Double-bonding-head die bonding equipment

Abstract

The utility model is suitable for the technical field of semiconductor production, and provides double-bonding-head die bonding equipment, which comprises a workbench, a translation adjusting mechanism, a clamp mechanism, a die supply working group and a die bonding mechanism. By arranging the working components such as the crystal supply working group and the crystal fixing mechanism on the translation mounting plate of the translation adjusting mechanisms, when the size method of a product is changed, only the two translation adjusting mechanisms are needed for synchronous adjustment, and the translation mounting plate can be driven by the driving assembly in the translation adjusting mechanisms to slide relative to the fixed bottom plate; in this way, the two crystal supply working groups and the two crystal fixing mechanisms can be driven to be close to or far away from each other synchronously with the clamp mechanism as the center, and therefore when the size of a product changes, the distance between the two crystal supply working groups and the distance between the two crystal fixing mechanisms can be adjusted according to the size of the product. The overall applicability of the equipment is improved, and the adjusting efficiency of the die bonding equipment is also improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of semiconductor production, especially relates to a double head die bonding equipment. BACKGROUND

[0002] Die bonder is one of the equipment for semiconductor device manufacturing, and its function is to connect semiconductor wafer and other components together. In order to improve the working efficiency of die bonding, most of the die bonder adopts the structure of double head, which can simultaneously work on two parts of the product during die bonding. However, the existing double head die bonder can only process products of specific size, resulting in the technical problem of poor applicability of the double head die bonder. SUMMARY

[0003] The utility model discloses a double head die bonding equipment, which aims to solve the technical problem of poor applicability of the double head die bonder in the prior art.

[0004] The utility model discloses a double head die bonding equipment, which aims to solve the technical problem of poor applicability of the double head die bonder in the prior art.

[0005] Workbench;

[0006] Translation adjustment mechanism, the number is two, two translation adjustment mechanism interval setting is established on the workbench, the translation adjustment mechanism includes fixed bottom plate, translation mounting plate and drive assembly, the fixed bottom plate is established on the workbench, the translation mounting plate is slidably arranged on the fixed bottom plate, and the drive assembly is used to drive the translation mounting plate to be close to or away from another translation mounting plate along the first direction;

[0007] Clamp mechanism, set up on the workbench, and located between two translation adjustment mechanism area, the clamp mechanism is used to install and fix the product, and transports the product to the die bonding position;

[0008] Crystal supply work group, the number is two groups, and is respectively set up on two translation mounting plates, and the crystal supply work group is used to provide crystal ring, and transports the crystal ring to the wafer separation after taking the crystal position; And

[0009] Die bonding mechanism, the number is two groups, and is respectively set up on two translation mounting plates, and the die bonding mechanism is used to transport and install the wafer at the wafer taking position to the product at the die bonding position.

[0010] In an optional embodiment, the double head die bonding equipment further comprises a controller and a position detection unit for detecting whether the translation mounting plate is at zero position, and the controller is electrically connected with the position detection unit and the control end of the drive assembly.

[0011] In an alternative embodiment, the position detecting unit comprises a photoelectric switch arranged on the fixed base plate, and a detecting member arranged on the translation mounting plate and configured to trigger the photoelectric switch when the translation mounting plate moves to a preset position.

[0012] In an alternative embodiment, a scale structure is arranged on the translation mounting plate along the first direction, and an indicating member is further arranged on the fixed base plate and configured to cooperate with the scale structure to indicate the position of the translation mounting plate.

[0013] In an alternative embodiment, a sliding structure is arranged between the fixed base plate and the translation mounting plate, the sliding structure comprising a sliding guide and a moving slider, the sliding guide being arranged on the fixed base plate along the first direction, and the moving slider being fixedly arranged on the translation mounting plate and being slidable along the length direction of the sliding guide.

[0014] In an alternative embodiment, the wafer supply workgroup comprises a wafer ring supply mechanism, a wafer ring carrying mechanism, a wafer ring rotating platform, and a pin mechanism, the wafer ring supply mechanism being configured to accommodate and store wafer rings, the wafer ring rotating platform being configured to support wafer rings and to position a wafer on a wafer ring at a wafer taking position, the wafer ring carrying mechanism being configured to carry wafer rings from the wafer ring supply mechanism to the wafer ring rotating platform, and the pin mechanism being configured to separate the wafer from the wafer ring.

[0015] In an alternative embodiment, the wafer ring rotating platform comprises a rotating frame, a rotating frame support, and a wafer ring translation assembly, the wafer ring translation assembly being arranged on the translation mounting plate, the rotating frame support being arranged on the wafer ring translation assembly, and the rotating frame being rotatably arranged on the rotating frame support and configured to support wafer rings and to adjust the horizontal angle of the wafer rings.

[0016] In an alternative embodiment, the die bonding mechanism comprises a die bonding support, a die bonding position module, a die bonding power unit, and a swing arm assembly, the die bonding support being arranged on the translation mounting plate, the die bonding power unit being movably connected to the die bonding support through the die bonding position module, and the swing arm assembly being connected to the driving end of the die bonding power unit.

[0017] In an alternative embodiment, the double-bonding head die bonding apparatus further comprises an image acquisition unit arranged on the translation mounting plate, the image acquisition unit being located below the working end of the swing arm assembly, and the image acquisition unit being configured to acquire the image of the wafer sucked by the working end of the swing arm assembly when the swing arm assembly is working.

[0018] In an alternative embodiment, the clamp mechanism comprises a clamp base, a first clamp translation part and a second clamp translation part, the clamp base is arranged on the workbench, the first clamp translation part is slidingly arranged on the clamp base, the second clamp translation part is slidingly arranged on the first clamp translation part, and the sliding direction of the first clamp translation part and the sliding direction of the second clamp translation part are arranged at an angle, and the top surface of the second clamp translation part is provided with a mounting plane for preventing and fixing the product.

[0019] The technical effect of the present application is that, compared with the double-head die bonding machine in the prior art, the crystal supply working groups and the die bonding mechanisms are arranged on the translation mounting plate of the translation adjusting mechanism, when the size of the product changes, only two translation adjusting mechanisms need to be adjusted synchronously, the driving assembly in the translation adjusting mechanism can drive the translation mounting plate to slide relative to the fixed bottom plate, and the two crystal supply working groups and the two die bonding mechanisms can be driven to approach or move away from each other synchronously with the clamp mechanism as the center, so that the distance between the two crystal supply working groups and the two die bonding mechanisms can be adjusted according to the size of the product when the size of the product changes, and the overall applicability of the equipment is improved. The crystal supply working groups and the die bonding mechanisms are arranged on the translation mounting plate, and when adjusting, only one component of the translation adjusting mechanism is needed to adjust the crystal supply working groups and the die bonding mechanisms, so that multiple adjustments are avoided, and the efficiency of the die bonding equipment is improved. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the description of the embodiments of the present application or the prior art. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings according to these drawings without creating any creative labor.

[0021] Figure 1 is a structural schematic view of a double-head die bonding equipment provided by the embodiments of the present application;

[0022] Figure 2 is a structural schematic view of a workbench and a translation adjusting mechanism adopted by the embodiments of the present application;

[0023] Figure 3 is Figure 2 is an enlarged structural schematic view of position A in FIG. 8;

[0024] Figure 4 is a structural schematic view of a translation adjusting mechanism adopted by the embodiments of the present application;

[0025] Figure 5 is a control flow schematic diagram of a double-bond head die bonding equipment provided by an embodiment of the present application;

[0026] Figure 6 is a partial structure schematic diagram of a die supply work group adopted by an embodiment of the present application;

[0027] Figure 7 is a structure schematic diagram of a die ring rotating platform adopted by an embodiment of the present application;

[0028] Figure 8 is a structure schematic diagram of a thimble mechanism adopted by an embodiment of the present application;

[0029] Figure 9 is a structure schematic diagram of a die bonding mechanism adopted by an embodiment of the present application;

[0030] Figure 10 is a structure schematic diagram of a clamp mechanism adopted by an embodiment of the present application.

[0031] Explanation of reference signs:

[0032] 1, workbench; 2, translation adjustment mechanism; 21, fixed bottom plate; 22, translation mounting plate; 23, driving assembly; 24, sliding structure; 241, sliding guide rail; 242, moving sliding block; 3, die supply work group; 31, die ring supply mechanism; 32, die ring carrying mechanism; 33, die ring rotating platform; 331, rotating frame body; 332, rotating frame support; 333, die ring translation assembly; 334, rotating power unit; 34, thimble mechanism; 341, thimble assembly; 342, thimble support; 343, thimble translation module; 344, thimble lifting module; 4, die bonding mechanism; 41, die bonding support; 42, die bonding position module; 43, die bonding power unit; 44, swing arm assembly; 5, clamp mechanism; 51, clamp base; 52, first clamp translation part; 53, second clamp translation part; 6, position detection unit; 61, photoelectric switch; 7, detection piece; 8, scale structure; 9, indication component; 10, controller. DETAILED DESCRIPTION

[0033] Embodiments of the present application are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present application, and cannot be understood as a limitation of the present application.

[0034] In the description of the utility model, it is understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model.

[0035] In the embodiment, according to the XYZ rectangular coordinate system defined in the above Figure 1 In the embodiment, according to the XYZ rectangular coordinate system defined in the above

[0036] In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the utility model, the meaning of "multiple" is two or more than two, unless otherwise specifically limited.

[0037] In the utility model, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood broadly, for example, can be fixed connection, can also be detachable connection, or integrated; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the communication or interaction relationship between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0038] In order to make the purpose, technical scheme and advantages of the utility model more clear and obvious, the utility model is further described in detail below in combination with the drawings and examples.

[0039] Please refer to Figures 1 to 4As shown, in the embodiment of the utility model, provide a kind of double head die bonding equipment, the double head die bonding equipment described above includes workbench 1, translation adjustment mechanism 2, clamp mechanism 5, supply crystal work group 3 and die bonding mechanism 4.Translation adjustment mechanism 2 is two and is all set on workbench 1, translation adjustment mechanism 2 includes fixed bottom plate 21, translation mounting plate 22 and drive assembly 23, fixed bottom plate 21 is set on workbench 1, translation mounting plate 22 is slidably set on fixed bottom plate 21, drive assembly 23 is set between fixed bottom plate 21 and translation mounting plate 22, drive assembly 23 is used to drive translation mounting plate 22 and another translation mounting plate 22 close or away along the first direction.Clamp mechanism 5 is set on workbench 1, and it is located between the region of two translation adjustment mechanisms 2, clamp mechanism 5 is used to install and fix product, and transport product to die bonding site.Supply crystal work group 3 is two groups and is respectively set on two translation mounting plates 22, and supply crystal work group 3 is used to provide crystal ring, and after transporting crystal ring to wafer taking site, wafer is separated.Die bonding mechanism 4 is two groups and is respectively set on two translation mounting plates 22, and die bonding mechanism 4 is used to transport wafer at wafer taking site and install to the product at die bonding site.

[0040] Specifically, workbench 1 refers to a support component with a certain height, and a mounting plane can be provided on the top surface of the workbench 1. Other components can be arranged on the mounting plane on the top of the workbench 1, and the other components are supported by the workbench 1. The supply crystal work group 3 refers to a work group composed of multiple mechanisms, which functions to transport the crystal ring to the wafer taking site and separate the wafer from the crystal ring. During the operation of the supply crystal work group 3, the wafer can be separated from the crystal ring after the crystal ring is transported to the wafer taking site, or the wafer can be transported to the wafer taking site after being separated from the crystal ring. The selection can be made according to the production process. The die bonding mechanism 4 refers to a mechanism for transporting the wafer from the wafer taking site to the die bonding site and fixing it on the product. The clamp mechanism 5 refers to a component structure that can clamp and fix the product and adjust the position of the product. The product can be an LED (Light Emitting Diode) product, a PCB (Printed Circuit Board) board, or other products. The wafer can be installed on the specified position of the product by the die bonding mechanism 4. In addition, during the operation of the double head die bonding equipment, the wafer taking site and the die bonding site refer to virtual positions on the equipment. The control system of the equipment can set the coordinates of the wafer taking site and the die bonding site according to the production requirements, and the details are not described here.

[0041] The translation adjusting mechanism 2 refers to the assembly structure for reciprocating movement of the belt object, the fixed base plate 21 and the translation mounting plate 22 both refer to the plate structure with a certain area, and the fixed base plate 21 and the translation mounting plate 22 are generally arranged in parallel. The fixed base plate 21 can be installed on the workbench 1 by clamping or fastener connection and the like. The translation mounting plate 22 can be slidably connected with the fixed base plate 21 through the sliding structure 24, wherein the sliding structure 24 can be a slide rail and slide block structure, and the sliding structure 24 can also be a slide rail and roller structure and the like. The driving assembly 23 refers to the component or assembly for driving the object to move along a straight line, and the driving assembly 23 can be a driving cylinder, a hydraulic cylinder or an electric push rod and the like, and the driving assembly 23 can also be a screw rod structure matched with a motor to realize the movement of the object.

[0042] The double-head die bonder provided by the embodiment of the utility model, compared with the double-head die bonder in the prior art, the crystal supply working group 3 and the die bonding mechanism 4 and the like working components are arranged on the translation mounting plate 22 of the translation adjusting mechanism 2, when the size of the product is changed, only two translation adjusting mechanisms 2 are needed to be adjusted synchronously, the translation mounting plate 22 can be driven to slide relative to the fixed base plate 21 through the driving assembly 23 in the translation adjusting mechanism 2, that is, the two crystal supply working groups 3 and the two die bonding mechanisms 4 can be driven to synchronously approach or move away from each other with the clamp mechanism 5 as the center, so that when the size of the product is changed, the distance between the two crystal supply working groups 3 and the two die bonding mechanisms 4 can be adjusted according to the size of the product, and the overall applicability of the equipment is improved. And the crystal supply working group 3 and the die bonding mechanism 4 are both arranged on the translation mounting plate 22, when adjusting, only one component of the translation adjusting mechanism 2 is needed to adjust, so that the adjustment of the crystal supply working group 3 and the die bonding mechanism 4 and the like multiple working components can be completed, multiple adjustments are avoided, and the efficiency of the die bonding equipment adjustment is improved.

[0043] In one embodiment, please refer to Figure 2 、 Figure 3 and Figure 5The double-bond head die bonding device further comprises a controller 10 and a position detection unit 6 for detecting whether the translation mounting plate 22 is at the zero position, and the controller 10 is electrically connected with the position detection unit 6 and the control end of the driving assembly 23. Specifically, the position detection unit 6 refers to a component or assembly for detecting the movement position of an object, and the position detection unit 6 can adopt an optical, electromagnetic or mechanical mode, and can adopt an encoder, a laser ranging unit or a Hall sensor. The position detection unit 6 can also adopt a proximity switch or a photoelectric switch 61, and the proximity switch or the photoelectric switch 61 is arranged at a preset position on the fixed bottom plate 21 and cooperates with at least part of the translation mounting plate 22. When the translation mounting plate 22 moves to the zero position, the position detection unit 6 is triggered, and the position detection unit 6 sends a signal to the controller 10, so that the controller 10 monitors that the translation mounting plate 22 has reached the zero position. The controller 10 refers to a component that can perform logical operations and control other electrical components, and the controller 10 can adopt a PLC (Programmable Logic Controller), an MCU (Microcontroller Unit) or an industrial computer.

[0044] The zero position generally refers to a position where the translation mounting plate 22 moves a distance of zero in the moving direction, and the specific position of the zero position can be set according to production needs. When the position of the translation mounting plate 22 needs to be moved, the controller 10 is electrically connected with the position detection unit 6 and the control end of the driving assembly 23, and can send a signal to the driving assembly 23 through the controller 10, so that the driving assembly 23 can drive the translation mounting plate 22 to move towards the zero position, and stop the movement of the translation mounting plate 22 after the position detection unit 6 is triggered. At this time, the translation mounting plate 22 is at the zero position. After the translation mounting plate 22 is at the zero position, the controller 10 sends a signal to the driving assembly 23 again, so that the driving assembly 23 drives the translation mounting plate 22 to move a specified distance based on the zero position according to the size of the product. When the distance between the current position of the translation mounting plate 22 and the zero position is known, the controller 10 can directly calculate the distance between the target and the current position, and then send a signal to the driving assembly 23, so that the driving assembly 23 drives the translation mounting plate 22 to move.

[0045] In the embodiment, the cooperation of the controller 10 and the position detection unit 6 can be realized, and the movement position of the translation mounting plate 22 and the zero position can be recorded, so as to avoid the problem that the movement of the translation mounting plate 22 is controlled by visual observation in the prior art, and the error is large and the control is not accurate enough. The movement of the translation mounting plate 22 can be more accurate, so that the overall adjustment of the device is more accurate and fast.

[0046] In addition, the controller 10 can record the position information of the translation mounting plate 22 when producing the corresponding product, so as to quickly switch when producing the same type of product next time, and improve the adaptability of the equipment.

[0047] In an optional embodiment, referring to Figure 4 , the driving assembly 23 comprises a motor, a fixed component and a screw component. The fixed component is fixed on the translation mounting plate 22, the screw component is rotationally arranged on the fixed base plate 21, the screw component penetrates through the fixed component and is threadedly connected with the fixed component, and the driving end of the motor is connected with the screw component for driving the screw component to rotate. Specifically, the fixed component refers to a component with a certain volume, which can be block-shaped, plate-shaped or combined in multiple shapes. The screw component refers to a component with a certain length, which can be rod-shaped or column-shaped, and a first thread can be arranged on the circumference of the screw component. The mounting hole for the screw component to pass through is arranged on the fixed component, and a second thread that is engaged with the first thread is arranged on the inner wall of the mounting hole. The motor refers to a component or assembly that can output torque, which can be a servo motor. When adjusting the position of the translation mounting plate 22, the motor can drive the screw component to rotate around its own axis, thereby driving the fixed component and the translation mounting plate 22 to move along the axis direction of the screw component, so that the adjustment of the translation mounting plate 22 is more convenient and accurate.

[0048] In an embodiment, referring to Figure 3 , the position detection unit 6 comprises a photoelectric switch 61 arranged on the fixed base plate 21, and a detection piece 7 arranged on the translation mounting plate 22 and used to trigger the photoelectric switch 61 when the translation mounting plate 22 moves to the preset position. Specifically, the photoelectric switch 61 refers to a sensor that detects objects by using photoelectric effect. It judges the existence, position or movement state of the object by emitting a light beam and detecting the reflected or blocked light signal. The photoelectric switch 61 usually comprises an emitter for emitting a detection light beam and a receiver for receiving the light beam, and the emitter and the receiver are arranged at a distance from each other. The detection piece 7 refers to a component with a certain volume, which can be plate-shaped, block-shaped or combined in multiple shapes. In use, the photoelectric switch 61 can continuously emit light to the receiver through the emitter, and when the translation mounting plate 22 moves to zero position, the detection piece 7 arranged on the translation mounting plate 22 can move to block the light received by the receiver between the emitter and the receiver, thereby triggering the photoelectric switch 61 and making the zero position detection of the translation mounting plate 22 more convenient.

[0049] In an optional embodiment, referring to Figure 3The detection piece 7 comprises a detection baffle, one end of the detection baffle is fixedly installed on the translation installation plate 22, and the other end of the detection baffle extends to the gap between the emitter and the receiver of the photoelectric switch 61. Specifically, the detection baffle refers to a plate-shaped structure with a certain thickness. By setting the detection piece 7 as the detection baffle, the manufacturing of the detection piece 7 is more convenient and the production cost is saved.

[0050] In one embodiment, referring to Figure 4 The translation installation plate 22 is provided with a scale structure 8 arranged along the first direction, and the fixed bottom plate 21 is further provided with an indicating component 9 for cooperating with the scale structure 8 to indicate the position of the translation installation plate 22. Specifically, the scale structure 8 refers to a plate-shaped structure with a certain length, and a scale for indicating the length is uniformly distributed along the length direction of the scale structure 8. The indicating component 9 refers to a component with a certain volume. The indicating component 9 can usually be a pointer structure, which can indicate the change of the scale when the scale structure 8 moves with the translation installation plate 22, so that the distance moved by the translation installation plate 22 can be displayed according to the change of the scale on the scale structure 8, and the movement of the translation installation plate 22 is more accurate.

[0051] In one embodiment, referring to Figure 4 The fixed bottom plate 21 and the translation installation plate 22 are provided with a sliding structure 24, the sliding structure 24 comprises a sliding guide rail 241 and a moving sliding block 242, the sliding guide rail 241 is arranged on the fixed bottom plate 21 and arranged along the first direction, and the moving sliding block 242 is fixedly arranged on the translation installation plate 22 and can slide along the length direction of the sliding guide rail 241. Specifically, the sliding guide rail 241 refers to a component with a certain length, and the moving sliding block 242 refers to a block-shaped component with a certain volume. By arranging the sliding guide rail 241 on the fixed bottom plate 21 and along the first direction, and fixing the moving sliding block 242 on the translation installation plate 22 and making the moving sliding block 242 slide along the length direction of the sliding guide rail 241, the relative sliding between the fixed bottom plate 21 and the translation installation plate 22 is more convenient and accurate.

[0052] In one embodiment, referring to Figure 1 And Figure 6The wafer supply workgroup 3 comprises a wafer ring supply mechanism 31, a wafer ring carrying mechanism 32, a wafer ring rotating platform 33 and a pin mechanism 34. The wafer ring supply mechanism 31 is used to accommodate and store wafer rings. The wafer ring rotating platform 33 is used to support wafer rings and make the wafer on the wafer ring be at a wafer taking position. The wafer ring carrying mechanism 32 is used to carry the wafer ring from the wafer ring supply mechanism 31 to the wafer ring rotating platform 33. The pin mechanism 34 is used to separate the wafer from the wafer ring. Specifically, in the production process, the wafer ring is stored in the wafer ring supply mechanism 31. The wafer ring carrying mechanism 32 can take the wafer ring with the wafer from the wafer ring supply mechanism 31 and place it on the wafer ring rotating platform 33. It can also take the empty wafer ring from the wafer ring rotating platform 33 and place it in the wafer ring supply mechanism 31. After the wafer ring is placed and fixed on the wafer ring rotating platform 33, the pin mechanism 34 can separate the wafer on the wafer ring from the wafer ring for the wafer fixing mechanism 4 to grab and transport to the wafer fixing position for wafer fixing, so that the wafer ring rotating platform 3 is more convenient to use.

[0053] In one embodiment, referring to Figure 7 The wafer ring rotating platform 33 comprises a rotating frame body 331, a rotating frame support 332 and a wafer ring translation assembly 333. The wafer ring translation assembly 333 is arranged on the translation mounting plate 22. The rotating frame support 332 is arranged on the wafer ring translation assembly 333. The rotating frame body 331 is rotationally arranged on the rotating frame support 332 and is used to support the wafer ring and adjust the horizontal angle of the wafer ring. Specifically, the rotating frame body 331 refers to a component that can support the wafer ring. A placement area matching the shape of the wafer ring is arranged on the rotating frame body 331. A support table for supporting the wafer ring is further arranged on the side wall of the placement area, which can facilitate the separation operation of the pin mechanism 34 on the wafer while supporting the wafer ring. The rotating frame support 332 refers to a component with a certain volume, which can support the rotating frame body 331. The wafer ring translation assembly 333 refers to a mechanism that can adjust the horizontal position of the component, wherein the rotating frame support 332 is installed on the wafer ring translation assembly 333. The horizontal position of the wafer ring placed on the rotating frame body 331 can be adjusted by the wafer ring translation assembly 333. At the same time, the rotating frame body 331 is rotationally arranged on the rotating frame support 332, so that the horizontal angle of the wafer ring can be adjusted by the rotation of the rotating frame body 331, making the wafer ring rotating platform 33 more convenient to use.

[0054] In one optional embodiment, referring to Figure 7The crystal ring translation assembly 333 can include a crystal ring base, a first crystal ring part, and a second crystal ring part. The first crystal ring part is slidingly arranged on the crystal ring base, the second crystal ring part is slidingly arranged on the first crystal ring part, and the sliding directions of the first crystal ring part and the second crystal ring part are arranged at an angle. The rotating frame support 332 is arranged on the second crystal ring part. The position adjustment of the rotating frame support 332 in the horizontal direction can be realized by the sliding of the first crystal ring part and the second crystal ring part, and the overall structure is simple.

[0055] In addition, sliding units are arranged between the first crystal ring part and the crystal ring base and between the first crystal ring part and the second crystal ring part. The sliding units generally adopt a sliding rail and sliding block structure, which can make the sliding more stable. Driving units are also arranged between the first crystal ring part and the crystal ring base and between the first crystal ring part and the second crystal ring part. The driving units can be motor and screw structures, linear motors, air cylinders, or hydraulic cylinders, etc. The arrangement of the driving units can make the adjustment of the entire crystal ring translation assembly 333 more automatic.

[0056] In another optional embodiment, please refer to Figure 7 A rotating power unit 334 is further arranged on the rotating frame support 332. The rotating power unit 334 can be a motor, a hydraulic motor, or other components that can output torque. A transmission unit is further arranged between the rotating power unit 334 and the rotating frame body 331. The transmission unit can be a gear transmission, a belt transmission, or a chain transmission, etc. so that the rotation of the rotating frame body 331 is more convenient.

[0057] In an embodiment, please refer to Figure 8, the ejector mechanism 34 includes an ejector assembly 341, an ejector support 342, an ejector translation module 343 and an ejector lifting module 344, the ejector translation module 343 is arranged between the translation mounting plate 22 and the ejector support 342, used for adjusting the horizontal position of the ejector support 342, the ejector lifting module 344 is arranged on the ejector support 342, the ejector assembly 341 is arranged on the driving end of the ejector lifting module 344, and can reciprocate in the vertical direction under the action of the ejector lifting module 344. Specifically, the ejector assembly 341 refers to the assembly that can separate the wafer and the thin film of the crystal ring, the ejector assembly 341 can include a ejector, an ejector seat and an ejector cap and the like structure. The ejector support 342 refers to a block-shaped component with a certain volume, which is used to install the ejector lifting module 344. The ejector lifting module 344 refers to a component for driving the entire ejector assembly 341 to move in the vertical direction, which can be a gas cylinder, a hydraulic cylinder or a combination structure of a motor and a crankshaft crank. The ejector translation module 343 refers to a component that can adjust the horizontal position of the ejector support 342, the ejector lifting module 344 and the ejector assembly 341. When working, the ejector assembly 341 can be adjusted in horizontal position under the action of the ejector translation module 343, so that the ejector assembly 341 is located below the rotating frame body 331. Then the ejector assembly 341 can reciprocate in the vertical direction under the action of the ejector lifting module 344 to separate the wafer.

[0058] In one embodiment, referring to Figure 9 , the die bonding mechanism 4 includes a die bonding support 41, a die bonding position module 42, a die bonding power unit 43 and a swing arm assembly 44, the die bonding support 41 is arranged on the translation mounting plate 22, the die bonding power unit 43 is movably connected to the die bonding support 41 through the die bonding position module 42, and the swing arm assembly 44 is connected to the driving end of the die bonding power unit 43. Specifically, the die bonding support 41 refers to a support component with a certain height, which can be columnar, block-shaped or a combination of various shapes, the die bonding position module 42 refers to a component that can adjust the horizontal position of the object, and the die bonding power unit 43 is arranged on the movable end of the die bonding position module 42. The die bonding power unit 43 refers to a component that can output torque, which can be a die bonding motor. In order to ensure the normal long-time use of the die bonding motor, a die bonding heat dissipation assembly is also arranged outside the die bonding motor. The swing arm assembly 44 refers to a swing arm structure with a certain length, which can realize the movement of the end of the swing arm assembly 44 through the swing of the swing arm assembly 44, so as to realize the transportation of the wafer.

[0059] In addition, the die bonding position module 42 can adjust the horizontal position of the die bonding power unit 43 and the swing arm assembly 44, and when the position of the adjustment platform changes, the position of the die bonding power unit 43 and the swing arm assembly 44 can also be adjusted through the die bonding position module 42, so that the use of the die bonder is more convenient.

[0060] In an optional embodiment, referring to Figure 9 , the swing arm assembly 44 comprises a swing arm and a suction nozzle assembly arranged at the end of the swing arm. The suction nozzle assembly is used to suck the wafer by negative pressure, and the swing arm swings back and forth under the drive of the die bonding power unit 43 to drive the suction nozzle assembly to move back and forth between the wafer taking position and the die bonding position.

[0061] In an embodiment, referring to Figure 1 , the double-bonding head die bonding device further comprises an image acquisition unit arranged on the translation mounting plate 22, and the image acquisition unit is located in the lower region of the working end of the swing arm assembly 44. The image acquisition unit is used to acquire the image of the wafer sucked on the working end of the swing arm assembly 44 when the swing arm assembly 44 is working. Specifically, the image acquisition unit refers to a device that can acquire the image of a specified position or region, such as a CCD (Charge-coupled Device, Charge-coupled Device) visual detection device. In this embodiment, the image of the wafer sucked on the working end of the swing arm assembly 44 can be acquired by the image acquisition unit when the swing arm assembly 44 is working, so that when the position or rotation angle of the wafer deviates, the position or rotation angle of the wafer is adjusted by the swing arm assembly 44, thereby improving the precision of die bonding.

[0062] In an embodiment, referring to Figure 10 , the clamp mechanism 5 comprises a clamp base 51, a first clamp translation part 52 and a second clamp translation part 53. The clamp base 51 is arranged on the workbench 1, the first clamp translation part 52 is slidingly arranged on the clamp base 51, and the second clamp translation part 53 is slidingly arranged on the first clamp translation part 52. The sliding direction of the first clamp translation part 52 and the sliding direction of the second clamp translation part 53 are arranged at an angle. An installation plane is arranged on the top surface of the second clamp translation part 53, and the installation plane is used to prevent and fix the product. Specifically, the position adjustment of the clamp frame can be realized by the sliding of the first clamp translation part 52 and the second clamp translation part 53, so that the position adjustment of the product is more convenient. In addition, sliding units are arranged between the clamp base 51 and the first clamp translation part 52, and between the first clamp translation part 52 and the second clamp translation part 53. The sliding unit can be a sliding rail and block structure, or a roller sliding structure 24. Driving units are arranged between the clamp base 51 and the first clamp translation part 52, and between the first clamp translation part 52 and the second clamp translation part 53. The driving unit can be a motor and screw structure, or a linear motor, air cylinder or hydraulic cylinder structure, so that the clamp mechanism 5 is more convenient to use.

[0063] The above are only preferred embodiments of the present application, and only the technical principles of the present application are specifically described, and these descriptions are only for explaining the principles of the present application, and cannot be interpreted as limiting the protection scope of the present application in any way. Based on the explanation herein, any modification, equivalent replacement and improvement made within the spirit and principles of the present application, and other specific embodiments of the present application that can be conceived by those skilled in the art without creative labor, should be included in the protection scope of the present application.

Claims

1. A dual bonder for die bonding, comprising: The double-bond head die bonding device comprises a workbench, two translation adjustment mechanisms, a clamp mechanism, two die supply work groups, and two die bonding mechanisms. The two translation adjustment mechanisms are arranged on the workbench and are spaced apart. The clamp mechanism is arranged on the workbench and is located in the region between the two translation adjustment mechanisms. The clamp mechanism is used for mounting and fixing a product and transporting the product to a die bonding position. The two die supply work groups are arranged on the two translation installation plates respectively. The two die supply work groups are used for providing a die ring and transporting the die ring to a die taking position and separating a wafer.

2. The dual bond head die bonding apparatus of claim 1, wherein, The two die bonding mechanisms are arranged on the two translation installation plates respectively.

3. The dual bond head die bonding apparatus of claim 2, wherein the first and second bond heads are arranged in a vertical direction. The two die bonding mechanisms are used for transporting and mounting the wafer at the die taking position to the product at the die bonding position.

4. The dual bond head die bonding apparatus of claim 3, wherein the first and second bond heads are arranged in a vertical direction. The double-bond head die bonding device further comprises a controller and a position detection unit for detecting whether the translation installation plate is at a zero position.

5. The dual bond head die bonding apparatus of claim 4, wherein the first and second bond heads are arranged in a vertical direction. The controller is electrically connected with the position detection unit and the control end of the driving assembly.

6. The double bond head die bonding apparatus according to any one of claims 1 to 5, wherein The position detection unit comprises a photoelectric switch arranged on the fixed base plate.

7. The dual bond head die bonding apparatus of claim 6, wherein the first and second bond heads are arranged in a vertical stack. The translation installation plate is provided with a detection piece. When the translation installation plate moves to a preset position, the detection piece triggers the photoelectric switch. The translation installation plate is provided with a scale structure arranged along the first direction. The fixed base plate is further provided with an indicating component. The indicating component is used for cooperating with the scale structure to indicate the position of the translation installation plate. The fixed base plate and the translation installation plate are provided with a sliding structure. The sliding structure comprises a sliding guide rail and a moving slider. The sliding guide rail is arranged on the fixed base plate and is arranged along the first direction. The moving slider is fixedly arranged on the translation installation plate and can slide along the length direction of the sliding guide rail. The die supply work group comprises a die ring supply mechanism, a die ring carrying mechanism, a die ring rotating platform, and a thimble mechanism. The die ring supply mechanism is used for accommodating and storing a die ring. The die ring rotating platform is used for supporting a die ring and making a wafer on the die ring at a die taking position. The die ring carrying mechanism is used for carrying the die ring from the die ring supply mechanism to the die ring rotating platform. The thimble mechanism is used for separating the wafer from the die ring. The die ring rotating platform comprises a rotating frame, a rotating frame support, and a die ring translation assembly. The die ring translation assembly is arranged on the translation installation plate. The rotating frame support is arranged on the die ring translation assembly. The rotating frame is rotatably arranged on the rotating frame support and is used for supporting a die ring and adjusting the horizontal angle of the die ring.

8. The double bond head die bonding apparatus according to any one of claims 1 to 5, wherein The die bonding mechanism comprises a die bonding support, a die bonding position module, a die bonding power unit and a swing arm assembly. The die bonding support is arranged on the translation mounting plate. The die bonding power unit is movably connected to the die bonding support through the die bonding position module. The swing arm assembly is connected to the driving end of the die bonding power unit.

9. The dual bond head die bonding apparatus of claim 8, wherein the first and second bond heads are arranged in a vertical stack. The double-bond head die bonding device further comprises an image acquisition unit. The image acquisition unit is arranged on the translation mounting plate. The image acquisition unit is located in the area below the working end of the swing arm assembly. The image acquisition unit is used to acquire the image of the wafer sucked by the working end of the swing arm assembly when the swing arm assembly is working.

10. The double bond head die bonding apparatus according to any one of claims 1 to 5, wherein The clamp mechanism comprises a clamp base, a first clamp translation part and a second clamp translation part. The clamp base is arranged on the workbench. The first clamp translation part is slidingly arranged on the clamp base. The second clamp translation part is slidingly arranged on the first clamp translation part. The sliding direction of the first clamp translation part and the sliding direction of the second clamp translation part are arranged at an angle. The top surface of the second clamp translation part is provided with a mounting plane. The mounting plane is used to prevent and fix the product.

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