Lamp-driver integrated packaging LED process detection device
By designing an integrated LED manufacturing process testing device that combines lamp and driver, the electrical connection and reliability testing issues of integrated LED manufacturing processes were solved, achieving efficient and low-error process quality control and meeting diverse production needs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-28
- Publication Date
- 2026-03-31
AI Technical Summary
In the existing technology, the manufacturing process and reliability testing of integrated LED packages with integrated lamp and driver face problems such as current channel control errors, packaging process defects, and lack of dedicated testing methods, resulting in high testing errors, high costs, and unsuitability for small-batch testing.
An integrated LED manufacturing process testing device combining lamp driver and circuit design was designed. It includes a housing, power supply, processor and testing fixtures, supports series and parallel station testing, and is equipped with limit switches and intelligent control panel. It can accurately test electrical connections and integrated circuit reliability, and reduce testing errors.
It significantly improves process quality control efficiency, supports diverse production needs, ensures accurate fault location, enhances testing safety and efficiency, and reduces testing costs.
Smart Images
Figure CN224066966U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of LED testing, and more specifically, to an integrated LED manufacturing process testing device that combines lamp driver and packaging. Background Technology
[0002] In the field of LED lighting technology, integrated LED packages that combine the driver circuit and the light-emitting chip are gradually becoming an industry trend due to their unique feature of integrating the driver circuit and the light-emitting chip into one unit. These LEDs control the constant current channel output of the light-emitting chip through a built-in integrated circuit (IC), achieving programmed lighting and color changing functions. However, their manufacturing process and reliability testing face significant technical bottlenecks: on the one hand, errors in the current channel control of the integrated circuit and defects in the packaging process (such as dark cracks and pressure marks) can easily lead to abnormal LED performance, requiring long-term lighting verification to confirm reliability; on the other hand, the industry lacks dedicated testing methods adapted to their integrated structure. Currently, screening is generally done using spectrophotometers, but spectrophotometers have an error rate of approximately 1%, and their operation is complex and costly, making them particularly unsuitable for small-batch testing scenarios.
[0003] Based on this, we provide an integrated LED manufacturing process testing device that combines lamp driver and packaging. Utility Model Content
[0004] To address the problems mentioned in the background art, this utility model provides an integrated LED manufacturing process testing device that combines lamp driver and LED chip, which can detect the electrical connection function of the LED chip and the reliability problems of the integrated circuit (such as dark cracks and pressure damage). This solves the pain point of the industry relying on high-error beam splitting equipment or terminal assembly testing, and significantly improves the efficiency of process quality control.
[0005] The integrated LED manufacturing process testing device combining lamp driver and packaging technology provided by this utility model adopts the following technical solution:
[0006] An integrated LED manufacturing process testing device combining lamp driver and package includes a housing, a power supply, a processor, and a testing fixture; the processor is disposed inside the housing, and the testing fixture is disposed on the top of the housing; the power supply is disposed inside the housing and is used to supply power to the testing fixture and the processor; the processor has a built-in register, which can control the corresponding testing fixture according to control requirements.
[0007] Preferably, the side of the housing is provided with heat dissipation holes, the back of the housing is equipped with a power interface, and the back of the housing is also equipped with a power switch for turning on the power.
[0008] Preferably, the test fixture includes a series station and a parallel station; the series station connects multiple LED beads through signal input pins and output pins to test the integrated circuit function; the parallel station independently controls the lighting signal of each LED bead.
[0009] Preferably, the top of the housing is provided with two switches, which control the series station and the parallel station respectively; the top of the housing is provided with a color switching button and a mode switching button, both of which are connected to the processor. By switching the processor's built-in program commands through the color switching button, the test station can receive signals of different colors. By switching the processor's built-in program commands through the mode switching button, the test station can receive signals of different lighting modes.
[0010] Preferably, the testing fixture includes an A-pin testing station and a B-pin testing station distributed vertically. Both the A-pin testing station and the B-pin testing station are provided with a signal input terminal and a signal output terminal, and adjacent LEDs are connected in series with the signal input terminal of the next LED through the signal output terminal.
[0011] Preferably, the test fixture further includes a limiter with an opening and closing structure. When the limiter is open, the test fixture is automatically powered off and the LED beads can be adjusted. When the limiter is closed, the test fixture is powered on and the LED beads are fixed.
[0012] In summary, this utility model has the following beneficial technical effects:
[0013] 1. The integrated LED manufacturing process testing device that combines lamp driver and packaging can detect the electrical connection function of lamp beads and the reliability of integrated circuits (such as dark cracks and pressure damage), solving the industry's pain point of relying on high-error beam splitting equipment or terminal assembly testing, and significantly improving process quality control efficiency.
[0014] 2. It supports both single-point control and breakpoint resume modes, flexibly responding to different testing scenarios and ensuring accurate fault location in complex circuits; it supports series, parallel, and different pin positions (such as A / B pin positions) testing to meet diverse production needs; equipped with limit switches, it protects the LED beads while achieving power-off protection (the station automatically cuts off power when the limit switch is opened), improving testing safety.
[0015] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the structure of an integrated LED manufacturing process testing device combining lamp driver and packaging according to Embodiment 1 of this utility model;
[0017] Figure 2This is a schematic diagram of the top structure of an integrated LED manufacturing process testing device combining lamp driver and packaging, according to Embodiment 1 of this utility model.
[0018] Figure 3 This is a front structural schematic diagram of an integrated LED manufacturing process testing device combining lamp driver and packaging according to Embodiment 1 of this utility model.
[0019] Figure 4 This is a side view of an integrated LED manufacturing process testing device combining lamp driver and packaging according to Embodiment 1 of this utility model.
[0020] Figure 5 This is a schematic diagram of the back structure of an integrated LED manufacturing process testing device combining lamp driver and packaging according to Embodiment 1 of this utility model;
[0021] Figure 6 This is a circuit diagram of an integrated LED manufacturing process testing device combining lamp driver and packaging, according to Embodiment 1 of this utility model.
[0022] Figure 7 This is a schematic diagram of the structure of an integrated LED manufacturing process testing device combining lamp driver and packaging according to Embodiment 2 of this utility model;
[0023] Figure 8 This is a schematic diagram of the top structure of an integrated LED manufacturing process testing device combining lamp driver and packaging, according to Embodiment 2 of this utility model.
[0024] Figure 9 This is a front structural schematic diagram of an integrated LED manufacturing process testing device combining lamp driver and packaging according to Embodiment 2 of this utility model.
[0025] Figure 10 This is a side view of an integrated LED manufacturing process testing device combining lamp driver and packaging according to Embodiment 2 of this utility model.
[0026] Figure 11 This is a schematic diagram of the back structure of an integrated LED manufacturing process testing device combining lamp driver and LED driver in Embodiment 2 of this utility model;
[0027] Figure 12 This is a circuit diagram of an integrated LED process testing device combining lamp driver and packaging, as described in Embodiment 2 of this utility model.
[0028] Explanation of reference numerals in the attached diagram: 1. Housing; 2. Power supply; 3. Processor; 4. Heat dissipation hole; 5. Power interface; 6. Power switch; 7. Series station; 8. Parallel station; 9. A-pin test station; 10. B-pin test station; 11. Limit switch. Detailed Implementation
[0029] The following is in conjunction with the appendix Figures 1 to 12 The present invention will be described in further detail below.
[0030] It should be noted that the accompanying drawings are schematic and not to scale. For clarity and convenience, the relative dimensions and proportions of the parts shown are exaggerated or reduced in size; all dimensions are merely illustrative and not limiting. Furthermore, the same reference numerals are used for the same structures, elements, or fittings appearing in more than two drawings to indicate similar features.
[0031] Example 1
[0032] This utility model discloses an integrated LED manufacturing process testing device that combines lamp driver and packaging. (Refer to...) Figures 1 to 6 An integrated LED manufacturing process testing device combining lamp driver and package includes a housing 1, a power supply 2, a processor 3, and a testing fixture; the processor 3 is located inside the housing 1, and the testing fixture is located on the top of the housing 1; the power supply 2 is located inside the housing 1 and is used to power the testing fixture and the processor 3; the processor 3 has built-in registers, which (integrate a multi-protocol communication instruction set and support SPI / I2C dual-mode switching) can control the corresponding testing fixture according to control requirements.
[0033] like Figure 4 and Figure 5 As shown, the side of the housing 1 has heat dissipation holes 4, the back of the housing 1 is equipped with a power interface 5, and the back of the housing 1 is also equipped with a power switch 6 for turning on the power supply 2.
[0034] Specifically, power supply 2 is equipped with an AC / DC conversion circuit, which inputs mains power through 220V power interface 5, converts it to 5V DC output through a voltage adapter, and is equipped with an independent power switch (6) to realize system power supply management.
[0035] like Figure 6 As shown, the test fixture includes a series station 7 and a parallel station 8; the series station 7 connects multiple LED beads through signal input and output pins to test the integrated circuit function; the parallel station 8 independently controls the lighting signal of each LED bead.
[0036] Specifically, serial station 7 adopts a daisy-chain topology, with the SDO pin of the front-stage LED and the SDI pin of the secondary LED cascaded. It has a built-in signal integrity detection circuit that can monitor the signal transmission attenuation in real time and supports cascade impedance matching adjustment (0-100Ω adjustable).
[0037] Parallel station 8: Configured with independent drive channels (1-16 channels expandable), each channel is equipped with isolated MOS drive circuit, supporting PWM dimming (100Hz-20kHz) and constant current drive (5-50mA).
[0038] like Figure 2As shown, the top of the housing 1 is equipped with two switches, which control the series station 7 and the parallel station 8 respectively; the top of the housing 1 is equipped with a color switching button and a mode switching button, both of which are connected to the processor 3. By switching the built-in program commands of the processor 3 through the color switching button, the test station can receive signals of different colors. By switching the built-in program commands of the processor 3 through the mode switching button, the test station can receive signals of different lighting modes.
[0039] like Figure 1 As shown, the front of housing 1 is equipped with dual digital displays: a main display for real-time analysis of IC communication protocols (SPI mode / I2C mode); and a secondary display for high-precision current monitoring (±1% accuracy, 10ms refresh rate).
[0040] The front of housing 1 is also equipped with an intelligent control panel, which includes a mode selection group (containing three sets of DIP switches for protocol switching / test mode / color space (RGB / CMYK)), a parameter adjustment group (integrated rotary encoder (current / duty cycle / frequency three-level adjustment)) and a function button group (configured with dedicated buttons for emergency stop, data saving, and test reset).
[0041] Example 2
[0042] This utility model discloses an integrated LED manufacturing process testing device that combines lamp driver and packaging. (Refer to...) Figures 7 to 12 An integrated LED manufacturing process testing device combining lamp driver and package includes a housing 1, a power supply 2, a processor 3, and a testing fixture; the processor 3 is disposed inside the housing 1, and the testing fixture is disposed on the top of the housing 1; the power supply 2 is disposed inside the housing 1 and is used to supply power to the testing fixture and the processor 3; the processor 3 has a built-in register, which can control the corresponding testing fixture according to control requirements.
[0043] like Figure 10 As shown, the side of the housing 1 has heat dissipation holes 4, the back of the housing 1 is equipped with a power interface 5, and the back of the housing 1 is also equipped with a power switch 6 for turning on the power supply 2.
[0044] like Figure 8 As shown, the test fixture includes a test station 9 with pin A and a test station 10 with pin B distributed vertically. Both test stations 9 with pin A and test stations 10 with pin B are equipped with signal input terminals and signal output terminals, and adjacent LEDs are connected in series with the signal input terminal of the next LED through the signal output terminal.
[0045] like Figure 8As shown, the test fixture also includes a limiter 11 (electromagnetic-mechanical dual-mode lock). The limiter 11 has an opening and closing structure. When the limiter 11 is open, the test fixture is automatically powered off and the LED beads can be adjusted. When the limiter 11 is closed, the test fixture is powered on and the LED beads are fixed.
[0046] This structural design enables the detection of electrical connection functions of LED chips and reliability issues of integrated circuits (such as dark cracks and pressure marks), solving the industry's pain point of relying on high-error beam splitting equipment or terminal assembly testing, significantly improving process quality control efficiency, and supporting both single-point control and breakpoint resume modes to flexibly respond to different testing scenarios and ensure accurate fault location in complex circuits; it supports series, parallel, and different pin positions (such as A / B pin positions) testing to meet diverse production needs; equipped with limit switch 11, it protects the LED chips while achieving power-off protection (the station automatically cuts off power when the limit switch is opened), improving testing safety.
[0047] All standard parts used in this utility model can be purchased from the market. Irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. In addition, the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here.
[0048] In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. "A plurality of" means two or more, unless otherwise explicitly specified.
[0049] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0050] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0051] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0052] The accompanying drawings of the embodiments disclosed in this utility model only involve the structures involved in the embodiments disclosed in this utility model. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this utility model can be combined with each other.
[0053] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A lamp-in-drive integrated package LED process detection device, characterized in that, The utility model relates to a test device for integrated circuit, which comprises a shell (1), a power supply (2), a processor (3) and a test tool. The processor (3) is arranged inside the shell (1), and the test tool is arranged on the top of the shell (1); the power supply (2) is arranged inside the shell (1) and is used for supplying power to the test tool and the processor (3). The processor (3) is provided with a register, which can control the corresponding test tool according to control requirements. The shell (1) is provided with a heat dissipation hole (4) on the side, a power supply interface (5) on the back and a power switch (6) on the back for turning on the power supply (2).
2. The lamp-in-drive integrated package LED process detection device of claim 1, wherein: The test tool comprises series workstations (7) and parallel workstations (8).
3. The lamp-in-drive integrated package LED process detection device of claim 1, wherein: The series workstations (7) are connected with a plurality of LED lamp beads through signal input pins and output pins to detect the functions of integrated circuits. The parallel workstations (8) independently control the lighting signals of each LED lamp bead. The top of the shell (1) is provided with two switch parts, which are used for controlling the series workstations (7) and the parallel workstations (8) respectively.
4. The lamp-in-drive integrated package LED process detection device of claim 3, wherein: The top of the shell (1) is provided with a color switching button and a mode switching button, which are connected with the processor (3); the color switching button is used for switching the program commands in the processor (3), so that the test workstations can receive signals of different colors; the mode switching button is used for switching the program commands in the processor (3), so that the test workstations can receive signals of different lighting modes. The test tool comprises A-pin test workstations (9) and B-pin test workstations (10) arranged in an up-down manner; the A-pin test workstations (9) and the B-pin test workstations (10) are provided with signal input ends and signal output ends, and adjacent lamp beads are connected in series through the signal output ends and the signal input ends of the next lamp beads.
5. The lamp-in-drive integrated package LED process detection device of claim 1, wherein: The test tool further comprises a position limiter (11) having an opening and closing structure; when the position limiter (11) is opened, the test tool is automatically powered off and the lamp beads can be adjusted; when the position limiter (11) is closed, the test tool is powered on and the lamp beads are fixed.
6. The lamp-in-drive integrated package LED process detection device of claim 5, wherein: