Bubble suppression device for film pasting of semiconductor lead frame

Abstract

The utility model relates to the technical field of wire frame rear film pasting process equipment, in particular to a semiconductor lead frame film pasting bubble suppression device, which comprises a film pasting platform, a negative pressure generation device and an air path module, and is characterized in that the film pasting platform at least comprises a fixed base; a raw material film head adsorption cavity, a positioning film paper adsorption cavity and a to-be-pasted film head suction hole air cavity which are mutually isolated are sequentially formed in the lower surface of the fixed base from left to right, a plurality of raw material film head fixing suction holes, a plurality of film paper adsorption holes and a plurality of to-be-pasted film head fixing suction holes are formed in the upper surface of the fixed base from left to right, and the raw material film head fixing suction holes communicate with the raw material film head adsorption cavity. The film paper adsorption hole is communicated with the positioning film paper adsorption cavity, and the to-be-pasted film head fixing suction hole is communicated with the to-be-pasted film head suction hole air cavity; the film paper is basically in a flat state when being pasted, and a good film pasting effect can be achieved by matching the film paper with the lead frame which is relatively parallel to the film paper, so that the integral reject ratio is greatly reduced, the probability of generating bubbles is reduced, and the sizes of the generated bubbles are reduced.

Description

Technical Field

[0001] This utility model relates to the technical field of lead frame post-film bonding process equipment, specifically to a device for suppressing bubbles in semiconductor lead frame film bonding. Background Technology

[0002] In the post-coating process of leadframes, since the frame to be coated has already undergone chip mounting and wire bonding in previous processes, the area of ​​the frame that has completed the above processes cannot be rolled during coating. Coating can only be performed on the edges of the frame, otherwise it will damage the chip and the leads. The resulting problem is that air bubbles may be generated in the chip area in the middle. The appearance of air bubbles may bring uncertainties to the subsequent injection molding and packaging process. Therefore, suppressing the generation of air bubbles during the coating process is a critical step in the post-coating process of leadframes.

[0003] Please refer to the structure of the high-temperature film paper. Figure 7 During the bottom film recycling process, the high-temperature film paper is fixed on a film-applying platform with perforations on its surface. A negative pressure is generated within these perforations, causing the film paper to be adsorbed by the suction force generated on the platform, overcoming the adhesion between the bottom film and the adhesive layer, thus peeling the bottom film off the adhesive layer. In this process, it is crucial to ensure that the suction force is greater than the adhesive force to achieve successful removal of the bottom film; otherwise, the required film layer will also be lifted, resulting in poor adsorption. The film-applying platform typically uses several suction holes, which evenly distribute the adsorption value generated by the negative pressure. Therefore, a vacuum generator with a high negative pressure requirement is needed to produce the negative pressure. However, if… Figure 8 As shown, an increase in adsorption value will, in turn, lead to greater deformation of the membrane paper at the adsorption pores. During the application of the membrane, the membrane paper is applied in a state of being adsorbed and fixed. Therefore, if the adsorption force is too large, air bubbles will inevitably be generated during the application of the membrane paper. Consequently, how to reduce the probability of air bubble generation and the size of air bubbles in the membrane application process after the lead frame has become an urgent problem to be solved. Utility Model Content

[0004] I. Technical problems to be solved

[0005] The purpose of this invention is to provide a semiconductor lead frame film bubble suppression device, which can significantly reduce the probability of bubble formation and the size of the generated bubbles.

[0006] II. Technical Solution

[0007] This utility model is achieved through the following technical solution:

[0008] This utility model proposes a device for suppressing bubbles in semiconductor lead frame film bonding, including a film bonding platform, a negative pressure generating device and an air circuit module, wherein the film bonding platform includes at least a fixed base;

[0009] The lower surface of the fixed base has, from left to right, a raw material membrane head adsorption chamber, a positioning membrane paper adsorption chamber, and a suction hole air chamber for the membrane head to be applied, which are isolated from each other. The upper surface of the fixed base has, from left to right, a plurality of raw material membrane head fixing suction holes, membrane paper adsorption holes, and membrane head fixing suction holes for the membrane head to be applied. The raw material membrane head fixing suction holes are connected to the raw material membrane head adsorption chamber, the membrane paper adsorption holes are connected to the positioning membrane paper adsorption chamber, and the membrane head fixing suction holes are connected to the suction hole air chamber for the membrane head to be applied.

[0010] The negative pressure generating device includes at least a vacuum generator with multiple independent vacuum modules. The gas path module includes at least a raw material membrane head adsorption gas pipe connecting the vacuum generator to the raw material membrane head adsorption chamber, a membrane paper positioning adsorption gas pipe connecting the vacuum generator to the positioning membrane paper adsorption chamber, and a membrane head adsorption gas pipe connecting the vacuum generator to the suction hole gas chamber of the membrane head to be applied. The raw material membrane head adsorption gas pipe, the membrane paper positioning adsorption gas pipe, and the membrane head adsorption gas pipe to be applied are connected to three independently on / off vacuum modules of the vacuum generator.

[0011] Furthermore, the raw material film head fixing suction holes, film paper adsorption holes, and film head fixing suction holes are all arranged in an array, and the hole spacing of the raw material film head fixing suction holes and the film head fixing suction holes is smaller than the hole spacing of the film paper adsorption holes.

[0012] Furthermore, the aperture of the suction hole for fixing the raw material film head is not larger than the suction hole for adsorbing the film paper, while the aperture of the suction hole for fixing the film head to be applied is larger than the suction hole for adsorbing the film paper.

[0013] Furthermore, the gas path module also includes an electronic vacuum proportional valve connected to the pipeline of the membrane paper positioning adsorption gas tube, and the film application platform also includes a corner plate, with the electronic vacuum proportional valve fixed on the corner plate.

[0014] Furthermore, the gas path module includes three pressure relief components that are independently connected to the raw material membrane head adsorption gas pipe, the membrane paper positioning adsorption gas pipe, and the membrane head adsorption gas pipe to be applied. The pressure relief components include a shut-off valve, a three-way air connector connecting the shut-off valve and the pipeline, and a pressure relief filter connected to the outlet end of the shut-off valve.

[0015] Furthermore, the film application platform also includes a base plate for supporting the fixed base, and the base plate has an air channel that connects the raw material film head adsorption cavity, the positioning film paper adsorption cavity, and the air cavity of the film head to be applied with the air path module in a mutually isolated manner.

[0016] Furthermore, a film paper cutting clearance groove is provided between the raw material film head fixing suction hole and the film paper adsorption hole on the surface of the fixed base.

[0017] Furthermore, the negative pressure generating module also includes a pressure regulating valve, a main air inlet pipe connecting the pressure regulating valve to the inlet end of the vacuum generator, an air source interface located at the inlet end of the pressure regulating valve, an air inlet filter connected to the pressure regulating valve, and a pressure display gauge.

[0018] III. Beneficial Effects

[0019] Compared with the prior art, this utility model has the following advantages:

[0020] 1. This utility model improves the stability of removing the bottom film by setting up a raw material film head adsorption chamber, a positioning film paper adsorption chamber, and a suction hole air chamber for the film to be applied, and by configuring an independent vacuum generator vacuum module to provide a stable negative pressure for film removal.

[0021] 2. When the film paper is applied, it is basically in a flat state. With the lead frame that is relatively parallel to it, a good film application effect can be achieved, which greatly reduces the overall defect rate, reduces the probability of bubble formation, and reduces the size of the bubbles. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0023] Figure 2 This is a top-view three-dimensional structural diagram of the fixed base;

[0024] Figure 3 This is a bottom-view three-dimensional structural diagram of the fixed base;

[0025] Figure 4 yes Figure 1 The front view;

[0026] Figure 5 This is a schematic diagram of the connection structure of the air circuit module and the negative pressure generating device;

[0027] Figure 6 yes Figure 5 The front view;

[0028] Figure 7 This is a schematic diagram of the structure of high-temperature film paper;

[0029] Figure 8 This is a schematic diagram showing the deformation of the high-temperature film paper when it is adsorbed on the film application platform;

[0030] 1. High-temperature film paper; 2. Film application platform; 201. Angle plate; 202. Fixing base; 20201. Film paper adsorption hole; 20202. Film paper cutting clearance groove; 20203. Raw material film head fixing suction hole; 20204. Positioning film adsorption cavity; 20205. Raw material film head adsorption cavity; 20206. Film head to be applied fixing suction hole; 20207. Film head to be applied suction hole air cavity; 203. Substrate; 204. Air path module; 20401. Raw material film head adsorption... 1. Air tube; 20402. Membrane paper positioning and adsorption air tube; 20403. Membrane head adsorption air tube; 20404. Electronic vacuum proportional valve; 20405. Three-way air connector; 20406. Cut-off valve; 20407. Pressure relief filter; 3. Bottom membrane recovery device; 4. Negative pressure generating module; 401. Air pressure regulating valve; 402. Pressure display gauge; 403. Air inlet filter; 404. Air source interface; 405. Main air inlet pipe; 406. Vacuum generator. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0032] Please refer to the semiconductor lead frame film bubble suppression device. Figure 1-6 Includes film application platform 2, negative pressure generating device and air circuit module 204;

[0033] The film application platform 2 includes at least a fixed base 202, which is used to adsorb and fix the high-temperature film paper 1. The lower surface of the fixed base 202 is provided with mutually isolated raw material film head adsorption chamber 20205, positioning film paper adsorption chamber 20204 and film head suction hole air chamber 20207 from left to right. The upper surface of the fixed base 202 is provided with a plurality of raw material film head fixing suction holes 20203, film paper adsorption holes 20201 and film head fixing suction holes 20206 from left to right. The raw material film head fixing suction holes 20203 are connected to the raw material film head adsorption chamber 20205, the film paper adsorption holes 20201 are connected to the positioning film paper adsorption chamber 20204, and the film head fixing suction holes 20206 are connected to the film head suction hole air chamber 20207.

[0034] The negative pressure generating device includes at least a vacuum generator 406 with multiple independent vacuum modules. The gas path module 204 includes at least a raw material membrane head adsorption gas pipe 20401 connecting the vacuum generator 406 to the raw material membrane head adsorption chamber 20205, a membrane paper positioning adsorption gas pipe 20402 connecting the vacuum generator 406 to the positioning membrane paper adsorption chamber 20204, and a membrane head adsorption gas pipe 20403 connecting the vacuum generator 406 to the membrane head suction hole gas chamber 20207. The raw material membrane head adsorption gas pipe 20401, the membrane paper positioning adsorption gas pipe 20402, and the membrane head adsorption gas pipe 20403 are connected to three independently on / off vacuum modules of the vacuum generator 406, and the vacuum adsorption force can be adjusted individually as needed.

[0035] The film application platform 2 also includes a substrate 203 for supporting the fixing base 202. The substrate 203 serves as the mounting base for the positioning fixing base 202. An airtight layer is provided in the middle of the substrate 203 to prevent air leakage. An air passage is provided in the substrate 203 to connect the raw material film head adsorption chamber 20205, the positioning film paper adsorption chamber 20204, and the air chamber 20207 of the film head to be applied with the air passage module 204, which are isolated from each other.

[0036] Among them, the raw material film head fixing suction holes 20203, the film paper adsorption holes 20201, and the film head fixing suction holes 20206 are all arranged in an array. The hole spacing of the raw material film head fixing suction holes 20203 and the film head fixing suction holes 20206 is smaller than the hole spacing of the film paper adsorption holes 20201. The raw material film head fixing suction holes 20203 and the film head fixing suction holes 20206 provide more uniform suction at both ends of the main body of the high-temperature film paper 1; the raw material film head fixing suction holes 20203 and 20206 provide more uniform suction at both ends of the main body of the high-temperature film paper 1; the raw material film head fixing suction holes 20203 and 20206 provide more uniform suction at both ends of the main body of the film paper 1. The aperture of the fixed suction hole 20203 is not larger than that of the membrane paper adsorption hole 20201. The aperture of the single raw material membrane head fixing suction hole 20203 is relatively small. The raw material membrane head of the high-temperature membrane paper 1 has a small amount of deformation under adsorption, which improves the stability of film peeling. In addition, the aperture of the film head fixing suction hole 20206 is larger than that of the membrane paper adsorption hole 20201, so that the single hole of the film head fixing suction hole 20206 provides a greater adsorption force, so that the end of the high-temperature membrane paper 1 can be firmly attracted and fixed.

[0037] The gas path module 204 also includes an electronic vacuum proportional valve 20404 connected to the pipeline of the membrane paper positioning adsorption gas tube 20402. The film application platform 2 also includes a corner plate 201, and the electronic vacuum proportional valve 20404 is fixed on the corner plate 201. The electronic vacuum proportional valve 20404 controls the magnitude of the vacuum adsorption force of the membrane paper positioning adsorption gas tube 20402 to which it is located.

[0038] The gas path module 204 includes three pressure relief components, which are independently connected to the raw material membrane head adsorption gas pipe 20401, the membrane paper positioning adsorption gas pipe 20402, and the membrane head adsorption gas pipe 20403 to be applied, respectively. The pressure relief components include a shut-off valve 20406, a three-way air connector 20405 connecting the shut-off valve 20406 to the pipeline, and a pressure relief filter 20407 connected to the outlet end of the shut-off valve 20406. The three-way air connector 20405 divides one gas pipe into two gas pipes of the same diameter. The shut-off valve 20406 regulates the gas flow rate of its respective gas path. The pressure relief filter 20407 silences the high-speed gas discharged and filters dust and other impurities contained in the gas in its respective gas path. The manual adjustment of the pressure relief component can fine-tune the negative pressure of each air chamber. The shut-off valve 20406 is a one-way adjustable shut-off valve 20406. The valve size of the shut-off valve 20406 controls the air flow rate entering each air path. When the valve of the shut-off valve 20406 is opened wider, more outside air enters the air path from the pressure relief filter 20407, which can share a certain amount of the negative pressure on the membrane paper.

[0039] A membrane paper cutting clearance groove 20202 is formed between the raw material membrane head fixing suction hole 20203 and the membrane paper suction hole 20201 on the surface of the fixed base 202. The cutting mechanism cuts the membrane paper in the membrane paper cutting clearance groove 20202.

[0040] In addition, the negative pressure generating module 4 also includes a pressure regulating valve 401, a main air inlet pipe 405 connecting the pressure regulating valve 401 and the inlet of the vacuum generator 406, an air source interface 404 located at the inlet of the pressure regulating valve 401, an air inlet filter 403 connected to the pressure regulating valve 401, and a pressure display gauge 402. The pressure regulating valve 401 can adjust the compressed air pressure from the air compressor to the pressure required by the equipment. The pressure display gauge 402 displays the adjusted compressed air pressure in the form of a pointer. The filter filters the air generated by the air compressor before sending it into the equipment, preventing water vapor, oil, and other contaminants from entering the equipment's air circuit, which could lead to equipment failure and reduced lifespan. The main air inlet pipe 405 is the pipeline that sends the pressure-regulated filtered compressed air into the pneumatic components of the equipment. The vacuum generator 406 converts the compressed air entering the equipment into negative pressure air with suction capacity.

[0041] The operating principle and workflow of this device include: fixing the high-temperature film paper 1, removing the bottom film, cutting the raw material film head, and adjusting the film paper to be perfectly flat; specifically...

[0042] Fixing the high-temperature membrane paper 1: The raw membrane paper is conveyed to the fixing base 202 through the supply device. The membrane paper positioning adsorption air pipe 20402 creates a negative pressure in the positioning membrane paper adsorption chamber 20204. At the same time, the adsorption air pipe 20403 of the membrane head creates a negative pressure in the suction chamber 20207 of the membrane head. Each suction hole of the membrane paper adsorption hole 20201 and the membrane head fixing suction hole 20206 exerts an adsorption force on the membrane paper to be applied placed above it, fixing the high-temperature membrane paper 1.

[0043] Bottom film removal: After the membrane paper is positioned and fixed, the corresponding vacuum module of the vacuum generator 406 works with the maximum adsorption force, so that negative pressure is generated in the positioning membrane paper adsorption chamber 20204 and the suction hole air chamber 20207 of the membrane head to be applied. The membrane paper is adsorbed at the maximum value at the membrane paper adsorption hole 20201 and the membrane head fixing suction hole 20206. The related bottom film recycling device 3 and the related bottom film removal device start to separate the bottom film that was originally stuck to the high temperature membrane paper 1. The bottom film recycling device 3 then recycles the waste bottom film. In this process, by using the vacuum module that works separately with the vacuum generator, sufficient adsorption force is generated to ensure the stability of the bottom film of the membrane paper when it is recycled by the bottom film recycling device 3.

[0044] Raw material membrane head cutting: The vacuum module where the raw material membrane head adsorption tube 20401 is located maintains the maximum adsorption force, so that negative pressure is generated in the raw material membrane head adsorption chamber 20205 and adsorbs and fixes the raw material membrane paper head. The membrane paper is cut at the position of the membrane paper cutting clearance groove 20202 by the membrane paper cutting device.

[0045] Adjusting the membrane paper to be flat: The electronic vacuum proportional valve 20404 is opened, and it controls the membrane paper positioning adsorption tube 20402 to reduce the vacuum adsorption force to about 5% of the original force, so that the deformation of the membrane paper to be applied due to the adsorption force disappears and it is in a flat state to be applied. Finally, the membrane application device completes the application of the lead frame.

[0046] In addition, depending on the actual effect of the film application, the negative pressure of each air chamber can be finely adjusted by manually adjusting the pressure relief component. Specifically, the flow rate of air entering each air path is controlled by the valve size of the shut-off valve 20406. When the valve of the shut-off valve 20406 is opened wider, more outside air enters the air path from the pressure relief filter 20407, which can share a certain amount of the negative pressure on the film paper, thereby adjusting the amount of deformation of the film paper when it is adsorbed.

[0047] This invention ensures that the film paper is essentially flat when it is applied, and with the parallel lead frame, it achieves a good film application effect, greatly reducing the overall defect rate and significantly reducing the problem of air bubbles after film application, which is difficult to avoid in the post-film application process. It also reduces the probability of air bubble formation and the size of the air bubbles.

[0048] The embodiments described above are merely preferred embodiments of the present invention and are not intended to limit the concept and scope of the present invention. Various modifications and improvements made to the technical solutions of the present invention by those skilled in the art without departing from the design concept of the present invention should fall within the protection scope of the present invention. The technical content for which protection is sought in the present invention has been fully described in the claims.

Claims

1. A semiconductor lead frame film-coating bubble suppression device, comprising a film-coating platform (2), a negative pressure generating device (4), and an air circuit module (204), characterized in that, The film application platform (2) includes at least a fixed base (202); The lower surface of the fixed base (202) is provided with, from left to right, mutually isolated raw material membrane head adsorption chamber (20205), positioning membrane paper adsorption chamber (20204), and membrane head suction hole air chamber (20207). The upper surface of the fixed base (202) is provided with, from left to right, a plurality of raw material membrane head fixing suction holes (20203), membrane paper adsorption holes (20201), and membrane head fixing suction holes (20206). The raw material membrane head fixing suction holes (20203) are connected to the raw material membrane head adsorption chamber (20205), the membrane paper adsorption holes (20201) are connected to the positioning membrane paper adsorption chamber (20204), and the membrane head fixing suction holes (20206) are connected to the membrane head suction hole air chamber (20207). The negative pressure generating device (4) includes at least a vacuum generator (406) with multiple independent vacuum modules. The gas path module (204) includes at least a raw material membrane head adsorption gas pipe (20401) connecting the vacuum generator (406) and the raw material membrane head adsorption chamber (20205), a membrane paper positioning adsorption gas pipe (20402) connecting the vacuum generator (406) and the positioning membrane paper adsorption chamber (20204), and a membrane head adsorption gas pipe (20403) connecting the vacuum generator (406) and the membrane head adsorption hole gas chamber (20207). The raw material membrane head adsorption gas pipe (20401), the membrane paper positioning adsorption gas pipe (20402), and the membrane head adsorption gas pipe (20403) are connected to three independently on / off vacuum modules of the vacuum generator (406).

2. The semiconductor lead frame film bubble suppression device according to claim 1, characterized in that, The raw material film head fixing suction hole (20203), film paper adsorption hole (20201), and film head fixing suction hole (20206) are all arranged in an array. The hole spacing of the raw material film head fixing suction hole (20203) and the film head fixing suction hole (20206) is smaller than the hole spacing of the film paper adsorption hole (20201).

3. The semiconductor lead frame film bubble suppression device according to claim 2, characterized in that, The aperture of the raw material film head fixing suction hole (20203) is not larger than the film paper adsorption hole (20201), and the aperture of the film head fixing suction hole (20206) to be applied is larger than the film paper adsorption hole (20201).

4. The semiconductor lead frame film bubble suppression device according to claim 1, characterized in that, The gas path module (204) also includes an electronic vacuum proportional valve (20404) on the pipeline connected to the membrane paper positioning adsorption gas pipe (20402), and the film application platform (2) also includes a corner plate (201), and the electronic vacuum proportional valve (20404) is fixed on the corner plate (201).

5. The semiconductor lead frame film bubble suppression device according to claim 4, characterized in that, The gas path module (204) includes three pressure relief components that are independently connected to the raw material membrane head adsorption gas pipe (20401), the membrane paper positioning adsorption gas pipe (20402), and the membrane head adsorption gas pipe (20403) respectively. The pressure relief components include a shut-off valve (20406), a three-way air connector (20405) connecting the shut-off valve (20406) and the pipeline, and a pressure relief filter (20407) connected to the outlet end of the shut-off valve (20406).

6. A semiconductor lead frame film bubble suppression device according to claim 5, characterized in that, The film application platform (2) further includes a substrate (203) for placing the fixed base (202). The substrate (203) has an air passage that connects the raw material film head adsorption chamber (20205), the positioning film paper adsorption chamber (20204), and the air chamber of the film head suction hole (20207) to be applied with the air passage module (204) in a mutually isolated manner.

7. A semiconductor lead frame film bubble suppression device according to any one of claims 1-6, characterized in that, A film paper cutting clearance groove (20202) is provided between the raw material film head fixing suction hole (20203) and the film paper adsorption hole (20201) on the surface of the fixed base (202).

8. The semiconductor lead frame film bubble suppression device according to claim 1, characterized in that, The negative pressure generating device (4) also includes a pressure regulating valve (401), a main air inlet pipe (405) connecting the pressure regulating valve (401) and the inlet end of the vacuum generator (406), an air source interface (404) located at the inlet end of the pressure regulating valve (401), an air inlet filter (403) connected to the pressure regulating valve (401), and a pressure display gauge (402).

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