High-damping shock-resistant base of integrated circuit equipment

Abstract

The utility model discloses a high-damping shock-resistant base of integrated circuit equipment in the technical field of integrated circuits, which comprises a base plate, a base frame is assembled at the center of the top end of the base plate, and a heat dissipation bottom plate is assembled at the bottom end in the base frame; fixing plates are assembled on the top end of the base plate and located on the periphery of the base frame, anti-seismic assemblies are installed on the inner walls of the fixing plates, and the anti-seismic assemblies are connected with the outer wall of the base frame; a heat dissipation hole is formed in the top end of the heat dissipation bottom plate, and a heat dissipation fan assembly is assembled in the heat dissipation hole; the heat dissipation fan assembly comprises a fan frame installed in the heat dissipation holes, a center base is assembled on the middle section of the interior of the fan frame, blade bodies are assembled on the periphery of the center base, and reinforcing ribs are installed at the edges of the tail ends of the blade bodies. The high-damping anti-seismic base of the integrated circuit equipment is reasonable in structural design, heat generated in the operation process of the integrated circuit equipment can be discharged, the anti-seismic performance is guaranteed, meanwhile, the heat dissipation performance of the equipment is not affected, and the high-damping anti-seismic base has high practicability.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit technology, specifically to a high-damping seismic-resistant base for integrated circuit equipment. Background Technology

[0002] An integrated circuit is a miniature electronic device or component. Using certain processes, the transistors, resistors, capacitors, inductors, and other components required for a circuit, along with interconnected wiring, are fabricated on one or several small pieces of semiconductor wafers or dielectric substrates. Then, they are packaged in a casing to become a miniature structure with the required circuit function. After the integrated circuit chip is mounted on the integrated circuit board, it needs to be encapsulated and glued using packaging equipment.

[0003] The shock-resistant bases used in existing integrated circuit equipment typically fasten the equipment tightly, causing the heat generated by the internal integrated circuits to easily get trapped inside the base during operation. This results in poor heat dissipation and significantly reduces the lifespan of the equipment, making it less practical. Therefore, it is necessary to improve the existing technology. Summary of the Invention

[0004] The purpose of this utility model is to provide a high-damping anti-vibration base for integrated circuit equipment, in order to solve the problem mentioned in the background art that the existing anti-vibration bases used for integrated circuit equipment generally fasten and fix the equipment tightly, and the heat generated by the integrated circuit inside the equipment is easily trapped in the base during operation, resulting in poor heat dissipation and thus greatly reducing the service life of the equipment.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a high-damping anti-vibration base for integrated circuit equipment, comprising a base plate, a base frame assembled at the top center of the base plate, and a heat dissipation base plate assembled at the bottom of the inner side of the base frame;

[0006] The top of the base plate is equipped with fixing plates around the base frame. The inner wall of the fixing plates is equipped with anti-seismic components, which are connected to the outer wall of the base frame.

[0007] The top of the heat dissipation base plate is provided with heat dissipation holes, and a heat dissipation fan assembly is installed inside the heat dissipation holes;

[0008] The cooling fan assembly includes a fan frame installed in a heat dissipation hole. A center seat is assembled in the middle section of the fan frame. Blades are assembled around the center seat. Reinforcing ribs are installed at the end edges of the blades.

[0009] As a preferred embodiment of the high-damping seismic base for an integrated circuit device of this utility model, the reinforcing ribs are raised from one end to the other, and one end of the reinforcing ribs extends beyond the end edge of the blade.

[0010] As a preferred embodiment of the high-damping seismic-resistant base for an integrated circuit device according to this utility model, the blade body has a chamfer at its starting end and is inclined.

[0011] As a preferred embodiment of the high-damping anti-vibration base for integrated circuit equipment according to this utility model, the interior of the heat dissipation hole is fitted with a dustproof mesh at the top of the heat dissipation fan assembly.

[0012] As a preferred embodiment of the high-damping seismic base for an integrated circuit device according to this utility model, the seismic component includes a buffer frame installed on the inner wall of a fixed plate, a buffer cavity is provided inside the buffer frame, a damper is installed inside the buffer cavity, a buffer plate is installed at the end of the damper, and the buffer plate is located on the side wall of the base frame.

[0013] As a preferred embodiment of the high-damping seismic base for an integrated circuit device according to this utility model, the sidewall of the buffer plate is provided with an adhesive pad layer, which is fitted to the outer wall of the base frame.

[0014] As a preferred embodiment of the high-damping anti-vibration base for integrated circuit equipment of this utility model, the bottom end of the heat dissipation base plate is provided with a heat dissipation groove, and the heat dissipation hole is connected to the heat dissipation groove.

[0015] Compared with the prior art, the beneficial effects of this utility model are: the high-damping anti-seismic base of this integrated circuit device has a reasonable structural design;

[0016] By installing anti-vibration components at the top of the base plate and around the base frame, the vibration frequency of the base frame can be significantly reduced, preventing damage to the integrated circuit equipment under vibration. It has excellent anti-vibration performance and strong protection. A heat dissipation base plate is installed inside the base frame, and a heat dissipation fan assembly is installed on the heat dissipation base plate, which can dissipate the heat generated during the operation of the integrated circuit equipment. While ensuring anti-vibration performance, it does not affect the heat dissipation performance of the equipment itself, and has high practicality. Attached Figure Description

[0017] Figure 1 This is a front-view three-dimensional structural schematic diagram of the present invention;

[0018] Figure 2 This is a schematic diagram of the heat dissipation base plate of this utility model;

[0019] Figure 3 This is a schematic diagram of the earthquake-resistant component of this utility model;

[0020] Figure 4 This is a schematic diagram of the cooling fan assembly of this utility model.

[0021] In the diagram: 1. Base plate; 2. Fixing plate; 3. Buffer frame; 4. Base frame; 5. Heat dissipation base plate; 6. Heat dissipation channel; 7. Heat dissipation hole; 8. Dustproof net; 9. Cooling fan assembly; 911. Center seat; 912. Blade; 913. One end of the reinforcing rib; 914. Reinforcing rib; 915. The other end of the reinforcing rib; 916. Chamfer; 917. Fan bracket; 10. Buffer cavity; 11. Damper; 12. Buffer plate; 13. Adhesive pad layer. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-4 This utility model provides a technical solution:

[0024] In this technical solution, a high-damping anti-vibration base for an integrated circuit device includes a base plate 1. A base frame 4 is mounted at the center of the top of the base plate 1, and a heat dissipation base plate 5 is mounted at the bottom of the base frame 4. Fixing plates 2 are mounted around the top of the base plate 1 and the inner wall of the fixing plates 2 is equipped with anti-vibration components, which are connected to the outer wall of the base frame 4. A heat dissipation hole 7 is opened at the top of the heat dissipation base plate 5, and a cooling fan assembly 9 is mounted inside the heat dissipation hole 7. The cooling fan assembly 9 includes a fan frame 917 installed in the heat dissipation hole 7, a center seat 911 is mounted in the middle section of the fan frame 917, blades 912 are mounted around the center seat 911, and reinforcing ribs 914 are installed at the end edges of the blades 912.

[0025] In this technical solution, the base frame 4 at the top center of the base plate 1 is used to place the integrated circuit. Fixing plates 2 are set around the outside of the base frame 4, and anti-vibration components are set between each fixing plate 2 and the base frame 4 to provide anti-vibration protection for the base frame 4. By setting a heat dissipation base plate 5 at the bottom inside the base frame 4, the heat generated by the integrated circuit can be dissipated. The heat dissipation hole 7 is equipped with a micro motor for driving the cooling fan assembly 9.

[0026] In some technical solutions, the reinforcing rib 914 is formed from one end 913 to the other end 915, forming a raised reinforcing rib 914 from low to high, and one end 913 of the reinforcing rib 914 extends beyond the end edge of the blade body 912.

[0027] In this technical solution, there are one or more reinforcing ribs 914. The reinforcing ribs 914 are raised or concave reinforcing ribs. The reinforcing ribs can increase the stability of the fan blades, thereby increasing the air volume of the fan blades.

[0028] In some technical solutions, the beginning of the blade 912 is provided with a chamfer 916, and the blade 912 is inclined.

[0029] In this technical solution, to reduce air intake resistance and fan noise, the blade 912 is tilted to enhance the cut-in airflow.

[0030] In some technical solutions, a dustproof mesh 8 is embedded inside the heat dissipation hole 7 at the top of the cooling fan assembly 9;

[0031] In this technical solution, the dustproof mesh 8 prevents dust from entering the heat dissipation holes 7.

[0032] In some technical solutions, the seismic component includes a buffer frame 3 installed on the inner wall of the fixed plate 2. The buffer frame 3 has a buffer cavity 10 inside, a damper 11 is installed inside the buffer cavity 10, and a buffer plate 12 is installed at the end of the damper 11. The buffer plate 12 is located on the side wall of the base frame 4.

[0033] In this technical solution, the base frame 4 is thus protected against seismic activity.

[0034] In some technical solutions, the side wall of the buffer plate 12 is equipped with an adhesive pad 13, which is attached to the outer wall of the base frame 4.

[0035] In this technical solution, the buffer plate 12 can be connected to the outer wall of the base frame 4 by setting the adhesive pad 13.

[0036] In some technical solutions, a heat dissipation groove 6 is provided at the bottom of the heat dissipation base plate 5, and the heat dissipation hole 7 is connected to the heat dissipation groove 6.

[0037] In this technical solution, the heat dissipation channel 6 is connected to the outside of the base frame 4, thereby dissipating the heat from the heat dissipation hole 7.

[0038] Working principle:

[0039] In use, the integrated circuit is first installed in the base frame 4. The anti-vibration component can improve the anti-vibration performance of the base frame 4. During operation, the heat generated can be discharged through the heat dissipation holes 7 and heat dissipation channels 6 by the cooling fan assembly 9.

[0040] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0041] Although the present invention has been described above with reference to embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the features in the embodiments disclosed in this invention can be combined with each other in any way. The lack of an exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A high-damped seismic base for an integrated circuit device, comprising a base plate (1), characterized in that: The top center of the base plate (1) is equipped with a base frame (4), the inside bottom of the base frame (4) is equipped with a heat dissipation bottom plate (5); The top of the base plate (1) is equipped with a fixed plate (2) around the base frame (4), the inner wall of the fixed plate (2) is installed with a shockproof assembly, and the shockproof assembly is connected to the outer wall of the base frame (4); The top of the heat dissipation bottom plate (5) is provided with a heat dissipation hole (7), and the inside of the heat dissipation hole (7) is equipped with a heat dissipation fan assembly (9); The heat dissipation fan assembly (9) includes a fan frame (917) installed in the heat dissipation hole (7), the inside middle segment of the fan frame (917) is equipped with a center seat (911), the four around of the center seat (911) is equipped with a blade body (912), and the end edge of the blade body (912) is installed with a reinforcing rib (914).

2. The high-damped seismic base for an integrated circuit device of claim 1, wherein, The one end (913) of the reinforcing rib (914) to the other end (915) of the reinforcing rib (914) forms a convex reinforcing rib (914) from low to high, and the one end (913) of the reinforcing rib (914) exceeds one end of the end edge of the blade body (912).

3. The high-damped seismic base for an integrated circuit device of claim 1, wherein, The start of the blade body (912) is provided with a chamfer (916), and the blade body (912) is inclined.

4. The high-damped seismic base for an integrated circuit device of claim 1, wherein, The inside of the heat dissipation hole (7) is embedded with a dust screen (8) at the top of the heat dissipation fan assembly (9).

5. The high-damped seismic base for an integrated circuit device of claim 1, wherein, The shockproof assembly includes a buffer frame (3) installed in the inner wall of the fixed plate (2), the inside of the buffer frame (3) is provided with a buffer cavity (10), the inside of the buffer cavity (10) is installed with a damper (11), the end of the damper (11) is installed with a buffer plate (12), and the buffer plate (12) is arranged at the side wall of the base frame (4).

6. The high-damped seismic base for an integrated circuit device of claim 5, wherein, The side wall of the buffer plate (12) is installed with an adhesive pad layer (13), and the adhesive pad layer (13) is arranged in close contact with the outer wall of the base frame (4).

7. The high-damped seismic base for an integrated circuit device of claim 1, wherein: The bottom of the heat dissipation bottom plate (5) is provided with a heat dissipation through slot (6), and the heat dissipation hole (7) is connected with the heat dissipation through slot (6).

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