Miniaturized high-density interconnected PCB (Printed Circuit Board)

Abstract

The utility model discloses a miniaturized high-density interconnection PCB, which comprises a first circuit board, the bottom of a first insulating board is movably connected with an inner board, the bottom of a second insulating board is movably connected with a second circuit board, and the top and the bottom of the inner board are both provided with limiting grooves. The bottom of the first circuit board and the top of the second circuit board are fixedly connected with limiting columns. A reinforcing frame is clamped in the concave groove, supporting rods are fixedly connected to the top and the bottom of the reinforcing frame, and the ends, away from the reinforcing frame, of the two supporting rods are attached to the bottom of the first circuit board and the top of the second circuit board correspondingly. According to the utility model, through the arrangement of the limiting columns, the through holes, the limiting grooves, the reinforcing frames and the supporting rods, the supporting strength in the device is enhanced, damage caused by extrusion is avoided, and through the arrangement of the copper pipes, the first connecting copper columns and the second copper columns, the heat dissipation performance of the device is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of draining rack especially relates to miniaturization high density interconnection PCB board. BACKGROUND

[0002] Miniaturization high density interconnection PCB (Printed Circuit Board) is a kind of technology that realizes higher circuit density and functional integration in limited space, and this technology is usually called high density interconnection (HDI) technology, which allows the circuit on the board to be more fine, and the component layout is more compact, thereby meeting the demand of modern electronic equipment to miniaturization, light weight and high performance.

[0003] The existing miniaturization high density interconnection PCB needs to set a cavity in its interior when assembling, which affects the strength of the whole high density interconnection PCB and is easy to be damaged when extruded, so the miniaturization high density interconnection PCB is needed. UTILITY MODEL CONTENT

[0004] The utility model discloses a miniaturization high density interconnection PCB to solve the shortcomings in the prior art.

[0005] In order to realize the above-mentioned purpose, the utility model adopts the following technical scheme: miniaturization high density interconnection PCB, including first circuit board, the bottom of first circuit board swing joint has first insulating plate, the bottom of first insulating plate swing joint has inner board, the bottom of inner board swing joint has second insulating plate, the bottom of second insulating plate swing joint has second circuit board, the inside of first insulating plate and second insulating plate is all set up with through -hole, the top and bottom of inner board are all set up with limit slot, the bottom of first circuit board and the top of second circuit board are all fixedly connected with limit post, and limit post passes through through -hole and is engaged with the inside of limit slot;

[0006] The recessed groove is provided between the inner plate and the first and second insulating plates, the recessed groove is engaged with the reinforcing frame, the top and bottom of the reinforcing frame are fixedly connected with the support rods, and the ends of the two support rods away from the reinforcing frame are respectively attached to the bottom of the first circuit board and the top of the second circuit board.

[0007] Further, the top of the first circuit board is fixedly connected with the first electronic element, the top of the second circuit board is fixedly connected with the second electronic element, and the second electronic element is located between the first circuit board and the second circuit board.

[0008] Further, the reinforcing frame is internally provided with a first connecting hole and a second connecting hole, and the number of the first connecting hole and the second connecting hole is two.

[0009] Further, the two first connecting holes correspond to the positions of the first electronic elements, and the two second connecting holes correspond to the positions of the second electronic elements.

[0010] Further, the inner plate is internally fixedly connected with a copper pipe, the circumferential surface of the copper pipe is fixedly connected with a first connecting copper ring and a second connecting copper ring, and the first connecting copper ring and the second connecting copper ring are symmetrically distributed.

[0011] Further, the first connecting copper ring is threadedly connected with a first connecting copper column at one end away from the copper pipe, and the circumferential surface of the first connecting copper column is fixedly connected with a first spacing copper ring.

[0012] The second connecting copper ring is threadedly connected with a second connecting copper column at one end away from the copper pipe, the circumferential surface of the second connecting copper column is fixedly connected with a second spacing copper ring, and one end of the first connecting copper column away from the first connecting copper ring and one end of the second connecting copper column away from the second connecting copper ring are rotatably connected with a copper wire.

[0013] The utility model has the advantages of the following beneficial effects:

[0014] Compared with the prior art, the miniaturized high-density interconnection PCB is provided with a limiting column, a through hole, a limiting slot, a reinforcing frame and a supporting rod, the reinforcing frame is installed in the concave groove between the first insulating plate and the second insulating plate during assembly of the device, the first circuit board and the second circuit board are supported by the supporting rod, thereby enhancing the supporting strength of the device, avoiding damage caused by extrusion, and the limiting column is inserted through the through hole and engaged with the limiting slot, thereby realizing integrated combination of the device and improving the convenience of assembly of the device.

[0015] Compared with the prior art, the miniaturized high-density interconnection PCB is provided with a copper pipe, a first connecting copper column and a second copper column, the first insulating plate and the first circuit board are separated by the first spacing copper ring and the second spacing copper ring during installation of the device, the second spacing copper ring and the second insulating plate are separated, and the first connecting copper column and the second connecting copper column are connected with the first connecting copper ring and the second connecting copper ring, respectively, thereby facilitating assembly of the device, facilitating heat dissipation of the device, and improving the heat dissipation performance of the device. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 The utility model provides an overall structure schematic view;

[0017] Figure 2 The utility model provides an internal structure schematic view first visual angle;

[0018] Figure 3 The utility model provides a Figure 2 The enlarged view of A in the middle part;

[0019] Figure 4 The utility model provides a second view angle of internal structure schematic diagram;

[0020] Figure 5 The utility model provides a third view angle of internal structure schematic diagram;

[0021] Figure 6 The utility model provides a Figure 5 The enlarged view of B in the middle part;

[0022] Figure 7 The utility model provides a fourth view angle of internal structure schematic diagram;

[0023] Figure 8 The utility model provides a part structure explosion map.

[0024] Legend:

[0025] 1, first circuit board;2, first insulating plate;3, inner plate;4, second insulating plate;5, second circuit board;6, limiting post;7, through hole;8, limiting groove;9, first electronic component;10, copper pipe;11, first connecting copper ring;12, first connecting copper post;13, first interval copper ring;14, copper wire;15, second connecting copper ring;16, second connecting copper post;17, second interval copper ring;18, second electronic component;19, reinforcing frame;20, support rod;21, first connecting hole;22, second connecting hole;23, concave groove. Specific implementation

[0026] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor fall within the scope of the utility model.

[0027] Refer to Figure 1-8The utility model provides a miniaturization high density interconnection PCB board: including first circuit board 1, the bottom of first circuit board 1 swing joint has first insulating plate 2, the bottom of first insulating plate 2 swing joint has inner board 3, the bottom of inner board 3 swing joint has second insulating plate 4, the bottom of second insulating plate 4 swing joint has second circuit board 5, and the inside of first insulating plate 2 and second insulating plate 4 is all seted up and has through -hole 7, and the top and bottom of inner board 3 are all seted up and have limit slot 8, and the bottom of first circuit board 1 and the top of second circuit board 5 are all fixedly connected with limit post 6, and limit post 6 passes through through -hole 7 and is engaged with the inside of limit slot 8,

[0028] The recessed groove 23 is arranged between the inner board 3 and the first insulating plate 2 and the second insulating plate 4, the reinforcing frame 19 is engaged in the recessed groove 23, the supporting rods 20 are fixedly connected to the top and bottom of the reinforcing frame 19, and the ends of the two supporting rods 20 away from the reinforcing frame 19 are attached to the bottom of the first circuit board 1 and the top of the second circuit board 5 respectively. When assembling the device, the reinforcing frame 19 is installed in the recessed groove 23 between the first insulating plate 2 and the second insulating plate 4, and the first circuit board 1 and the second circuit board 5 are supported by the supporting rods 20, thereby enhancing the support strength inside the device and avoiding damage caused by extrusion. The limit post 6 passes through the through-hole 7 and is engaged with the inside of the limit slot 8, thereby realizing the integration of the device and facilitating the convenience of assembling the device.

[0029] The first electronic element 9 is fixedly connected to the top of the first circuit board 1, the second electronic element 18 is fixedly connected to the top of the second circuit board 5, and the second electronic element 18 is located between the first circuit board 1 and the second circuit board 5. The first electronic element 9 and the second electronic element 18 are connected for signal transmission through the first circuit board 1 and the second circuit board 5.

[0030] The first connecting hole 21 and the second connecting hole 22 are arranged in the reinforcing frame 19, and the number of the first connecting hole 21 and the second connecting hole 22 is two. The first connecting hole 21 and the second connecting hole 22 facilitate the air circulation inside the device and avoid air circulation obstruction.

[0031] The two first connecting holes 21 correspond to the positions of the first electronic element 9, and the two second connecting holes 22 correspond to the positions of the second electronic element 18. The second electronic element 18 is installed inside the device, thereby reducing the volume occupied by the device and realizing the miniaturization of the device.

[0032] The copper pipe 10 is fixedly connected to the inside of the inner board 3, the first connecting copper ring 11 and the second connecting copper ring 15 are fixedly connected to the circumferential surface of the copper pipe 10, and the first connecting copper ring 11 and the second connecting copper ring 15 are symmetrically distributed. The copper pipe 10, the first connecting copper ring 11 and the second connecting copper ring 15 facilitate heat dissipation inside the device.

[0033] The first connecting copper ring 11 is threadedly connected with a first connecting copper column 12 at one end away from the copper pipe 10, and the circumferential surface of the first connecting copper column 12 is sleeved with a first spacing copper ring 13.

[0034] The second connecting copper ring 15 is threadedly connected with a second connecting copper column 16 at one end away from the copper pipe 10, the circumferential surface of the second connecting copper column 16 is sleeved with a second spacing copper ring 17, and one end of the first connecting copper column 12 away from the first connecting copper ring 11 and one end of the second connecting copper column 16 away from the second connecting copper ring 15 are both rotationally connected with a copper wire 14.

[0035] The first circuit board 1, the first insulating plate 2, the inner plate 3, the second insulating plate 4 and the second circuit board 5 are spaced apart, and are separated by the first spacing copper ring 13, the first connecting copper ring 11, the second connecting copper ring 15 and the second spacing copper ring 17.

[0036] Working principle: when the device is assembled, the reinforcing frame 19 is installed in the concave groove 23 between the first insulating plate 2 and the second insulating plate 4, and the support rod 20 is used to support the first circuit board 1 and the second circuit board 5, thereby enhancing the support strength of the inside of the device and avoiding damage caused by extrusion, and the limiting column 6 is used to pass through the through hole 7 and be clamped in the limiting groove 8, thereby realizing the integrated combination of the device, which is beneficial to improve the convenience of assembling the device, and the device is designed by multiple layers of stacking when in use, realizes the unprecedented line density and complex circuit layout, effectively reduces the crosstalk and interference between signals, makes the circuit more stable and the performance more superior, and the high density reduces the volume of the device, makes the miniaturization feature more obvious.

[0037] Finally, it should be pointed out that: the above only describes the preferred embodiments of the present application, and is not used to limit the present application, although the present application has been described in detail with reference to the foregoing embodiments, for those skilled in the art, the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced, any modification, equivalent replacement, improvement, etc. within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A miniaturized high-density interconnect PCB board, comprising a first circuit board (1), characterized in that: The bottom of the first circuit board (1) is movably connected to a first insulating plate (2), the bottom of the first insulating plate (2) is movably connected to an inner plate (3), the bottom of the inner plate (3) is movably connected to a second insulating plate (4), the bottom of the second insulating plate (4) is movably connected to a second circuit board (5), the interior of the first insulating plate (2) and the second insulating plate (4) are both provided with through holes (7), the top and bottom of the inner plate (3) are both provided with limiting grooves (8), the bottom of the first circuit board (1) and the top of the second circuit board (5) are both fixedly connected to limiting posts (6), and the limiting posts (6) pass through the through holes (7) and engage with the interior of the limiting grooves (8); A recessed groove (23) is provided between the inner plate (3), the first insulating plate (2), and the second insulating plate (4). A reinforcing frame (19) is engaged inside the recessed groove (23). Support rods (20) are fixedly connected to the top and bottom of the reinforcing frame (19). The ends of the two support rods (20) away from the reinforcing frame (19) are respectively attached to the bottom of the first circuit board (1) and the top of the second circuit board (5).

2. The miniaturized high-density interconnect PCB board according to claim 1, characterized in that: The top of the first circuit board (1) is fixedly connected to a first electronic component (9), and the top of the second circuit board (5) is fixedly connected to a second electronic component (18), and the second electronic component (18) is located between the first circuit board (1) and the second circuit board (5).

3. The miniaturized high-density interconnect PCB board according to claim 2, characterized in that: The reinforcing frame (19) has a first connecting hole (21) and a second connecting hole (22) inside, and there are two of each of the first connecting hole (21) and the second connecting hole (22).

4. The miniaturized high-density interconnect PCB board according to claim 3, characterized in that: The two first connection holes (21) correspond to the positions of the first electronic component (9), and the two second connection holes (22) correspond to the positions of the second electronic component (18).

5. The miniaturized high-density interconnect PCB board according to claim 4, characterized in that: The inner plate (3) is fixedly connected to a copper tube (10), and the circumferential surface of the copper tube (10) is fixedly connected to a first connecting copper ring (11) and a second connecting copper ring (15), and the first connecting copper ring (11) and the second connecting copper ring (15) are symmetrically distributed.

6. The miniaturized high-density interconnect PCB board according to claim 5, characterized in that: The first connecting copper ring (11) is threaded to the end away from the copper tube (10) with a first connecting copper post (12), and a first spacer copper ring (13) is sleeved on the circumferential surface of the first connecting copper post (12). The end of the second connecting copper ring (15) away from the copper tube (10) is threaded with a second connecting copper post (16). The circumferential surface of the second connecting copper post (16) is fitted with a second spacer copper ring (17). The end of the first connecting copper post (12) away from the first connecting copper ring (11) and the end of the second connecting copper post (16) away from the second connecting copper ring (15) are rotatably connected with copper wires (14).

Images