Circuit board tin spraying equipment

Abstract

The utility model relates to the technical field of circuit board manufacturing, in particular to circuit board tin spraying equipment which comprises a containing frame, a tin bath is arranged in the containing frame, an air cylinder is installed on the left side of the containing frame, a placing plate is arranged at the top end of a movable rod of the air cylinder, square notches are formed in the two side edges of the placing plate, and the square notches are arranged in the containing frame. Square supporting blocks matched with the square notches are arranged on the two side walls in the tin bath, and a liquid discharging pipe is arranged at the bottom of the tin bath. The circuit board can be automatically placed in and taken out of the soldering tin pool through the air cylinder and the placing plate, the risk that a worker makes direct contact with high-temperature soldering tin is greatly reduced, and therefore the operation safety is improved, and the work efficiency can be improved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board manufacturing technology, and in particular to a circuit board tin spraying equipment. Background Technology

[0002] In circuit board manufacturing, tin plating, also known as hot air leveling, is a crucial step. This process involves immersing the circuit board in a hot molten solder bath, ensuring that all exposed copper surfaces are evenly covered with solder. Subsequently, excess molten solder is removed from the circuit board surface using equipment such as hot air knives, ensuring the smoothness and flatness of the solder layer. Tin plating not only effectively prevents copper oxidation but also provides an ideal foundation for the conductivity and adhesion of subsequent component soldering.

[0003] Currently, during the soldering process, it is usually done manually using hangers or other fixing devices to immerse circuit boards into the solder bath and remove them after a predetermined time. However, this traditional manual operation method has obvious shortcomings and safety hazards: the temperature of the hot solder bath is usually as high as 250°C or more. When workers directly operate the hangers to put in and take out the circuit boards, they face the risk of burns. Working in a high-temperature environment for a long time will increase the physical burden on workers and may cause heatstroke, fatigue and other problems, thereby reducing work efficiency and affecting the health of employees.

[0004] Therefore, there is an urgent need for a circuit board tinning device that can automatically place and remove circuit boards during the tinning process. Utility Model Content

[0005] In order to overcome the shortcomings of the existing tin-spraying process, which relies on manual operation of placing and removing circuit boards into the hot solder bath, resulting in significant safety hazards, low work efficiency, and heavy workload for workers in high-temperature environments, this utility model provides a circuit board tin-spraying device that can automatically place and remove circuit boards during the tin-immersion step.

[0006] To address the aforementioned issues, this utility model employs the following technical solution: a circuit board soldering device, comprising a receiving frame containing a solder bath, a cylinder mounted on the left side of the receiving frame, a placement plate at the top of the cylinder's movable rod, square slots on both sides of the placement plate, square support blocks matching the square slots on both sides of the inner side walls of the solder bath, a drain pipe at the bottom of the solder bath with a valve mounted on the drain pipe, a hot air box at the rear of the receiving frame, a roller conveyor assembly at the upper part of the hot air box, and a hot air knife mounted on the top of the hot air box.

[0007] Furthermore, a servo motor is installed on the right side of the receiving frame, and a lead screw is connected to the output shaft of the servo motor. A push plate is threaded onto the lead screw, and the push plate is located on the top side of the solder bath. A guide rod located below the lead screw is fixedly installed on the right side of the receiving frame. The guide rod is arranged parallel to the lead screw and passes through one side of the push plate to achieve a sliding connection for the push plate to move along the guide rod.

[0008] Furthermore, a buffer pad is provided on the side of the push plate that contacts the circuit board.

[0009] Furthermore, the end of the drain pipe is connected to a collecting pipe, a filter cylinder is installed on the collecting pipe, a cylinder cover is fitted onto the filter cylinder, and both the filter cylinder and the cylinder cover are equipped with filter screens.

[0010] Furthermore, a guide groove is provided on the outer side of the hot air box, and a protective cover is slidably installed on the guide groove, which covers the control terminal position on the hot air knife.

[0011] Furthermore, a locking block is provided at the connection between the cylinder's movable rod and the placement plate, and a locking groove adapted to the locking block is provided on the placement plate.

[0012] Furthermore, a collection frame is provided inside the hot air box, located below the roller conveyor assembly.

[0013] Furthermore, a protective cover is fixed to the right side of the accommodating frame, and the protective cover covers the location of the guide rod and the lead screw.

[0014] Compared with the prior art, the present invention has the following technical effects: 1. The automatic placement and removal of circuit boards into the solder bath is achieved by using a cylinder and a placement plate, which greatly reduces the risk of direct contact between humans and high-temperature solder, thereby improving the safety of the operation and helping to improve work efficiency.

[0015] 2. By setting up servo motors, lead screws, push plates, and guide rods, the entire process, including tinning, removal, transfer to the roller conveyor assembly, and hot air knife purging, is automated, simplifying the operation process and reducing human intervention.

[0016] 3. The integrated filter cylinder, cylinder cover, and filter screen in this equipment can remove impurities from the recycled molten tin, allowing the molten tin to be reused, which not only saves costs but also reduces waste generation. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0018] Figure 2 This is a three-dimensional sectional view of the components of this utility model, including the accommodating frame, the placement plate, and the hot air box.

[0019] Figure 3 This is a three-dimensional sectional view of the cylinder, placement plate, and drain pipe components of this utility model.

[0020] Figure 4 This is a three-dimensional sectional view of the hot air box, roller conveyor assembly, and hot air knife components of this utility model.

[0021] Figure 5 This is a three-dimensional sectional view of the servo motor, lead screw, push plate, and other components of this utility model.

[0022] Figure 6 This is a three-dimensional sectional view of the components of this utility model, including the collecting pipe, filter cylinder, and cylinder cover.

[0023] Component names and serial numbers in the diagram: 1: Container frame, 2: Solder bath, 3: Cylinder, 4: Placement plate, 5: Square support block, 6: Drain pipe, 7: Valve, 8: Hot air box, 9: Roller conveyor assembly, 10: Hot air knife, 11: Servo motor, 12: Lead screw, 13: Push plate, 14: Buffer pad, 15: Guide rod, 16: Manifold, 17: Filter cartridge, 18: Cylinder cover, 19: Filter screen, 20: Protective cover, 21: Clamping block, 22: Collection frame, 23: Protective cover. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Example 1: Please refer to Figures 1-4A circuit board soldering device includes a receiving frame 1, which houses a solder bath 2 for storing high-temperature molten solder. A cylinder 3 is mounted on the left side of the receiving frame 1. A placement plate 4 is attached to the top of the movable rod of the cylinder 3. A locking block 21 is provided at the connection between the movable rod of the cylinder 3 and the placement plate 4. The placement plate 4 has a slot that matches the locking block 21. The movable rod of the cylinder 3 and the placement plate 4 are detachably connected through the locking block 21 and the slot, allowing for replacement and cleaning of the placement plate 4. Furthermore, two square slots are provided on both the front and rear sides of the placement plate 4, and two square slots matching the square slots are provided on both the front and rear side walls inside the solder bath 2. The shaped support block 5, the bottom of the solder bath 2 is provided with a drain pipe 6, and a valve 7 is installed on the drain pipe 6 to control the discharge of solder liquid, a hot air box 8 is provided on the rear side of the receiving frame 1, a roller conveyor assembly 9 is provided in the upper part of the hot air box 8, a collection frame 22 is provided inside the hot air box 8 below the roller conveyor assembly 9 to collect excess solder liquid blown down by the hot air knife 10, a hot air knife 10 is installed on the top of the hot air box 8, a guide groove is opened on the outer side of the hot air box 8, and a protective cover 20 is slidably provided on the guide groove. The protective cover 20 covers the control terminal position on the hot air knife 10 to provide additional safety protection and avoid accidental contact.

[0026] When using this equipment to perform soldering on circuit boards, the operator first places the pre-treated circuit board flat on the placement plate 4. Then, by controlling the shortening of the movable rod of the control cylinder 3, the placement plate 4, along with the circuit board, descends until the circuit board is completely immersed in the high-temperature molten solder. As the placement plate 4 continues to descend, the square support block 5 on the inner wall of the solder bath 2 protrudes from the square slot below the placement plate 4, thereby lifting the circuit board off the placement plate 4. This ensures sufficient space between the back of the circuit board and the placement plate 4, allowing both sides of the circuit board to fully contact the molten solder. During the process, the exposed copper portion of the circuit board is coated with molten solder. After the tinning process is completed, the control system extends the movable rod of the cylinder 3, which lifts the placement plate 4 and pushes the circuit board out of the solder bath 2. This realizes the automatic placement and removal of the circuit board from the solder bath 2, improving the safety of the operation. Subsequently, the tinned circuit board is transferred to the roller conveyor assembly 9, which is responsible for conveying the circuit board backward. During this process, the hot air knife 10 blows the surface of the circuit board to remove excess molten solder, making the solder layer smoother and more even, and finally completing the entire tinning operation.

[0027] Example 2: Based on Example 1, please refer to... Figure 5A servo motor 11 is installed on the right side of the receiving frame 1. A lead screw 12 is connected to the output shaft of the servo motor 11. A push plate 13 is threaded onto the lead screw 12. The push plate 13 is located at the top front of the solder bath 2 and is used to push the circuit board after soldering into the roller conveyor assembly 9. A buffer pad 14 is provided on the side of the push plate 13 that contacts the circuit board to protect the circuit board from damage. A guide rod 15 located below the lead screw 12 is fixedly installed on the right side of the receiving frame 1. The guide rod 15 is arranged parallel to the lead screw 12 and passes through one side of the push plate 13 to achieve a sliding connection for the push plate 13 to move along the guide rod 15. A protective cover 23 is fixedly connected to the right side of the receiving frame 1. The protective cover 23 covers the location of the guide rod 15 and the lead screw 12 to prevent external dust and other contaminants from entering the critical mechanical component area and increase operational safety.

[0028] After the placement plate 4 pushes the circuit board out of the solder bath 2, the servo motor 11 starts and drives the lead screw 12 to rotate, causing the push plate 13 to move backward along the guide rod 15. During this process, the push plate 13 pushes the circuit board that has completed the soldering process and moves it from the placement plate 4 to the roller conveyor assembly 9, thereby achieving the purpose of automatically and quickly transferring the circuit board.

[0029] Please see Figure 6 The end of the drain pipe 6 is connected to a collecting pipe 16, a filter cylinder 17 is installed on the collecting pipe 16, a cylinder cover 18 is snapped onto the filter cylinder 17, and both the filter cylinder 17 and the cylinder cover 18 are provided with filter screens 19 for removing impurities from the recycled tin liquid.

[0030] When it is necessary to drain the molten tin, first open the valve 7 on the drain pipe 6 so that the molten tin inside the tin bath 2 flows into the collecting pipe 16 through the drain pipe 6 and is filtered through the filter cylinder 17 and the filter screen 19 in the cylinder cover 18, thereby effectively removing impurities from the molten tin. The molten tin after the above treatment can be collected for subsequent recycling and reuse.

[0031] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A circuit board soldering device, comprising a receiving frame (1) having a solder bath (2) built into the receiving frame (1), characterized in that, A cylinder (3) is installed on the left side of the accommodating frame (1). A placement plate (4) is provided at the top of the movable rod of the cylinder (3). Square slots are provided on both sides of the placement plate (4). Square support blocks (5) matching the square slots are provided on both sides of the inner side wall of the tin bath (2). A drain pipe (6) is provided at the bottom of the tin bath (2). A valve (7) is installed on the drain pipe (6). A hot air box (8) is provided on the rear side of the accommodating frame (1). A roller conveyor assembly (9) is provided in the upper part of the hot air box (8). A hot air knife (10) is installed on the top of the hot air box (8).

2. The circuit board soldering equipment according to claim 1, characterized in that, A servo motor (11) is installed on the right side of the accommodating frame (1). A lead screw (12) is connected to the output shaft of the servo motor (11). A push plate (13) is threaded on the lead screw (12). The push plate (13) is located on the top side of the tin bath (2). A guide rod (15) located below the lead screw (12) is fixedly installed on the right side of the accommodating frame (1). The guide rod (15) is arranged parallel to the lead screw (12) and passes through one side of the push plate (13) to achieve a sliding connection in which the push plate (13) moves along the guide rod (15).

3. A circuit board soldering equipment according to claim 2, characterized in that, A buffer pad (14) is provided on the side of the push plate (13) that contacts the circuit board.

4. A circuit board soldering equipment according to claim 3, characterized in that, The end of the drain pipe (6) is connected to a collecting pipe (16), a filter cylinder (17) is installed on the collecting pipe (16), a cylinder cover (18) is snapped onto the filter cylinder (17), and a filter screen (19) is provided on both the filter cylinder (17) and the cylinder cover (18).

5. A circuit board soldering equipment according to claim 4, characterized in that, The hot air box (8) has a guide groove on its outer side, and a protective cover (20) is slidably installed on the guide groove. The protective cover (20) covers the control terminal position on the hot air knife (10).

6. A circuit board soldering equipment according to claim 5, characterized in that, A locking block (21) is provided at the connection between the movable rod of the cylinder (3) and the placement plate (4), and a slot adapted to the locking block (21) is provided on the placement plate (4).

7. A circuit board soldering equipment according to claim 6, characterized in that, The hot air box (8) is provided with a collection frame (22) located below the roller conveyor assembly (9).

8. A circuit board soldering equipment according to claim 7, characterized in that, A protective cover (23) is fixed to the right side of the accommodating frame (1), and the protective cover (23) covers the location of the guide rod (15) and the lead screw (12).

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