Silicon wafer protection device

Abstract

The utility model discloses a silicon wafer protection device, which belongs to the technical field of silicon wafer production and is used for spacing a plurality of silicon wafer groups. The silicon wafer protection device comprises a distance piece which extends along the Y direction so as to separate two adjacent silicon wafer groups; the distance piece comprises a supporting part which is used for supporting the silicon wafer single bodies on the two adjacent silicon wafer groups. As the supporting part is arranged between the two adjacent silicon wafer groups, the silicon wafer monomers on the two adjacent silicon wafer groups can be supported through the supporting part, and when the silicon wafer monomers on the two adjacent silicon wafer groups are inclined and inverted oppositely, the corresponding silicon wafer monomers do not collide with each other, so that the safety of the silicon wafer monomers can be improved; and the fragment rate in the silicon wafer monomer production process is greatly reduced.

Description

Technical Field

[0001] This application belongs to the field of silicon wafer manufacturing technology, and specifically relates to a silicon wafer protection device. Background Technology

[0002] In the process of silicon wafer production, silicon rods need to be cut into single crystals. Cutting is generally done using a double- or even multi-piece cutting method, where multiple silicon rods are bonded side-by-side to a single substrate. This allows the cutting equipment to cut multiple silicon rods simultaneously, producing silicon wafers. After cutting, the substrate needs to be removed. Once the adhesive is removed from the multiple silicon rods, the wafers lose their support and are prone to tipping over or colliding, which can lead to wafer breakage. Utility Model Content

[0003] Purpose of the utility model: This application provides a silicon wafer protection device to overcome the technical problem that silicon wafers are prone to collision and damage after multiple rows of silicon rods are debonded.

[0004] Technical solution: The silicon wafer protection device described in the embodiments of this application is used to space multiple silicon wafer groups;

[0005] The silicon wafer protection device includes:

[0006] A spacer extending along the Y direction to space between two adjacent silicon wafer groups;

[0007] The spacer includes a support portion for supporting individual silicon wafers on two adjacent silicon wafer groups.

[0008] In some embodiments, the spacer is a flexible structure, and the elastic modulus of the flexible structure is A, satisfying: 0.01 MPa ≤ A ≤ 100 MPa.

[0009] In some embodiments, the silicon wafer protection device includes:

[0010] The carrier includes a connecting portion extending along the X direction, which intersects the Y direction, and each connecting portion is connected to the spacer, the connecting portion being used to carry the spacer.

[0011] In some embodiments, the number of the support portions is multiple, and the multiple support portions are arranged at intervals along the Z direction, wherein the Z direction intersects the X direction and the Y direction in pairs;

[0012] The spacer includes:

[0013] A first overlapping portion is connected to the support portion, and at least one of the connecting portions is connected to the first overlapping portion.

[0014] In some embodiments, the first overlapping portion includes:

[0015] A first connecting plate is located in the middle of the support portion and is connected to each of the support portions.

[0016] In some embodiments, the first overlapping portion includes:

[0017] A second connecting plate is located at the end of the support portion and is connected to each of the support portions.

[0018] In some embodiments, each of the second connection plates has at least one through hole, and at least a portion of the connection portion is located on both sides of the silicon wafer assembly in the Y direction and passes through the corresponding through hole.

[0019] In some embodiments, the spacer includes:

[0020] At least one second overlap portion is located between two adjacent support portions and is connected to the two adjacent support portions respectively. The second overlap portion has at least one connection hole, and a connection portion passes through each connection hole. The connection portion passing through the connection hole is used to be disposed between two adjacent silicon wafer units on the silicon wafer assembly.

[0021] In some embodiments, the silicon wafer protection device includes:

[0022] Two fixing members are arranged at intervals along the X direction, and a plurality of silicon wafer groups are disposed between the two fixing members. The two ends of the connecting part are detachably connected to the corresponding fixing members.

[0023] Each of the fasteners includes multiple fixing rods, which are spaced apart along the Z direction, and at least one fixing rod is connected to the connecting part.

[0024] In some embodiments, the carrier includes:

[0025] Multiple limiting parts are provided, and each of the connecting parts is provided with the limiting part at both ends. The connecting part is detachably connected to the corresponding fixing member through the limiting part.

[0026] Beneficial Effects: The silicon wafer protection device of this application embodiment is used to space multiple silicon wafer groups. The silicon wafer protection device includes: a spacer extending along the Y direction to space two adjacent silicon wafer groups; the spacer includes a support portion for supporting individual silicon wafers on the two adjacent silicon wafer groups. Because the support portion is provided between two adjacent silicon wafer groups, the individual silicon wafers on the two adjacent silicon wafer groups can be supported. When individual silicon wafers on two adjacent silicon wafer groups tilt or fall over, the corresponding individual silicon wafers will not collide, thereby improving the safety of the individual silicon wafers and greatly reducing the breakage rate during the silicon wafer production process. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a perspective view of the silicon wafer protection device according to an embodiment of this application;

[0029] Figure 2 This is a perspective view of the spacer in an embodiment of this application;

[0030] Figure 3 This is a schematic diagram of the structure of the spacer in an embodiment of this application, wherein the spacer is a mesh structure;

[0031] Figure 4 This is a schematic diagram of the structure of the support member according to an embodiment of this application, wherein the support member is inclined in the Y direction;

[0032] Figure 5 This is a schematic diagram of the structure of the support member according to an embodiment of this application, wherein the support member has a wave-shaped structure;

[0033] Figure 6 This is a schematic diagram of the structure of the support member according to an embodiment of this application, wherein the support member is a mesh structure;

[0034] Figure 7 This is a perspective view of a spacer according to an embodiment of this application, wherein multiple support portions are connected by a first connecting plate;

[0035] Figure 8 This is a front view of the spacer according to an embodiment of this application, wherein multiple support portions are connected by a second connecting plate;

[0036] Figure 9 This is a front view of the spacer according to an embodiment of this application, wherein the spacer is provided with a second overlapping portion;

[0037] Figure 10 This is a front view of the spacer according to an embodiment of this application, wherein the spacer does not have a second overlapping portion, and the connecting hole is provided on a support portion;

[0038] Figure 11 This is a front view of the spacer according to an embodiment of this application, wherein the spacer does not have a second overlapping portion, and the connecting holes are provided on multiple support portions;

[0039] Figure 12 This is a front view of the spacer in an embodiment of this application, wherein there are multiple second overlapping portions, which are arranged in a straight line along the Y direction;

[0040] Figure 13 This is a front view of the spacer in an embodiment of this application, wherein there are multiple second overlapping portions, which are staggered along the Y direction;

[0041] Figure 14 This is a front view of the spacer in an embodiment of this application, wherein a plurality of second overlapping portions are arranged at intervals along the Z direction;

[0042] Figure 15 This is a top view of a silicon wafer protection device according to an embodiment of this application, wherein the silicon wafer group is composed of a plurality of shorter silicon rod crystals along the Y direction;

[0043] Figure 16 This is a perspective view showing the connection between the second overlapping portion and the connecting portion on the spacer in an embodiment of this application;

[0044] Figure 17 This is a side view of a silicon wafer protection device according to an embodiment of this application;

[0045] Reference numerals: 10-Silicon wafer assembly; 11-Gap; 12-Semiconductor wafer; 20-Spacer; 21-Through hole; 22-Support part; 23-First overlapping part; 231-First connecting plate; 232-Second connecting plate; 24-Second overlapping part; 241-Connecting hole; 30-Carrier; 31-Connecting part; 33-Limiting part; 40-Fixing member; 41-Fixing rod. Detailed Implementation

[0046] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0047] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, and "at least one" can mean one, two, or more, unless otherwise explicitly specified.

[0048] In the process of silicon wafer production, silicon ingots need to be cut. Cutting is generally done using a double- or even multi-piece cutting method, where multiple silicon ingots are bonded side-by-side to a single substrate. This allows the cutting equipment to cut multiple ingots simultaneously, producing silicon wafers (i.e., bonding multiple silicon ingots side-by-side to a substrate and then cutting them simultaneously with a cutting device improves cutting efficiency). After cutting, the bonded substrate needs to be removed. Once the bonding between the multiple silicon ingots is lost, the silicon wafers on adjacent ingots lose their support, making them prone to tilting and tipping over. This can lead to collisions and breakage between the wafers.

[0049] In view of this, embodiments of this application provide a silicon wafer protection device to overcome at least one of the above-mentioned technical problems.

[0050] Please see Figure 1 and Figure 2 In this embodiment, the silicon wafer protection device can be used to space multiple silicon wafer groups 10, which are arranged along the X direction. Adjacent silicon wafer groups 10 have a gap 11 between them. Each silicon wafer group 10 includes at least one silicon wafer unit 12 arranged along the Y direction. The X and Y directions intersect; preferably, the X and Y directions are perpendicular to each other. The silicon wafer protection device includes a spacer 20 and a support member 30.

[0051] The spacer 20 extends along the Y direction and has multiple through holes 21. The spacer 20 can be used to pass through gaps 11 to separate two adjacent silicon wafer groups 10, that is, to separate the silicon wafer units 12 on two adjacent silicon wafer groups 10. The carrier 30 includes multiple connecting portions 31 extending along the X direction. Each through hole 21 has a connecting portion 31 passing through it. The connecting portion 31 is used to support the spacer 20.

[0052] The spacer 20 includes a support portion 22, which can pass through the gap 11 to support silicon wafers 12 on two adjacent silicon wafer groups 10. The support portion 22 can be a single, large-volume plate-like structure or mesh structure. Alternatively, multiple support portions 22 can be spaced apart along the Z-direction or spaced apart at an angle to the Z-direction. Each support portion 22 passes through the gap 11 to support silicon wafers 12 on two adjacent silicon wafer groups 10. The Z-direction intersects with the X and Y directions; preferably, the Z-direction is perpendicular to the X and Y directions.

[0053] Understandably, after multiple silicon rods are cut and debonded by the cutting device, each silicon rod forms a silicon wafer group 10. Multiple silicon wafer groups 10 are arranged at intervals along the X direction. Each silicon wafer group 10 includes multiple silicon wafer units 12 arranged along the Y direction. There is a gap 11 between adjacent silicon wafer groups 10 (when multiple silicon rods are bonded to a substrate, they can be arranged at intervals, and gaps 11 can be formed between adjacent silicon rods without affecting the cutting device's ability to cut the multiple silicon rods). After the multiple silicon rods are cut and before removing the bonded substrate, spacers 20 can be embedded between adjacent silicon wafer groups 10, that is, embedded into the corresponding gaps 11 (if there are three or more silicon wafer groups 10, multiple spacers 20 are required). Simultaneously, the spacers 20 penetrate the gaps 11 along the Y direction. The two opposite sides of the spacer 20 along the X direction are respectively connected to the two adjacent silicon wafer groups 10 (the two opposite sides of the spacer 20 can contact the corresponding silicon wafer group 10, that is, contact each silicon wafer unit 12 on the silicon wafer group 10). When the silicon wafer unit 12 on the silicon wafer group 10 has a tendency to tilt, the spacer 20 can support it.

[0054] The spacer 20 can also be spaced apart from two adjacent silicon wafer groups 10, without contacting the corresponding silicon wafer group 10. In this case, the spacer 20 needs to be a flexible structure (such as rubber, silicone, or other flexible materials). The flexible spacer 20 has a low elastic modulus (elastic modulus is an indicator of a material's ability to resist elastic deformation. The lower the elastic modulus, the easier it is for the material to undergo elastic deformation under stress, and it usually behaves more softly. For example, rubber has a low elastic modulus, so it has good softness, while steel has a high elastic modulus, exhibiting hardness). Its elastic modulus is generally between 0.01 MPa and 100 MPa (including 0.01 MPa and 100 MPa). When the silicon wafer unit 12 on the silicon wafer group 10 tilts, the flexible spacer 20 can block and support the silicon wafer unit 12, preventing the corresponding two silicon wafer units 12 from tipping over and colliding. When the spacer 20 comes into contact with the silicon wafer unit 12, it will not damage the silicon wafer unit 12, and can play a certain role in buffering and protecting the silicon wafer unit 12. After the bonding board is removed, the multiple silicon wafer groups 10 lose their restraining function, and the multiple silicon wafer units 12 on the silicon wafer groups 10 also lose their restraining function. Each silicon wafer unit 12 may tilt, and corresponding silicon wafer units 12 on two adjacent silicon wafer groups 10 may flip over and collide with each other. Because spacers 20 are set between two adjacent silicon wafer groups 10, the silicon wafer units 12 on the two adjacent silicon wafer groups 10 are supported by the spacers 20, which prevents the silicon wafer units 12 on the two adjacent silicon wafer groups 10 from tilting or flipping over, and prevents corresponding silicon wafer units 12 from colliding with each other. This improves the safety of the silicon wafer units 12 and greatly reduces the breakage rate of the silicon wafer units 12 during the production process. Specifically, the support portion 22 on the spacer 20 can support the silicon wafer units 12 on the two adjacent silicon wafer groups 10. Since the support portion 22 passes through the gap 11 and is located between the two adjacent silicon wafer groups 10, the silicon wafer units 12 on the two adjacent silicon wafer groups 10 can be supported by the support portion 22. When the silicon wafer units 12 on the two adjacent silicon wafer groups 10 tilt or fall over, the corresponding silicon wafer units 12 will not collide, thereby improving the safety of the silicon wafer units 12 and greatly reducing the breakage rate of the silicon wafer units 12 during the production process.

[0055] The spacer 20 can be a rectangular plate structure or a mesh structure (such as...). Figure 3 The spacer 20 can also be composed of multiple structures. Multiple support portions 22 spaced apart along the Z-direction can be provided on the spacer 20, and each support portion 22 passes through a corresponding gap 11. The support portion 22 can be a straight plate structure (such as...). Figure 2 Extending along the Y direction, it can also be like... Figure 4 (Extending along the Y-axis at an angle), wavy structure (such as...) Figure 5), or a network structure (such as Figure 6 Multiple support parts 22 are arranged between two adjacent silicon wafer groups 10, and each support part 22 can support the corresponding silicon wafer unit 12. The multiple support parts 22 are arranged at intervals along the Z direction, so that the multiple support parts 22 support the upper, middle and lower positions between the corresponding two silicon wafer units 12, which effectively avoids the collision between the two silicon wafer units 12, further improves the safety of the silicon wafer units 12, and avoids damage caused by mutual collision.

[0056] During the use of the spacer 20, the spacer 20 can be supported by the carrier 30. The carrier 30 includes multiple connecting parts 31, some of which pass through the through holes 21 on the spacer 20. The spacer 20 is supported by the connecting parts 31, so that the spacer 20 can be placed between two adjacent silicon wafer groups 10 to prevent the silicon wafers 12 on the adjacent silicon wafer groups 10 from colliding and being damaged.

[0057] When the spacer 20 includes multiple support portions 22 spaced apart along the Z direction, the connecting portion 31 can also pass through the gap between two adjacent support portions 22, so that the connecting portion 31 bears the load of one of the support portions 22, thereby achieving the supporting function of the entire spacer 20, preventing the spacer 20 from sliding down under the action of gravity, and ensuring that the spacer 20 can be stably supported between two adjacent silicon wafer groups 10.

[0058] Please see Figure 2 In conjunction with the above embodiments, in some embodiments, when there are multiple support portions 22, the multiple support portions 22 are arranged at intervals along the Z direction, and the spacer 20 includes a first overlapping portion 23, the first overlapping portion 23 is connected to each support portion 22, and at least one connecting portion 31 is connected to the first overlapping portion 23.

[0059] It is understandable that a first overlapping portion 23 is also provided on the spacer 20. The first overlapping portion 23 can be connected to each support portion 22 respectively to connect multiple support portions 22 into a whole, so that the multiple support portions 22 will not become loose during use, and ensure that the multiple support portions 22 can play a good role in spacing the two adjacent silicon wafer groups 10.

[0060] Please see Figure 7 In conjunction with the above embodiments, in some embodiments, the first overlapping portion 23 includes a first connecting plate 231. The first connecting plate 231 is located at the center of each support portion 22 and is connected to each support portion 22.

[0061] It is understood that the first overlapping portion 23 includes a first connecting plate 231. The number of first connecting plates 231 can be one or more. When there are multiple first connecting plates 231, they can be arranged at intervals along the Y direction. The first connecting plate 231 can be located at the middle position of each support portion 22, which refers to the position on the support portion 22 that is different from the two ends. When there are multiple first connecting plates 231, they can be arranged in a distribution form that spreads outward from the center of the support portion 22, and each is connected to each support portion 22 to improve the stability of the connection between the multiple support portions 22. When the spacer 20 is used, the first connecting plate 231 on it is generally located between two adjacent silicon wafer groups 10, that is, inside the gap 11, and can extend along the Z direction. Its extension direction is the same as the arrangement direction of the multiple support portions 22, so the multiple support portions 22 can be connected into a whole at the same time through the connecting plate 231. Since the first connecting plate 231 is also located inside the gap 11, the overlapping and cooperation of the first connecting plate 231 and the support part 22 between two adjacent silicon wafer groups 10 can increase the distance between the two adjacent silicon wafer groups 10, reduce the probability of collision when the corresponding silicon wafer is tilted, and improve the safety of material handling after cutting.

[0062] Please see Figure 1 and Figure 8 In conjunction with the above embodiments, in some embodiments, the first overlapping portion 23 includes a second connecting plate 232, which is located at the end of each support portion 22 and connected to each support portion 22.

[0063] It is understood that the first overlapping portion 23 includes a second connecting plate 232, which can extend along the Z direction to connect multiple support portions 22 to form a whole for convenient use. The second connecting plate 232 is connected to the end of each support portion 22, that is, both ends of each support portion 22 are connected to the second connecting plate 232. Since each support portion 22 passes through the gap 11, when the spacer 20 is in use, the second connecting plate 232 on it is generally located outside the gap 11, so that the outer contour of the spacer 20 forms a rectangular structure, which can improve the structural strength and stability of the spacer 20 and reduce the risk of deformation at the ends of the support portions 22.

[0064] Please see Figure 2 and Figure 8 In conjunction with the above embodiments, in some embodiments, each second connecting plate 232 has a through hole 21, and at least a portion of the connecting portion 31 is located on both sides of the silicon wafer assembly 10 in the Y direction and passes through the corresponding through hole 21.

[0065] It is understood that since the support part 22 passes through the inside of the gap 11, the two second connecting plates 232 set at both ends of the support part 22 are located outside the gap 11. Each second connecting plate 232 has a through hole 21. The connecting part 31 passing through the through hole 21 is located on both sides of the silicon wafer group 10 along the Y direction. Through the connecting part 31 set on the second connecting plate 232, the outermost silicon wafer unit 12 on the silicon wafer group 10 can be supported to prevent the outermost silicon wafer unit 12 from tilting or even falling over, thus ensuring the stability of the outermost silicon wafer unit 12 and improving the stability of the entire silicon wafer group 10. This allows multiple silicon wafer units 12 to be in a vertical state, arranged in an orderly manner, and easy to pick up.

[0066] Please see Figure 8 In conjunction with the above embodiments, in some embodiments, each second connecting plate 232 has a plurality of through holes 21, and the plurality of through holes 21 on each second connecting plate 232 are spaced apart along the Z direction.

[0067] It is understood that multiple through holes 21 arranged at intervals along the Z direction can be provided on each second connecting plate 232. A connecting part 31 can be inserted into the interior of each through hole 21, resulting in multiple connecting parts 31 arranged at intervals along the Z direction. These multiple connecting parts 31 are connected to the second connecting plate 232. These multiple connecting parts 31 are respectively located on both sides of the silicon wafer assembly 10 along the Y direction. By providing multiple connecting parts 31 on the second connecting plate 232 and arranging them at intervals along the Z direction, the upper, middle, and lower positions of the outermost silicon wafer unit 12 of the silicon wafer assembly 10 can be supported, further ensuring the stability of the outermost silicon wafer unit 12 and the entire silicon wafer assembly 10.

[0068] Please see Figure 9 In conjunction with the above embodiments, in some embodiments, the spacer 20 includes a second overlap portion 24.

[0069] The second overlapping portion 24 is located between two adjacent support portions 22 and is connected to the two adjacent support portions 22 respectively. The second overlapping portion 24 has a plurality of spaced connecting holes 241. Each connecting hole 241 has a connecting portion 31 passing through it. The connecting portion 31 passing through the connecting hole 241 is used to be disposed between two adjacent silicon wafer units 12 on the silicon wafer group 10.

[0070] It is understood that for multiple spaced support portions 22, a second overlapping portion 24 can be provided between two adjacent support portions 22, and the second overlapping portion 24 can extend along the Y direction. Multiple connecting holes 241 can be provided on the second overlapping portion 24, and the multiple connecting holes 241 can be spaced along the Y direction, and their arrangement direction is the same as the arrangement direction of the multiple silicon wafer units 12. A connecting portion 31 is also provided inside each connecting hole 241, and the connecting portion 31 extending along the X direction is also provided in the connecting hole 241. The connecting portion 31 is also provided between two adjacent silicon wafer units 12 on a silicon wafer group 10, which can divide multiple silicon wafer units 12 on a silicon wafer group 10 into multiple parts, each part having at least one silicon wafer unit 12. If there are enough connecting holes 241 and connecting portions 31, a connecting portion 31 can be provided between any two adjacent silicon wafer units 12 on the silicon wafer group 10. Through multiple connecting portions 31, the silicon wafer units 12 on the silicon wafer group 10 can be clearly distinguished, making it convenient for workers to pick up the silicon wafer units 12 and improving the efficiency of material handling. The connecting portion 31 can be a relatively thin and long structure with a certain strength, such as fishing line or metal wire, so as to facilitate the embedding of the connecting portion 31 between two adjacent silicon wafer units 12 on the silicon wafer group 10.

[0071] In the structural design process, it is also possible to omit the second overlapping portion 24 and directly provide connecting holes 241 on the support portion 22. Multiple connecting holes 241 spaced apart along the Y direction can be provided on one of the support portions 22 for the connecting portions 31 to pass through, so that multiple connecting portions 31 are arranged at linear intervals along the Y direction (e.g., ...). Figure 10 (As shown). Alternatively, multiple connecting holes 241 arranged at intervals along the Y direction can be provided on two or more support portions 22 (e.g., Figure 11 As shown, the connecting part 31 is inserted through different connecting holes 241 as needed to support the corresponding silicon wafer unit 12. The connecting holes 241 may be staggered along the Y direction.

[0072] Please see Figure 12 , Figure 13 , Figure 14 and Figure 16 In conjunction with the above embodiments, in some embodiments, the spacer 20 includes a plurality of second overlapping portions 24, which are distributed along the Y direction or the Z direction. Each second overlapping portion 24 is located between two adjacent support portions 22 and is connected to the two adjacent support portions 22 respectively. Each second overlapping portion 24 has at least one connecting hole 241, and a connecting portion 31 passes through each connecting hole 241. The connecting portion 31 passing through the connecting hole 241 is used to be disposed between two adjacent silicon wafer units 12 on the silicon wafer assembly 10.

[0073] It is understandable that the second overlapping portion 24 can be either a long plate-like structure or a combination of multiple short sheet-like structures (such as...). Figure 12 and Figure 16 As shown, multiple second overlapping portions 24 are arranged at linear intervals along the Y direction. Each second overlapping portion 24 is provided with at least one connecting hole 241, which facilitates the connection of at least one connecting portion 31 to the second overlapping portion 24. This allows the connecting portion 31 to pass between two adjacent silicon wafer units 12, providing spacing and support. By setting the second overlapping portions 24 as multiple spaced-apart sheet-like structures, the volume and material usage of the second overlapping portions 24 can be reduced, thus reducing costs. Simultaneously, the weight of the second overlapping portions 24 can also be reduced, thereby reducing the weight of the entire spacer 20 and facilitating handling.

[0074] Or, such as Figure 13 As shown, multiple second overlapping portions 24 are arranged at staggered intervals along the Y direction. Each second overlapping portion 24 is provided with a connecting hole 241. The connecting portion 31 passing through the connecting hole 241 is located at different heights, which can provide spacing and support for different positions of the silicon wafer unit 12 (for example, the upper position between some adjacent silicon wafer units 12 can be supported and spaced by the connecting portion 31, the middle position between some adjacent silicon wafer units 12 can be supported and spaced by the connecting portion 31, and the lower position between some adjacent silicon wafer units 12 can be supported and spaced by the connecting portion 31), and can also make the silicon wafer group 10 have distinct layers.

[0075] Or, such as Figure 14 As shown, multiple second overlapping portions 24 can also be arranged at intervals along the Z direction. Each second overlapping portion 24 is located between two adjacent support portions 22. This arrangement ensures that after the connecting portion 31 passes through the corresponding connecting hole 241, at least some of the connecting portions 31 are also arranged at intervals in the Z direction. When these connecting portions 31 are located between two adjacent silicon wafer units 12, they can be located at the upper, middle, and lower positions of the silicon wafer unit 12, respectively. This ensures that the upper, middle, and lower positions of the two adjacent silicon wafer units 12 will not come into contact or collide, and also makes the layers of the silicon wafer group 10 more distinct.

[0076] When the silicon wafer assembly 10 is bonded to the substrate, the silicon wafer assembly 10 may not be a single unit; it can be composed of multiple shorter silicon ingots connected and combined along the Y direction (multiple shorter silicon ingots bonded to the substrate along the Y direction can form a silicon wafer assembly 10). Figure 15As shown, a second overlapping portion 24 is provided on the silicon wafer protection device. The position of the second overlapping portion 24 can correspond to the position between two adjacent shorter silicon rod crystals on the silicon wafer assembly 10, so that the connecting portion 31 connected to the second overlapping portion 24 can be inserted between the two adjacent shorter silicon rod crystals (the connecting portion 31 may not penetrate the second overlapping portion 24, or one end may be fixedly connected to the second overlapping portion 24), thereby spacing and supporting the two adjacent shorter silicon rod crystals.

[0077] Please see Figure 1 In conjunction with the above embodiments, in some embodiments, the silicon wafer protection device includes two fixing members 40. The two fixing members 40 are arranged at intervals along the X direction, and a plurality of silicon wafer groups 10 are disposed between the two fixing members 40. The two ends of the connecting part 31 are detachably connected to the corresponding fixing member 40.

[0078] Understandably, the two fixing members 40 on the silicon wafer protection device can be respectively set on both sides of the multiple silicon wafer groups 10 along the X direction. The multiple silicon wafer groups 10 are located between the two fixing members 40. The two ends of the connecting part 31 can be detachably connected to the corresponding fixing member 40, thereby fixing the connecting part 31 and supporting the spacer 20. When the silicon wafer protection device is in use, the two ends of the multiple connecting parts 31 passing through the spacer 20 can be connected to the corresponding fixing members 40, so that the multiple connecting parts 31 can support the spacer 20. Then, the multiple silicon wafer groups 10 after cutting are moved from top to bottom (at this time, the multiple silicon wafer groups 10 are still bonded to the board). During the downward movement of the multiple silicon wafer groups 10, the gaps 11 on them correspond to the positions of the corresponding spacers 20. The spacers 20 can be embedded into the corresponding gaps 11 and can penetrate the gaps 11 along the Y direction, so that the spacers 20 can support the two adjacent silicon wafer groups 10 and prevent the silicon wafers 12 on the two adjacent silicon wafer groups 10 from tipping over. Meanwhile, as multiple silicon wafer groups 10 move downwards, the corresponding connecting parts 31 can also be embedded between two adjacent silicon wafer units 12 on the silicon wafer group 10, dividing the silicon wafer group 10 into multiple parts for easy material handling.

[0079] Please see Figure 1 and Figure 17 In conjunction with the above embodiments, in some embodiments, each fixing member 40 includes a plurality of fixing rods 41, the plurality of fixing rods 41 are arranged at intervals along the Z direction, and at least one fixing rod 41 is connected to the connecting part 31.

[0080] It is understood that each fixing member 40 may include multiple fixing rods 41 spaced apart along the Z direction. The different fixing rods 41 have different heights, and the two ends of the connecting part 31 can be connected to the fixing rods 41 at different heights, thereby setting the connecting part 31 at different heights, which allows the height of the spacer 20 to be adjusted. At the same time, multiple connecting parts 31 arranged along the Z direction can be connected to different fixing rods 41 to facilitate the fixing of connecting parts 31 at different heights.

[0081] Please see Figure 1 and Figure 17 In conjunction with the above embodiments, in some embodiments, the carrier 30 includes a plurality of limiting parts 33, and each connecting part 31 has a limiting part 33 at both ends, and the connecting part 31 is detachably connected to the corresponding fixing part 40 through the limiting part 33.

[0082] It is understandable that a limiting part 33 can be provided at both ends of each connecting part 31, and the connecting part 31 can be detachably connected to the fixing part 40 through the limiting part 33, so as to facilitate quick replacement of the connecting part 31. The limiting part 33 can be a structure that is easy to disassemble and assemble, such as a bolt or a clip.

[0083] A material handling device includes the silicon wafer protection device described above. The material handling device possesses all the technical features and beneficial effects of the silicon wafer protection device, which will not be elaborated further here.

[0084] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0085] The silicon wafer protection device provided in the embodiments of this application has been described in detail above, and specific examples have been used to illustrate the principle and implementation of this application. The description of the above embodiments is only for the purpose of helping to understand the technical solution and core idea of ​​this application. Those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A silicon wafer protection device, characterized by, A silicon wafer protection device for spacing a plurality of silicon wafer groups (10); The silicon wafer protection device comprises: a spacer (20) extending along a Y direction to space two adjacent silicon wafer groups (10); The spacer (20) comprises a support portion (22) for supporting a silicon wafer unit (12) on two adjacent silicon wafer groups (10).

2. The silicon wafer protection device of claim 1, wherein, The spacer (20) is a flexible structure with an elastic modulus A satisfying 0.01Mpa≤A≤100Mpa.

3. The silicon wafer protection device of claim 1, wherein, The silicon wafer protection device comprises: a carrier (30) comprising a connecting portion (31) extending along an X direction intersecting the Y direction, each connecting portion (31) being connected to the spacer (20), and the connecting portion (31) being used for carrying the spacer (20).

4. The silicon wafer protection device of claim 3, wherein, The support portion (22) is in a plurality, and the plurality of support portions (22) are arranged along a Z direction intersecting the X direction and the Y direction. The spacer (20) comprises: a first lap portion (23) connected to the support portion (22), and at least one connecting portion (31) being connected to the first lap portion (23).

5. The silicon wafer protection device of claim 4, wherein, The first lap portion (23) comprises: a first connecting plate (231) located at a middle portion of the support portion (22) and connected to each support portion (22).

6. The silicon wafer protection device of claim 4, wherein, The first lap portion (23) comprises: a second connecting plate (232) located at an end portion of the support portion (22) and connected to each support portion (22).

7. The silicon wafer protection device of claim 6, wherein, Each second connecting plate (232) has at least one through hole (21), and at least part of the connecting portion (31) is located on both sides of the silicon wafer group (10) in the Y direction and passes through the corresponding through hole (21).

8. The silicon wafer protection device of claim 4, wherein, The spacer (20) comprises: at least one second lap portion (24) located between two adjacent support portions (22) and connected to the two adjacent support portions (22), respectively, the second lap portion (24) having at least one connecting hole (241), and each connecting hole (241) passing through one connecting portion (31), and the connecting portion (31) passing through the connecting hole (241) being used for being arranged between two adjacent silicon wafer units (12) on the silicon wafer group (10).

9. The silicon wafer protection device of claim 3, wherein, The silicon wafer protection device comprises: two fixing members (40) arranged along the X direction, a plurality of silicon wafer groups (10) being arranged between the two fixing members (40), and two ends of the connecting portion (31) being detachably connected to the corresponding fixing members (40), respectively; Each fixing member (40) comprises a plurality of fixing rods (41) arranged along the Z direction, and at least one fixing rod (41) being connected to the connecting portion (31).

10. The silicon wafer protection device of claim 9, wherein, The carrier (30) comprises: A plurality of limiting parts (33) are arranged at both ends of each connecting part (31), and the connecting part (31) is detachably connected with the corresponding fixing part (40) through the limiting part (33).

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