Needle stone grinding wheel for machining outer diameter of silicon carbide wafer

Abstract

The utility model discloses a needle stone grinding wheel for processing the outer diameter of a silicon carbide wafer, which mainly comprises a transmission shaft, a main shaft, a fixing clamp, a grinding disc and the like, the fixing clamp stably clamps the grinding disc through an upper clamp and a lower clamp to ensure the stability of the grinding disc during processing, and the main shaft is fixed through a mounting seat and a mounting base. The stability is guaranteed through pin connection, meanwhile, precise positioning is achieved between the mounting base and the fixing clamps through limiting structures, the number of grinding discs in the multiple fixing clamps is sequentially increased, different machining requirements can be met, the upper clamp and the lower clamp are tightly connected through bolts, inserting cylinders and the like, the grinding discs are connected in a nested mode through embedding grooves and nesting pieces, and the machining efficiency is improved. In addition, the grinding disc is provided with an inner arc groove and a chip removal hole, chip removal is facilitated, the needle stone grinding wheel is reasonable in structural design, the precision, stability and chip removal performance of silicon carbide wafer outer diameter machining can be effectively improved, and the needle stone grinding wheel has good application prospects.

Description

Technical Field

[0001] This utility model belongs to the technical field of needle-stone grinding wheels, specifically relating to a needle-stone grinding wheel for machining the outer diameter of silicon carbide wafers. Background Technology

[0002] Grinding wheels for machining the outer diameter of silicon carbide wafers are key tools used for precision grinding in semiconductor manufacturing. Their design must meet the requirements of high hardness, high brittleness, and high precision machining of silicon carbide materials.

[0003] However, during the grinding process of existing silicon carbide wafers, the versatility and applicability of grinding wheels are poor due to the different grinding precision. Different precision grinding wheels need to be replaced depending on the situation, which cannot meet the diverse processing needs. Utility Model Content

[0004] The purpose of this invention is to provide a needle-shaped grinding wheel for machining the outer diameter of silicon carbide wafers, in order to solve the problem mentioned in the background art that the existing grinding wheels for silicon carbide wafers have poor versatility and applicability due to different grinding precisions, requiring the replacement of grinding wheels with different precisions as needed, thus failing to meet diverse processing requirements.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a needle-shaped grinding wheel for machining the outer diameter of silicon carbide wafers, comprising a drive shaft;

[0006] A main shaft is provided at the top of the drive shaft, a fixing clamp is provided inside the main shaft, and a grinding disc is provided inside the fixing clamp.

[0007] An upper clamp is provided at the top of the fixing fixture, and a lower clamp is provided at the bottom of the upper clamp. The grinding disc is clamped and fixed by the upper clamp and the lower clamp.

[0008] Preferably, a mounting base is provided above the spindle, and a mounting base is provided at the bottom of the spindle. The mounting base and the spindle are fixed by pins.

[0009] Preferably, the mounting base has a ring array of limit rods inside, and the fixing clamp has a ring array of limit holes inside, with the limit holes corresponding to the limit rods.

[0010] Preferably, a bolt fixing hole is provided inside the fixing clamp, and a fixing bolt is provided inside the bolt fixing hole. The upper clamp and the lower clamp are fixedly connected by the fixing bolt.

[0011] Preferably, the fixed clamp array is provided with four clamps, and the mesh number of the abrasive discs inside the fixed clamps increases sequentially.

[0012] Preferably, the upper and lower clamps are provided with grooves at the outer gripping positions, and the upper and lower sides of the grinding disc are respectively provided with nesting parts, and the grinding disc and the fixing clamp are connected by nesting parts and grooves.

[0013] Preferably, a buffer pad is provided at the inner side of the groove and the nesting part, an inner arc groove is provided at the top of the grinding disc, and chip removal holes are arranged in a ring array inside the grinding disc.

[0014] Preferably, a connector is provided at the middle position inside the upper clamp, and the upper clamp and the lower clamp are connected by the connector.

[0015] Compared with the prior art, this utility model provides a needle-stone grinding wheel for machining the outer diameter of silicon carbide wafers, which has the following beneficial effects:

[0016] 1. The design incorporates a mounting base, mounting seat, pin fixing, limit rods, limiters, bolt fixing holes, and fixing bolts. The mounting base is positioned above the spindle and secured with pins. This structure provides stable support for the spindle, ensuring its stability during operation. This prevents spindle wobbling from affecting machining accuracy during high-speed grinding wheel rotation. The limit rods arranged in a ring inside the mounting base correspond to the limit holes arranged in a ring inside the fixture. When installing the fixture, the limit rods are inserted into the limit holes, precisely determining the position of the fixture and ensuring high consistency and accuracy in the installation position of each fixture. This design improves the stability and repeatability of the processing. The fixed fixture has internal bolt holes, and the upper and lower fixtures are fixedly connected through these holes. This connection method ensures a more secure grip on the grinding disc, preventing it from loosening due to external impacts during processing and ensuring smooth operation. The fixed fixture array has four fixtures, with the grit size of the grinding discs increasing sequentially within each fixture. This design allows the grinding wheel to easily select the appropriate grit size for processing different stages and precision requirements of the silicon carbide wafer, improving the versatility and applicability of the grinding wheel and meeting diverse processing needs.

[0017] 2. Through the design of grooves, nesting parts, buffer pads, inner arc grooves, and chip removal holes, the grooves at the outer gripper positions of the upper and lower clamps are nested with the nesting parts on the upper and lower sides of the grinding disc. This structure can accurately position the grinding disc, making it more stable in the fixed fixture. When the grinding wheel rotates at high speed for processing, it ensures that the grinding disc will not shift or shake, thus guaranteeing processing accuracy. The buffer pads set at the inner positions of the grooves and nesting parts can effectively buffer the impact force generated by the contact between the grinding wheel and the workpiece during processing, reducing damage to the grinding disc and extending its service life. At the same time, it can also reduce the risk of the grinding disc breaking or being damaged due to excessive impact force, improving the safety of the entire processing process. The inner arc groove set at the top of the grinding disc and the chip removal holes set in the internal annular array can significantly improve the chip removal capacity and ensure processing efficiency. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of this utility model.

[0019] Figure 2 This is a schematic diagram of the fixing fixture in this utility model.

[0020] Figure 3 This is a structural schematic diagram of the cross-section of the fixing fixture in this utility model.

[0021] Figure 4 This is a schematic diagram of the structure of the grinding disc in this utility model.

[0022] In the diagram: 1. Drive shaft; 2. Mounting base; 3. Grinding disc; 4. Fixing clamp; 5. Mounting base; 6. Pin; 7. Main shaft; 8. Fixing bolt; 9. Upper clamp; 10. Lower clamp; 11. Bolt fixing hole; 12. Chip removal hole; 13. Inner arc groove; 14. Insert sleeve; 15. Embedded groove; 16. Nested part; 17. Limiting rod; 18. Limiting hole; 19. Buffer pad. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] This utility model provides, for example Figure 1-4 The awl-shaped grinding wheel shown is used for machining the outer diameter of silicon carbide wafers and includes a drive shaft 1;

[0025] A main shaft 7 is provided at the top of the drive shaft 1, a fixing clamp 4 is provided inside the main shaft 7, and a grinding disc 3 is provided inside the fixing clamp 4.

[0026] An upper clamp 9 is provided at the top of the fixing clamp 4, and a lower clamp 10 is provided at the bottom of the upper clamp 9. The grinding disc 3 is clamped and fixed by the upper clamp 9 and the lower clamp 10.

[0027] A mounting base 2 is provided above the spindle 7, and a mounting base 5 is provided at the bottom of the spindle 7. The mounting base 5 and the spindle 7 are fixed by pins 6.

[0028] Limiting rods 17 are arranged in a ring array inside the mounting base 2, and limiting holes 18 are arranged in a ring array inside the fixing clamp 4. The limiting holes 18 correspond to the limiting rods 17.

[0029] The fixing clamp 4 has a bolt fixing hole 11 inside, and a fixing bolt 8 is provided inside the bolt fixing hole 11. The upper clamp 9 and the lower clamp 10 are fixedly connected by the fixing bolt 8.

[0030] There are four fixed clamps 4 arrays, and the mesh size of the grinding discs 3 inside the fixed clamps 4 increases sequentially.

[0031] The upper clamp 9 and the lower clamp 10 are provided with grooves 15 at the outer gripping positions. The upper and lower sides of the grinding disc 3 are respectively provided with nesting parts 16. The grinding disc 3 and the fixing clamp 4 are connected by nesting parts 16 and grooves 15.

[0032] A buffer pad 19 is provided on the inner side of the groove 15 and the nesting part 16, an inner arc groove 13 is provided on the top of the grinding disc 3, and chip removal holes 12 are provided in the annular array inside the grinding disc 3.

[0033] An insertion tube 14 is provided in the middle of the upper clamp 9, and the upper clamp 9 and the lower clamp 10 are connected by insertion tube 14.

[0034] In this embodiment, the specific implementation steps of a needle-shaped grinding wheel for machining the outer diameter of silicon carbide wafers are as follows: The spindle 7 is placed on the mounting base 5 and fixed with pins 6 to ensure a stable connection between the spindle 7 and the mounting base 5. The mounting base 5 provides stable support for the spindle 7. The fixing clamp 4 is installed inside the spindle 7. Since the mounting base 2 has a ring array of limiting rods 17 and the fixing clamp 4 has a ring array of limiting holes 18, with the limiting holes 18 corresponding to the limiting rods 17, during installation, the limiting holes 18 of the fixing clamp 4 are aligned with the limiting rods 17. This ensures that the fixing clamp 4 is accurately installed at the predetermined position on the spindle 7, achieving precise positioning. The grinding disc 3 is placed between the upper clamp 9 and the lower clamp 10. Since the upper clamp 9 and the lower clamp 10 have grooves 15 at the outer gripping positions, the upper and lower sides of the grinding disc 3 are... The equipment is equipped with a nesting part 16. The nesting part 16 of the grinding disc 3 is nested into the groove 15 of the upper and lower clamps to initially fix the grinding disc 3. Fixing bolts 8 are installed in the bolt fixing holes 11 inside the fixing clamp 4. The upper clamp 9 and the lower clamp 10 are fixedly connected by the fixing bolts 8 to further fix the grinding disc 3 firmly. At the same time, there are four fixed clamps 4 in an array, and the mesh number of the grinding disc 3 inside each fixed clamp 4 increases sequentially. The appropriate combination of grinding discs can be selected for installation according to the processing requirements. A plug-in tube 14 is set in the middle position inside the upper clamp 9. The lower clamp 10 is plugged into the upper clamp 9 through the plug-in tube 14 to ensure that the upper and lower clamps are tightly connected and firmly clamp the grinding disc 3. After processing, the equipment is turned off and the grinding wheel stops rotating. The wear of the grinding disc 3 is checked. If the grinding disc 3 is severely worn, it needs to be replaced.

[0035] like Figure 1-3 As shown, a mounting base 2 is provided above the spindle 7, and a mounting base 5 is provided at the bottom of the spindle 7. The mounting base 5 and the spindle 7 are fixed by pins 6. Limiting rods 17 are arranged in a ring array inside the mounting base 2. Limiting holes 18 are arranged in a ring array inside the fixing fixture 4. The limiting holes 18 correspond to the limiting rods 17. Bolt fixing holes 11 are provided inside the fixing fixture 4. Fixing bolts 8 are provided inside the bolt fixing holes 11. The upper fixture 9 and the lower fixture 10 are fixedly connected by fixing bolts 8. There are four fixing fixtures arranged in an array. The mesh size of the grinding discs 3 inside the fixing fixtures 4 increases sequentially.

[0036] Preferably, a mounting base 2 is provided above the spindle 7, and a mounting base 5 is provided at the bottom, both fixed by pins 6. This structure provides stable support for the spindle 7, ensuring its stability during operation. This, in turn, ensures that the grinding wheel will not be affected by spindle wobbling during high-speed rotation, thus maintaining machining accuracy. The limiting rods 17 arranged in a ring array inside the mounting base 2 correspond to the limiting holes 18 arranged in a ring array inside the fixing fixture 4. When installing the fixing fixture 4, the limiting rods 17 are inserted into the limiting holes 18, precisely determining the position of the fixing fixture 4. This ensures a high degree of consistency and accuracy in the installation position of each fixing fixture 4, improving machining stability and repeatability. The fixed fixture 4 has bolt fixing holes 11 inside. The upper fixture 9 and the lower fixture 10 are fixedly connected in the bolt fixing holes 11 by fixing bolts 8. This connection method makes the upper and lower fixtures hold the grinding disc 3 more firmly, ensuring that the grinding disc 3 will not loosen due to external impact during the processing, and ensuring the smooth progress of the processing. The fixed fixture 4 array has four fixtures, and the grit number of the grinding disc 3 inside each fixed fixture 4 increases sequentially. This design allows the grinding wheel to easily select the appropriate grit number of the grinding disc 3 for processing according to different processing stages and precision requirements of silicon carbide wafers, improving the versatility and applicability of the grinding wheel and meeting diverse processing needs.

[0037] like Figure 1 and Figure 4 As shown, grooves 15 are provided at the outer gripping positions of the upper clamp 9 and the lower clamp 10. Nesting parts 16 are provided on the upper and lower sides of the grinding disc 3 respectively. The grinding disc 3 and the fixing clamp 4 are nested and connected by the nesting parts 16 and the grooves 15. Buffer pads 19 are provided at the inner positions of the grooves 15 and the nesting parts 16. An inner arc groove 13 is provided at the top position of the grinding disc 3. Chip removal holes 12 are arranged in a ring array inside the grinding disc 3.

[0038] Preferably, the grooves 15 at the outer gripper positions of the upper clamp 9 and the lower clamp 10 are nested and connected to the nesting parts 16 on the upper and lower sides of the grinding disc 3. This structure can accurately position the grinding disc 3, making the grinding disc 3 more securely installed in the fixed clamp 4. When the grinding wheel rotates at high speed for processing, it ensures that the grinding disc 3 will not shift or shake, thereby ensuring processing accuracy. The buffer pads 19 provided at the inner positions of the grooves 15 and the nesting parts 16 can effectively buffer the impact force generated by the contact between the grinding wheel and the workpiece during processing, reduce damage to the grinding disc 3, extend the service life of the grinding disc 3, and at the same time, reduce the risk of the grinding disc 3 breaking or being damaged due to excessive impact force, thus improving the safety of the entire processing process. The inner arc groove 13 provided at the top position of the grinding disc 3 and the chip removal holes 12 arranged in an internal annular array can significantly improve the chip removal capacity and ensure processing efficiency.

[0039] like Figure 1-4As shown, a connector 14 is provided in the middle of the upper clamp 9, and the upper clamp 9 and the lower clamp 10 are connected by the connector 14.

[0040] Optionally, the plug-in sleeve 14 simplifies the connection between the upper clamp 9 and the lower clamp 10, greatly improving the assembly efficiency of the clamps, shortening the installation and debugging time of the equipment, and improving the overall work efficiency. The plug-in sleeve 14 can provide precise positioning for the upper clamp 9 and the lower clamp 10, ensuring that the two maintain an accurate relative position after connection. This precise positioning can ensure the clamping position accuracy of the fixed clamp 4 on the grinding disc 3. This stable connection structure can effectively resist external forces, prevent relative displacement or loosening between the upper and lower clamps, ensure the stability of the entire fixed clamp 4 structure, and improve the reliability of the processing.

[0041] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A needle-shaped grinding wheel for machining the outer diameter of silicon carbide wafers, comprising a drive shaft (1); A main shaft (7) is provided at the top of the drive shaft (1), a fixing clamp (4) is provided inside the main shaft (7), and a grinding disc (3) is provided inside the fixing clamp (4). Its features are: The fixing clamp (4) is provided with an upper clamp (9) at the top position and a lower clamp (10) at the bottom position of the upper clamp (9). The grinding disc (3) is clamped and fixed by the upper clamp (9) and the lower clamp (10).

2. The awl-shaped grinding wheel for machining the outer diameter of silicon carbide wafers according to claim 1, characterized in that: A mounting base (2) is provided above the spindle (7), and a mounting base (5) is provided at the bottom of the spindle (7). The mounting base (5) and the spindle (7) are fixed by pins (6).

3. The awl-shaped grinding wheel for machining the outer diameter of silicon carbide wafers according to claim 2, characterized in that: The mounting base (2) has a ring array of limit rods (17) inside, and the fixing clamp (4) has a ring array of limit holes (18) inside, with the limit holes (18) corresponding to the limit rods (17).

4. The awl-shaped grinding wheel for machining the outer diameter of silicon carbide wafers according to claim 3, characterized in that: The fixing clamp (4) has a bolt fixing hole (11) inside, and a fixing bolt (8) is provided inside the bolt fixing hole (11). The upper clamp (9) and the lower clamp (10) are fixedly connected by the fixing bolt (8).

5. The awl-shaped grinding wheel for machining the outer diameter of silicon carbide wafers according to claim 4, characterized in that: The fixed clamp (4) array is provided with four, and the mesh number of the abrasive disc (3) inside the fixed clamp (4) increases sequentially.

6. The awl-shaped grinding wheel for machining the outer diameter of silicon carbide wafers according to claim 1, characterized in that: The upper clamp (9) and lower clamp (10) are provided with grooves (15) at the gripping positions on the outside. The upper and lower sides of the grinding disc (3) are respectively provided with nesting parts (16). The grinding disc (3) and the fixing clamp (4) are nested and connected by the nesting parts (16) and the grooves (15).

7. The awl-shaped grinding wheel for machining the outer diameter of silicon carbide wafers according to claim 6, characterized in that: A buffer pad (19) is provided on the inner side of the groove (15) and the nesting part (16), an inner arc groove (13) is provided on the top of the grinding disc (3), and chip removal holes (12) are arranged in a ring array inside the grinding disc (3).

8. The awl-shaped grinding wheel for machining the outer diameter of silicon carbide wafers according to claim 1, characterized in that: A plug-in tube (14) is provided at the middle position inside the upper clamp (9), and the upper clamp (9) and the lower clamp (10) are connected by plugging in the plug-in tube (14).

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