Super capacitor structure

Abstract

The utility model provides a super capacitor structure. The super capacitor structure comprises a bottom plate, a top cover, a mounting piece, a first capacitor module, a second capacitor module and a connecting structure, the top cover is detachably connected to the bottom plate, and an accommodating cavity is formed between the top cover and the bottom plate; the mounting piece is positioned in the accommodating cavity; the first capacitor module is located between the mounting piece and the bottom plate, and the first capacitor module is detachably connected to the mounting piece; the second capacitor module is located between the mounting piece and the top cover, and the second capacitor module is detachably connected to the mounting piece; the two ends of the connecting structure are detachably connected to the bottom plate and the top cover respectively, and the connecting structure is configured to press the first capacitor module on the bottom plate and press the second capacitor module on the top cover.

Description

Technical Field

[0001] This application relates to the field of energy storage technology, and in particular to a supercapacitor structure. Background Technology

[0002] Most supercapacitor structures integrate multiple individual capacitors onto a circuit board to form a capacitor module, which is then fixed inside a housing. Currently, most capacitor modules are secured to the housing directly with screws, leaving one side of each individual capacitor unsecured, resulting in poor installation stability. Utility Model Content

[0003] This application provides a supercapacitor structure to solve the problem of poor installation stability of capacitor modules in known supercapacitor structures.

[0004] This application provides a supercapacitor structure, including a base plate, a top cover, a mounting component, a first capacitor module, a second capacitor module, and a connecting structure; the top cover is detachably connected to the base plate, and a receiving cavity is formed between the top cover and the base plate; the mounting component is located within the receiving cavity; the first capacitor module is located between the mounting component and the base plate, and the first capacitor module is detachably connected to the mounting component; the second capacitor module is located between the mounting component and the top cover, and the second capacitor module is detachably connected to the mounting component; both ends of the connecting structure are detachably connected to the base plate and the top cover, respectively, and the connecting structure is configured to press the first capacitor module onto the base plate and press the second capacitor module onto the top cover.

[0005] In one possible implementation, the connection structure includes a first connector, a second connector, and an intermediate connector;

[0006] One end of the first connector is connected to the base plate, and the other end is detachably connected to the intermediate connector. The first capacitor module is clamped between the base plate and the intermediate connector.

[0007] One end of the second connector is connected to the top cover, and the other end is detachably connected to the intermediate connector. The second capacitor module is clamped between the top cover and the intermediate connector.

[0008] In one possible implementation, the first capacitor module includes a first circuit board and a plurality of first capacitor units, wherein the plurality of first capacitor units are connected to the first circuit board.

[0009] The first circuit board has a first through hole, the first connector passes through the first through hole, and the middle connector abuts against the first circuit board at one end near the base plate.

[0010] In one possible implementation, the first circuit board is detachably connected to the side of the mounting member near the base plate.

[0011] In one possible implementation, the second capacitor module includes a second circuit board and a plurality of second capacitor units, wherein the plurality of second capacitor units are connected to the second circuit board;

[0012] The second circuit board has a second through hole, the second connector passes through the second through hole, and the end of the intermediate connector away from the base plate abuts against the second circuit board.

[0013] In one possible implementation, the second circuit board is detachably connected to the side of the mounting member away from the base plate.

[0014] In one possible implementation, the supercapacitor structure further includes a first buffer element sandwiched between the first capacitor module and the base plate; and / or

[0015] The supercapacitor structure also includes a second buffer, which is sandwiched between the second capacitor module and the top cover.

[0016] In one possible implementation, the top cover includes a first section and two second sections. Along a first direction, the first section is spaced apart from the bottom plate. Along a second direction, the two second sections are connected to both sides of the first section and are detachably connected to the bottom plate. The second direction intersects the first direction.

[0017] In one possible implementation, the supercapacitor structure further includes two side plates, which are disposed on opposite sides of the top cover along a third direction, and both side plates are detachably connected to the top cover.

[0018] In one possible implementation, the side plate has heat dissipation holes that connect to the receiving cavity.

[0019] The supercapacitor structure of this application, by setting a mounting component between the base plate and the top cover, connects both the first and second capacitor modules to the mounting component. This simplifies the overall structure of the supercapacitor by using a single mounting component as the connection base while simultaneously enabling the installation of both the first and second capacitor modules. Furthermore, this application also includes a connection structure that presses the first capacitor module firmly onto the base plate and the second capacitor module firmly onto the top cover, further securing the first and second capacitor modules. This ensures that both ends of the first and second capacitor modules are limited, guaranteeing the stability of the installation. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the supercapacitor structure of this application in one embodiment.

[0021] Figure 2 This is a schematic diagram of the structure of the first capacitor module of the supercapacitor structure of this application in one embodiment.

[0022] Figure 3 This is an exploded view of the supercapacitor structure of this application in one embodiment.

[0023] Figure 4 This is a schematic diagram of the internal structure of the supercapacitor structure of this application in one embodiment.

[0024] Figure 5 This is a schematic diagram showing the separation of the connection structure of the supercapacitor structure of this application in one embodiment.

[0025] Key component symbols: 100, Supercapacitor structure; Z, First direction; Y, Second direction; X, Third direction; 10, Top cover; 11, First section; 12, Second section; 13, Extension; 14, Reinforcing section; 15, Handle; 16, Receiving cavity; 17, Input / output terminals; 20, Base plate; 30, Side plate; 31, Heat dissipation hole; 40, First capacitor module; 41, First circuit board; 410, First through hole; 42, First capacitor unit; 43, Positive terminal; 44, Negative terminal; 50, Second capacitor module; 51, Second circuit board; 510, Second through hole; 52, Second capacitor unit; 60, Mounting component; 70, Connection structure; 71, First connector; 710, First connecting part; 72, Second connector; 720, Second connecting part; 73, Intermediate connector; 80, First buffer; 90, Second buffer.

[0026] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0027] The following description will refer to the accompanying drawings to provide a more complete picture of the present application. The drawings illustrate exemplary embodiments of the present application. However, the present application may be implemented in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. These exemplary embodiments are provided to make the present application thorough and complete, and to fully convey the scope of the present application to those skilled in the art. The same reference numerals denote the same or similar components.

[0028] The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to limit the application. As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” are intended to also include the plural forms. Furthermore, when used herein, “comprising” and / or “including” and / or “having,” integers, steps, operations, components, and / or components, but does not exclude the presence or addition of one or more other features, regions, integers, steps, operations, components, and / or groups thereof.

[0029] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. Furthermore, unless expressly defined herein, terms such as those defined in a general dictionary should be interpreted as having the same meaning as they have in the relevant art and in the content of this application, and will not be interpreted as having an idealized or overly formal meaning.

[0030] The specific embodiments of this application will be further described in detail below with reference to the accompanying drawings.

[0031] like Figures 1 to 3 As shown, this embodiment provides a supercapacitor structure 100, including a base plate 20, a top cover 10, a mounting component 60, a first capacitor module 40, a second capacitor module 50, and a connection structure 70.

[0032] For ease of reading, this application introduces a first direction Z, a second direction Y, and a third direction X to describe the embodiments of this application. The first direction Z, the second direction Y, and the third direction X can be three non-parallel straight lines in space; further, the first direction Z, the second direction Y, and the third direction X can be three mutually perpendicular directions in a three-dimensional coordinate system (a three-dimensional Cartesian coordinate system). In subsequent embodiments, the first direction Z is described as the Z-axis direction of the three-dimensional coordinate system, the second direction Y is the Y-axis direction of the three-dimensional coordinate system, and the third direction X is the X-axis direction of the three-dimensional coordinate system.

[0033] Along the first direction Z, a top cover 10 is disposed on one side of a base plate 20, and the top cover 10 is detachably connected to the base plate 20, forming a receiving cavity 16 between the top cover 10 and the base plate 20. A mounting member 60 is located within the receiving cavity 16 to divide the receiving cavity 16 into two chambers. A first capacitor module 40 is located between the mounting member 60 and the base plate 20, and the first capacitor module 40 is detachably connected to the mounting member 60. A second capacitor module 50 is located between the mounting member 60 and the top cover 10, and the second capacitor module 50 is detachably connected to the mounting member 60. The two ends of a connecting structure 70 are detachably connected to the base plate 20 and the top cover 10, respectively, and the connecting structure 70 is configured to press the first capacitor module 40 against the base plate 20 and the second capacitor module 50 against the top cover 10.

[0034] Thus, the supercapacitor structure 100 of this application, by providing a mounting member 60 between the base plate 20 and the top cover 10, connects both the first capacitor module 40 and the second capacitor module 50 to the mounting member 60. While achieving the installation of the first capacitor module 40 and the second capacitor module 50, the use of a single mounting member 60 as the connection base simplifies the overall structure of the supercapacitor structure 100. Furthermore, this application also provides a connecting structure 70, which presses the first capacitor module 40 firmly onto the base plate 20 and the second capacitor module 50 firmly onto the top cover 10, further securing the first capacitor module 40 and the second capacitor module 50. This ensures that both ends of the first capacitor module 40 and the second capacitor module 50 are limited, guaranteeing the stability of the installation of the first capacitor module 40 and the second capacitor module 50.

[0035] Please combine Figures 1 to 3 In one embodiment, the top cover 10 includes a first section 11 and two second sections 12. Along a first direction Z, the first section 11 is spaced apart from the bottom plate 20. Along a second direction Y, the two second sections 12 are connected to both sides of the first section 11 and are detachably connected to the bottom plate 20. The second direction Y intersects the first direction Z.

[0036] The second section 12 is perpendicular to the first section 11. Along the first direction Z, one end of the second section 12 is integrally formed on the side of the first section 11 in the second direction Y, and the other end of the second section 12 has an extension 13 protruding from it. Along the second direction Y, the extension 13 protrudes outward from the side of the second section 12 away from the other second section 12. The extension 13 is fitted to the base plate 20, and the extension 13 is detachably connected to the base plate 20, for example, the extension 13 and the base plate 20 can be connected by fasteners such as bolts.

[0037] In this embodiment, the top cover 10 further includes a plurality of reinforcing portions 14. The reinforcing portions 14 are located at the connection between the second section 12 and the first section 11, and are simultaneously connected to both the second section 12 and the first section 11 to ensure the structural strength of the top cover 10. The number of reinforcing portions 14 is set to four: two reinforcing portions 14 are connected to one extension 13, and the other two reinforcing portions 14 are connected to another extension 13. Furthermore, the two reinforcing portions 14 connected to the same extension 13 are spaced apart in a third direction X and are approximately located at both ends of the extension 13.

[0038] In this embodiment, the top cover 10 also includes handles 15, with two handles 15 respectively connected to two extensions 13. The handles 15 facilitate the user's handling of the supercapacitor structure 100.

[0039] In this embodiment, the supercapacitor structure 100 also includes two side plates 30. Along the third direction X, the two side plates 30 are respectively disposed on opposite sides of the top cover 10, and both side plates 30 are detachably connected to the top cover 10.

[0040] The receiving cavity 16 formed by the top cover 10 and the side plates 30 is open at both ends in the third direction X. The two side plates 30 are used to close the two openings so that the receiving cavity 16 is in a substantially closed state. The side plates 30 are located inside the receiving cavity 16, and the outer peripheral surface of the side plates 30 abuts against the inner peripheral surface of the receiving cavity 16. The side plates 30 are detachably connected to both the top cover 10 and the bottom plate 20. For example, the side plates 30 can be connected to the top cover 10 and the bottom plate 20 by fasteners such as bolts.

[0041] Specifically, the side plate 30 is provided with heat dissipation holes 31, which are connected to the receiving cavity 16. The number of heat dissipation holes 31 is set to be multiple, and the multiple heat dissipation holes 31 are distributed in an array to facilitate the injection of cool air from the heat dissipation holes 31 into the receiving cavity 16 to dissipate heat from the first capacitor module 40 and the second capacitor module 50, so as to avoid heat accumulation affecting the service life of the first capacitor module 40 and the second capacitor module.

[0042] Please combine Figures 2 to 4 In one embodiment, the first capacitor module 40 includes a first circuit board 41 and a plurality of first capacitor units 42. The plurality of first capacitor units 42 are connected to the first circuit board 41, specifically through processes such as soldering. The plurality of first capacitor units 42 are arranged in series and are all electrically connected to the first circuit board 41.

[0043] The first capacitor module 40 also includes a positive terminal 43 and a negative terminal 44, both of which are electrically connected to the first circuit board 41, so that the module composed of multiple first capacitor units 42 can form a current loop with external electrical equipment through the positive terminal 43 and the negative terminal 44.

[0044] The first section 11 is provided with an input / output terminal 17, which is electrically connected to the positive terminal 43 and the negative terminal 44, so as to realize the first capacitor module 40 is electrically connected to the external electrical equipment through the input / output terminal 17, thereby realizing the charging, discharging and voltage detection of the first capacitor module 40.

[0045] In this embodiment, the first circuit board 41 is detachably connected to the mounting member 60 on the side near the base plate 20. The mounting member 60 is arranged along a third direction X, and the number of mounting members 60 is set to two. Along the second direction Y, the two mounting members 60 are spaced apart. Along the first direction Z, the first circuit board 41 is simultaneously connected to the two mounting members 60 on the side near the base plate 20, specifically by fasteners such as bolts.

[0046] Specifically, the number of first capacitor modules 40 is set to two, and the two first capacitor modules 40 are spaced apart along the third direction X. The first circuit boards 41 of the two first capacitor modules 40 are connected to the two mounting parts 60 by fasteners such as bolts.

[0047] It is understood that in other embodiments, the number of first capacitor modules 40 may also be set to three or four or other numbers, and the specific number can be selected according to actual needs.

[0048] In this embodiment, the supercapacitor structure 100 further includes a first buffer 80, which is sandwiched between the first capacitor module 40 and the base plate 20.

[0049] The first buffer 80 is a buffer pad made of elastic material, and each first capacitor module 40 corresponds to multiple first buffers 80. The first buffer 80 is arranged along the second direction Y, and multiple first buffers 80 are arranged sequentially at intervals along the third direction X. The multiple first buffers 80 fill the gap between the first capacitor module 40 and the base plate 20, which can play a shock absorption role.

[0050] Please combine Figures 2 to 4 In one embodiment, the second capacitor module 50 includes a second circuit board 51 and a plurality of second capacitor units 52. The plurality of second capacitor units 52 are connected to the second circuit board 51, specifically through processes such as soldering. The plurality of second capacitor units 52 are arranged in series and are all electrically connected to the second circuit board 51.

[0051] The structure of the second capacitor module 50 and its electrical connection with external electrical equipment are the same as those of the first capacitor module 40, and will not be described again here.

[0052] In this embodiment, the second circuit board 51 is detachably connected to the side of the mounting member 60 away from the base plate 20. Specifically, along the first direction Z, the second circuit board 51 is simultaneously connected to the side of the two mounting members 60 near the first section 11, which can be achieved by fasteners such as bolts.

[0053] Specifically, the number of second capacitor modules 50 is set to two, and the two second capacitor modules 50 are spaced apart along the third direction X. The second circuit boards 51 of the two second capacitor modules 50 are connected to the two mounting parts 60 by fasteners such as bolts.

[0054] It is understood that in other embodiments, the number of second capacitor modules 50 may also be set to three or four or other numbers, and the specific number can be selected according to actual needs.

[0055] In this embodiment, the supercapacitor structure 100 further includes a second buffer 90, which is sandwiched between the second capacitor module 50 and the top cover 10.

[0056] The second buffer 90 is a buffer pad made of elastic material, and each second capacitor module 50 corresponds to multiple second buffers 90. The second buffer 90 is arranged along the second direction Y, and multiple second buffers 90 are arranged sequentially at intervals along the third direction X. The multiple second buffers 90 fill the gap between the second capacitor module 50 and the first section 11, which can play a shock absorption role.

[0057] Please combine Figures 3 to 5 In one embodiment, the connection structure 70 includes a first connector 71, a second connector 72, and an intermediate connector 73.

[0058] The first connector 71, the second connector 72, and the intermediate connector 73 are all arranged along the first direction Z. Along the first direction Z, the first connector 71 and the second connector 72 are spaced apart, and the intermediate connector 73 is located between the first connector 71 and the second connector 72.

[0059] Along the first direction Z, one end of the first connector 71 is connected to the base plate 20. The first connector 71 can be integrally formed with the base plate 20, or the first connector 71 and the base plate 20 can be connected by a threaded connection, so as to facilitate the separation of the first connector 71 and the base plate 20.

[0060] Along the first direction Z, the other end of the first connector 71 is detachably connected to the intermediate connector 73, and the first capacitor module 40 is clamped between the base plate 20 and the intermediate connector 73. The intermediate connector 73 is a hollow tubular structure, and its inner wall is provided with internal threads. The end of the first connector 71 away from the base plate 20 has a protruding first connecting portion 710, which can extend into the intermediate connector 73. The outer peripheral surface of the first connecting portion 710 is provided with external threads, which mate with the internal threads to achieve a threaded connection between the first connector 71 and the intermediate connector 73. Along the first direction Z, the end of the intermediate connector 73 near the base plate 20 abuts against the side of the first circuit board 41 away from the base plate 20, so that the first capacitor module 40 is pressed against the base plate 20 through the intermediate connector 73.

[0061] The first circuit board 41 has a first through hole 410 that extends through the first circuit board 41 along the first direction Z. The end of the first connector 71 away from the base plate 20 passes through the first through hole 410 and is connected to the intermediate connector 73. In addition, the first connector 71 can pass through the gap between the plurality of first capacitor units 42.

[0062] Specifically, each first capacitor module 40 is provided with four corresponding first connectors 71, which are arranged in a rectangular array. Correspondingly, the number of first through holes 410 is set to four, and the four first through holes 410 are respectively located at the four corners of the first circuit board 41.

[0063] In this embodiment, along the first direction Z, one end of the second connector 72 is connected to the first section 11 of the top cover 10. The second connector 72 can be integrally formed with the first section 11, or the second connector 72 and the first section 11 can be connected by a threaded connection so as to facilitate the separation of the second connector 72 from the first section 11.

[0064] Along the first direction Z, the other end of the second connector 72 is detachably connected to the intermediate connector 73, and the second capacitor module 50 is clamped between the first region 11 and the intermediate connector 73. The end of the second connector 72 away from the first region 11 has a protruding second connecting portion 720, which can extend into the intermediate connector 73. The outer peripheral surface of the second connecting portion 720 has an external thread, which engages with the internal thread of the intermediate connector 73 to achieve a threaded connection between the second connector 72 and the intermediate connector 73. Along the first direction Z, the end of the intermediate connector 73 near the first region 11 abuts against the side of the second circuit board 51 away from the first region 11, so that the second capacitor module 50 is pressed against the first region 11 by the intermediate connector 73.

[0065] The second circuit board 51 has a second through hole 510 extending through the second circuit board 51 along the first direction Z. The end of the second connector 72 away from the first region 11 passes through the second through hole 510 and is connected to the intermediate connector 73. In addition, the second connector 72 can pass through the gap between the plurality of second capacitor units 52.

[0066] Specifically, each second capacitor module 50 is provided with four corresponding second connectors 72, which are arranged in a rectangular array. Correspondingly, the number of second through holes 510 is also set to four, with the four second through holes 510 corresponding to the four second connectors 72, and the four second through holes 510 are located at the four corners of the second circuit board 51.

[0067] Furthermore, the number of intermediate connectors 73 is the same as the number of first connectors 71 and second connectors 72, so that each first connector 71 is connected to the corresponding second connector 72 through an intermediate connector 73, thereby forming an integral structure after the first connectors 71, second connectors 72, and intermediate connectors 73 are connected. The first connectors 71 are connected to the base plate 20, the second connectors 72 are connected to the top cover 10, and the base plate 20 is also connected to the top cover 10, thereby improving the structural stability of the entire supercapacitor structure 100 and enhancing its resistance to earthquakes and deformation.

[0068] The specific embodiments of this application have been described above with reference to the accompanying drawings. However, those skilled in the art will understand that various changes and substitutions can be made to the specific embodiments of this application without departing from the scope of this application. All such changes and substitutions fall within the scope defined by this application.

Claims

1. A supercapacitor structure, characterized by, The supercapacitor structure comprises a bottom plate, a top cover detachably connected to the bottom plate, a receiving cavity formed between the top cover and the bottom plate, a mounting member located in the receiving cavity, a first capacitor module located between the mounting member and the bottom plate and detachably connected to the mounting member, a second capacitor module located between the mounting member and the top cover and detachably connected to the mounting member, and a connecting structure having two ends detachably connected to the bottom plate and the top cover respectively, and configured to press the first capacitor module against the bottom plate and press the second capacitor module against the top cover. The connecting structure comprises a first connecting member, a second connecting member, and an intermediate connecting member. One end of the first connecting member is connected to the bottom plate, and the other end thereof is detachably connected to the intermediate connecting member, and the first capacitor module is clamped between the bottom plate and the intermediate connecting member. One end of the second connecting member is connected to the top cover, and the other end thereof is detachably connected to the intermediate connecting member, and the second capacitor module is clamped between the top cover and the intermediate connecting member. The first capacitor module comprises a first circuit board and a plurality of first capacitor units connected to the first circuit board. The first circuit board is provided with a first through hole, the first connecting member is arranged in the first through hole, and one end of the intermediate connecting member close to the bottom plate abuts against the first circuit board. The first circuit board is detachably connected to one side of the mounting member close to the bottom plate.

2. The supercapacitor structure of claim 1, wherein, The second capacitor module comprises a second circuit board and a plurality of second capacitor units connected to the second circuit board. The second circuit board is provided with a second through hole, the second connecting member is arranged in the second through hole, and one end of the intermediate connecting member away from the bottom plate abuts against the second circuit board. The second circuit board is detachably connected to one side of the mounting member away from the bottom plate.

3. The supercapacitor structure of claim 2, wherein, The supercapacitor structure further comprises a first buffer member clamped between the first capacitor module and the bottom plate, and / or a second buffer member clamped between the second capacitor module and the top cover. The top cover comprises a first region and two second regions, the first region is spaced apart from the bottom plate along a first direction, and the two second regions are connected to two sides of the first region along a second direction, the two second regions are detachably connected to the bottom plate, and the second direction intersects the first direction.

4. The supercapacitor structure of claim 3, wherein, The supercapacitor structure further comprises two side plates, the two side plates are located on opposite sides of the top cover along a third direction, and the two side plates are detachably connected to the top cover.

5. The supercapacitance structure of claim 2, wherein, The side plate is provided with a heat dissipation hole, and the heat dissipation hole communicates with the receiving cavity. ​ 6. The supercapacitor structure of claim 5, wherein, ​ 7. The supercapacitance structure of claim 1, wherein, ​ ​ 8. The supercapacitance structure of claim 1, wherein, ​ 9. The supercapacitance structure of claim 1, wherein, ​ 10. The supercapacitor structure of claim 9, wherein, ​

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