Improved mechanism for automatically reducing fragments in plasma enhanced chemical vapor deposition (PECVD) of heterojunction cell

Abstract

The utility model relates to the technical field of batteries, and discloses an improved mechanism for automatically reducing fragments by PECVD (Plasma Enhanced Chemical Vapor Deposition) of a heterojunction battery. According to the improved mechanism for automatically reducing fragments in the PECVD of the heterojunction battery, the silicon wafer segmentation block is used for separating a front silicon wafer and a rear silicon wafer and adopts a conical structure, and the silicon wafer segmentation block on the cushion block adopts the conical structure, so that when the wafers are placed on the cushion block by the automatic lifting platform, the silicon wafers can slide down from the conical structure if slight deviation exists, and the silicon wafers are separated from the cushion block. The screw holes are used for fixing the cushion block and fixing the cushion block on the belt of the rapid runway, the cushion block platform is used for lifting the silicon wafer, and the novel cushion block is formed by replacing the silicon wafer segmentation block above with the conical segmentation block and replacing the cushion block on the belt of the rapid runway with the novel cushion block on the basis of the original cushion block. When the silicon wafers are placed on the belt, the silicon wafers are prevented from being broken in the transmission process or the gantry feeding and discharging process due to edge landing caused by the cushion blocks, and therefore the purpose of reducing the fragment rate is achieved.

Description

Technical Field

[0001] This utility model relates to the field of battery technology, specifically to an improved mechanism for automated fragmentation reduction in heterojunction battery PECVD. Background Technology

[0002] Heterojunction batteries are a popular battery technology with advantages such as high efficiency, low-temperature manufacturing process, no PID phenomenon, and the ability to be developed into thin sheets, showing broad development prospects. However, compared with other types of batteries, their automated structure is more complex, resulting in more fragmentation. Therefore, reducing the equipment fragmentation rate has become a primary task.

[0003] Currently, the silicon wafer isolation blocks on the silicon wafer pads in the automated high-speed track of heterojunction CVD are trapezoidal pad structures. Due to design flaws, they are prone to overlap and fragmentation. This solution addresses this problem by changing the design of the pads to reduce the fragmentation rate. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] The purpose of this invention is to provide an improved mechanism for automated PECVD fragment reduction in heterojunction batteries, in order to solve the problem mentioned in the background art that heterojunction batteries are currently a popular battery technology, but compared with other types of batteries, their automated structures are more complex, resulting in more fragments.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, this utility model provides the following technical solution: an improved mechanism for automated fragment reduction in heterojunction solar cell PECVD, comprising a first silicon wafer segmentation block, the first silicon wafer segmentation block having a conical structure, and a first pad platform fixedly disposed at the bottom of the first silicon wafer segmentation block.

[0008] Preferably, the first pad platform is provided with a screw hole one and a screw hole two inside the first pad platform. The silicon wafer dividing block is used to separate the front and rear silicon wafers and adopts a conical structure.

[0009] Preferably, a battery cell is fixedly disposed at the bottom of one side of the first pad platform, and a second pad platform is fixedly disposed at the top of one side of the battery cell. The silicon wafer dividing block on the pad uses a conical structure. When the automated lifting platform places the wafer onto the pad, if there is a slight deviation, the silicon wafer will slide off the conical structure, thus preventing overlap.

[0010] Preferably, the second pad platform has a screw hole three and a screw hole four fixedly provided inside. The screw holes are used to fix the pad to the belt of the high-speed track, and the pad platform is used to support the silicon wafer.

[0011] Preferably, a second silicon wafer dividing block is fixedly installed on the top of the second pad platform. The second silicon wafer dividing block is fixedly installed on the outside of the second pad platform. The new pad is based on the original pad, but the silicon wafer dividing block on top is replaced with a conical dividing block. The pad on the high-speed track belt is replaced with the new pad to prevent the silicon wafer from overlapping when it is placed on the belt, which would cause it to break during transmission or when the gantry is loading and unloading, thereby reducing the breakage rate.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. The improved mechanism for reducing fragmentation in the automated PECVD of heterojunction solar cells features a silicon wafer dividing block designed to separate two silicon wafers. The block has a conical structure, and the silicon wafer dividing block on the pad also has a conical structure. When the automated lifting platform places the wafer onto the pad, any slight deviation will cause the wafer to slide off the conical structure, thus preventing overlap. The screw holes are used to fix the pad to the belt of the high-speed track, and the pad platform is designed to lift the silicon wafer.

[0014] 2. The improved mechanism for reducing fragmentation in the PECVD automation of heterojunction solar cells features a new type of pad. The original pad is modified by replacing the silicon wafer dividing block on top with a conical dividing block. The pad on the high-speed conveyor belt is also replaced with the new type of pad. This prevents the silicon wafers from overlapping when placed on the belt due to the pad, which could cause fragmentation during transmission or gantry loading and unloading, thereby reducing the fragmentation rate. Attached Figure Description

[0015] Figure 1 This is a schematic cross-sectional view of the present invention.

[0016] Figure 2 This is a partial cross-sectional structural diagram of the present invention;

[0017] Figure 3 This is a partial cross-sectional structural diagram of the present invention.

[0018] In the figure: 1. First silicon wafer segmentation block; 2. First pad platform; 3. Screw hole one; 4. Screw hole two; 5. Solar cell; 6. Second pad platform; 7. Screw hole three; 8. Screw hole four; 9. Second silicon wafer segmentation block. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figures 1-3 This utility model provides a technical solution: an improved mechanism for automated reduction of debris in heterojunction solar cell PECVD, including a first silicon wafer dividing block 1, the first silicon wafer dividing block 1 adopts a conical structure, and a first pad platform 2 is fixedly provided at the bottom of the first silicon wafer dividing block 1.

[0021] The first pad platform 2 has screw holes 1-3 and 4 inside. A solar cell 5 is fixedly mounted on the bottom side of one side of the first pad platform 2. A second pad platform 6 is fixedly mounted on the top side of one side of the solar cell 5. Screw holes 3-7 and 4-8 are fixedly mounted inside the second pad platform 6. A second silicon wafer divider 9 is fixedly mounted on the top of the second pad platform 6. The second silicon wafer divider 9 is fixedly mounted on the outside of the second pad platform 6. When using the improved mechanism for automated fragment reduction in heterojunction solar cell PECVD, the silicon wafer divider is used to separate the front and rear silicon wafers. The new type of pad adopts a conical structure. The silicon wafer dividing block on the pad also uses a conical structure. When the automated lifting platform places the wafers onto the pad, if there is a slight deviation, the silicon wafers will slide off the conical structure, thus preventing overlap. The screw holes are used to fix the pad to the conveyor belt of the high-speed track. The pad platform is used to lift the silicon wafers. The new pad is based on the original pad, but the silicon wafer dividing block on top is replaced with a conical dividing block. The pad on the high-speed track conveyor belt is replaced with the new type of pad to prevent the silicon wafers from overlapping when placed on the belt, thus preventing breakage during transmission or gantry loading and unloading, thereby reducing the breakage rate.

[0022] Working Principle: When using the improved mechanism for reducing fragmentation in the automated PECVD of heterojunction solar cells, the silicon wafer divider is used to separate the front and rear silicon wafers. It adopts a conical structure. The silicon wafer divider on the pad also has a conical structure. When the automated lifting platform places the wafer onto the pad, if there is a slight deviation, the silicon wafer will slide off the conical structure, thus preventing overlap. The screw holes are used to fix the pad to the conveyor belt of the high-speed track. The pad platform is used to lift the silicon wafer. The new pad is based on the original pad, but the silicon wafer divider on top is replaced with a conical divider. The pad on the high-speed track conveyor belt is replaced with the new pad to prevent the silicon wafer from overlapping when placed on the belt, thus preventing fragmentation during transmission or gantry loading and unloading, thereby reducing the fragmentation rate.

[0023] Finally, it should be noted that the above content is only used to illustrate the technical solution of this utility model, and is not intended to limit the scope of protection of this utility model. Simple modifications or equivalent substitutions made by those skilled in the art to the technical solution of this utility model do not depart from the essence and scope of the technical solution of this utility model.

Claims

1. An improved mechanism for PECVD automation for reducing chipping of heterojunction cells, comprising a first silicon wafer dividing block (1), characterized in that: The first silicon wafer segmentation block (1) adopts a conical structure, and a first cushion block platform (2) is fixedly arranged at the bottom of the first silicon wafer segmentation block (1).

2. The improved mechanism for PECVD automated reduction of debris for a heterojunction cell according to claim 1, wherein: A screw hole one (3) is fixedly arranged in the first cushion block platform (2), and a screw hole two (4) is fixedly arranged in the first cushion block platform (2).

3. The improved mechanism for PECVD automated debris reduction for a heterojunction cell of claim 2, wherein: A battery piece (5) is fixedly arranged at the bottom of one side of the first cushion block platform (2), and a second cushion block platform (6) is fixedly arranged at the top of one side of the battery piece (5).

4. The improved mechanism for PECVD automated debris reduction for a heterojunction cell of claim 3, wherein: A screw hole three (7) is fixedly arranged in the second cushion block platform (6), and a screw hole four (8) is fixedly arranged in the second cushion block platform (6).

5. The improved mechanism for PECVD automated debris reduction for a heterojunction cell of claim 4, wherein: A second silicon wafer segmentation block (9) is fixedly arranged outside the second cushion block platform (6) and arranged at the top of the second cushion block platform (6).

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