Headset decoding chip heat dissipation assembly

Abstract

The utility model belongs to the technical field of Bluetooth earphone chip heat dissipation, and discloses an earphone decoding chip heat dissipation assembly, which comprises a C-shaped exposed heat dissipation part, a decoding chip pressing plate and two groups of clip-shaped fixing chucks, the horizontal decoding chip pressing plate is arranged in the C-shaped exposed heat dissipation part, the clip-shaped fixing chucks are arranged at the two ends of the C-shaped exposed heat dissipation part, and the clip-shaped fixing chucks are arranged in the C-shaped exposed heat dissipation part. The C-shaped exposed heat dissipation part, the decoding chip pressing plate and the concentric-square-shaped fixing clamping head are integrally machined by metal, the C-shaped exposed heat dissipation part is fixedly installed on one side of the shell, one side of the C-shaped exposed heat dissipation part is exposed outside and makes contact with air, a decoding chip is arranged below the decoding chip pressing plate, the decoding chip pressing plate is attached to the top face of the decoding chip, and the C-shaped exposed heat dissipation part is fixedly installed on the other side of the shell. According to the utility model, the structure design is compact and reasonable, heat generated by the decoding chip in the Bluetooth earphone can be conducted to the outside to be dissipated, the heat accumulation of the decoding chip can be prevented, the frequency can be prevented from being reduced, the service life of the decoding chip can be prolonged, and the heat dissipation performance is excellent.

Description

Technical Field

[0001] This utility model relates to the field of Bluetooth headset chip heat dissipation technology, specifically a heat dissipation component for a headset decoding chip. Background Technology

[0002] In the field of audio equipment, the headphone decoding chip, as a core component, directly determines the headphone's performance, sound reproduction accuracy, and music playback quality. As consumers increasingly demand high-quality audio experiences, high-performance decoding chips, with their superior audio resolution and signal processing precision, have become key to improving headphone sound quality. These chips can more accurately reproduce the details of audio signals, allowing users to enjoy richer and more realistic music effects. From delicate instrument timbres to clear vocal performance, everything depends on the excellent performance of the decoding chip.

[0003] However, in the Bluetooth headset market, product design is facing stringent space constraints. To meet users' demands for portability and comfort, Bluetooth headsets are constantly becoming smaller and lighter, resulting in extremely compact internal spaces. This design trend poses a significant challenge to the application of high-performance decoding chips. Although high-performance decoding chips possess powerful audio processing capabilities, they generate a large amount of heat during operation, especially under prolonged high-load conditions.

[0004] Due to the limited internal space of Bluetooth headsets, they cannot be equipped with large heat dissipation devices like traditional desktop devices, making it difficult for heat to dissipate effectively and causing it to easily accumulate around the chip. When the chip temperature continues to rise, to avoid damage from overheating, the chip will automatically trigger a frequency reduction mechanism, lowering its operating frequency. This not only significantly reduces the audio processing performance of the decoding chip, leading to degraded sound quality and audio stuttering, but also significantly shortens the chip's lifespan. More seriously, the sustained high-temperature environment may adversely affect other electronic components inside the Bluetooth headset, interfering with their normal operation and even causing short circuits and other malfunctions, affecting the overall stability and reliability of the headset.

[0005] Therefore, designing an efficient heat dissipation solution within the limited space of Bluetooth headsets and solving the heat dissipation problem of high-performance decoding chips has become a key technical challenge that urgently needs to be overcome to improve the sound quality and product performance of Bluetooth headsets. Utility Model Content

[0006] Technical problems to be solved

[0007] To address the shortcomings of existing technologies, this invention provides a heat dissipation component for an earphone decoding chip, thereby solving the problems mentioned in the background section, such as the limited space in Bluetooth earphones affecting the heat dissipation of the decoding chip.

[0008] (II) Technical Solution

[0009] To achieve the above-mentioned objectives, this utility model provides the following technical solution: a heat dissipation assembly for an earphone decoding chip, comprising a C-shaped exposed heat dissipation part, a decoding chip pressure plate, and two sets of U-shaped fixing clips. A horizontal decoding chip pressure plate is disposed inside the C-shaped exposed heat dissipation part, and U-shaped fixing clips are disposed at both ends of the C-shaped exposed heat dissipation part. The C-shaped exposed heat dissipation part, the decoding chip pressure plate, and the U-shaped fixing clips are integrally machined from metal. The C-shaped exposed heat dissipation part is fixedly installed on one side of the housing, and one side of the C-shaped exposed heat dissipation part is exposed to the air. A decoding chip is disposed below the decoding chip pressure plate, and the decoding chip pressure plate is attached to the top surface of the decoding chip. The gap between the decoding chip pressure plate and the decoding chip is filled with thermally conductive silicone grease.

[0010] Preferably, the outer shell includes a middle outer shell, an upper outer shell, and a lower outer shell. The middle outer shell is assembled from a C-shaped exposed heat dissipation part and a C-shaped mating plastic part. The upper outer shell is provided on one side of the middle outer shell and is plugged into the upper outer shell. The lower outer shell is provided on the side of the middle outer shell opposite to the upper outer shell. The lower outer shell is fixedly connected to the C-shaped mating plastic part by adhesive. An earpiece is provided on the lower outer shell.

[0011] Preferably, the C-shaped mating plastic part has a U-shaped groove corresponding to the U-shaped fixing head, the U-shaped groove is inserted and connected to the U-shaped fixing head, and the exposed C-shaped heat dissipation part is fixed to one side of the C-shaped mating plastic part by the U-shaped fixing head.

[0012] Preferably, the C-shaped plastic part is provided with a lower support rod and an upper support rod. The lower support rod is provided on the side of the C-shaped plastic part corresponding to the ear tip. The lower support rod is glued to the lower outer shell. The upper support rod is provided above the lower support rod. The lower support rod and the upper support rod form the first circuit board mounting port.

[0013] Preferably, a first circuit board is provided inside the middle outer shell corresponding to the first circuit board mounting port. The edge of the first circuit board abuts against the inner sidewall of the middle outer shell. One side of the first circuit board abuts against the lower support rod, and the other side of the first circuit board abuts against the upper support rod. A Bluetooth chip and a decoding chip are provided on the first circuit board, with the decoding chip placed below the decoding chip pressure plate and the Bluetooth chip placed on the side of the upper support rod opposite to the decoding chip.

[0014] Preferably, a second circuit board is provided above the upper support rod, and the second circuit board is fixedly installed inside the upper housing.

[0015] Preferably, a charging board and a battery pack are provided on the lower outer shell corresponding to the Bluetooth chip, and a speaker is provided on the side of the lower support rod away from the battery pack. Both the battery pack and the speaker are electrically connected to the first circuit board.

[0016] (III) Beneficial Effects

[0017] Compared with the prior art, the present invention provides a heat dissipation component for an earphone decoding chip, which has the following advantages:

[0018] 1. The headphone decoding chip heat dissipation component is equipped with a C-shaped exposed heat dissipation part, a decoding chip pressure plate and various structural components that work together with it. It can conduct the heat of the decoding chip inside the Bluetooth headphone to the outside for dissipation, which can prevent the decoding chip from accumulating heat and reducing the frequency, improve its service life, and has excellent heat dissipation performance.

[0019] 2. It is equipped with a C-shaped exposed heat dissipation part and a C-shaped matching plastic part, which are assembled by snap-fit ​​to form the middle shell of the earphone. The metal C-shaped exposed heat dissipation part can contact the outside to exchange heat, and can conduct internal heat to the air. It has strong heat dissipation capacity, can prevent heat accumulation at the decoding chip, which will affect its working performance, and can significantly improve the performance and service life of the decoding chip.

[0020] 3. It is equipped with a decoding chip pressure plate that can be attached to the top of the decoding chip to dissipate heat from the decoding chip, thereby improving the performance and lifespan of the decoding chip. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0022] Figure 2 This is a schematic diagram of the overall structure of the earphone of this utility model;

[0023] Figure 3 This is an exploded view of the headphone shell structure of this utility model;

[0024] Figure 4 This is a schematic diagram of the C-shaped exposed heat dissipation part and the C-shaped mating plastic part of this utility model;

[0025] Figure 5 This is a schematic diagram of the first circuit board and the upper and lower support rods of this utility model;

[0026] Figure 6 This is a schematic diagram of the second circuit board, upper support rod, and upper outer shell structure of this utility model.

[0027] In the diagram: 1. C-shaped exposed heat dissipation part; 2. Decoding chip pressure plate; 3. U-shaped fixing clip; 4. Outer shell; 5. Middle outer shell; 6. Upper outer shell; 7. Lower outer shell; 8. C-shaped mating plastic part; 9. U-shaped slot; 10. Lower support rod; 11. Upper support rod; 12. First circuit board mounting port; 13. First circuit board; 14. Bluetooth chip; 15. Decoding chip; 16. Second circuit board; 17. Charging board; 18. Battery pack; 19. Speaker. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] Please see Figure 1-6 This utility model provides a technical solution:

[0030] A heat dissipation assembly for an earphone decoding chip includes a C-shaped exposed heat dissipation part 1, a decoding chip pressure plate 2, and two sets of U-shaped fixing clips 3. The C-shaped exposed heat dissipation part 1 has a horizontal decoding chip pressure plate 2 inside, and U-shaped fixing clips 3 are provided at both ends of the C-shaped exposed heat dissipation part 1. The C-shaped exposed heat dissipation part 1, the decoding chip pressure plate 2, and the U-shaped fixing clips 3 are machined as a single piece of metal. The C-shaped exposed heat dissipation part 1 is fixedly installed on one side of the outer shell 4, and one side of the C-shaped exposed heat dissipation part 1 is exposed to the air. A decoding chip 15 is provided below the decoding chip pressure plate 2, and the decoding chip pressure plate 2 is attached to the top surface of the decoding chip 15. The gap between the decoding chip pressure plate 2 and the decoding chip 15 is filled with thermal grease.

[0031] Furthermore, the outer shell 4 includes a middle outer shell 5, an upper outer shell 6, and a lower outer shell 7. The middle outer shell 5 is assembled from a C-shaped exposed heat dissipation part 1 and a C-shaped mating plastic part 8. The upper outer shell 6 is provided on one side of the middle outer shell 5, and the middle outer shell 5 is plugged into the upper outer shell 6. The lower outer shell 7 is provided on the side of the middle outer shell 5 away from the upper outer shell 6. The lower outer shell 7 is fixedly connected to the C-shaped mating plastic part 8 by adhesive. An earpiece is provided on the lower outer shell 7.

[0032] Furthermore, the C-shaped mating plastic part 8 has a U-shaped slot 9 corresponding to the U-shaped fixing head 3. The U-shaped slot 9 is inserted and connected to the U-shaped fixing head 3. The exposed C-shaped heat dissipation part 1 is fixed to one side of the C-shaped mating plastic part 8 by the U-shaped fixing head 3. During the assembly of the headphones, the lower shell 7 and the C-shaped mating plastic part 8 are glued together and fixed, and the U-shaped fixing head 3 is connected and fixed to the U-shaped slot 9 by insertion. Finally, the upper shell 6 is inserted and fixed to the entire middle shell 5.

[0033] Furthermore, the C-shaped plastic part 8 is provided with a lower support rod 10 and an upper support rod 11. The lower support rod 10 is provided on one side of the C-shaped plastic part 8 corresponding to the ear head. The lower support rod 10 is glued to the lower outer shell 7. The upper support rod 11 is provided above the lower support rod 10. The lower support rod 10 and the upper support rod 11 form the first circuit board mounting port 12. The lower support rod 10 and the upper support rod 11 can hold the two sides of the opening of the C-shaped plastic part 8, preventing it from deforming in the direction of opening expansion, and improving the mechanical properties of the C-shaped plastic part 8. The U-shaped grooves 9 at both ends of the C-shaped plastic part 8 cover the outside of the U-shaped fixing head 3. If the C-shaped plastic part 8 deforms, the entire structure will fall apart.

[0034] Furthermore, a first circuit board 13 is disposed inside the middle outer casing 5 corresponding to the first circuit board mounting port 12. The edge of the first circuit board 13 abuts against the inner sidewall of the middle outer casing 5, one side of the first circuit board 13 abuts against the lower support rod 10, and the other side of the first circuit board 13 abuts against the upper support rod 11. A Bluetooth chip 14 and a decoding chip 15 are disposed on the first circuit board 13, with the decoding chip 15 positioned below the decoding chip pressure plate 2, and the Bluetooth chip 14 positioned on the side of the upper support rod 11 opposite to the decoding chip 15. The lower support rod 10 and the upper support rod 11 also limit and support the first circuit board 13, preventing it from moving up and down and ensuring that the decoding chip pressure plate 2 and the decoding chip 15 are tightly attached together. The C-shaped mating plastic part 8 must be made of plastic and cannot be made of metal, as metal will form a natural electromagnetic shield, affecting the signal transmission of the Bluetooth chip 14.

[0035] Furthermore, a second circuit board 16 is provided above the upper support rod 11, and the second circuit board 16 is fixedly installed inside the upper housing 6. Components such as headphone control components and microphones can be installed on the second circuit board 16. The upper support rod 11 supports the second circuit board 16, keeping the second circuit board 16 at a distance from the first circuit board 13 to prevent heat accumulation from affecting each other.

[0036] Furthermore, a charging plate 17 and a battery pack 18 are provided on the lower outer shell 7 corresponding to the Bluetooth chip 14. A speaker 19 is provided on the side of the lower support rod 10 opposite to the battery pack 18. Both the battery pack 18 and the speaker 19 are electrically connected to the first circuit board 13. A charging hole is provided at the bottom of the lower outer shell 7 corresponding to the charging plate 17. The charging pins can pass through the lower outer shell 7 to contact the charging plate 17 to charge the earphones. The speaker 19 is adjacent to the earphone in-ear head for easy sound conduction.

[0037] Structural Description:

[0038] C-shaped exposed heat dissipation part 1: The key heat dissipation structure of the headphone decoding chip heat dissipation component. It is made of metal, integrally processed, and one side is exposed to the air to conduct the heat generated by the decoding chip to the outside for dissipation.

[0039] Decoding chip pressure plate 2: It is attached to the top surface of the decoding chip, made of metal, and filled with thermal grease between it and the decoding chip. It is responsible for conducting the heat of the decoding chip to the C-shaped exposed heat dissipation part.

[0040] 3. The metal fixing clip is located at both ends of the exposed heat dissipation part of the C-shaped part. It is connected to the groove on the plastic part of the C-shaped part to fix the exposed heat dissipation part of the C-shaped part.

[0041] Shell 4: The overall external structure of the headphones, consisting of a middle shell, an upper shell, and a lower shell, providing protection and a mounting base for the internal components;

[0042] The middle outer shell 5 is composed of a C-shaped exposed heat dissipation part and a C-shaped mating plastic part. It is the supporting structure in the middle of the earphone and is used to install components such as the first circuit board.

[0043] Upper outer shell 6: Installed on one side of the middle outer shell, connected to the middle outer shell by plug-in connection, and the second circuit board is fixedly installed inside;

[0044] Lower housing 7: Installed on the side of the middle housing away from the upper housing, it is fixedly connected to the C-shaped plastic part by adhesive, and is equipped with an ear tip, as well as components such as a charging pad, battery pack and speaker;

[0045] C-shaped plastic part 8: It is spliced ​​with the C-shaped exposed heat dissipation part to form the middle shell, and has a U-shaped slot. The interior is equipped with a lower support rod and an upper support rod to provide installation space and structural support for the internal components.

[0046] U-shaped slot 9: It is formed on the C-shaped mating plastic part and is inserted and mated with the U-shaped fixing head to realize the fixed connection between the exposed heat dissipation part of the C-shape and the C-shaped mating plastic part;

[0047] Lower support rod 10: It is set inside the C-shaped plastic part on the side corresponding to the ear tip, and is glued to the lower shell. Together with the upper support rod, it forms the first circuit board mounting opening and plays a role in limiting and supporting the first circuit board.

[0048] Upper support rod 11: Located above the lower support rod, together with the lower support rod, it forms the first circuit board mounting port, supports the second circuit board, keeps the second circuit board away from the first circuit board, and prevents heat accumulation from affecting each other.

[0049] First circuit board mounting port 12: Composed of a lower support rod and an upper support rod, used to mount the first circuit board, providing mounting position and positioning for the circuit board;

[0050] First circuit board 13: Installed inside the middle shell at the mounting port corresponding to the first circuit board, with its edge abutting against the inner wall of the middle shell, and its two sides abutting against the lower support rod and the upper support rod respectively, and equipped with a Bluetooth chip and a decoding chip;

[0051] Bluetooth chip 14: Located on the first circuit board, on the side opposite to the decoding chip on the upper support lever, responsible for enabling the Bluetooth connection function of the headphones;

[0052] Decoding chip 15: Located on the first circuit board, below the decoding chip pressure plate, it is a core component that determines the headphone performance, timbre and music quality, and generates heat when working;

[0053] Second circuit board 16: Fixedly installed inside the upper housing, located above the upper support rod, on which components such as headphone control components and microphone can be installed;

[0054] Charging board 17: Located on the lower shell at the corresponding Bluetooth chip location, it is used to receive electrical energy transmitted by the charging contacts to charge the battery pack;

[0055] Battery pack 18: Located on the lower outer shell at the location corresponding to the Bluetooth chip, it is electrically connected to the first circuit board to provide power to the earphones;

[0056] Speaker 19: Located on the side of the lower support rod away from the battery pack, electrically connected to the first circuit board, close to the earphone inlet, used to convert electrical signals into sound signals to achieve sound output.

[0057] Working Principle: When the headphones are working, the decoding chip 15, as the core processing unit, generates a large amount of heat during the audio signal decoding process. At this time, the decoding chip pressure plate 2, which is tightly attached to the top surface of the decoding chip 15, plays a crucial role. The thermal grease filling the space between the decoding chip pressure plate 2 and the decoding chip 15 effectively fills the tiny gaps between them, greatly reducing thermal resistance and significantly enhancing heat conduction efficiency, allowing the heat generated by the decoding chip 15 to be quickly and efficiently transferred to the decoding chip pressure plate 2. Since the C-shaped exposed heat sink 1, the decoding chip pressure plate 2, and the U-shaped fixing clip 3 are all integrally machined from metal, the excellent thermal conductivity of metal provides a smooth channel for heat conduction. Heat is quickly conducted through the decoding chip pressure plate 2 to the C-shaped exposed heat sink 1. The unique C-shaped design of the C-shaped exposed heat sink 1 gives it a large heat dissipation surface area, and one side is exposed to the air, allowing it to fully utilize the principle of air convection to quickly dissipate heat into the external environment. This design effectively avoids heat buildup around the decoding chip 15, preventing the chip from throttling due to overheating and ensuring stable operation and high performance of the decoding chip 15. Regarding the outer shell structure, the middle shell 5 is composed of a C-shaped exposed heat dissipation section 1 and a C-shaped mating plastic part 8. The U-shaped slot 9 on the C-shaped mating plastic part 8 is inserted into and connected to the U-shaped fixing clips 3 at both ends of the C-shaped exposed heat dissipation section 1. This design not only achieves a stable connection between the two but also provides a reliable way to fix the heat dissipation components. The lower shell 7 is fixedly connected to the C-shaped mating plastic part 8 with adhesive, and the upper shell 6 is inserted into and connected to the middle shell 5, together forming a complete and compact earphone shell structure. While ensuring structural stability, the lower support rod 10 and upper support rod 11 located inside the C-shaped mating plastic part 8 serve multiple functions. On the one hand, these components hold the openings of the C-shaped plastic part 8 in place, preventing deformation in the direction of opening expansion. This effectively improves the mechanical properties of the C-shaped plastic part 8 and prevents the entire heat dissipation assembly from collapsing due to structural deformation. On the other hand, the lower support rod 10 and the upper support rod 11 limit and support the first circuit board 13, ensuring its stable installation. This, in turn, ensures that the decoding chip pressure plate 2 and the decoding chip 15 remain in close contact, maintaining good heat conduction. Simultaneously, the upper support rod 11 supports the second circuit board 16 mounted above it, maintaining a certain distance between the second circuit board 16 and the first circuit board 13. This effectively prevents the heat generated by the two circuit boards from affecting each other, further optimizing the heat dissipation environment. Furthermore, the charging plate 17, battery pack 18, and speaker 19 components on the lower housing 7, while fulfilling the functions of headphone charging, power supply, and sound output, also avoid interfering with the heat dissipation process of the decoding chip 15 through a reasonable layout design.The charging port design at the bottom of the lower shell 7 allows the charging pins to pass through the shell and contact the charging plate 17 for charging. The speaker 19 is positioned close to the earbud for easy sound conduction. All components inside the earphone perform their respective functions and work together to ensure the normal operation of the earphone and the stable performance of its various functions while achieving efficient heat dissipation.

[0058] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation component for an earphone decoding chip, characterized in that: It includes a C-shaped exposed heat dissipation part (1), a decoding chip pressure plate (2) and two sets of spiral-shaped fixing clips (3). The C-shaped exposed heat dissipation part (1) is equipped with a horizontal decoding chip pressure plate (2). The C-shaped exposed heat dissipation part (1) is equipped with spiral-shaped fixing clips (3) at both ends. The C-shaped exposed heat dissipation part (1), the decoding chip pressure plate (2) and the spiral-shaped fixing clips (3) are made of metal as a whole. The C-shaped exposed heat dissipation part (1) is fixedly installed on one side of the outer shell (4), and one side of the C-shaped exposed heat dissipation part (1) is exposed to the air. A decoding chip (15) is provided below the decoding chip pressure plate (2). The decoding chip pressure plate (2) is attached to the top surface of the decoding chip (15). The gap between the decoding chip pressure plate (2) and the decoding chip (15) is filled with thermal grease.

2. The heat dissipation assembly for an earphone decoding chip according to claim 1, characterized in that: The outer shell (4) includes a middle outer shell (5), an upper outer shell (6) and a lower outer shell (7). The middle outer shell (5) is assembled from a C-shaped exposed heat dissipation part (1) and a C-shaped mating plastic part (8). The upper outer shell (6) is provided on one side of the middle outer shell (5). The middle outer shell (5) and the upper outer shell (6) are connected by insertion. The lower outer shell (7) is provided on the side of the middle outer shell (5) away from the upper outer shell (6). The lower outer shell (7) is fixedly connected to the C-shaped mating plastic part (8) by adhesive. An ear tip is provided on the lower outer shell (7).

3. The heat dissipation assembly for an earphone decoding chip according to claim 2, characterized in that: The C-shaped mating plastic part (8) has a spiral groove (9) corresponding to the spiral fixing head (3). The spiral groove (9) is connected to the spiral fixing head (3). The C-shaped exposed heat dissipation part (1) is fixed to one side of the C-shaped mating plastic part (8) through the spiral fixing head (3).

4. The heat dissipation assembly for an earphone decoding chip according to claim 2, characterized in that: The C-shaped plastic part (8) is provided with a lower support rod (10) and an upper support rod (11). The lower support rod (10) is provided on the side of the C-shaped plastic part (8) corresponding to the ear tip. The lower support rod (10) is glued to the lower shell (7). The upper support rod (11) is provided above the lower support rod (10). The lower support rod (10) and the upper support rod (11) together form the first circuit board mounting port (12).

5. The heat dissipation assembly for an earphone decoding chip according to claim 4, characterized in that: The middle outer shell (5) is provided with a first circuit board (13) at the first circuit board mounting port (12). The edge of the first circuit board (13) abuts against the inner wall of the middle outer shell (5). One side of the first circuit board (13) abuts against the lower support rod (10), and the other side of the first circuit board (13) abuts against the upper support rod (11). The first circuit board (13) is provided with a Bluetooth chip (14) and a decoding chip (15). The decoding chip (15) is placed below the decoding chip pressure plate (2), and the Bluetooth chip (14) is placed on the other side of the upper support rod (11) away from the decoding chip (15).

6. The heat dissipation assembly for an earphone decoding chip according to claim 4, characterized in that: A second circuit board (16) is provided above the upper support rod (11), and the second circuit board (16) is fixedly installed inside the upper outer shell (6).

7. The heat dissipation assembly for an earphone decoding chip according to claim 5, characterized in that: The lower housing (7) is provided with a charging board (17) and a battery pack (18) corresponding to the Bluetooth chip (14). A speaker (19) is provided on the side of the lower support rod (10) away from the battery pack (18). The battery pack (18) and the speaker (19) are both electrically connected to the first circuit board (13).

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