechanism 1 can be implemented using, but is not limited to, a cable chain, a track combined with an electric push rod, or a cylinder, etc., to drive the clamping mechanism 2 to move vertically and horizontally; these details will not be elaborated here. For the carrying mechanism 3, clamping mechanisms 2 are typically symmetrically arranged on both sides of the carrying mechanism 3. When clamping the carrying mechanism 3, the clamping mechanisms 2 on both sides move synchronously towards each other. When the carrying mechanism 3 is being loaded and unloaded for cleaning, the clamping mechanisms 2 on both sides move synchronously and in the same direction.

[0026] Specifically, such as Figure 3 As shown, the clamping mechanism 2 includes a clamping arm 22, an upper passive gripper 21, and a lower active gripper 23. The clamping arm 22 is driven by the lifting and translating mechanism 1. The lower active gripper 23 is fixed to the inner side of the lower end of the clamping arm 22. The upper passive gripper 21 is hinged to the upper end of the clamping arm 22 via a hinge shaft 212. The upper passive gripper 21 and the clamping arm 22 are elastically supported by a torsion spring. One end of the torsion spring is fixed to the upper passive gripper 21, and the other end is fixed to the clamping arm 22. The axis of the torsion spring is the axis of the hinge shaft 212.

[0027] In this embodiment, the upper passive gripper 21 and the lower active gripper 23 on the same gripping arm 22 move in opposite directions relative to the bearing mechanism 3 during gripping. The movement direction of the upper passive gripper 21 relative to the bearing base plate 32 is opposite to the movement direction of the corresponding lower active gripper 23. That is, for one side of the bearing mechanism 3, the bearing mechanism 3 is clamped and positioned from both sides of the bearing side plate 31, further improving the reliability of gripping.

[0028] like Figure 3 As shown, the reverse movement of the two is achieved through the U-shaped structure of the upper passive gripper 21. Specifically, when the upper passive gripper 21 is engaged with the bearing side plate 31, it forms an inverted U-shaped structure. The U-shaped structure includes an arc-shaped connector 213, a long side 215, and a short side 211. The long side 215 and the short side 211 are respectively connected to the two ends of the arc-shaped connector 213 to form a U-shape. The length of the long side 215 is greater than the length of the short side 211.

[0029] The long side portion 215 has a contact portion 216 protruding from its inner outer surface, and the outer edge of the contact portion 216 has a spherical structure. The short side portion 211 has an auxiliary clamping portion 214 protruding from its inner outer surface. When the upper passive gripper 21 is in frictional engagement with the bearing side plate 31, the auxiliary clamping portion 214 abuts against the bearing side plate 31. Through the spherical contact portion 216, during the rotation of the upper passive gripper 21, when the inner surface of the long side portion 215 is subjected to pressure from the outer surface of the bearing side plate 31, it can effectively transmit and convert the pressure into driving the hinge shaft 212 to rotate and effectively overcome the torsion spring force, thereby driving the short side portion 211 to move closer to the inner surface of the bearing side plate 31 until it contacts and applies pressure, so that the auxiliary clamping portion 214 presses against the inner surface of the bearing side plate 31 and forms a frictional engagement with the inner surface of the bearing side plate 31.

[0030] Work process:

[0031] like Figure 2 and Figure 1 As shown, the supporting mechanism 3 carries the silicon wafer and places it on the worktable plane 4. The lifting and translating mechanism 1 drives the clamping arm 22 of the clamping mechanism 2 to move up, down, and left and right. When it is necessary to clamp the supporting mechanism 3, the clamping mechanisms 2 on both sides move to both sides of the supporting mechanism 3 under the drive of the lifting and translating mechanism 1 and move towards each other relative to the supporting mechanism 3.

[0032] At this time, the lower active gripper 23 moves relative to the bearing side plate 31. The long side 215 of the upper passive gripper 21 first contacts the outer side of the bearing side plate 31 and is pushed outward by the bearing side plate 31 during the contact process. The upper passive gripper 21 rotates in the opposite direction along the hinge axis 212, thereby driving the auxiliary gripping part 214 of the short side 211 to rotate and abut against the inner side of the bearing side plate 31, thus completing the gripping and positioning of the bearing mechanism 3 by the upper passive gripper 21.

[0033] During unlocking, the lifting and translating mechanism 1 drives the clamping arm 22 to move outward relative to the bearing mechanism 3, the lower active clamping claw 23 disengages from the bearing base plate 32, the contact part 216 of the upper passive clamping claw 21 moves outward relative to the bearing side plate 31, and the upper passive clamping claw 21 rebounds in the opposite direction under the action of the torsion spring, the auxiliary clamping part 214 disengages from the inner wall of the bearing side plate 31, and the unlocking of the upper end of the bearing mechanism 3 is completed.

[0034] In this embodiment, the position of the upper passive gripper 21 needs to be reasonably set according to the height of the bearing mechanism 3, so that the short side 211 of the upper passive gripper 21 will not interfere with the bearing side plate 31 during rotation. At the same time, during external support clamping and positioning, the side of the clamping arm 22 connected to the lower active gripper 23 contacts and engages with the outer side of the corresponding bearing side plate 31 when the lower active gripper 23 engages with the bearing base plate 32. In this way, the clamping arm 22 engages with the bearing side plate 31 from the outside, forming the lower active gripper 23, clamping arm 22, and upper passive gripper 21, clamping the bearing device from bottom to top, which can further ensure the reliability of clamping and reduce the shaking that may be caused during loading and unloading.

[0035] Example 2:

[0036] like Figure 1 and Figure 3 The loading and unloading worktable of a tank-type RCA cleaning equipment for silicon wafer processing shown is Embodiment 2 of this utility model. Embodiment 2 further improves the supporting mechanism 3 based on Embodiment 1.

[0037] Specifically, the support base plate 32 of the support mechanism 3 has several flow-stabilizing holes spaced apart. These flow-stabilizing holes are tapered through-holes 321, wider at the top and narrower at the bottom. Through the tapered through-holes 321, when the support device is lowered into the cleaning tank, the cleaning fluid enters the support device through the tapered holes. At this time, due to the design of the larger diameter at the top and smaller diameter at the bottom, the pressure of the cleaning fluid entering the support device from bottom to top is lower than that of a normal straight hole, thereby reducing the impact on the silicon wafer.

[0038] The loading and unloading worktable of the trough-type RCA cleaning equipment for silicon wafer processing is designed in this way. Through reasonable structural design, a flow stabilizing hole is opened on the support base plate 32 of the support mechanism 3. When the support plate falls, the tapered hole with a larger top and a smaller bottom can avoid excessive impact of the cleaning fluid on the silicon wafer, thus further ensuring the cleaning quality of the silicon wafer.

[0039] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A loading and unloading workbench for a tank-type RCA cleaning equipment for silicon wafer processing, installed on a tank-type RCA cleaning machine, characterized in that: It comprises a workbench plane, a lifting and translating mechanism, a clamping mechanism and a bearing mechanism; the bearing mechanism is placed on the workbench plane, and a silicon wafer is arranged in the bearing mechanism; the lifting and translating mechanism drives the clamping mechanism to move in the horizontal direction and the height direction; The bearing mechanism comprises a bearing bottom plate and bearing side plates fixed on both sides of the bearing bottom plate. The clamping mechanism comprises a clamping arm, an upper passive jaw and a lower active jaw; the clamping arm is driven by the lifting and translating mechanism; the lower active jaw is arranged at the lower end of the clamping arm; the upper passive jaw is hingedly arranged at the upper end of the clamping arm through a hinge shaft; the upper passive jaw and the clamping arm are elastically supported through a torsional spring; one end of the torsional spring is fixed to the upper passive jaw, and the other end is fixed to the clamping arm; the axis of the torsional spring is the hinge shaft axis; when the lower active jaw on the clamping arm driven by the lifting and translating mechanism cooperates with the clamping of the bearing bottom plate, the lower active jaw rotates along the hinge shaft and frictionally cooperates with the bearing side plate.

2. The loading and unloading worktable of the slot-type RCA cleaning equipment for silicon wafer processing according to claim 1, characterized in that: The movement direction of the upper passive jaw relative to the bearing bottom plate is opposite to the movement direction of the corresponding lower active jaw.

3. The loading and unloading workbench of a tank-type RCA cleaning equipment for silicon wafer processing as described in claim 2, characterized in that: The upper passive jaw has an inverted U-shaped structure when cooperating with the clamping of the bearing side plate; the U-shaped structure comprises an arc-shaped connecting piece, a long side part and a short side part; the long side part and the short side part are connected to the two ends of the arc-shaped connecting piece to form a U-shaped structure; the length of the long side part is greater than the length of the short side part. The outer end of the short side part has an auxiliary clamping part; when the upper passive jaw frictionally cooperates with the bearing side plate, the auxiliary clamping part abuts against the bearing side plate.

4. The loading and unloading worktable of the slot-type RCA cleaning equipment for silicon wafer processing according to claim 3, characterized in that: The outer end of the long side part has a contact part; the outer edge surface of the contact part has a spherical structure.

5. The loading and unloading worktable of the slot-type RCA cleaning equipment for silicon wafer processing according to claim 1, characterized in that: The side surface of the clamping arm connected to the lower active jaw contacts and cooperates with the outer side surface of the corresponding bearing side plate when the lower active jaw cooperates with the clamping of the bearing bottom plate.

6. The loading and unloading worktable of the slot-type RCA cleaning equipment for silicon wafer processing according to claim 1, characterized in that: The workbench plane is a grid support; the grid support has a liquid receiving groove below the position of the grid support to receive waste liquid.

7. The loading and unloading worktable of the slot-type RCA cleaning equipment for silicon wafer processing according to claim 1, characterized in that: The bearing bottom plate is provided with a plurality of stable flow holes; the stable flow holes are tapered through holes with the upper part being larger and the lower part being smaller.

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