Test base, test seat and test assembly
By designing test bases and test sockets suitable for different packaging forms, the problems of insufficient applicability and poor safety of existing power device test fixtures have been solved, and stable and flexible chip testing has been achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-20
- Publication Date
- 2026-03-31
AI Technical Summary
Existing power device testing fixtures are not sufficiently applicable and lack safety, failing to meet stringent product quality testing requirements.
A test base and test socket are designed, including a base plate, a signal source interface, a fixing base, and a detachable test socket, which can be matched with chips of different package forms to achieve stable electrical signal transmission and measurement.
It enables stable testing of chips with different packaging forms, improves the applicability and safety of testing, and simplifies the transfer process of chip testing.
Smart Images
Figure CN224066844U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor testing technology, and in particular to a test base, test socket, and test assembly. Background Technology
[0002] To ensure stricter quality control, product testing becomes more challenging. Preliminary testing is required before mass production, often necessitating traditional manual testing to guarantee product quality and performance.
[0003] Power device test sockets, as a key component in electronic device testing, play a crucial role in connecting, transmitting signals, and stabilizing the test environment. Most test fixtures are simply test benches, which, while able to achieve basic testing results, still suffer from insufficient applicability and inadequate safety. Utility Model Content
[0004] Therefore, it is necessary to provide a test base, a test socket, and test components.
[0005] Firstly, this application provides a test base, including:
[0006] The base plate includes a first connection point and a fixing seat, the first connection point and the fixing seat are respectively located on a first side of the base plate, and the first connection point is located inside the fixing seat; wherein, the fixing seat is used for detachable connection with a test seat; when the test seat is connected to the fixing seat, the first connection point is connected to a second connection point on the test seat;
[0007] The signal source interface is located on the second side of the base plate and is connected to the first connection point for connecting to the test equipment.
[0008] In one embodiment, the first connection point includes a first electrode connection point, a second electrode connection point, and a third electrode connection point. The first electrode connection point, the second electrode connection point, and the third electrode connection point are respectively used to connect one-to-one with the three electrodes of the power device in the chip under test through the second connection point.
[0009] In one embodiment, the target pole connection point includes at least one of the first pole connection point, the second pole connection point, and the third pole connection point;
[0010] The target electrode connection point includes a first sub-connection point and a second sub-connection point, wherein the first sub-connection point and the second sub-connection point are respectively used to connect to the same electrode of the power device through the second connection point; wherein,
[0011] The first sub-connection point is used to transmit power signals from the test equipment to the electrodes of the power device;
[0012] The second sub-connection point is used to transmit the measurement signal from the electrodes of the power device to the test equipment.
[0013] In one embodiment, the base plate further includes a conductive structure, wherein the signal source interface is connected to the first connection point through the conductive structure.
[0014] Secondly, this application also provides a test socket, comprising:
[0015] Test socket body;
[0016] The second connection point is located on the first side of the test base body;
[0017] The chip interface, located on the second side of the test socket body and connected to the second connection point, is used to connect to the chip under test; wherein...
[0018] The test socket is used for detachable connection with the test base; when the test socket is connected to the test base, the second connection point is connected to the first connection point in the test base.
[0019] In one embodiment, the second connection point includes a fourth pole connection point, a fifth pole connection point, and a sixth pole connection point;
[0020] The chip interface includes at least a power device interface, which comprises a first-pole interface, a second-pole interface, and a third-pole interface; wherein...
[0021] The first terminal interface is connected to the fourth terminal connection point, and the first terminal interface is used to connect to the first terminal of the power device of the chip under test;
[0022] The second pole interface is connected to the fifth pole connection point, and the second pole interface is used to connect to the second pole of the power device of the chip under test;
[0023] The third terminal interface is connected to the sixth terminal connection point, and the third terminal interface is used to connect to the third terminal of the power device of the chip under test.
[0024] In one embodiment, the target pole connection point includes at least one of the fourth pole connection point, the fifth pole connection point, and the sixth pole connection point; the target pole connection point includes a third sub-connection point and a fourth sub-connection point.
[0025] The test socket further includes a first connector and a second connector; wherein,
[0026] The target pole connection point is connected to the target pole interface through the first connector or the second connector; the target pole interface includes at least one of the first pole interface, the second pole interface and the third pole interface.
[0027] In one embodiment, the test socket body includes a first conductive layer, a second insulating layer, and a second conductive layer stacked sequentially; wherein,
[0028] The first connector includes a first conductive wire and a first conductive plug, wherein the first conductive wire is located in the first conductive layer;
[0029] The second connector includes a second conductive wire and a second conductive plug, wherein the second conductive wire is located in the second conductive layer;
[0030] In one configuration, the first conductive line is connected to the target electrode interface, and the target electrode connection point is connected to the first conductive line via the first conductive plug; or, the second conductive line is connected to the target electrode interface, and the target electrode connection point is connected to the second conductive line via the second conductive plug.
[0031] Thirdly, this application also provides a test component, including the test base provided in any of the above embodiments, and / or the test socket provided in any of the above embodiments.
[0032] In one embodiment, at least two test sockets are included, wherein the arrangement of the second connection points of each test socket is the same as the arrangement of the first connection points, and the chip interfaces of each test socket are different.
[0033] In the aforementioned test base, test socket, and test components, the test base includes a base plate and a signal source interface. The base plate includes a first connection point and a fixing seat, which are located on a first side of the base plate, with the first connection point located within the fixing seat. The fixing seat is used for detachable connection with the test socket. The test socket includes a test socket body, a second connection point, and a chip interface. The second connection point is located on a first side of the test socket body, and the chip interface is located on a second side of the test socket body and connected to the second connection point. The chip interface can be used to connect to the chip under test. The test socket is used for detachable connection with the test base. When the test socket is connected to the test base, the second connection point connects to the first connection point in the test base. This application provides a test base for use with a corresponding test socket, which can be applied to the testing of chips with different package forms. Furthermore, the test base and test socket have a simple structure, small size, and are easy to move, making them suitable as adapters for different chip testing applications. Attached Figure Description
[0034] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0035] Figure 1 A top view of a test base provided in one embodiment;
[0036] Figure 2 A top view of a test stand provided in one embodiment;
[0037] Figure 3 A cross-sectional view of the fixing seat in a test base provided in one embodiment;
[0038] Figure 4 A test socket corresponding to the TO-252 package is provided in one embodiment;
[0039] Figure 5 A test socket corresponding to the TOLL package method provided in one embodiment;
[0040] Figure 6 A test socket corresponding to the PDFN5*6-8L package type is provided in one embodiment;
[0041] Figure 7 A test socket corresponding to the PDFN3*3-8L package type is provided in one embodiment;
[0042] Figure 8 A test socket corresponding to the DFN8*8-8L package type is provided in one embodiment;
[0043] Figure 9 This is a test socket provided in one embodiment corresponding to the SOP-8 package. Detailed Implementation
[0044] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.
[0045] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
[0046] It is understood that the terms "first," "second," etc., used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of this application, a first connection point may be referred to as a second connection point, and similarly, a second connection point may be referred to as a first connection point. Both the first connection point and the second connection point are connection points, but they are not the same connection point.
[0047] It is understood that the term "connection" in the following embodiments should be understood as "electrical connection," "communication connection," etc., if the connected circuits, modules, units, etc., have electrical signal or data transmission with each other.
[0048] It is understandable that "at least one" refers to one or more, and "multiple" refers to two or more. "At least a part of an element" refers to part or all of an element.
[0049] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, the term “and / or” as used in this specification includes any and all combinations of the associated listed items.
[0050] In one embodiment, such as Figure 1 As shown, this application provides a test base, including a base plate 100 and a signal source interface 200.
[0051] The base plate 100 includes a first connection point 110 and a fixing base 120. The first connection point 110 and the fixing base 120 are respectively located on a first side of the base plate 100, and the first connection point 110 is located inside the fixing base 120. The fixing base 120 is used for detachable connection with a test socket. When the test socket is connected to the fixing base 120, the first connection point 110 is connected to a second connection point on the test socket. The test socket is used to connect a chip under test, such as... Figure 2 As shown, the test socket is provided with multiple chip interfaces 400 that are connected to the chip under test, and multiple second connection points 300 that are connected to the chip interfaces 400. The second connection points 300 can be detachably connected to the fixing base 120 on the test base. Figure 3 As an example of a mounting base 120, the mounting base 120 is provided with a receiving structure 121 that can just accommodate the second connection point 300, which is inserted into the receiving structure 121 and connected to the first connection point 110.
[0052] The signal source interface 200 is located on the second side of the base plate 100 and is connected to the first connection point 110. The signal source interface 200 is used to connect to the test equipment, and different signal source interfaces 200 are connected to different terminals of the test equipment. The signal source interface 200 can be connected to the first connection point through wiring inside the base plate 100 or directly through the base plate 100. The number of signal source interfaces 200 can be up to 6.
[0053] The test base structure of this application embodiment is simple and can be used with corresponding test sockets to test chips with different packaging forms.
[0054] In one embodiment, please refer to... Figure 1 The first connection point 110 includes a first electrode connection point 111, a second electrode connection point 112 and a third electrode connection point 113. The first electrode connection point 111, the second electrode connection point 112 and the third electrode connection point 113 are respectively used to connect to the three electrodes of the power device in the chip under test through the second connection point 300.
[0055] Furthermore, the target electrode connection point includes a first sub-connection point and a second sub-connection point, which are respectively used to connect to the same electrode of the power device through the second connection point. The first sub-connection point is used to transmit power signals from the test equipment to the electrode of the power device, and the second sub-connection point is used to transmit measurement signals from the electrode of the power device to the test equipment. The target electrode connection point includes at least one of a first electrode connection point, a second electrode connection point, and a third electrode connection point.
[0056] Understandable, such as Figure 1 As shown, the first pole connection point 110 includes sub-connection points 1111 and 1112, the second pole connection point 120 includes sub-connection points 1121 and 1122, and the third pole connection point 130 includes sub-connection points 1131 and 1132. Sub-connection points 1111 and 1112 can be connected to the first pole of the power device through the second connection point 300 on the test socket, sub-connection points 1121 and 1122 can be connected to the second pole of the power device through the second connection point 300 on the test socket, and sub-connection points 1131 and 1132 can be connected to the third pole of the power device through the second connection point 300 on the test socket.
[0057] One of the source, drain, or gate of the power device can be used as the first terminal, another of the source, drain, or gate of the power device can be used as the second terminal, and the remaining terminal of the source, drain, or gate of the power device can be used as the third terminal. For example, the source of the power device can be used as the first terminal, the drain as the second terminal, and the gate as the third terminal; alternatively, the drain of the power device can be used as the first terminal, the source as the second terminal, and the gate as the third terminal; alternatively, the gate can be used as the first terminal, the source as the second terminal, and the drain as the third terminal.
[0058] It is understandable that by cooperating with the six sub-connection points on the test base and the second connection point 300 on the test socket, Kelvin connection of the power device can be achieved, and the electrical parameters of the power device can be measured more accurately.
[0059] In one embodiment, the base plate 100 further includes a conductive structure 130, through which the signal source interface 200 is connected to the first connection point 110. The conductive structure 130 can be made of copper, and the area and shape of the conductive structures 130 connected to each signal source interface 200 can be the same or different. Each conductive structure 130 can be disposed in the same layer within the base plate 100. Besides facilitating electrical signal transmission between the signal source interface 200 and the first connection point 110, the conductive structure 130 also serves a heat dissipation function.
[0060] In one embodiment, the test base further includes multiple first fixing components, and each signal source interface is fixedly connected to the base plate through at least one first fixing component. The first fixing component can be a bolt.
[0061] In one embodiment, the test base further includes a fixing plate and a plurality of second fixing components. The fixing plate is fixedly connected to the base plate through each of the second fixing components, and the fixing plate is located on the first side of the base plate. Each signal source interface is fixedly connected to the fixing plate and passes through the fixing plate. The end of each signal source interface near the base plate is connected to the base plate.
[0062] In one embodiment, each signal source interface 200 includes a first signal probe and a second signal probe, wherein the first signal probe is connected to a first connection point 110, and the second signal probe is connected to a reference ground. The second signal probe is arranged around the first signal probe and can be used to shield the electrical signals transmitted on the first signal probe from interference by external electromagnetic signals.
[0063] In one embodiment, this application also provides a test socket, such as Figure 2As shown, the device includes a test socket body 500, a second connection point 300, and a chip interface 400. The second connection point 300 is located on the first side of the test socket body 500, and the chip interface 400 is located on the second side of the test socket body 500 and is connected to the second connection point 300. The chip interface 400 can be used to connect to the chip under test. The test socket body 500 can be a PCB (printed circuit board), and the chip interface 400 and the second connection point 300 can be connected through internal wiring within the test socket body 500.
[0064] The test socket is used for detachable connection to the test base. When the test socket is connected to the test base, the second connection point 300 is connected to the first connection point 110 in the test base. The test base can be described with reference to the test base provided in any of the above embodiments. It can be understood that when the test socket is connected to the test base, the chip interface 400, the second connection point 300, the first connection point 110, and the signal source interface 200 are connected in a one-to-one correspondence.
[0065] The test socket provided in this application embodiment can be used to connect to a chip under test with a specific package form, and together with the test base, it can realize the testing of the chip under test in different scenarios.
[0066] In one embodiment, please refer to... Figure 2 The second connection point 300 includes a fourth pole connection point 310, a fifth pole connection point 320, and a sixth pole connection point 360.
[0067] The chip interface 400 includes at least a power device interface, which comprises a first terminal interface, a second terminal interface, and a third terminal interface. The first terminal interface is connected to the fourth terminal connection point 310 and can be used to connect to the first terminal of the power device of the chip under test. The second terminal interface is connected to the fifth terminal connection point 320 and can be used to connect to the second terminal of the power device of the chip under test. The third terminal interface is connected to the sixth terminal connection point 330 and can be used to connect to the third terminal of the power device of the chip under test.
[0068] It is understood that one end of the first pole interface is connected to the fourth pole connection point 310 through the internal wiring of the test socket body 500, and the other end of the first pole interface is connected to the first pole of the power device. One end of the second pole interface is connected to the fifth pole connection point 320 through the internal wiring of the test socket body 500, and the other end of the second pole interface is connected to the second pole of the power device. One end of the third pole interface is connected to the sixth pole connection point 330 through the internal wiring of the test socket body 500, and the second end of the third pole interface is connected to the third pole of the power device.
[0069] Furthermore, the target pole connection point includes at least one of the fourth pole connection point 310, the fifth pole connection point 320, and the sixth pole connection point 330. The target pole connection point includes a third sub-connection point and a fourth sub-connection point. It can be understood that the fourth pole connection point 310 includes sub-connection points 311 and 312, the fifth pole connection point 320 includes sub-connection points 321 and 322, and the sixth pole connection point 330 includes sub-connection points 331 and 332. Each sub-connection point in the test socket can be connected one-to-one with each sub-connection point in the test base.
[0070] In one embodiment, the test socket further includes a first connector 610 and a second connector 620, and the target electrode connection point is connected to the target electrode interface through the first connector 610 or the second connector 620. The target electrode interface includes at least one of a first electrode interface, a second electrode interface, and a third electrode interface.
[0071] To improve the integration of the test socket, the test socket body 500 can be laminated from multiple film layers. For example, the test socket body 500 may include a first conductive layer, a second insulating layer, and a second conductive layer stacked sequentially. In some embodiments, a second insulating layer is further disposed on the side of the first conductive layer away from the first insulating layer, and a third insulating layer is further formed on the side of the second conductive layer away from the first insulating layer. The first connector and the second connector can be disposed in different film layers. Thus, the first connector 610 and the second connector 620 can be disposed in different conductive film layers. Specifically, the first connector 610 includes a first conductive wire 611 and a first conductive plug 612, with the first conductive wire 611 located in the first conductive layer. The second connector 620 includes a second conductive wire 621 and a second conductive plug 622, with the second conductive wire 621 located in the second conductive layer.
[0072] The first conductive line 611 is connected to the target electrode interface, and the target electrode connection point is connected to the first conductive line through the first conductive plug 612. Taking the first side of the test socket body where the first conductive layer is closer as an example, the first conductive plug 612 passes through the first conductive layer, the first insulating layer, and the second conductive layer to the first conductive line 611 and the target electrode connection point, thereby connecting the target electrode connection point and the corresponding target electrode interface.
[0073] Optionally, the second conductive line 621 is connected to the target electrode interface, and the target electrode connection point is connected to the second conductive line via the second conductive plug 622. Taking the first side of the test socket body where the first conductive layer is closer as an example, the second conductive plug 622 passes through the first conductive layer, the first insulating layer, and the second conductive layer to connect to the second conductive line 621 and the target electrode connection point, thereby connecting the target electrode connection point and the corresponding target electrode interface.
[0074] Optionally, the first conductive line 611 is connected to a portion of the first, second, and third pole interfaces, and the second conductive line 621 is connected to the remaining portions of the first, second, and third pole interfaces. Then, the corresponding second connection point is connected to the chip interface via the first conductive plug 612, and the corresponding second connection point is connected to the chip interface via the second conductive plug 622.
[0075] In one embodiment, the second connection point 300 is disposed on the periphery of the chip interface 400.
[0076] Based on the same concept, in one embodiment, this application also provides a test component, including the test base provided in any of the above embodiments, and / or the test socket provided in any of the above embodiments.
[0077] In one embodiment, the test component includes at least two test sockets, wherein the arrangement of the second connection points 300 of each test socket is the same as the arrangement of the first connection points 110, and the chip interface 400 of each test socket is different.
[0078] like Figures 4-9 As shown, six different test sockets are presented. The arrangement of the second connection point 300 in each test socket is the same, and also the same as the arrangement of the first connection point 110 in the test base. However, the arrangement of the chip interface 400 in each test socket is different. Each test socket corresponds to a specific packaging method. For example, Figure 4 This is a test socket for connecting chips in TO-252 packages. Figure 5 For use as a test socket for chips employing the TOLL package method. Figure 6 This is a test socket for connecting chips in PDFN5*6-8L packages. Figure 7 This is a test socket for connecting chips in PDFN3*3-8L packages. Figure 8 This is a test socket for connecting chips in DFN8*8-8L packages. Figure 9 This is a test socket for a chip that uses an SOP-8 package.
[0079] When using the test components of this application, the appropriate test socket and test base can be selected and connected according to the different package types of the chip under test. In this way, stable testing can be performed simply by changing different test sockets.
[0080] In the description of this specification, references to terms such as "some embodiments," "other embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.
[0081] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0082] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these modifications and improvements all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.
Claims
1. A test socket, characterized by, The application relates to a test base and a test seat. The test base comprises a base plate, a signal source interface and a test seat sub. The base plate comprises a first connecting point and a fixing seat, which are located at a first side of the base plate respectively, and the first connecting point is located in the fixing seat; the fixing seat is used for detachable connection with the test seat sub; when the test seat sub is connected with the fixing seat, the first connecting point is connected with a second connecting point on the test seat sub.
2. The test socket of claim 1, wherein, The signal source interface is located at a second side of the base plate, is connected with the first connecting point and is used for connection with a test device.
3. The test socket of claim 2, wherein, The first connecting point comprises a first pole connecting point, a second pole connecting point and a third pole connecting point, which are used for one-to-one corresponding connection with three electrodes of a power device in a chip to be tested through the second connecting point. A target pole connecting point comprises at least one of the first pole connecting point, the second pole connecting point and the third pole connecting point. The target pole connecting point comprises a first sub connecting point and a second sub connecting point, which are used for connection with the same electrode of the power device through the second connecting point; wherein The first sub connecting point is used for transmitting a power supply signal from the test device to the electrode of the power device; 4. The test socket of any one of claims 1-3, wherein, The second sub connecting point is used for transmitting a measurement signal from the electrode of the power device to the test device.
5. A test socket characterized by, The base plate further comprises a conductive structure, wherein the signal source interface is connected with the first connecting point through the conductive structure. The test seat comprises a test seat body, a second connecting point, a chip interface and a test seat sub. The second connecting point is located at a first side of the test seat body. The chip interface is located at a second side of the test seat body, is connected with the second connecting point and is used for connection with a chip to be tested; wherein The test seat sub is used for detachable connection with a test base; when the test seat sub is connected with the test base, the second connecting point is connected with a first connecting point in the test base.
6. The test socket of claim 5, wherein, The second connecting point comprises a fourth pole connecting point, a fifth pole connecting point and a sixth pole connecting point. The chip interface comprises at least a power device interface, which comprises a first pole interface, a second pole interface and a third pole interface; wherein The first pole interface is connected with the fourth pole connecting point and is used for connection with a first pole of a power device of the chip to be tested; The second pole interface is connected with the fifth pole connecting point and is used for connection with a second pole of the power device of the chip to be tested; The third pole interface is connected with the sixth pole connecting point and is used for connection with a third pole of the power device of the chip to be tested.
7. The test socket of claim 6, wherein, A target pole connecting point comprises at least one of the fourth pole connecting point, the fifth pole connecting point and the sixth pole connecting point; the target pole connecting point comprises a third sub connecting point and a fourth sub connecting point. The test seat sub further comprises a first connecting piece and a second connecting piece; wherein The target pole connecting point is connected with a target pole interface through the first connecting piece or the second connecting piece; the target pole interface comprises at least one of the first pole interface, the second pole interface and the third pole interface.
8. The test socket of claim 7, wherein, The test seat body comprises a first conductive layer, a second insulating layer and a second conductive layer which are stacked in sequence; wherein, The first connecting member comprises a first conductive wire and a first conductive plug, and the first conductive wire is located in the first conductive layer; The second connecting member comprises a second conductive wire and a second conductive plug, and the second conductive wire is located in the second conductive layer; The first conductive wire is connected with the target electrode interface, and the target electrode connecting point is connected with the first conductive wire through the first conductive plug; or the second conductive wire is connected with the target electrode interface, and the target electrode connecting point is connected with the second conductive wire through the second conductive plug.
9. A test assembly characterized by, The test seat comprises at least two test seat bodies, wherein the arrangement of the second connecting point of each test seat body is the same as the arrangement of the first connecting point, and the chip interface of each test seat body is different.
10. The test assembly of claim 9, wherein, The test seat comprises at least two test seat bodies, wherein the arrangement of the second connecting point of each test seat body is the same as the arrangement of the first connecting point, and the chip interface of each test seat body is different.