Pin tin soldering device for high-temperature capacitor production

Abstract

The utility model relates to the technical field of capacitor production, and discloses a pin soldering device for high-temperature capacitor production, which comprises a support table, a carrier and a capacitor main body, the upper end of the support table is fixedly connected with a fixed frame, a pin clamping and conveying assembly is arranged between the support table and the fixed frame, the pin clamping and conveying assembly comprises a movable frame, and the movable frame is fixedly connected with the carrier. Driving grooves are formed in the front inner wall and the rear inner wall of the fixing frame correspondingly, a driving lead screw is rotationally connected between the inner walls of the two sides of one driving groove, and a positioning rod is fixedly connected between the inner walls of the two sides of the other driving groove. According to the automatic welding device, the pin clamping and conveying assembly is arranged, then the pin bodies to be welded can be automatically clamped and conveyed to the upper ends of the capacitor bodies, the welding stability is greatly improved, the distance between the pin bodies can be adjusted through the distance adjusting assembly, and the welding efficiency is improved. Therefore, the device can be adapted to the to-be-welded parts on various capacitor main bodies.

Description

Technical Field

[0001] This utility model relates to the field of capacitor production technology, and in particular to a pin soldering device for high-temperature capacitor production. Background Technology

[0002] With the increasing demand for high performance and high reliability in electronic devices, high-temperature capacitors, as key components, are widely used in electronic products operating in high-temperature environments. In the capacitor production process, soldering is one of the key steps, especially the soldering of capacitor leads. Currently, traditional high-temperature capacitor pin soldering technology mainly relies on manual operation, where workers manually align and solder the leads by hand.

[0003] However, the traditional method of manually aligning and soldering pins has many drawbacks. First, manual operation makes it difficult to ensure the consistency and high precision of the soldering, affecting the quality of the capacitor. Second, because the operation requires a high level of human skill and stability, the production efficiency is low and human error is prone to occur. In addition, the labor intensity of operators in this method is also high. Therefore, those skilled in the art have provided a pin soldering device for high-temperature capacitor production to solve the problems mentioned in the background art. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a pin soldering device for high-temperature capacitor production. This device, equipped with a pin clamping and conveying assembly, automatically picks up and conveys the pins to be soldered to the top of the capacitor body. Compared to the traditional method of hand-held pin alignment and soldering, this automated operation significantly improves soldering stability, effectively reduces errors that may occur during manual soldering, enhances the consistency of capacitor product quality, and reduces the labor intensity of operators.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a pin soldering device for high-temperature capacitor production, comprising a support platform, a carrier frame and a capacitor body, wherein a fixed frame is fixedly connected to the upper end of the support platform, and a pin clamping and conveying assembly is provided between the support platform and the fixed frame.

[0006] The pin clamping and conveying assembly includes a movable frame. The fixed frame has drive grooves on its front and rear inner walls. A drive screw is rotatably connected between the two inner walls of one drive groove, and a positioning rod is fixedly connected between the two inner walls of the other drive groove. A drive block is threaded onto the outer wall of the drive screw, and a positioning block is threaded onto the outer wall of the positioning rod. Both the drive block and the positioning block are fixedly connected to the movable frame. A first cylinder is fixedly installed at the front and rear of the upper end of the movable frame. The telescopic ends of both first cylinders pass through the movable frame and are fixedly connected to an adjusting frame. A clamping frame is installed at the front and rear of the lower end of the adjusting frame. A movable groove is opened at the lower end of both clamping frames. A first bidirectional threaded rod is rotatably connected between the two inner walls of the two movable grooves. A movable block is threaded onto the outer wall of both first bidirectional threaded rods. A clamping block is fixedly connected to the lower end of multiple movable blocks. A spacing adjustment assembly is provided between the two clamping frames and the adjusting frame.

[0007] Through the above technical solution, by providing a pin clamping and conveying assembly, the movable frame can be moved to the carrier frame and the clamping plate can be aligned with the pin body to be welded. Then, by activating the first cylinder, the adjusting frame is moved down, causing the clamping plate to fall to both sides of the pin body to be welded. At this time, by controlling the rotation of the first bidirectional threaded rod, the corresponding clamping plate can be moved via the provided movable block, thereby realizing the clamping operation of the pin body. Subsequently, by activating the first cylinder to control the clamping plate to lift, the clamping operation can be completed. Then, by controlling the clamping plate to move the pin body to the capacitor body, and with the cooperation of the provided first cylinder, the pin body can be lowered to the solder joint, thereby automatically realizing the clamping and conveying of the pin body to be welded to the upper end of the capacitor body.

[0008] Furthermore, the spacing adjustment assembly includes a second bidirectional threaded rod, and the lower end of the adjustment frame is provided with an adjustment groove. The second bidirectional threaded rod is rotatably connected between the front and rear inner walls of the adjustment groove. Adjustment blocks are threadedly sleeved on the front and rear parts of the outer wall of the second bidirectional threaded rod. Both adjustment blocks are fixedly connected to the corresponding clamping frame. A third motor is fixedly installed at the rear end of the adjustment frame. The output end of the third motor passes through the adjustment frame and is fixedly connected to the second bidirectional threaded rod.

[0009] Through the above technical solution, by providing a spacing adjustment component, the second bidirectional threaded rod can be rotated by starting the third motor. The two clamping frames can be moved relative to each other or in opposite directions via the provided adjustment block. Thus, the distance between the pin bodies can be automatically adjusted according to the requirements of different capacitor bodies. This allows the device to adapt to the welding parts on various capacitor bodies, further improving the flexibility and adaptability of production and ensuring the welding operation of capacitor bodies of different specifications.

[0010] Furthermore, two spring grooves are opened on both sides of the inside of the support platform. The upper inner wall of each of the two spring grooves is provided with a movable groove. Movable plates are movably arranged inside each of the two spring grooves. Multiple return springs are fixedly connected between the two movable plates and the inner wall of the opposite side of the corresponding spring groove. Positioning clamps are fixedly connected to the upper ends of the two movable plates. The two positioning clamps are movably arranged in the corresponding movable grooves. Mounting brackets are fixedly connected to the front and rear of the upper end of the support platform. A second cylinder is fixedly arranged at one end of each of the two mounting brackets. The telescopic ends of the two second cylinders pass through the corresponding mounting brackets and are fixedly connected to a fixing clamp. The capacitor body is arranged between the two positioning clamps and the two fixing clamps.

[0011] The above technical solution involves placing the capacitor body to be processed between two positioning clamps. The capacitor body is initially positioned by the two positioning clamps via a return spring. Then, the capacitor body is clamped and fixed by activating the second cylinder to move the fixing clamp.

[0012] Furthermore, two T-shaped blocks are fixedly connected to one side of the upper end of the support platform, and multiple pin bodies are movably arranged inside the shelf. T-shaped grooves are opened on both sides of the rear end of the shelf, and the two T-shaped blocks are slidably arranged in the corresponding T-shaped grooves.

[0013] The above technical solution, by providing T-blocks and T-slots, allows the shelf to be positioned and placed on the support platform.

[0014] Furthermore, the upper inner walls of both of the moving slots are provided with first limiting slots, and the upper ends of the multiple moving blocks are fixedly connected with first limiting blocks, and the multiple first limiting blocks are slidably arranged in the corresponding first limiting slots.

[0015] Through the above technical solution, by providing a first limiting groove and a first limiting block, the corresponding moving block can move stably and effectively.

[0016] Furthermore, a first motor is fixedly installed on one side of each of the two clamping frames, and the output ends of the two first motors pass through the corresponding clamping frame and are fixedly connected to the corresponding first bidirectional threaded rod. A second motor is fixedly installed on one side of the fixed frame, and the output end of the second motor passes through the fixed frame and is fixedly connected to the drive screw.

[0017] With the above technical solution, starting the first motor can cause the first bidirectional threaded rod to rotate, and starting the second motor can cause the drive screw to rotate.

[0018] Furthermore, a second limiting groove is provided on the upper inner wall of the adjusting groove, and a second limiting block is fixedly connected to the upper end of each of the two adjusting blocks, and the two second limiting blocks are slidably disposed within the second limiting groove.

[0019] Through the above technical solution, by providing a second limiting groove and a second limiting block, the corresponding adjusting block can move stably and effectively.

[0020] Furthermore, a placement frame is fixedly connected to one side of the front end of the fixed frame, and a solder gun is movably disposed inside the placement frame;

[0021] The above technical solution provides a convenient rack for placing the solder gun. When needed, the gun can be removed so that operators can use it to solder the pin body and capacitor body.

[0022] This utility model has the following beneficial effects:

[0023] 1. The present invention proposes a pin soldering device for high-temperature capacitor production. By providing a pin clamping and conveying component, it can automatically clamp and convey the pin body to be soldered to the upper end of the capacitor body. Compared with the traditional method of manually aligning and soldering the pin body, this device greatly improves the stability of soldering through automated operation, effectively reduces the errors that may occur in manual soldering, improves the quality consistency of capacitor products, and reduces the labor intensity of operators.

[0024] 2. The present invention proposes a pin soldering device for high-temperature capacitor production. By incorporating a spacing adjustment component, the device can adapt and adjust the clamped pin body according to the spacing of the points to be soldered during use. Specifically, by activating a third motor to rotate the second bidirectional threaded rod, the two clamping frames can move relative to or away from each other via an adjustment block. This allows the device to automatically adjust the distance between the pin bodies according to the requirements of different capacitor bodies, thereby enabling it to adapt to the soldering parts on various capacitor bodies. This further enhances the flexibility and adaptability of production and ensures the soldering operation of capacitor bodies of different specifications. Attached Figure Description

[0025] Figure 1 This is an isometric schematic diagram of a pin soldering device for high-temperature capacitor production proposed in this utility model;

[0026] Figure 2 This is a front sectional view of a pin soldering device for high-temperature capacitor production proposed in this utility model;

[0027] Figure 3 for Figure 2 Enlarged structural diagram at point A;

[0028] Figure 4 This is a side sectional view of a pin soldering device for high-temperature capacitor production proposed in this utility model;

[0029] Figure 5 This is a partial top-section schematic diagram of a pin soldering device for high-temperature capacitor production proposed in this utility model;

[0030] Figure 6 This is a top-section schematic diagram of a pin soldering device for high-temperature capacitor production proposed in this utility model.

[0031] Legend:

[0032] 1. Support platform; 2. Fixing frame; 3. Carrier frame; 4. Pin body; 5. Capacitor body; 6. Pin clamping and conveying assembly; 7. Moving frame; 8. First cylinder; 9. Adjusting frame; 10. Clamping frame; 11. Moving groove; 12. First bidirectional threaded rod; 13. Moving block; 14. Clamping block; 15. First limiting groove; 16. First limiting block; 17. First motor; 18. Drive groove; 19. Drive screw; 20. Positioning rod; 21. Drive block; 22. Fixed... 23. Positioning block; 24. Second motor; 25. Spacing adjustment assembly; 26. Adjustment groove; 27. Second bidirectional threaded rod; 28. Adjustment block; 29. ​​Second limiting groove; 30. Second limiting block; 31. Third motor; 32. Spring groove; 33. Movable plate; 34. Return spring; 35. Movable groove; 36. Positioning clamp; 37. Mounting bracket; 38. Second cylinder; 39. Fixed clamp; 40. T-block; 41. T-slot; 42. Placement bracket; 43. Solder gun. Detailed Implementation

[0033] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of specific embodiments. Obviously, the described specific embodiments are only a part of the specific embodiments of the present invention, and not all of them. Based on the specific embodiments of the present invention, all other specific embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] Reference Figure 1-6 The present invention provides a specific embodiment of a pin soldering device for high-temperature capacitor production, comprising a support platform 1, a carrier 3 and a capacitor body 5, wherein a fixed frame 2 is fixedly connected to the upper end of the support platform 1, and a pin clamping and conveying assembly 6 is provided between the support platform 1 and the fixed frame 2.

[0035] The pin clamping and conveying assembly 6 includes a movable frame 7. The front and rear inner walls of the fixed frame 2 are both provided with drive grooves 18. A drive screw 19 is rotatably connected between the two inner walls of one drive groove 18, and a positioning rod 20 is fixedly connected between the two inner walls of the other drive groove 18. A drive block 21 is threaded onto the outer wall of the drive screw 19, and a positioning block 22 is threaded onto the outer wall of the positioning rod 20. Both the drive block 21 and the positioning block 22 are fixedly connected to the movable frame 7. A first cylinder 8 is fixedly installed at the front and rear of the upper end of the movable frame 7. The telescopic ends of both first cylinders 8 pass through the movable frame 7 and are fixedly connected to an adjusting frame 9. A clamping frame 10 is installed at the front and rear of the lower end of the adjusting frame 9. A movable groove 11 is provided at the lower end of both clamping frames 10. Both sides of the inner wall of the movable groove 11 are rotatably connected to a first bidirectional threaded rod 12. The outer walls of the two first bidirectional threaded rods 12 are threaded with movable blocks 13. The upper inner walls of the two movable grooves 11 are provided with first limiting grooves 15. The upper ends of the multiple movable blocks 13 are fixedly connected to first limiting blocks 16. The multiple first limiting blocks 16 are slidably arranged in the corresponding first limiting grooves 15. By providing the first limiting grooves 15 and the first limiting blocks 16, the corresponding movable blocks 13 can move stably and effectively. The lower ends of the multiple movable blocks 13 are fixedly connected to clamping blocks 14. A first motor 17 is fixedly arranged on one side of each of the two clamping frames 10. The output ends of the two first motors 17 pass through the corresponding clamping frames 10 and are connected to the corresponding first bidirectional threaded rods 13. The rod 12 is fixedly connected, and a second motor 23 is fixedly installed on one side of the fixed frame 2. The output end of the second motor 23 passes through the fixed frame 2 and is fixedly connected to the drive screw 19. By starting the first motor 17, the first bidirectional threaded rod 12 can be rotated, and by starting the second motor 23, the drive screw 19 can be rotated. A spacing adjustment component 24 is provided between the two clamping frames 10 and the adjusting frame 9. With the needle clamping and conveying component 6 provided, the moving frame 7 can be moved to the carrier frame 3 and the clamping plate can be aligned with the needle body 4 to be welded. Then, by starting the first cylinder 8, the adjusting frame 9 is moved down, and the clamping plate falls to both sides of the needle body 4 to be welded. At this time, by controlling the rotation of the first bidirectional threaded rod 12, the moving block is provided. 13 allows the corresponding clamping plate to move, thereby achieving the clamping operation of the pin body 4. Then, by activating the first cylinder 8 to control the clamping plate to lift, the clamping operation can be completed. Next, by controlling the clamping plate to move the pin body 4 to the capacitor body 5, and with the cooperation of the first cylinder 8, the pin body 4 can be lowered to the solder joint, thereby automatically clamping and transporting the pin body 4 to be soldered to the upper end of the capacitor body 5. Two spring grooves 31 are opened on both sides of the inside of the support platform 1. The upper inner wall of each spring groove 31 is provided with a movable groove 34. Movable plates 32 are movably arranged inside each spring groove 31. Multiple return springs 33 are fixedly connected between the two movable plates 32 and the inner wall of the corresponding spring groove 31 on the opposite side.Positioning clamps 35 are fixedly connected to the upper ends of both movable plates 32. Both positioning clamps 35 are movably positioned within corresponding movable slots 34. Mounting brackets 36 are fixedly connected to the front and rear ends of the upper end of the support platform 1. A second cylinder 37 is fixedly mounted at one end of each mounting bracket 36. The telescopic ends of both second cylinders 37 pass through the corresponding mounting brackets 36 and are fixedly connected to a fixing clamp 38. The capacitor body 5 is positioned between the two positioning clamps 35 and the two fixing clamps 38. By placing the capacitor body 5 to be processed between the two positioning clamps 35, the capacitor body 5 can be initially positioned by the two positioning clamps 35 via the provided return spring 33. Then, by activating the second cylinders 37, the fixing clamps 38 can be moved, thereby enabling the processing of the capacitor body 5. The capacitor body 5 is clamped and fixed. Two T-blocks 39 are fixedly connected to one side of the upper end of the support platform 1. Multiple pin bodies 4 are movably arranged inside the shelf 3. T-slots 40 are opened on both sides of the rear end of the shelf 3. The two T-blocks 39 are slidably arranged in the corresponding T-slots 40. With the T-blocks 39 and T-slots 40, the shelf 3 can be positioned on the support platform 1. A placement rack 41 is fixedly connected to one side of the front end of the fixing frame 2. A solder gun 42 is movably arranged in the placement rack 41. With the placement rack 41, the solder gun 42 can be conveniently placed. When needed, it can be taken out so that the operator can hold the solder gun 42 to solder the pin bodies 4 and the capacitor body 5.

[0036] Reference Figure 4 The spacing adjustment assembly 24 includes a second bidirectional threaded rod 26. An adjustment groove 25 is provided at the lower end of the adjustment frame 9. The second bidirectional threaded rod 26 is rotatably connected between the front and rear inner walls of the adjustment groove 25. Adjustment blocks 27 are threadedly sleeved on the front and rear sides of the outer wall of the second bidirectional threaded rod 26. A second limiting groove 28 is provided on the upper inner wall of the adjustment groove 25. A second limiting block 29 is fixedly connected to the upper end of each of the two adjustment blocks 27. Both second limiting blocks 29 are slidably disposed within the second limiting groove 28. By providing the second limiting groove 28 and the second limiting block 29, the corresponding adjustment block 27 can move stably and effectively. Both adjustment blocks 27 are fixedly attached to the corresponding clamping frame 10. A third motor 30 is fixedly installed at the rear end of the adjustment frame 9. The output end of the third motor 30 passes through the adjustment frame 9 and is fixedly connected to the second bidirectional threaded rod 26. With the spacing adjustment component 24, the second bidirectional threaded rod 26 can be rotated by starting the third motor 30. The two clamping frames 10 can move relative to each other or away from each other via the adjustment block 27. This allows the distance between the pin bodies 4 to be automatically adjusted according to the requirements of different capacitor bodies 5. As a result, the device can be adapted to the welding parts on various capacitor bodies 5, further improving the flexibility and adaptability of production and ensuring the welding operation of capacitor bodies 5 of different specifications.

[0037] Working principle: In use, first, the carrier 3 containing the body 4 of the pins to be welded is clamped onto the two T-blocks 39. Then, the capacitor body 5 to be processed is placed between the two positioning clamps 35. The return spring 33 allows the two positioning clamps 35 to initially position the capacitor body 5. Then, by activating the second cylinder 37, the fixing clamp 38 is moved, thereby clamping and fixing the capacitor body 5. Next, by activating the second motor 23, the drive screw 19 is rotated. Through the drive block 21 and the positioning block 22, the moving frame 7 can be moved to... The system controls the movement of the clamping plate to the carrier 3, aligning it with the main body 4 of the pin to be welded. Then, the first cylinder 8 is activated, causing the adjusting frame 9 to move downwards, resulting in the clamping plate falling to both sides of the main body 4. At this point, the first motor 17 is activated, causing the first bidirectional threaded rod 12 to rotate. This, via the provided moving block 13, moves the corresponding clamping plate, thus clamping the main body 4. Subsequently, the clamping plate is raised by activating the first cylinder 8 to complete the clamping operation. Finally, the second motor 23 is activated to move the clamping plate, carrying the main body 4, to the capacitor. The main body 5, in conjunction with the first cylinder 8, allows the pin body 4 to fall to the solder joint, thus automatically clamping and transporting the pin body 4 to be soldered to the upper end of the capacitor body 5. Compared with the traditional method of manually aligning and soldering the pin body 4, this device greatly improves the stability of soldering through automated operation, effectively reduces the errors that may occur during manual soldering, improves the quality consistency of capacitor products, and reduces the labor intensity of operators. Finally, the operator only needs to hold the solder gun 42 to perform soldering operations on the pin body 4 and the capacitor body 5. At the same time, when using the device, the clamped pin body 4 can also be adjusted according to the distance between the solder joints. That is, by starting the third motor 30, the second bidirectional threaded rod 26 rotates, and the two clamping frames 10 can move relative to each other or in opposite directions through the adjustment block 27. Thus, the distance between the pin bodies 4 can be automatically adjusted according to the requirements of different capacitor bodies 5, so that the device can be adapted to the soldering parts on various capacitor bodies 5, further improving the flexibility and adaptability of production and ensuring the soldering operation of capacitor bodies 5 of different specifications.

[0038] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing specific embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A pin soldering device for high-temperature capacitor production, comprising a support platform (1), a carrier (3), and a capacitor body (5), characterized in that: The upper end of the support platform (1) is fixedly connected to a fixing frame (2), and a pin clamping and conveying assembly (6) is provided between the support platform (1) and the fixing frame (2); The pin clamping and conveying assembly (6) includes a movable frame (7). The fixed frame (2) has drive grooves (18) on both its front and rear inner walls. A drive screw (19) is rotatably connected between the inner walls of one drive groove (18), and a positioning rod (20) is fixedly connected between the inner walls of the other drive groove (18). A drive block (21) is threaded onto the outer wall of the drive screw (19), and a positioning block (22) is threaded onto the outer wall of the positioning rod (20). Both the drive block (21) and the positioning block (22) are fixedly connected to the movable frame (7). A first cylinder (8) is fixedly installed at the front and rear ends of the upper part of the movable frame (7). The telescopic ends of the two first cylinders (8) pass through the movable frame (7) and are fixedly connected to the adjusting frame (9). The lower end of the adjusting frame (9) is provided with a clamping frame (10) at the front and rear. The lower end of the two clamping frames (10) is provided with a moving groove (11). The inner walls on both sides of the two moving grooves (11) are rotatably connected with a first bidirectional threaded rod (12). The outer walls of the two first bidirectional threaded rods (12) are threaded with moving blocks (13). The lower ends of the multiple moving blocks (13) are fixedly connected with clamping blocks (14). A spacing adjustment component (24) is provided between the two clamping frames (10) and the adjusting frame (9).

2. The pin soldering device for high-temperature capacitor production according to claim 1, characterized in that: The spacing adjustment assembly (24) includes a second bidirectional threaded rod (26). The lower end of the adjustment frame (9) is provided with an adjustment groove (25). The second bidirectional threaded rod (26) is rotatably connected between the front and rear inner walls of the adjustment groove (25). The outer wall of the second bidirectional threaded rod (26) is threaded with adjustment blocks (27) at both the front and rear. Both adjustment blocks (27) are fixedly connected to the corresponding clamping frame (10). A third motor (30) is fixedly installed at the rear end of the adjustment frame (9). The output end of the third motor (30) passes through the adjustment frame (9) and is fixedly connected to the second bidirectional threaded rod (26).

3. The pin soldering device for high-temperature capacitor production according to claim 1, characterized in that: The support platform (1) has two spring grooves (31) on its inner sides. Each spring groove (31) has a movable groove (34) on its upper inner wall. Each spring groove (31) has a movable plate (32) inside it. Multiple return springs (33) are fixedly connected between the two movable plates (32) and the corresponding inner wall of the spring groove (31). Each movable plate (32) has a fixed positioning clamp (35) at its upper end. The positioning clamps (35) are all movably set in the corresponding movable slots (34). The upper end of the support platform (1) is fixedly connected to the front and rear positions of the mounting brackets (36). One end of each of the two mounting brackets (36) is fixedly provided with a second cylinder (37). The telescopic ends of the two second cylinders (37) pass through the corresponding mounting brackets (36) and are fixedly connected to the fixing clamps (38). The capacitor body (5) is set between the two positioning clamps (35) and the two fixing clamps (38).

4. The pin soldering device for high-temperature capacitor production according to claim 1, characterized in that: Two T-shaped blocks (39) are fixedly connected to one side of the upper end of the support platform (1). Multiple pin bodies (4) are movably arranged inside the shelf (3). T-shaped grooves (40) are opened on both sides of the rear end of the shelf (3). The two T-shaped blocks (39) are slidably arranged in the corresponding T-shaped grooves (40).

5. The pin soldering device for high-temperature capacitor production according to claim 1, characterized in that: The upper inner walls of the two moving slots (11) are provided with first limiting slots (15), and the upper ends of the multiple moving blocks (13) are fixedly connected with first limiting blocks (16), and the multiple first limiting blocks (16) are slidably arranged in the corresponding first limiting slots (15).

6. The pin soldering device for high-temperature capacitor production according to claim 1, characterized in that: A first motor (17) is fixedly installed on one side of each of the two clamping frames (10). The output ends of the two first motors (17) pass through the corresponding clamping frame (10) and are fixedly connected to the corresponding first bidirectional threaded rod (12). A second motor (23) is fixedly installed on one side of the fixing frame (2). The output end of the second motor (23) passes through the fixing frame (2) and is fixedly connected to the drive screw (19).

7. The pin soldering device for high-temperature capacitor production according to claim 2, characterized in that: The upper inner wall of the adjustment groove (25) is provided with a second limiting groove (28), and the upper ends of the two adjustment blocks (27) are fixedly connected with second limiting blocks (29), and the two second limiting blocks (29) are slidably arranged in the second limiting groove (28).

8. The pin soldering device for high-temperature capacitor production according to claim 1, characterized in that: A placement frame (41) is fixedly connected to one side of the front end of the fixed frame (2), and a solder gun (42) is movably arranged inside the placement frame (41).

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