Circuit board capable of being operated and processed on single side

Abstract

The utility model discloses a circuit board capable of being operated and processed on a single side, which relates to the technical field of circuit boards and comprises a substrate, a wiring hole is arranged on the inner wall of the substrate, a reducing groove is arranged on the inner wall of the substrate, a fracture is arranged on the inner wall of the substrate, a radiating groove is arranged on the inner wall of the substrate, and the radiating groove is arranged on the inner wall of the substrate. And a metal heat dissipation block is mounted on the inner wall of the heat dissipation groove. According to the utility model, through the arrangement of the reduced matching grooves, the heat dissipation grooves and the metal heat dissipation blocks, for some devices with strict weight requirements, such as aerospace, unmanned aerial vehicles and portable electronic devices, through reasonable drilling on the substrate, the weight of the substrate can be effectively reduced, and the weight of the whole device is further reduced; and the metal heat dissipation block penetrates through the interior of the substrate, so that heat dissipated by elements in the substrate during working can be effectively and quickly conducted out, and the heat dissipation effect of the substrate can be improved through the matched use of the reducing and matching groove, the heat dissipation groove and the metal heat dissipation block.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of circuit board, concretely is a kind of circuit board for single-sided operation processing. BACKGROUND

[0002] With the development of electronic equipment towards light weight, portability, multi-functional direction, the performance and processing convenience of circuit board are increasingly urgent, especially in some space and cost sensitive application scenarios, the advantage of single-sided operation processing circuit board is increasingly prominent, for example, in wearable device, circuit board not only thin, also need to have good electrical performance, and can be conveniently operated and processed on single side, to meet the requirements of equipment miniaturization and high integration, but the existing single-sided operation processing circuit board is poor in heat dissipation effect when using, the high temperature generated by internal components when working cannot be dissipated in time, which can easily cause damage to the components, and the substrate can be damaged during installation and use, and the voltage difference between different potential conductors in the substrate is large enough to break the air insulation medium between them, form a conductive channel, produce arc, and the high temperature generated by arc can make the metal circuit on the substrate rapidly heat up, cause the circuit to melt, deform, even burn out, and the connectivity of the circuit is damaged, affecting the normal operation of the equipment, to solve the above problems, therefore a kind of circuit board for single-sided operation processing is needed.

[0003] The existing single-sided operation processing circuit board has the problems of poor heat dissipation effect, unable to buffer and protect the substrate, and unable to reduce the influence of arc on the internal circuit of the substrate when operating, so there is an urgent need for a single-sided operation processing circuit board. UTILITY MODEL CONTENTS

[0004] Therefore, the utility model aims at providing a kind of circuit board for single-sided operation processing to solve the problems of poor heat dissipation effect, unable to buffer and protect the substrate and unable to reduce the influence of arc on the internal circuit of the substrate when using the existing single-sided operation processing circuit board.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a kind of circuit board for single-sided operation processing, including substrate, the inner wall of the substrate is provided with wiring hole, the inner wall of the substrate is provided with reduction slot, the inner wall of the substrate is provided with fracture, the inner wall of the substrate is provided with heat dissipation groove, the inner wall of the heat dissipation groove is installed with metal heat dissipation block, the inner wall of the substrate is provided with clamping groove, the inner wall of the clamping groove is installed with silica gel buffer gasket.

[0006] Preferably, the reduction slot is arranged in a rectangular array centered on the central axis of the substrate, and the inner wall diameter of the reduction slot is larger than the inner wall diameter of the wiring hole.

[0007] Preferably, the fracture is symmetrically arranged with the central axis of the substrate as the center, and the fracture penetrates the inside of the substrate.

[0008] Preferably, the heat dissipation grooves are equidistantly arranged with the central axis of the substrate as the center, and the metal heat dissipation blocks are closely attached to the heat dissipation grooves.

[0009] Preferably, the silica gel buffer gasket is connected with the clamping groove in a clamping manner, and the silica gel buffer gasket is elastically arranged.

[0010] Compared with the prior art, the utility model has the advantages that:

[0011] 1、The fracture is arranged, when the voltage difference between the conductors of different potentials on the substrate is large enough, the air insulation medium between them is broken down, an electric arc is formed, the high temperature generated by the electric arc makes the metal circuit on the substrate heat rapidly, causing the circuit to melt, deform, even burn out, the connectivity of the circuit is damaged, and the high temperature and strong electric field of the electric arc can make the insulating material of the substrate degrade, even be broken down, after the insulating layer is damaged, short circuit is easy to occur between adjacent circuits, causing more serious failure, when the electric arc is generated, the electric arc is divided into multiple small arc segments, the voltage of each small arc segment is reduced, the arc gap resistance is rapidly increased, and the medium strength is rapidly restored, so that the electric arc is more easily extinguished, and the negative influence of the electric arc on the internal circuit of the substrate is reduced.

[0012] 2、The reducing groove, the heat dissipation groove and the metal heat dissipation block are arranged, the reducing groove is arranged, for some equipment with strict requirements on weight, such as aerospace, unmanned aerial vehicle and portable electronic equipment, the weight of the substrate can be effectively reduced by reasonably drilling holes on the substrate, so that the weight of the whole equipment is reduced, and the performance and portability of the equipment are improved, the metal heat dissipation block penetrates the inside of the substrate, can effectively rapidly guide out the heat generated by the internal elements of the substrate during work, and the cooperation of the reducing groove, the heat dissipation groove and the metal heat dissipation block can improve the heat dissipation effect of the substrate.

[0013] 3、The clamping groove and the silica gel buffer gasket are arranged, the silica gel buffer gasket is clamped with the clamping groove, so that the substrate is protected during installation or use, damage of the internal elements of the substrate caused by the action force generated by vibration is avoided, the clamping mode of the silica gel buffer gasket is convenient to replace after abrasion, and the practicability is high. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a structural schematic view of the front appearance of the utility model;

[0015] Figure 2 It is a structural schematic view of the side appearance of the utility model;

[0016] Figure 3 This is a structural diagram showing the disassembled internal components of this utility model;

[0017] Figure 4 This is a structural schematic diagram showing the details of the silicone buffer pad of this utility model.

[0018] In the diagram: 1. Substrate; 2. Wiring hole; 3. Reduction groove; 4. Break; 5. Heat sink; 6. Metal heat sink; 7. Card slot; 8. Silicone buffer pad. Detailed Implementation

[0019] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0020] The embodiments of this utility model will be described below based on its overall structure.

[0021] Please see Figures 1-4 A circuit board for single-sided operation includes a substrate 1. The inner wall of the substrate 1 has wiring holes 2, a reduction groove 3, and a break 4. The reduction grooves 3 are arranged in a rectangular array centered on the central axis of the substrate 1, and the inner diameter of the reduction grooves 3 is larger than the inner diameter of the wiring holes 2. The break 4 is symmetrically arranged centered on the central axis of the substrate 1 and penetrates the interior of the substrate 1. Through the break 4, when the voltage difference between conductors at different potentials on the substrate 1 is sufficiently large, causing the insulating medium such as air to break down, a conductive channel is formed, generating an electric arc. The high temperature generated by the electric arc will cause the metal circuits on the substrate 1 to heat up rapidly, resulting in local melting, deformation, or even burnout of the circuits, which will disrupt the continuity of the circuit. Furthermore, the high temperature and strong electric field of the electric arc will degrade the performance of the insulating material of the substrate 1, or even cause it to break down. After the insulation layer is damaged, short circuits are likely to occur between adjacent circuits, leading to more serious faults. However, the setting of the break 4 divides the electric arc into multiple small arc segments when it is generated. This reduces the voltage of each small arc segment, rapidly increases the arc gap resistance, and accelerates the recovery of dielectric strength, making it easier to extinguish the arc and reducing the negative impact of the electric arc on the internal circuits of the substrate 1.

[0022] Please see Figures 1-4A circuit board for single-sided operation is disclosed. The inner wall of the substrate 1 is provided with heat dissipation grooves 5, and metal heat sinks 6 are installed on the inner wall of the heat dissipation grooves 5. The heat dissipation grooves 5 are evenly distributed around the central axis of the substrate 1, and the metal heat sinks 6 are tightly fitted to the heat dissipation grooves 5. Through the setting of the reduction grooves 3, heat dissipation grooves 5 and metal heat sinks 6, the setting of the reduction grooves 3 can effectively reduce the weight of the substrate 1 for some devices with strict weight requirements, such as aerospace, drones, and portable electronic devices, by drilling holes in the substrate 1, thereby reducing the weight of the entire device and improving the performance and portability of the device. The metal heat sinks 6 penetrate through the interior of the substrate 1 and can effectively and quickly conduct the heat dissipated by the internal components of the substrate 1 during operation. The combined use of the reduction grooves 3, heat dissipation grooves 5 and metal heat sinks 6 can improve the heat dissipation effect of the substrate 1.

[0023] Please see Figures 1-4 A circuit board for single-sided operation is provided. The inner wall of the substrate 1 is provided with a slot 7. A silicone buffer pad 8 is installed on the inner wall of the slot 7. The silicone buffer pad 8 is engaged with the slot 7 and is elastically designed. The slot 7 and the silicone buffer pad 8 are engaged to protect the substrate 1 during installation or use, preventing damage to the internal components of the substrate 1 caused by vibration. At the same time, the engaging method of the silicone buffer pad 8 makes it easy to replace after wear, which is highly practical.

[0024] Working Principle: In use, the device is first moved to the desired position. Then, when an electric arc is generated inside the substrate 1, the arc is divided into multiple small arc segments by the break point 4. This reduces the voltage of each small arc segment, rapidly increases the arc gap resistance, and accelerates the recovery of dielectric strength, making it easier to extinguish the arc and reducing the negative impact of the arc on the internal circuitry of the substrate 1. For devices with strict weight requirements, such as aerospace, drones, and portable electronic devices, proper drilling on the substrate 1 can effectively reduce its weight, thereby reducing the overall weight of the device and improving its performance and portability. The heat sink 6 penetrates the interior of the substrate 1, effectively and quickly dissipating the heat generated by the internal components of the substrate 1 during operation. The combined use of the heat sink 3, heat dissipation groove 5, and metal heat sink 6 improves the heat dissipation effect of the substrate 1. Finally, the silicone buffer pad 8 is snapped into the slot 7 to provide buffer protection for the substrate 1 during installation or use, preventing damage to the internal components caused by vibration. At the same time, the snapping method of the silicone buffer pad 8 facilitates replacement after wear, making it highly practical. This completes the use of the device. The contents not described in detail in this specification are prior art known to those skilled in the art.

[0025] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A circuit board for single-sided operation, comprising a substrate (1), characterized in that: The inner wall of the substrate (1) is provided with wiring holes (2), the inner wall of the substrate (1) is provided with a reduction groove (3), the inner wall of the substrate (1) is provided with a break (4), the inner wall of the substrate (1) is provided with a heat dissipation groove (5), a metal heat dissipation block (6) is installed on the inner wall of the heat dissipation groove (5), the inner wall of the substrate (1) is provided with a card slot (7), and a silicone buffer pad (8) is installed on the inner wall of the card slot (7).

2. The circuit board for single-sided operation according to claim 1, characterized in that: The reduction grooves (3) are arranged in a rectangular array with the central axis of the substrate (1) as the center, and the inner wall diameter of the reduction grooves (3) is larger than the inner wall diameter of the wiring hole (2).

3. The circuit board for single-sided operation according to claim 1, characterized in that: The fracture (4) is symmetrically arranged with the central axis of the substrate (1) as the center, and the fracture (4) penetrates the interior of the substrate (1).

4. A circuit board for single-sided operation processing according to claim 1, characterized in that: The heat dissipation grooves (5) are arranged at equal intervals with the central axis of the substrate (1) as the center, and the metal heat dissipation blocks (6) are closely attached to the heat dissipation grooves (5).

5. A circuit board for single-sided operation processing according to claim 1, characterized in that: The silicone buffer pad (8) is engaged with the slot (7), and the silicone buffer pad (8) is elastically set.

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