Light emitting diode

Abstract

The utility model discloses a light-emitting diode, which comprises a transparent glass bottom plate, a transparent resin table fixedly arranged at the center of the upper end of the transparent glass bottom plate, a light-emitting chip arranged at the upper end of the transparent resin table, and four downward metal elastic sheets welded at the lower end of the light-emitting chip, the peripheral side walls of the transparent resin table are provided with slots for the four metal elastic pieces to be inserted in a matched mode respectively, the bottoms of the slots are provided with limiting holes extending inwards, and the lower ends of the metal elastic pieces are provided with limiting hooks embedded into the corresponding limiting holes in a protruding mode. Two pins extending downwards are fixedly arranged on the transparent glass bottom plate and connected with the positive electrode and the negative electrode of the light-emitting chip through metal wires respectively. The transparent glass outer cover covers the upper end of the transparent glass bottom plate and is fixedly connected with the transparent glass bottom plate, so that the light-emitting chip is located in the center and is not prone to deviation, and the light-emitting chip is limited to the upper end of the transparent resin table through cooperation of the limiting hole and the limiting hook.

Description

Technical Field

[0001] This utility model relates to the field of diode technology, specifically to a light-emitting diode. Background Technology

[0002] Light-emitting diodes, or LEDs for short, are common light-emitting devices that release light through the recombination of electrons and holes. They are widely used in the lighting industry. LEDs efficiently convert electrical energy into light energy and have wide applications in modern society, such as lighting, flat panel displays, and medical devices. During the manufacturing process of LEDs, a packaging operation is required. During packaging, the LED chip is prone to misalignment, which reduces the lighting effect during use. Utility Model Content

[0003] To address the shortcomings of the prior art, this utility model proposes a light-emitting diode.

[0004] To achieve the above-mentioned technical effects, the present invention adopts the following solution:

[0005] A light-emitting diode includes a transparent glass substrate, a transparent resin stage, a light-emitting chip, and a transparent glass cover;

[0006] The transparent resin platform is fixedly mounted on the upper center of the transparent glass base plate. The light-emitting chip is mounted on the upper end of the transparent resin platform with its bottom facing down. Four downward-facing metal springs are welded to the lower end of the light-emitting chip. Slots extending downward from the upper end are provided on the four side walls of the transparent resin platform. The four metal springs are respectively matched and inserted into the slots around the transparent resin platform to clamp the transparent resin platform. The bottom of the slot is provided with an inward-extending limiting hole. The lower end of the metal springs protrudes and is provided with a limiting hook that is embedded in the corresponding limiting hole.

[0007] Two downward-extending pins are fixed on the transparent glass base plate, and the two pins are respectively connected to the positive and negative terminals of the light-emitting chip through a metal wire;

[0008] The transparent glass cover is placed on top of the transparent glass base plate and fixedly connected. The transparent resin platform, light-emitting chip, metal spring and metal wire are all located inside the transparent glass cover.

[0009] In a preferred embodiment, the bottom of the light-emitting chip is connected to the top of the transparent resin stage via a solder layer.

[0010] In a preferred embodiment, the upper end of the bottom of the transparent glass is provided with an annular limiting groove surrounding the transparent resin platform, and the lower end of the transparent glass cover is provided with an annular limiting edge, which is fitted into the annular limiting groove.

[0011] In a preferred embodiment, the upper end of the transparent glass base plate has two grooves, both of which are located inside the transparent glass cover. Metal connectors are fixedly installed in the grooves, and the upper ends of two pins are respectively connected to the two metal connectors. Two metal wires are respectively connected to the two metal connectors.

[0012] In the preferred embodiment, the two pins are located on opposite sides of the transparent resin stage.

[0013] Compared with existing technologies, the beneficial effects are:

[0014] This utility model has a simple structure and is easy to use. The light-emitting chip is clamped by four metal springs at the lower end of the chip, which clamps the transparent resin platform located in the center of the transparent glass base plate, so that the light-emitting chip is in the center and is not easy to shift. Furthermore, the light-emitting chip is restricted to the upper end of the transparent resin platform by the cooperation of the limiting hole and the limiting hook. Attached Figure Description

[0015] Figure 1 This is a cross-sectional schematic diagram of the present invention.

[0016] Reference numerals: 1. Transparent glass base plate; 2. Transparent glass cover; 3. Transparent resin platform; 4. Light-emitting chip; 5. Metal spring; 6. Slot; 7. Limiting hook; 8. Limiting hole; 9. Annular limiting edge; 10. Metal connector; 11. Pin; 12. Metal wire; 13. Solder layer. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0018] A light-emitting diode includes a transparent glass substrate 1, a transparent resin platform 3, a light-emitting chip 4, and a transparent glass cover 2;

[0019] The transparent resin platform 3 is fixedly disposed at the upper center of the transparent glass base plate 1. The transparent resin platform 3 is insulated. The light-emitting chip 4 is disposed at the upper end of the transparent resin platform 3 with its bottom facing down. The substrate of the light-emitting chip 4 is located at the lower end. Four downward-facing metal springs 5 ​​are welded to the lower end of the light-emitting chip 4. Slots 6 extending downward from the upper end are provided on the four sides of the transparent resin platform 3. The four metal springs 5 ​​are respectively matched and inserted into the slots 6 around the transparent resin platform 3 to clamp the transparent resin platform 3. The bottom of the slot 6 is provided with an inwardly extending limiting hole 8. The lower end of the metal spring 5 protrudes and is provided with a limiting hook 7 that is embedded in the corresponding limiting hole 8.

[0020] Two downward-extending pins 11 are fixed on the transparent glass base plate 1. The two pins 11 are respectively connected to the positive and negative terminals of the light-emitting chip 4 through a metal wire 12.

[0021] The transparent glass cover 2 is placed over the upper end of the transparent glass base plate 1 and fixedly connected. The fixing method adopts existing technology, such as sealing with sealant or flame sintering the connection between the transparent glass cover and the transparent glass base plate. The transparent resin platform 3, the light-emitting chip 4, the metal spring 5 and the metal wire are all located inside the transparent glass cover 2.

[0022] The light-emitting chip 4 is clamped by four metal springs 5 ​​at the lower end of the transparent resin platform 3 located in the center of the transparent glass base plate 1, so that the light-emitting chip 4 is located in the center and is not easy to shift. Furthermore, the light-emitting chip 4 is restricted to the upper end of the transparent resin platform 3 by the cooperation of the limiting hole 8 and the limiting hook 7.

[0023] In a preferred embodiment, the bottom of the light-emitting chip 4 is connected to the upper end of the transparent resin stage 3 via a solder layer 13. The solder layer 13 is used to solder the light-emitting chip 4 to the transparent resin stage 3 via reflow soldering, further fixing the light-emitting chip 4 to the upper end of the transparent resin stage 3.

[0024] In a preferred embodiment, the upper end of the bottom of the transparent glass is provided with an annular limiting groove surrounding the transparent resin platform 3, and the lower end of the transparent glass cover 2 is provided with an annular limiting edge 9, which is fitted into the annular limiting groove. Through the cooperation of the annular limiting groove and the annular limiting edge 9, the center of the transparent glass cover 2 is aligned with the center of the transparent glass base plate 1 without any offset.

[0025] In a preferred embodiment, the upper end of the transparent glass base plate 1 has two grooves, both located inside the transparent glass outer cover 2. Metal connectors 10 are fixedly installed within the grooves. The upper ends of two leads 11 are connected to the two metal connectors 10 respectively, and two metal wires are connected to the two metal connectors 10 respectively. Because the leads 11 are thinner and have a smaller cross-sectional area, connecting the metal wires 12 through the metal connectors 10 with larger cross-sectional areas facilitates wiring.

[0026] In the preferred embodiment, the two pins 11 are located on opposite sides of the transparent resin stage 3. This ensures that the two metal wires 12 are located on opposite sides of the transparent resin stage 3, preventing them from colliding and short-circuiting.

[0027] In the description of this utility model, it should be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are only used to facilitate the description of this utility model and simplify the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0029] Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

Claims

1. A light emitting diode, characterized by, It comprises a transparent glass bottom plate (1), a transparent resin platform (3), a light emitting chip (4) and a transparent glass cover (2). The transparent resin platform (3) is fixedly arranged at the upper end center of the transparent glass bottom plate (1), the light emitting chip (4) is arranged at the upper end of the transparent resin platform (3), the bottom of the light emitting chip (4) faces downward, four downward metal springs (5) are welded at the lower end of the light emitting chip (4), four insertion grooves (6) extending from the upper end to the lower end are arranged on the side walls of the transparent resin platform (3), the four metal springs (5) are respectively inserted into the insertion grooves (6) around the transparent resin platform (3) for clamping the transparent resin platform (3), the bottom of the insertion groove (6) is provided with an inwardly extending limiting hole (8), and the lower end of the metal spring (5) is provided with a limiting hook (7) embedded in the corresponding limiting hole (8). Two downward extending pins (11) are fixedly arranged on the transparent glass bottom plate (1), and the two pins (11) are connected with the positive and negative electrodes of the light emitting chip (4) through a metal wire (12). The transparent glass cover (2) covers the upper end of the transparent glass bottom plate (1) and is fixedly connected, the transparent resin platform (3), the light emitting chip (4), the metal spring (5) and the metal wire are located in the transparent glass cover (2).

2. The light emitting diode of claim 1, wherein the first and second semiconductor layers are formed of a compound semiconductor. The bottom of the light emitting chip (4) and the upper end of the transparent resin platform (3) are connected through a tin solder layer (13).

3. The light emitting diode of claim 1, wherein the first and second semiconductor layers are formed of a compound semiconductor. The upper end of the transparent glass bottom plate is provided with an annular limiting groove around the transparent resin platform (3), the lower end of the transparent glass cover (2) is provided with an annular limiting edge (9), and the annular limiting edge (9) is matched and embedded in the annular limiting groove.

4. The light emitting diode of claim 1, wherein the first and second semiconductor layers are formed of a group III-V compound semiconductor. The upper end of the transparent glass bottom plate (1) is provided with two grooves, and the two grooves are located in the transparent glass cover (2), the metal wire head (10) is fixedly arranged in the groove, the upper end of the two pins (11) is respectively connected with the two metal wire heads (10), and the two metal wires are respectively connected with the two metal wire heads (10).

5. The light emitting diode of claim 1, wherein the first and second semiconductor layers are formed of a group III-V compound semiconductor. The two pins (11) are respectively located on the two sides of the transparent resin platform (3).

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