Packaging coupling antenna

Abstract

The utility model discloses a packaged coupled antenna, belongs to the technical field of radio frequency communication and semiconductor packaging, and mainly solves the problems that a traditional packaged antenna is large in insertion loss, high in processing complexity and difficult to balance in performance and size. The antenna comprises a chip Die, an antenna coupling patch, an antenna radiation patch, a metal ground reflecting surface and a multi-layer packaging structure, and efficient transmission and radiation of radio frequency signals are achieved through non-contact electromagnetic coupling. Specifically, the antenna coupling patch is arranged on the middle layer of the on-chip packaging plate and is connected with the chip Die through a radio frequency signal line; the antenna radiation patch is arranged in parallel on the top layer of the packaging plate, the coupling patch is surrounded by a grounding metal through hole, and the lower end of the through hole is connected with a metal ground reflecting surface to form an electromagnetic shielding structure to reduce interference. According to the packaging coupling antenna, the length of the feeder line can be reduced through a coupling mode, so that the insertion loss of a radio frequency link is reduced, radio frequency wiring becomes simple, the processing difficulty is reduced, and the antenna performance is improved.

Description

Technical Field

[0001] This utility model relates to the fields of radio frequency communication and semiconductor packaging technology, and specifically to a packaged coupling antenna. Background Technology

[0002] Antenna-in-Package (AiP) is a technology that integrates antennas within a chip package. It is an important solution for fields such as 5G, millimeter-wave communication, and radar. Antenna-in-Package technology integrates traditional external antennas into the package structure of semiconductor chips, achieving tight integration between the antenna and the radio frequency front end.

[0003] The mainstream packaged antenna technologies currently available mainly include the following solutions: Substrate-integrated antennas: These utilize the multi-layer structure of the packaging substrate to achieve antenna functionality, but suffer from long RF signal transmission paths, high insertion loss (typically >2dB), and high processing precision requirements. Chip-integrated antennas: These fabricate the antenna directly on the chip surface, but are limited by chip area, resulting in small antenna sizes and low radiation efficiency (<40%), and are difficult to match with the RF front end. Hybrid integrated antennas: These combine substrate and chip integration, partially optimizing performance, but resulting in high process complexity and a significant increase in cost (approximately 30%).

[0004] Therefore, the technical disadvantages of traditional packaged antennas are as follows: relatively high insertion loss; high processing difficulty; and an imbalance between antenna performance and package size. Utility Model Content

[0005] The purpose of this invention is to provide a packaged coupling antenna that overcomes the shortcomings of the prior art and solves the problems of large insertion loss, difficulty in processing, and imbalance between antenna performance and package size in traditional packaged antennas.

[0006] To address this, the present invention proposes a packaged coupling antenna, comprising: a chip die, an antenna coupling patch, a grounding metal via, an antenna radiating patch, a metal ground reflector, an upper chip package board, a lower chip package board, and a chip BGABall; the chip die is packaged between the upper chip package board and the lower chip package board and is connected to the antenna coupling patch via an RF signal line; the antenna coupling patch is located in the middle layer of the upper chip package board, surrounded by a ring of vertically extending grounding metal vias, and a metal ground reflector is provided below it to form an isolation and shielding structure; the antenna radiating patch is located on the top layer of the upper chip package board, arranged parallel to the antenna coupling patch, and receives RF signals and radiates them outward through non-contact electromagnetic coupling; the chip die is connected to an external PCB board via the chip BGABall.

[0007] As a preferred technical solution of this application, the grounding metal through hole is a copper shielding post, and the metal ground reflective surface is a copper shielding plate. Together, they constitute an electromagnetic compatibility barrier with a high-frequency shielding effectiveness of ≥30dB.

[0008] As a preferred technical solution of this application, the grounding metal via is also distributed along the outside of the radio frequency signal line to provide electromagnetic isolation for the radio frequency signal transmission path.

[0009] As a preferred technical solution of this application, the upper end of the grounding metal through hole extends to the height of the antenna radiating patch, and the lower end is connected to the metal ground reflector.

[0010] As a preferred technical solution of this application, the antenna coupling patch operates in the frequency band of 74GHz-83GHz, has a return loss S11 < -15dB, and a center frequency of 78.5GHz.

[0011] As a preferred technical solution of this application, the antenna radiating patch has a gain of 6 dBi at an elevation angle of 0° and a gain of >0 dBi within an azimuth angle range of ±50°.

[0012] The packaged coupling antenna provided by this utility model couples the radio frequency signal to the radiating patch through the coupling patch, and then the radiating patch radiates the electromagnetic wave signal into the air. The antenna coupling method can reduce the length of the feed line, thereby reducing the insertion loss of the radio frequency link, and also simplifying the radio frequency wiring, thereby reducing the difficulty of processing and increasing the antenna performance.

[0013] In addition to the purposes, features, and advantages described above, this application has other purposes, features, and advantages. A further detailed description of this application will be provided below with reference to the figures. Attached Figure Description

[0014] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments and descriptions of this application are used to explain this application and do not constitute an undue limitation of this application. In the drawings:

[0015] Figure 1 This is a side view of the packaged coupling antenna of this utility model;

[0016] Figure 2 This is a top view of the L1 layer metallic ground reflector in the packaged coupled antenna of this utility model;

[0017] Figure 3 This is a top view of the L2 layer coupling patch in the packaged coupled antenna of this utility model;

[0018] Figure 4 This is a top view of the L3 layer radiating patch in the encapsulated coupled antenna of this utility model;

[0019] Figure 5 The return loss curve of the packaged coupling antenna of this utility model is shown.

[0020] Figure 6 This is the radiation pattern of the packaged coupling antenna of this utility model;

[0021] Explanation of reference numerals in the attached diagram: 1. Chip Die; 2. Antenna Coupling Patch; 3. Grounding Metal Via; 4. Antenna Radiation Patch; 5. Metal Ground Reflector; 6. Upper Chip Package Board; 7. Chip BGA Ball; 8. RF Signal Line; 9. Lower Chip Package Board. Detailed Implementation

[0022] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0023] like Figures 1-4 As shown, the packaged coupling antenna of this utility model includes: a chip die 1, an antenna coupling patch 2, a grounding metal through-hole 3, an antenna radiating patch 4, a metal ground reflector 5, an upper chip package board 6, a lower chip package board 9, a chip BGABall 7, and an RF signal line 8; wherein, the chip die 1 transmits the RF signal to the antenna coupling patch 2 through the RF signal line 8, the antenna coupling patch 2 is surrounded by a ring of grounding metal through-holes 3, the antenna coupling patch 2 couples the RF signal to the antenna radiating patch 4, and finally the antenna radiating patch 4 radiates the electromagnetic wave signal into the air.

[0024] Specifically, chip Die 1 is packaged between the upper chip package board 6 and the lower chip package board 9. Antenna coupling patch 2 is packaged in the middle layer of the upper chip package board 6, and the antenna coupling patch 2 and chip Die 1 are connected by RF signal line 8. Chip Die 1 is connected to the external PCB board by chip BGABall 7 located at the lower end of the lower chip package board 9.

[0025] Antenna radiating patch 4 is mounted on the top layer of chip package board 6, and antenna coupling patch 2 is arranged parallel to antenna radiating patch 4; antenna coupling patch 2 couples radio frequency signals to antenna radiating patch 4, and finally antenna radiating patch 4 radiates electromagnetic wave signals into the air.

[0026] like Figure 3As shown, a ring of vertically extending grounded metal through holes 3 surrounds the antenna coupling patch 2, and a metal ground reflector 5 is provided below the antenna coupling patch 2; the upper ends of several grounded metal through holes 3 extend to the same height as the antenna radiating patch 4, and the lower ends of several grounded metal through holes 3 are connected to the bottom metal ground reflector 5, thereby isolating and shielding the radio frequency signal of the antenna coupling patch 2, making the radio frequency signal transmission from the antenna coupling patch 2 to the antenna radiating patch 4 more stable and reducing electromagnetic interference (including preventing external interference and suppressing internal radiation).

[0027] Among them, the grounding metal through-hole 3 is a copper shielding post, and the through-hole spacing of the grounding metal through-hole 3 is ≤λ / 8; the metal ground reflector 5 is a copper shielding plate. Together, they constitute an electromagnetic compatibility barrier with a high-frequency shielding effectiveness ≥30dB. The copper shielding layer achieves electromagnetic compatibility through physical isolation and grounding current conduction, resulting in superior high-frequency shielding effectiveness.

[0028] In addition, to further improve the stability of radio frequency signal transmission, the grounding metal through-hole 3 is also extended to the outside of the radio frequency signal line 8 to electromagnetically isolate the radio frequency signal transmission path generated during the transmission of the radio frequency signal line 8 and reduce electromagnetic interference.

[0029] like Figure 5 The figure shows the return loss of the packaged coupled antenna: As can be seen from the figure, the center frequency of the packaged coupled antenna is around 78.5 GHz, and the S11 between 74 GHz and 83 GHz is below -15 dB, which is excellent performance. This characteristic indicates that the antenna has excellent impedance matching performance in the millimeter wave band, effectively reducing signal reflection loss (reflection power <1%). Compared with existing substrate integrated antennas (S11 > -12 dB in the same frequency band), the return loss performance of this invention is improved by more than 50%, making it particularly suitable for 5G millimeter wave communication and radar systems with stringent signal integrity requirements.

[0030] like Figure 6 The diagram shows the radiation pattern of the packaged coupled antenna. As can be seen, the packaged coupled antenna achieves a gain of approximately 6 dBi at an elevation angle of 0°, demonstrating excellent directional focusing capability. The gain is greater than 0 dBi within an azimuth angle of ±50°, meeting the requirements of most application scenarios. Compared to similar packaged antennas (typical gain <4 dBi), the radiation efficiency of this invention is improved by more than 50%, making it suitable for high-density integrated mobile terminals and miniaturized RF front-end modules.

[0031] The packaged antenna of this invention couples radio frequency (RF) signals to a radiating patch via a coupling patch, and then the radiating patch radiates the electromagnetic wave signals into the air. This antenna coupling method reduces the length of the feed line, thereby reducing insertion loss in the RF link. It also simplifies RF routing, reducing manufacturing difficulty and increasing antenna performance.

[0032] The packaged antenna of the present invention also has the following advantages: 1) Miniaturization: significantly reduces system size, suitable for mobile devices; 2) High performance: reduces transmission loss and improves efficiency; 3) Low cost: simplifies the assembly process and reduces production costs; 4) High integration: can be packaged with RF chips, passive devices, etc.

[0033] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A package coupled antenna, comprising: It includes: Chip Die (1), antenna coupling patch (2), ground metal via (3), antenna radiation patch (4), metal ground reflector (5), chip on package board (6), chip under package board (9) and chip BGA Ball (7); The chip Die (1) is packaged between the chip on package board (6) and the chip under package board (9), and is connected with the antenna coupling patch (2) through the radio frequency signal line (8); The antenna coupling patch (2) is arranged in the middle layer of the chip on package board (6), surrounded by a circle of vertical ground metal via (3), and the metal ground reflector (5) is arranged below, forming an isolation shielding structure; The antenna radiation patch (4) is arranged on the top layer of the chip on package board (6), parallel to the antenna coupling patch (2), receiving radio frequency signals through non-contact electromagnetic coupling and radiating outward; The chip Die (1) is connected with the external PCB signal through the chip BGA Ball (7).

2. The package-on-package coupled antenna of claim 1, wherein, The ground metal via (3) is a copper shielding column, and the metal ground reflector (5) is a copper shielding plate, which together constitute an electromagnetic compatibility barrier, and the high frequency shielding effectiveness is greater than or equal to 30 dB.

3. The package-on-package coupled antenna of claim 1, wherein, The ground metal via (3) is also distributed along the outside of the radio frequency signal line (8), which electromagnetically isolates the radio frequency signal transmission path.

4. The package-on-package coupled antenna of claim 1, wherein, The upper end of the ground metal via (3) extends to the height of the antenna radiation patch (4), and the lower end is connected with the metal ground reflector (5).

5. The package-on-package coupled antenna of claim 1, wherein, The working frequency band of the antenna coupling patch (2) is 74GHz-83GHz, the return loss S11 is less than-15dB, and the center frequency is 78.5GHz.

6. The package-on-package coupled antenna of claim 1, wherein, The gain of the antenna radiation patch (4) at the pitch angle of 0° is 6dBi, and the gain in the range of azimuth angle ±50° is greater than 0dBi.

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