Coating-packaged surface-mounted electronic ceramic component

Abstract

The utility model provides a coated and packaged surface mount electronic ceramic component, which comprises a ceramic component body, connecting sleeves and welding lead-out pins, the connecting sleeves are fixedly connected to the surfaces of the two ends of the ceramic component body, the electrical end of the ceramic component body is electrically connected with the welding lead-out pins, and the welding lead-out pins are fixedly connected with the connecting sleeves. The two welding lead-out pins are fixedly welded to the circuit board, the ceramic component body is arranged above the circuit board, the two ends of the ceramic component body are fixedly connected with connecting plates respectively, and adjusting assemblies are arranged at the lower ends of the connecting plates. According to the coated and packaged surface-mounted electronic ceramic component, by arranging the adjusting assembly, the problem that the component is damaged due to too large abutting force or poor contact cannot be effectively prevented due to too small abutting force is effectively avoided; through the arrangement of the buffer assembly, when the ceramic component body is subjected to vibration or sudden impact, the possibility that the ceramic component body cracks or even is broken is reduced.

Description

Technical Field

[0001] This utility model relates to the field of electronic components technology, and more specifically, to a coated and encapsulated surface-mount electronic ceramic component. Background Technology

[0002] With the rapid development of consumer electronics (such as smartphones and wearable devices), new energy vehicles, aerospace and other fields, electronic devices have placed higher demands on the miniaturization, lightweighting and high performance of components. Currently, after electronic ceramic components are soldered, they are coated and encapsulated. Although coating and encapsulation can isolate the electronic ceramic components from the influence of the external environment, when the device is subjected to external impacts such as vibration, bending and deflection of the circuit board, there is a phenomenon that the solder joints of the electronic ceramic components and the circuit board may crack or even detach. This can lead to poor contact between the electronic ceramic components and the circuit board, affecting normal operation.

[0003] To address the aforementioned issues, regarding the coating and encapsulation of electronic ceramic components after soldering, while coating and encapsulation can isolate the components from external environmental influences, when the device is subjected to external impacts such as vibrations or bending of the circuit board, cracks or even detachment may occur at the solder joints between the electronic ceramic component's leads and the circuit board. This can lead to poor contact between the electronic ceramic component and the circuit board, affecting normal operation. Extensive research revealed a coated and encapsulated surface-mount electronic ceramic component with patent publication number CN213368254U. This component includes a ceramic component body and a circuit board. The ceramic component body is positioned above the circuit board, and its electrical terminals are electrically connected to solder leads, which are soldered and fixed to the circuit board. A top cover plate is fixedly connected to the upper end of the ceramic component body. Fixing blocks are fixedly connected to the upper ends of the left and right side walls of the top cover plate, and fixing rods are fixedly connected to the lower ends of the two fixing blocks. A pressure rod is provided below each of the two fixing rods. This invention ensures a tight fit between the lead-out pins and the soldering points on the circuit board, preventing poor contact caused by external impacts and ensuring normal operation. It also prevents the ceramic components from failing to dissipate heat effectively after coating, thus extending their lifespan. However, the technical solution provided by this patent has the following problems:

[0004] (1) According to the description of the published patent CN213368254U, the clamping force is precisely controlled by relying on the spring to provide clamping force. However, different specifications and types of ceramic components and circuit boards may require different degrees of clamping force. This fixed spring structure cannot be flexibly adjusted, which may result in excessive clamping force damaging the components or insufficient clamping force failing to effectively prevent poor contact.

[0005] (2) The core material of electronic ceramic components is ceramic. Its significant characteristics are high brittleness and weak impact resistance. During the operation of industrial equipment, unavoidable mechanical vibration or unpredictable sudden impact poses a potential threat to the ceramic body, which may cause the ceramic body to crack or even break.

[0006] This invention effectively avoids damage to components due to excessive clamping force or failure to prevent poor contact due to insufficient clamping force; and reduces the possibility of cracks or even breakage of the ceramic component body when it is subjected to vibration or sudden impact. Utility Model Content

[0007] The present invention aims to solve the technical problems mentioned in the background art and provides a coated and encapsulated surface mount electronic ceramic component. By adjusting the component, it effectively avoids damage to the component due to excessive clamping force or failure to prevent poor contact due to insufficient clamping force. By using the buffer component, it reduces the possibility of cracks or even breakage of the ceramic component when it is subjected to vibration or sudden impact.

[0008] To achieve the above objectives, this utility model provides the following technical solution: a surface-mount electronic ceramic component with coating and encapsulation, comprising: a ceramic component body, a connecting sleeve, and solder leads, wherein the connecting sleeve is fixedly connected to both ends of the ceramic component body, the electrical terminals of the ceramic component body are electrically connected to solder leads, and the two solder leads are soldered and fixed to a circuit board, the ceramic component body is disposed above the circuit board, and connecting plates are fixedly connected to both ends of the ceramic component body, an adjustment component is provided at the lower end of the connecting plate, and a buffer component is provided at the lower end of the ceramic component body;

[0009] The adjustment assembly includes a sleeve rod fixedly connected to the lower end of the connecting plate, a lead screw rotatably connected inside the sleeve rod, a slider threadedly connected to the surface of the lead screw, a telescopic rod fixedly connected to the lower end of the slider, a pressure plate fixedly connected to the lower end of the telescopic rod, an insulating sleeve fixedly connected to the lower surface of the pressure plate, and a rotating rod fixedly connected to the upper end of the lead screw.

[0010] The buffer assembly includes a connecting rod fixedly connected to the lower surface of the ceramic component body, a sleeve disposed at the lower end of the connecting rod, a sliding plate slidably connected inside the sleeve, and a spring disposed at the lower end of the sliding plate.

[0011] A further preferred embodiment: sleeve rods are fixedly connected to both ends of the lower surface of the connecting plate, and a lead screw is rotatably connected inside the sleeve rods.

[0012] A further preferred embodiment: the lead screw surface is threaded with a slider, the slider is slidably connected to the inner surface of the sleeve rod, and the upper end of the lead screw is fixedly connected to a rotating rod via a rotating shaft, the rotating rod being disposed on the upper surface of the connecting plate.

[0013] A further preferred embodiment: a telescopic rod is fixedly connected to the lower end of the slider, a pressure plate is fixedly connected to the lower end of the telescopic rod, and an insulating sleeve is fixedly connected to the lower surface of the pressure plate.

[0014] A further preferred embodiment: A connecting rod is fixedly connected to the lower surface of the ceramic component body, and several connecting rods are provided.

[0015] A further preferred embodiment: each of the connecting rods has a sleeve at its lower end, the connecting rods are telescopically connected inside the sleeves, and the sleeves are fixedly connected to the surface of the circuit board.

[0016] A further preferred embodiment: a sliding plate is fixedly connected to the lower end of the connecting rod, the sliding plate is slidably connected to the inner surface of the sleeve, a spring is provided at the lower end of the sliding plate, the upper end of the spring is fixedly connected to the lower surface of the sliding plate, and the lower end of the spring is fixedly connected to the bottom end of the inner wall of the sleeve.

[0017] Beneficial effects:

[0018] 1. By setting up an adjustment component, after the welding of the lead pins is completed, the clamping force requirements of different specifications and types of ceramic components and circuit boards vary. This can be adjusted using the adjustment component. Rotating the rotating rod drives the lead screw to rotate synchronously. The rotation of the lead screw causes the slider to slide up and down within the sleeve. As the slider moves, the connected telescopic rod also moves up and down accordingly, thereby adjusting the position of the pressure plate. Through this operation, a stable and appropriate clamping force can be applied to the two lead pins according to actual needs, preparing for subsequent coating work. This adjustment method effectively avoids damage to components due to excessive clamping force or ineffective prevention of poor contact due to insufficient clamping force.

[0019] 2. By setting up a buffer component, when the ceramic component body is subjected to vibration or sudden impact during the operation of industrial equipment, a downward force is generated and transmitted to the connecting rod. Under the action of this force, the connecting rod drives the slide plate to move downward, thereby compressing the spring. During the compression process, the spring absorbs and buffers part of the impact force, thereby greatly reducing the impact force acting on the ceramic component body and significantly reducing the possibility of the ceramic component body cracking or even breaking.

[0020] 3. In summary, this type of coated and encapsulated surface mount electronic ceramic component adjustment assembly effectively avoids damage to components due to excessive clamping force or failure to prevent poor contact due to insufficient clamping force; the buffer assembly reduces the possibility of cracks or even breakage of the ceramic component body when it is subjected to vibration or sudden impact. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0022] Figure 2 This is a schematic diagram of the adjustment component structure of this utility model.

[0023] Figure 3 This is a schematic diagram of the telescopic rod structure of this utility model.

[0024] Figure 4 This is a schematic diagram of the internal structure of the sleeve of this utility model.

[0025] Figure 1-4 In the middle: 1. Ceramic component body; 2. Connecting sleeve; 3. Connecting plate; 4. Rotating rod; 5. Sleeve rod; 6. Telescopic rod; 7. Pressure plate; 8. Insulating sleeve; 9. Welded lead-out foot; 10. Sleeve; 11. Connecting rod; 12. Lead screw; 13. Slider; 14. Slide plate; 15. Spring. Detailed Implementation

[0026] The following will refer to the appendix in the embodiments of this utility model. Figures 1-4 The technical solutions in the embodiments of this utility model will be clearly and completely described.

[0027] Please see Figure 1-4In this embodiment of the present invention, a surface-mount electronic ceramic component with coating and encapsulation includes: a connecting sleeve 2 fixedly connected to both ends of the ceramic component body 1, which can provide a certain degree of protection for the ceramic component body 1; the electrical terminals of the ceramic component body 1 are electrically connected to solder leads 9, and the two solder leads 9 are soldered and fixed to the circuit board; the ceramic component body 1 is positioned above the circuit board. As a core component, the ceramic component body 1's electrical terminals are electrically connected to the circuit board through the solder leads 9, enabling the ceramic component body 1 to perform its intended functions in the circuit, such as acting as a capacitor or resistor. The solder leads 9 are soldered and fixed to the circuit board, ensuring the stability and reliability of the electrical connection. Positioning the ceramic component body 1 above the circuit board facilitates installation and coating / encapsulation operations, and also provides a certain space between the ceramic component body 1 and the circuit board for heat dissipation. The two ends of the ceramic component body 1 are fixedly connected to... The connecting plate 3 provides a basic support structure for the installation of the adjustment component. The adjustment component is located at the lower end of the connecting plate 3. Its function is to adjust the position of the pressure plate 7 according to the clamping force requirements of different specifications and types of ceramic component bodies 1 and circuit boards. This can be achieved by adjusting the component, such as by rotating the rotating rod 4 to drive the lead screw 12 to rotate, and causing the slider 13 to slide within the sleeve rod 5. This applies appropriate clamping force to the welding lead 9, avoiding damage to components or poor contact due to improper clamping force. The buffer component is located at the lower end of the ceramic component body 1. When the ceramic component body 1 is subjected to vibration or sudden impact during the operation of industrial equipment, the downward force generated by the ceramic component body 1 is transmitted to the sliding plate 14 through the connecting rod 11 and the compression spring 15. The compression of the spring 15 absorbs and buffers part of the impact force, thereby reducing the impact force acting on the ceramic component body 1 and reducing the possibility of cracks or even breakage of the ceramic component body 1, thus protecting the ceramic component body 1.

[0028] The adjustment assembly includes a sleeve rod 5 fixed to the lower end of the connecting plate 3, providing a mounting base and support structure for the entire adjustment assembly. It connects the adjustment assembly to the ceramic component body 1 via the connecting plate 3, ensuring the adjustment assembly can stably act on the welding lead-out foot 9 and guaranteeing its stability during operation, preventing easy shaking or displacement. The lead screw 12 rotates within the sleeve rod 5 and is a key transmission component for achieving the adjustment function. By rotating the lead screw 12, rotational motion is converted into linear motion, thereby driving the slider 13, which is threadedly connected to the lead screw 12, to move up and down, thus achieving the adjustment function. The position of the pressure plate 7 is adjusted to meet the requirements of the clamping force of the welding lead-out foot 9 under different conditions. The slider 13 is threadedly connected to the lead screw 12, allowing it to move up and down as the lead screw 12 rotates. Simultaneously, the slider 13 is slidably connected to the inner surface of the sleeve 5, serving as a guide and limiter, ensuring that the slider 13 can only move along the axial direction of the sleeve 5 without deviation or rotation, thus ensuring the accuracy and stability of the adjustment. The telescopic rod 6 connects the slider 13 and the pressure plate 7. When the slider 13 moves up and down, the telescopic rod 6 can extend and retract accordingly, transmitting the movement of the slider 13 to the pressure plate 7. The telescopic rod 6 not only transmits motion but also buffers and absorbs some external forces to a certain extent, preventing excessive impact on the pressure plate 7 and the welding lead 9. It also accommodates adjustments for different heights. The pressure plate 7 directly acts on the welding lead 9 and is connected to the slider 13 via the telescopic rod 6. When the slider 13 moves under the drive of the lead screw 12, the pressure plate 7 moves up and down accordingly, applying or adjusting the clamping force on the welding lead 9 to ensure a tight fit between the welding lead 9 and the circuit board soldering position, preventing poor contact. The insulating sleeve 8 is installed at the lower end of the pressure plate 7. The main function of the insulating sleeve 8 is to provide insulation protection. It can prevent electrical short circuits between the pressure plate 7 and the solder lead 9 or the circuit board, ensuring the electrical safety of the components during operation. At the same time, the insulating sleeve 8 can also protect the solder lead 9 from direct wear or damage by the pressure plate 7 to a certain extent. The rotating rod 4 provides an operating handle for the operator. By rotating the rotating rod 4, the lead screw 12 can be easily rotated, thereby realizing the adjustment of the slider 13, the telescopic rod 6 and the pressure plate 7. The setting of the rotating rod 4 makes the adjustment operation more convenient and labor-saving, improving the efficiency and operability of the adjustment.

[0029] The buffer assembly includes a connecting rod 11 fixedly connected to the lower end of the ceramic component body 1, which plays a role in force transmission. When the ceramic component body 1 is subjected to external vibration or sudden impact, the generated force is transmitted downward through the connecting rod 11. It is a key connecting component that transmits the external force on the ceramic component body 1 to other parts of the buffer assembly, ensuring the force transmission path during the buffering process. The sleeve 10 provides installation space and housing protection for the slide plate 14 and the spring 15. At the same time, it restricts the movement direction of the slide plate 14, allowing it to slide axially only inside the sleeve 10, providing guidance for the sliding of the slide plate 14, ensuring the stability and accuracy of the buffer assembly during operation, and preventing the slide plate 14 from deviating during movement. The slide plate 14 is slidably connected to the inside of the sleeve 10. Under the force transmitted by the connecting rod 11, the sliding plate 14 can slide up and down within the sleeve 10. It is a force receiving and conversion component, which applies the force transmitted by the connecting rod 11 to the spring 15. At the same time, its own sliding is also affected by the reaction force of the spring 15, which plays a role in adjusting and buffering. The spring 15 is the core component of the buffer assembly. When the sliding plate 14 moves downward under the force transmitted by the connecting rod 11, the spring 15 is compressed. During the compression process, the spring 15 absorbs and stores some of the energy of the impact force. When the impact force decreases or disappears, the spring 15 releases the stored energy, pushing the sliding plate 14 and the connecting rod 11 to return to their original position, thereby reducing the impact force acting on the ceramic component body 1 and playing a role in buffering and protecting the ceramic component body 1.

[0030] In this embodiment of the invention, the sleeve rod 5 is fixed at both ends of the lower surface of the connecting plate 3, serving as a support and positioning element. It provides the mounting base for subsequent components of the adjustment assembly, such as the lead screw 12 and slider 13, which cooperate with the sleeve rod 5. This allows the adjustment assembly to be stably mounted on the ceramic component body 1, which is connected to the ceramic component body 1 via the connecting plate 3. The fixed connection at both ends ensures the installation stability of the sleeve rod 5, preventing it from shaking or shifting during adjustment. This ensures that the adjustment assembly can accurately apply a clamping force to the welding lead-out foot 9. The lead screw 12 rotates inside the sleeve rod 5, serving as the key transmission mechanism for achieving the adjustment function. The structure allows rotational motion to be converted into linear motion by rotating the lead screw 12. Because the lead screw 12 is threadedly connected to the slider 13, the slider 13 moves axially along the sleeve 5 as the lead screw 12 rotates, thereby driving the telescopic rod 6, pressure plate 7, and other components connected to the slider 13 to move up and down, thus adjusting the clamping force of the welding lead-out foot 9. The sleeve 5 protects and limits the lead screw 12. On the one hand, it protects the lead screw 12 from external environmental influences such as dust and debris entering and affecting its rotation. On the other hand, it limits the range of motion of the lead screw 12, allowing it to rotate only inside the sleeve 5, ensuring the accuracy and stability of the adjustment.

[0031] In this embodiment of the invention, the threaded connection between the lead screw 12 and the slider 13 is the key part for realizing motion conversion. When the lead screw 12 rotates, due to the action of the thread, the slider 13 will move linearly along the axial direction of the lead screw 12. This effectively converts the rotational motion of the lead screw 12 driven by the rotating rod 4 into the linear motion of the slider 13, thereby providing a power transmission method for adjusting the position of the pressure plate 7. The position of the slider 13 can be precisely adjusted according to actual needs, thereby adjusting the clamping force on the welding lead-out foot 9. The sliding connection between the slider 13 and the inner surface of the sleeve 5 plays a guiding and limiting role. The sleeve 5 provides a stable track for the movement of the slider 13, ensuring that the slider 13 can only move along the axial direction of the sleeve 5 and will not deviate or rotate in other directions. This ensures the accuracy of the movement of the slider 13. The connection method ensures stability and allows the adjustment process to proceed as expected, guaranteeing the accuracy and reliability of the clamping force adjustment for the welding lead-out 9. Simultaneously, this connection method also provides some protection for the slider 13, reducing the possibility of external interference during its movement. The rotating rod 4 is positioned on the upper surface of the connecting plate for easy operation. This position allows operators to easily access the rotating rod 4 during component installation and adjustment, facilitating rotation. Furthermore, this positioning ensures that the rotating rod 4 does not interfere with the normal operation of the ceramic component body 1 or other components, maintaining the compactness and rationality of the entire component structure. The connecting plate also provides support and fixation for the rotating rod 4, ensuring its stability during rotation.

[0032] In this embodiment of the invention, the fixed connection between the slider 13 and the telescopic rod 6 allows the slider 13 to accurately transmit its motion to the telescopic rod 6 when it moves vertically under the drive of the lead screw 12. The telescopic rod 6 acts as a bridge connecting the slider 13 and the pressure plate 7, and to a certain extent, it can buffer and absorb the impact or vibration that may occur during the adjustment process, avoiding excessive rigid impact on the pressure plate 7 and the welding lead-out foot 9. At the same time, the telescopic characteristics of the telescopic rod 6 can also adapt to the adjustment requirements of different heights, ensuring that when adjusting the position of the slider 13, the pressure plate 7 can smoothly reach the appropriate position to clamp the welding lead-out foot 9. The fixed connection between the telescopic rod 6 and the pressure plate 7 allows the pressure plate 7 to move up and down with the movement of the telescopic rod 6. The pressure plate 7 is the component that directly acts on the welding lead-out foot 9. Through this connection method, the motion transmitted from the slider 13 and the telescopic rod 6 can be accurately transferred. The action of pressing or releasing the solder lead 9 is transformed into a pressing or releasing action. In this way, according to actual needs, by adjusting the position of the slider 13, the telescopic rod 6 drives the pressure plate 7 to apply appropriate pressing force to the solder lead 9, so as to ensure that the solder lead 9 is tightly attached to the soldering position of the circuit board and prevent poor contact. The insulating sleeve 8 is fixed on the lower surface of the pressure plate 7, mainly serving as an insulating protection function. Since the solder lead 9 is a conductive component connected to the circuit, and the pressure plate 7 is usually made of metal or other conductive materials to ensure a certain strength and rigidity, the presence of the insulating sleeve 8 can effectively prevent electrical short circuits between the pressure plate 7 and the solder lead 9, ensuring the electrical safety of the components during operation. At the same time, the insulating sleeve 8 can also protect the solder lead 9 from direct wear or damage by the pressure plate 7 to a certain extent, extending the service life of the solder lead 9 and improving the reliability of the entire electronic ceramic component.

[0033] In this embodiment of the invention, the fixed connection between the connecting rod 11 and the lower surface of the ceramic component body 1 establishes a bridge between the ceramic component body 1 and other parts of the buffer assembly. When the ceramic component body 1 is subjected to external vibration, impact, or other forces, the connecting rod 11 can stably transmit these forces to the lower buffer structures such as the sleeve 10, the slide plate 14, and the spring 15, enabling the buffer assembly to effectively function, absorb and buffer external forces, and protect the ceramic component body 1 from damage. This connection method ensures the stability and reliability of the force transmission path, ensuring that the buffering process can proceed smoothly. The arrangement of several connecting rods 11 can reduce the force exerted on the ceramic component body 1. External forces are distributed more evenly on the buffer assembly. If there is only one connecting rod 11, the external force may be concentrated at this connection point, resulting in excessive local stress, affecting the buffering effect, or even damaging the connecting rod 11 or the ceramic component body 1. Multiple connecting rods 11 can disperse the external force, allowing all parts of the buffer assembly to participate in the buffering process, improving the overall buffering performance and stability of the buffer assembly. In addition, multiple connecting rods 11 can also enhance the firmness of the connection between the ceramic component body 1 and the buffer assembly, preventing the connection from loosening or breaking during long-term use or under large external forces, thereby better protecting the ceramic component body 1 and extending its service life.

[0034] In this embodiment of the invention, a sleeve 10 is provided at the lower end of each connecting rod 11, providing a guiding and restrictive space for the movement of the connecting rod 11. When the ceramic component body 1 is subjected to external force, the connecting rod 11 will move within the sleeve 10. The sleeve 10 ensures that the connecting rod 11 moves telescopically in a predetermined direction, preventing it from shifting or swaying during movement, thereby ensuring the stability and reliability of the buffering effect. At the same time, the sleeve 10 also provides a certain degree of protection for the connecting rod 11, preventing it from being interfered with or damaged by external debris. This telescopic connection method is a key structure for realizing the buffering function. When the ceramic component body 1 is subjected to vibration or impact, the connecting rod 11 will move downward within the sleeve 10, compressing the internal spring 15 and converting the energy of the external force into the elastic potential energy of the spring, thereby achieving buffering and... The shock absorption function works by the spring force pushing the connecting rod 11 upwards to reset the ceramic component body 1 after the external force disappears, allowing it to return to its original position. The telescopic connection allows the connecting rod 11 to move within a certain range, effectively absorbing and mitigating the impact of external forces on the ceramic component body 1 and protecting the component's safety. The sleeve 10 is fixed to the surface of the circuit board, providing a stable support base for the entire buffer assembly. It firmly connects the buffer assembly to the circuit board, ensuring that the buffer assembly can function stably when the ceramic component body 1 is subjected to external forces, without affecting the buffering effect due to its own instability. At the same time, this fixing method also ensures the relative positional relationship between the ceramic component body 1 and the circuit board, ensuring that the component can work normally and will not interfere with or damage other components on the circuit board during the buffering process.

[0035] In this embodiment of the invention, the fixed connection between the connecting rod 11 and the sliding plate 14 enables the transmission of force. When the ceramic component body 1 is subjected to external forces such as vibration or impact, the connecting rod 11 transmits these forces to the sliding plate 14, allowing the sliding plate 14 to move within the sleeve 10, thereby triggering the buffering mechanism. This connection method ensures the stable transmission of force from the ceramic component body 1 to the sliding plate 14, which is the basis for the smooth operation of the entire buffering process. The fixed connection between the upper end of the spring 15 and the sliding plate 14 allows the sliding plate 14 to compress the spring 15 when it moves downward under the force transmitted by the connecting rod 11. The spring 15 is elastic and absorbs and stores the energy of the external force during compression, converting mechanical energy into elastic potential energy. When the external force disappears, the spring 15 can release the stored energy, pushing the sliding plate 14 upward. The movement allows the ceramic component body 1 to return to its original position. This connection method is the core mechanism for achieving buffering and shock absorption. Energy is absorbed and released through the elastic deformation of the spring 15, protecting the ceramic component body 1 from damage by external forces. The fixed connection between the lower end of the spring 15 and the bottom end of the inner wall of the sleeve 10 provides a stable support point for the spring 15. This ensures that the spring 15 can maintain a stable working state during compression and stretching, without displacement or deformation. At the same time, this fixing method also allows the spring 15 to effectively transfer the force transmitted from the slide plate 14 to the sleeve 10. Then, through the connection between the sleeve 10 and the circuit board, the force is distributed to the circuit board, avoiding excessive local stress. In this way, the spring 15 can better play its role in buffering and shock absorption, protecting the ceramic component body 1 and the circuit board.

[0036] Working Principle: First, place the ceramic component body 1 on the circuit board and place the solder leads 9 in their corresponding soldering positions on the circuit board. Soldering of the leads 9 can then be performed. After soldering, considering the varying clamping force requirements of different specifications and types of ceramic component bodies 1 and circuit boards, adjustments can be made using the adjusting assembly. Rotating the rotating rod 4 drives the lead screw 12 to rotate synchronously. The rotation of the lead screw 12 causes the slider 13 to slide up and down within the sleeve rod 5. As the slider 13 moves, the connected telescopic rod 6 also moves up and down accordingly, thereby adjusting the position of the pressure plate 7. Through this operation, a stable and appropriate clamping force can be applied to the two solder leads 9 according to actual needs, preparing for subsequent coating. After preparing for the coating work, this adjustment method effectively avoids damage to components due to excessive clamping force or failure to prevent poor contact due to insufficient clamping force. At this time, the coating work can be carried out. After the coating is completed, the surface mounting coating and encapsulation work of the electronic ceramic component body 1 can be completed. During the operation of industrial equipment, when the ceramic component body 1 is subjected to vibration or sudden impact, a downward force will be generated and transmitted to the connecting rod 11. Under the action of this force, the connecting rod 11 drives the slide plate 14 to move downward, thereby compressing the spring 15. During the compression process of the spring 15, it absorbs and buffers part of the impact force, thereby greatly reducing the impact force acting on the ceramic component body 1 and significantly reducing the possibility of cracks or even breakage of the ceramic component body 1.

Claims

1. A surface mount electronic ceramic device coated with a package, comprising: The utility model provides a ceramic component body (1), connecting sleeve (2), welding lead foot (9), its characterized in be: connecting sleeve (2) fixed connection is in ceramic component body (1) both ends surface, ceramic component body (1) electricity end electric connection has welding lead foot (9), and two welding lead foot (9) and circuit board welding fixed, ceramic component body (1) sets up in the top of circuit board, ceramic component body (1) both ends fixed connection has connecting plate (3) respectively, connecting plate (3) lower end is provided with adjusting assembly, ceramic component body (1) lower end is provided with buffer assembly, The adjusting assembly includes sleeve rod (5) fixedly connected to the lower end of the connecting plate (3) respectively, the screw rod (12) rotatably connected inside the sleeve rod (5), the sliding block (13) threaded connected to the surface of the screw rod (12), the telescopic rod (6) fixedly connected to the lower end of the sliding block (13), the pressing plate (7) fixedly connected to the lower end of the telescopic rod (6), the insulating sleeve (8) fixedly connected to the lower end surface of the pressing plate (7), the rotating rod (4) fixedly connected to the upper end of the screw rod (12), The buffer assembly includes the connecting rod (11) fixedly connected to the lower end surface of the ceramic component body (1), the sleeve (10) provided at the lower end of the connecting rod (11), the sliding plate (14) slidably connected inside the sleeve (10), the spring (15) provided at the lower end of the sliding plate (14).

2. The coated, encapsulated surface mount electronic ceramic component of claim 1, wherein: The sleeve rod (5) is fixedly connected to the lower surface of the connecting plate (3) at both ends respectively.

3. The coated, encapsulated surface mount electronic ceramic component of claim 1, wherein: The screw rod (12) is threaded connected to the surface of the sliding block (13), and the sliding block (13) is slidably connected to the inner surface of the sleeve rod (5). The rotating rod (4) is fixedly connected to the upper end of the screw rod (12) through the rotating shaft, and the rotating rod (4) is arranged on the upper end surface of the connecting plate.

4. The coated, encapsulated surface mount electronic ceramic component of claim 3, wherein: The telescopic rod (6) is fixedly connected to the lower end of the sliding block (13), and the pressing plate (7) is fixedly connected to the lower end of the telescopic rod (6). The insulating sleeve (8) is fixedly connected to the lower end surface of the pressing plate (7).

5. The coated, encapsulated surface mount electronic ceramic component of claim 1, wherein: The connecting rod (11) is fixedly connected to the lower end surface of the ceramic component body (1), and a plurality of connecting rods (11) are arranged.

6. The coated, encapsulated surface mount electronic ceramic component of claim 1, wherein: The sleeve (10) is arranged at the lower end of each connecting rod (11), and the connecting rod (11) is telescopically connected inside the sleeve (10). The sleeve (10) is fixedly connected to the surface of the circuit board.

7. The coated, encapsulated surface mount electronic ceramic component of claim 1, wherein: The sliding plate (14) is fixedly connected to the lower end of the connecting rod (11), and the sliding plate (14) is slidably connected to the inner surface of the sleeve (10). The spring (15) is arranged at the lower end of the sliding plate (14), the upper end of the spring (15) is fixedly connected to the lower end surface of the sliding plate (14), and the lower end of the spring (15) is fixedly connected to the bottom end of the inner wall of the sleeve (10).

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