Camera module and electronic equipment

Abstract

The utility model discloses a camera module and electronic equipment, and belongs to the technical field of electronic equipment. The camera module comprises an image sensor, the image sensor comprises a first light-sensitive surface and a second light-sensitive surface which are deviated from each other, the first light-sensitive surface is provided with a first light-sensitive component, and the second light-sensitive surface is provided with a second light-sensitive component; the first lens is arranged opposite to the first light-sensitive surface, and the first lens is used for transmitting light to the first light-sensitive surface; and the second lens is arranged opposite to the second light-sensitive surface, and the second lens is used for transmitting the light to the second light-sensitive surface.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, specifically relating to a camera module and an electronic device. Background Technology

[0002] With the increasing demand for multi-functional mobile communication devices, most mobile communication devices are equipped with front-facing and rear-facing cameras.

[0003] In related technologies, the front-facing camera and the rear-facing camera are designed separately, meaning that each camera has its own image sensor and corresponding electrical components, resulting in them occupying a large amount of space inside the electronic device. Utility Model Content

[0004] The purpose of this application is to provide a camera module and electronic device that solves the problem that having separate image sensors and corresponding electrical components for both the front and rear cameras results in a large amount of space being occupied inside the electronic device.

[0005] In a first aspect, embodiments of this application provide a camera module, including: an image sensor, the image sensor including a first photosensitive surface and a second photosensitive surface opposite to each other, the first photosensitive surface being provided with a first photosensitive component, and the second photosensitive surface being provided with a second photosensitive component; a first lens, disposed opposite to the first photosensitive surface, the first lens being used to transmit light to the first photosensitive surface; and a second lens, disposed opposite to the second photosensitive surface, the second lens being used to transmit light to the second photosensitive surface.

[0006] Secondly, embodiments of this application provide an electronic device, including: the camera module in the first aspect; a rear cover, on which a first lens of the camera module is disposed; and a front cover, disposed opposite to the rear cover, on which a second lens of the camera module is disposed.

[0007] In this embodiment, the first lens and the first photosensitive component in the image sensor form a first imaging system, and the second lens and the second photosensitive component in the image sensor form a second imaging system. The first and second imaging systems share the same image sensor, eliminating the need for separate image sensors and corresponding electrical components for each imaging system. This reduces the size of the camera module and the space it occupies within the electronic device. It should be noted that the first and second lenses are axially aligned, making the horizontal dimension of the camera module only the size of one lens, thus saving space in the horizontal direction. Attached Figure Description

[0008] Figure 1 The following are schematic diagrams illustrating the structure of a camera module provided in some embodiments of this application;

[0009] Figure 2 One of the image sensor circuit diagrams provided in some embodiments of this application is shown;

[0010] Figure 3 This illustration shows one of the structural schematic diagrams of the image sensor and circuit board provided in some embodiments of this application;

[0011] Figure 4 This is a second schematic diagram of the structure of the image sensor and circuit board provided in some embodiments of this application;

[0012] Figure 5 This is shown as a third schematic diagram of the structure of the image sensor and circuit board provided in some embodiments of this application;

[0013] Figure 6 The fourth illustration shows a structural schematic diagram of the image sensor and circuit board provided in some embodiments of this application;

[0014] Figure 7 This illustration shows one of the structural schematic diagrams of the image sensor provided in some embodiments of this application;

[0015] Figure 8 A second schematic diagram of the structure of the image sensor provided in some embodiments of this application is shown;

[0016] Figure 9 This is shown as a third schematic diagram of the structure of the image sensor provided in some embodiments of this application;

[0017] Figure 10 This illustration shows one of the structural schematic diagrams of the circuit board provided in some embodiments of this application;

[0018] Figure 11 This is a second schematic diagram of the circuit board structure provided in some embodiments of this application;

[0019] Figure 12 This is shown as a third schematic diagram of the circuit board structure provided in some embodiments of this application;

[0020] Figure 13 This is a second example of an image sensor circuit diagram provided in some embodiments of this application;

[0021] Figure 14 This illustration shows one of the structural schematic diagrams of the electronic device provided in some embodiments of this application;

[0022] Figure 15 This is a second schematic diagram of the structure of an electronic device provided in some embodiments of this application.

[0023] The attached figures are labeled as follows:

[0024] 100 Camera module, 110 Image sensor, 111 First photosensitive surface, 112 Second photosensitive surface, 113 First imaging area, 114 First connection area, 115 Second imaging area, 116 Second connection area, 117 First photosensitive component, 118 Second photosensitive component, 119 Switch component, 120 First lens, 130 Second lens, 140 Circuit board, 141 Cutout, 142 Third connection area, 143 Fourth connection area, 144 Device pad, 145 Recess, 150 Frame, 151 First filter, 152 second filter, 160 data output bus, 170 connecting line, 180 components, T1 first switch, T2 second switch, T3 third switch, T4 fourth switch, T5 fifth switch, T6 sixth switch, T7 seventh switch, T8 eighth switch, T9 sixth switch, T10 tenth switch, PD1 first photosensitive element, PD2 second photosensitive element, ADC analog-to-digital converter, VC power supply, 200 electronic equipment, 201 rear cover, 202 front cover. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0026] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0027] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0028] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0029] The following is in conjunction with the appendix Figures 1 to 15 The camera module and electronic device provided in this application will be described in detail through specific embodiments and application scenarios.

[0030] In some embodiments of this application, a camera module is provided. Figure 1 The following are schematic diagrams illustrating the structure of a camera module provided in some embodiments of this application. Figure 2 One of the image sensor circuit diagrams provided in some embodiments of this application is shown, such as Figure 1 and Figure 2 As shown, the camera module 100 includes: an image sensor 110, which includes a first photosensitive surface 111 and a second photosensitive surface 112 facing away from each other; the first photosensitive surface 111 is provided with a first photosensitive component 117, and the second photosensitive surface 112 is provided with a second photosensitive component 118; a first lens 120, which is disposed opposite to the first photosensitive surface 111 and is used to transmit light to the first photosensitive surface 111; and a second lens 130, which is disposed opposite to the second photosensitive surface 112 and is used to transmit light to the second photosensitive surface 112.

[0031] In this embodiment, the camera module 100 includes a dual-image sensor 110, wherein the image sensor 110 includes two imaging surfaces: a first photosensitive surface 111 and a second photosensitive surface 112, enabling the image sensor 110 to perform dual-image imaging. A first photosensitive component 117 for sensing light is disposed on the first photosensitive surface 111 of the image sensor 110, and a second photosensitive component 118 for sensing light is disposed on the second photosensitive surface 112. The camera module 100 also includes a first lens 120 and a second lens 130, which are respectively disposed opposite to the first photosensitive surface 111 and the second photosensitive surface 112. Both the first lens 120 and the second lens 130 are used to collect and focus light. The first lens 120 can transmit light to the first photosensitive surface 111 of the image sensor 110, and the second lens 130 can transmit light to the second photosensitive surface 112 of the image sensor 110.

[0032] When light is transmitted through the first lens 120 to the first photosensitive component 117 on the first photosensitive surface 111, the first photosensitive component 117 is a photosensitive element disposed on the first photosensitive surface 111, and is responsible for capturing the intensity information of the external light and converting it into an electrical signal. When light is transmitted through the second lens 130 to the second photosensitive component 118 on the second photosensitive surface 112, the second photosensitive component 118 is a photosensitive element disposed on the second photosensitive surface 112, and is responsible for capturing the intensity information of the external light and converting it into an electrical signal.

[0033] Specifically, the first photosensitive component 117 and the second photosensitive component 118 convert the received light signal into an electrical signal in the form of current or voltage through the photoelectric effect. Hereinafter, the first pixel signal refers to the electrical signal output by the first photosensitive component 117, and the second pixel signal refers to the electrical signal output by the second photosensitive component 118.

[0034] It should be noted that both the first lens 120 and the second lens 130 include a multi-layer lens structure, which enables them to receive and refract light from the outside world, ensuring that the light can be accurately projected onto the first photosensitive surface 111 and the second photosensitive surface 112. Both the first lens 120 and the second lens 130 include a controllable aperture, and the amount of light entering the first lens 120 and the second lens 130 can be controlled by controlling the opening and closing of the aperture, thereby adjusting the exposure and depth of field.

[0035] Specifically, the first photosensitive surface 111 and the second photosensitive surface 112 are two photosensitive surfaces that are opposite to each other in the image sensor 110. That is, the light-inlet end of the first lens 120 and the light-inlet end of the second lens 130 are also set opposite to each other. Therefore, when the camera module 100 is set inside the electronic device, the first lens 120 and the second lens 130 can be used as the front lens and the rear lens of the electronic device, respectively. This allows the front lens and the rear lens of the electronic device to share the same image sensor 110, reducing the space occupied by the camera module 100 inside the electronic device. Furthermore, when the electronic device switches between the front lens and the rear lens, there is no need to power off the image sensor 110, saving the power-on and power-off time required when switching between the front lens and the rear lens, which is convenient for quick capture.

[0036] In this embodiment, the first lens 120 and the first photosensitive component 117 in the image sensor 110 form a first imaging system, and the second lens 130 and the second photosensitive component 118 in the image sensor 110 form a second imaging system. The first imaging system and the second imaging system share the same image sensor 110, eliminating the need to design a separate image sensor 110 and corresponding electrical components for each imaging system. This reduces the size of the camera module 100 and the space occupied by the camera module 100 inside the electronic device.

[0037] It should be noted that the first lens 120 and the second lens 130 are aligned axially, so that the horizontal dimension of the camera module 100 is only the size of one lens, saving the space occupied by the camera module 100 in the horizontal direction.

[0038] Figure 3 This illustration shows one of the structural schematic diagrams of the image sensor and circuit board provided in some embodiments of this application. Figure 4 This is the second schematic diagram of the structure of the image sensor and circuit board provided in some embodiments of this application. Figure 5 This is shown as the third schematic diagram of the structure of the image sensor and circuit board provided in some embodiments of this application. Figure 6 The fourth illustration shows a schematic diagram of the structure of the image sensor and circuit board provided in some embodiments of this application. Figure 7 This illustration shows one of the structural schematic diagrams of the image sensor provided in some embodiments of this application. Figure 8 The second schematic diagram shows the structure of the image sensor provided in some embodiments of this application. Figure 9 The third schematic diagram shows the structure of the image sensor provided in some embodiments of this application. Figure 10 This illustration shows one of the schematic diagrams of the circuit board provided in some embodiments of this application. Figure 11 The second schematic diagram shows the structure of a circuit board provided in some embodiments of this application. Figure 12 The third schematic diagram shows the structure of a circuit board provided in some embodiments of this application, such as... Figures 1 to 12 As shown, in some embodiments of this application, the camera module 100 further includes: a circuit board 140, which is located between the first lens 120 and the second lens 130. The circuit board 140 has a groove 145, and a cutout 141 is formed in the groove 145. The image sensor 110 is disposed in the groove 145. The first photosensitive surface 111 is disposed away from the circuit board 140, and the second photosensitive surface 112 is disposed facing the circuit board 140. The cutout 141 is used to transmit light to the second photosensitive surface 112.

[0039] In this embodiment, the camera module 100 further includes a circuit board 140. A first lens 120 and a second lens 130 are distributed on both sides of the circuit board 140. An image sensor 110 is mounted on the circuit board 140 and electrically connected to it. The circuit board 140 can support the image sensor 110. The circuit board 140 provides power to the image sensor 110, and the first pixel signal or second pixel signal generated by the image sensor 110 can be transmitted to an image signal processor via the circuit board 140. The image signal processor can process the first pixel signal or second pixel signal to generate a final image.

[0040] In this embodiment, a groove 145 is provided on the circuit board 140 to accommodate the image sensor 110. A cutout 141 is provided inside the groove 145. When the image sensor 110 is located inside the groove 145, the first photosensitive surface 111 of the image sensor 110 faces the outside of the groove 145, and the second photosensitive surface 112 faces the inside of the groove 145. Since the cutout 141 is provided inside the groove 145, the cutout 141 and the second photosensitive surface 112 are positioned opposite each other. Light can pass through the groove 145 and the circuit board 140 to be transmitted to the second photosensitive surface 112 of the image sensor 110. This avoids the circuit board 140 blocking the second photosensitive surface 112 when the image sensor 110 is mounted on the circuit board 140, thus preventing the circuit board 140 from obstructing the imaging process.

[0041] It should be noted that the circuit board 140 has a groove 145 and a stepped portion is formed on the circuit board 140. CSP (Chip Scale Package) pads are provided on the stepped portion, that is, the CSP pads are located in the groove 145, thereby saving space in the thickness direction of the circuit board 140.

[0042] In this embodiment, the first photosensitive component 117 and the second photosensitive component 118 in the image sensor 110 can share the same circuit board 140, further reducing the space occupied by the camera module 100 in the electronic device, and saving the hardware cost and circuit design cost of a circuit board 140. Furthermore, when switching between the output of the first pixel signal by the first photosensitive component 117 and the output of the second pixel signal by the second photosensitive component 118, there is no need to disconnect the power supply VC signal from the circuit board 140 to the image sensor 110; switching can be performed quickly directly through software, improving the fast switching and capture effect of the camera module 100. Since the image sensor 110 includes the first photosensitive component 117 and the second photosensitive component 118, the metal content inside the image sensor 110 is relatively increased. This increases the operating time for the image sensor 110 to reach its temperature equilibrium point, improving the imaging effect of the image sensor 110.

[0043] In this embodiment, by providing a groove 145 on the circuit board 140 and placing the image sensor 110 within the groove 145, the overall thickness of the image sensor 110 when mounted on the circuit board 140 can be effectively reduced. Furthermore, by providing a cutout 141 within the groove 145, the circuit board 140 can be prevented from obstructing the second photosensitive surface 112 of the image sensor 110, thereby ensuring the imaging effect of the image sensor 110.

[0044] like Figures 3 to 12As shown, in some embodiments of this application, the first photosensitive surface 111 includes a first imaging region 113 and a first connecting region 114. The first connecting region 114 is located outside the first imaging region 113, and the first photosensitive component 117 is located inside the first imaging region 113. The first connecting region 114 is used to connect with the circuit board 140. The second photosensitive surface 112 includes a second imaging region 115 and a second connecting region 116. The second connecting region 116 is located outside the second imaging region 115, and the second photosensitive component 118 is located inside the second imaging region 115. The second imaging region 115 is disposed opposite to the cutout 141, and the second connecting region 116 is used to connect with the circuit board 140. The area of ​​the cutout 141 is larger than the area of ​​the second imaging region 115.

[0045] In this embodiment, the first photosensitive surface 111 includes a first imaging region 113 and a first connecting region 114. The first connecting region 114 at least partially surrounds the first imaging region 113, that is, the first imaging region 113 is located inside the first connecting region 114. A first photosensitive component 117 for sensing light is disposed within the first imaging region 113. The first lens 120 can transmit light to the first imaging region 113 of the first photosensitive surface 111. The first photosensitive component 117 within the first imaging region 113 can sense light and form a first pixel signal.

[0046] Specifically, the first connection area 114 is provided with COB (Chip-on-Board) pads, and the image sensor 110 is directly bonded to the circuit board 140 by wire bonding to achieve electrical connection between the chip and the circuit board 140. The first connection area 114 is disposed opposite to the third connection area 142 on the circuit board 140. The third connection area 142 is provided with metal pads, which are connected to the COB pads of the first connection area 114 of the image sensor 110 through the connecting line 170, thereby realizing the electrical connection between the first photosensitive component 117 located in the first imaging area 113 and the circuit board 140, enabling signal transmission between the circuit board 140 and the first photosensitive component 117.

[0047] In this embodiment, the second photosensitive surface 112 includes a second imaging region 115 and a second connecting region 116. The second connecting region 116 at least partially surrounds the second imaging region 115, that is, the second imaging region 115 is located inside the second connecting region 116. A second photosensitive component 118 for sensing light is disposed within the second imaging region 115. The second lens 130 can transmit light to the second imaging region 115 of the second photosensitive surface 112. The second photosensitive component 118 within the second imaging region 115 can sense light and form a second pixel signal.

[0048] Specifically, the second connection area 116 is provided with CSP pads, and the fourth connection area 143 of the circuit board 140 is provided with metal pads. The CSP pads of the second connection area 116 and the metal pads of the fourth connection area 143 of the circuit board 140 are connected by a connecting line 170, thereby realizing the electrical connection between the second photosensitive component 118 in the second imaging area 115 and the circuit board 140, enabling signal transmission between the circuit board 140 and the second photosensitive component 118. The CSP pads in the second connection area 116 are shielded after being connected to the circuit board 140 by soldering, while the second photosensitive component 118 in the second imaging area 115 is within the cutout 141 and is not shielded.

[0049] For example, components 180 on circuit board 140 are connected to circuit board 140 via component pads 144.

[0050] It should be noted that the second imaging area 115 is positioned opposite to the cutout 141, and the area of ​​the cutout 141 is larger than that of the second imaging area 115, so that the cutout 141 can completely cover the second imaging area 115, allowing light to pass through the cutout 141 and be transmitted to the second imaging area 115, thereby improving the photosensitive imaging effect of the second photosensitive component 118 in the second imaging area 115.

[0051] In this embodiment, a first connection area 114 and a first imaging area 113 are provided on the first photosensitive surface 111 of the image sensor 110. The first connection area 114 can be stably connected to the circuit board 140, and the first photosensitive component 117 in the first imaging area 113 can be electrically connected to the circuit board 140 through the pad pins on the first connection area 114. A second connection area 116 and a second imaging area 115 are provided on the second photosensitive surface 112 of the image sensor 110. The second connection area 116 can be stably connected to the circuit board 140, and the second photosensitive component 118 in the second imaging area 115 can be electrically connected to the circuit board 140 through the pad pins on the second connection area 116. Furthermore, the area of ​​the cutout 141 on the circuit board 140 is larger than the area of ​​the second imaging area 115, further preventing the circuit board 140 from blocking the light transmitted to the second imaging area 115 and improving the imaging effect of the camera module 100.

[0052] like Figure 1As shown, in some embodiments of this application, the camera module 100 further includes: a frame 150, a circuit board 140, a first lens 120 and a second lens 130, all disposed in the frame 150, with the first lens 120 and the second lens 130 located on opposite sides of the circuit board 140; a first filter 151 disposed in the frame 150, located between the image sensor 110 and the first lens 120; and a second filter 152 disposed in the frame 150, located between the image sensor 110 and the second lens 130.

[0053] In this embodiment, the camera module 100 further includes a frame 150, which supports the circuit board 140, the first lens 120, and the second lens 130. A first filter 151 is disposed on the frame 150 between the first lens 120 and the first photosensitive surface 111, and a second filter 152 is disposed between the second lens 130 and the second photosensitive surface 112. The first filter 151 filters the light transmitted from the first lens 120 to the first photosensitive surface 111, improving the imaging effect of the first photosensitive component 117 on the first photosensitive surface 111. The second filter 152 filters the light transmitted from the second lens 130 to the second photosensitive surface 112, improving the imaging effect of the second photosensitive component 118 on the second photosensitive surface 112.

[0054] Specifically, the first filter 151 and the second filter 152 are both used for infrared light filtering to improve the color accuracy of the first photosensitive component 117 and the second photosensitive component 118. The first filter 151 and the second filter 152 are also used for ultraviolet light filtering to improve the imaging clarity of the first photosensitive component 117 and the second photosensitive component 118.

[0055] For example, the first filter 151 and the second filter 152 may be blue glass filters.

[0056] Figure 13 This application shows a second example of an image sensor circuit diagram provided in some embodiments, such as... Figure 2 and Figure 13 As shown, the image sensor 110 further includes a switching assembly 119, the first end of which is connected to the output end of the first photosensitive assembly 117, the second end of which is connected to the second photosensitive assembly 118, and the control end of the switching assembly 119 is used to receive a control signal, which is used to control the on / off state of the first end to the output end of the switching assembly 119, and to control the on / off state of the second end to the output end of the switching assembly 119.

[0057] In this embodiment, the image sensor 110 further includes a switching component 119. The first and second ends of the switching component 119 are respectively connected to the output ends of the first photosensitive component 117 and the second photosensitive component 118. That is, the first pixel signal output by the first photosensitive component 117 can be transmitted to the first end of the switching component 119, and the second pixel signal output by the second photosensitive component 118 can be transmitted to the second end of the switching component 119. The control end of the switching component 119 is used to receive control signals and, in response to the received control signals, can control the on / off state of the first end to the output end and the on / off state of the second end to the output end of the switching component 119. By controlling the on / off states of the first and second ends of the switching component 119, the switching component 119 can select to output either the first pixel signal or the second pixel signal.

[0058] Specifically, in response to the control signal, the switch assembly 119 is turned on from the first end to the output end and turned off from the second end to the output end. The first pixel signal generated by the first photosensitive component 117 is transmitted outward through the switch assembly 119. At this time, the power supply signal to the second photosensitive component 118 can be stopped, so that the second photosensitive component 118 stops operating to save power.

[0059] In response to the control signal, the second terminal of the switch assembly 119 is turned on to the output terminal, and the first terminal of the switch assembly 119 is turned off to the output terminal. The second pixel signal generated by the second photosensitive component 118 is transmitted outward through the switch assembly 119. At this time, the power supply signal to the first photosensitive component 117 can be stopped, so that the first photosensitive component 117 stops operating to save power.

[0060] In this embodiment, a switch component 119 is provided in the image sensor 110. The switch component 119 can control the transmission of the first pixel signal generated by the first photosensitive component 117 or the transmission of the second pixel signal generated by the second photosensitive component 118, so that the image sensor 110 can flexibly select the pixel signal to be output. When the camera module 100 is installed in the electronic device, the front and rear lenses of the electronic device can be switched quickly.

[0061] like Figure 2 and Figure 13As shown, in some embodiments of this application, the switching assembly 119 includes: a first switching transistor T1, the first end of which is connected to the output end of the first photosensitive assembly 117, the second end of which is the output end of the switching assembly 119, and the control end of which is used to receive control signals; and a second switching transistor T2, the first end of which is connected to the output end of the second photosensitive assembly 118, the second end of which is the output end of the switching assembly 119, and the control end of which is used to receive control signals.

[0062] In this embodiment, the switching component 119 includes a first switch transistor T1 and a second switch transistor T2. The first switch transistor T1 controls whether the first pixel signal output by the first photosensitive component 117 is transmitted outward, and the second switch transistor T2 controls whether the second pixel signal output by the second photosensitive component 118 is transmitted outward. The control terminals of the first and second switches T1 together serve as the control terminals of the switching component 119. The first terminal of the first switch transistor T1 serves as the first terminal of the switching component 119, and the first terminal of the second switch transistor T2 serves as the second terminal of the switching component 119. The second terminals of the first and second switches T2 together serve as the output terminals of the switching component 119.

[0063] For example, the control terminals of the first switch T1 and the second switch T2 are connected, enabling the first switch T1 and the second switch T2 to receive control signals synchronously. Specifically, for example, the first switch T1 is turned on with a high-level signal and turned off with a low-level signal; the second switch T2 is turned off with a high-level signal and turned on with a low-level signal. By transmitting a high-level control signal to the switching assembly 119, the first switch T1 is turned on and the second switch T2 is turned off, or by transmitting a low-level control signal to the switching assembly 119, the first switch T1 is turned off and the second switch T2 is turned on.

[0064] In this embodiment, a first switch T1 and a second switch T2 are provided in the switch assembly 119. The first switch T1 is connected to the first photosensitive assembly 117, and the second switch T2 is connected to the second photosensitive assembly 118. This enables accurate control over whether the first pixel signal and the second pixel signal generated by the first photosensitive assembly 117 and the second photosensitive assembly 118 are transmitted outward. When the camera module 100 is installed in the electronic device, the switching efficiency between the front and rear lenses of the electronic device is further improved.

[0065] like Figure 2 and Figure 13As shown, in some embodiments of this application, the number of the first photosensitive component 117, the second photosensitive component 118, and the switching component 119 are all at least two. The image sensor 110 also includes at least two analog-to-digital converters (ADCs), the input terminals of the at least two ADCs are connected to the output terminals of the at least two switching components 119 in a one-to-one correspondence, and the output terminals of the at least two ADCs are connected to the data output bus 160.

[0066] In this embodiment, there are multiple first photosensitive components 117 and multiple second photosensitive components 118. Multiple first photosensitive components 117 are disposed on the first photosensitive surface 111 to form a first pixel array, and multiple second photosensitive components 118 are disposed on the second photosensitive surface 112 to form a second pixel array. The image sensor 110 is also provided with at least two analog-to-digital converters (ADCs). The at least two ADCs correspond one-to-one with at least two first photosensitive components 117, at least two second photosensitive components 118, and at least two switching components 119. The ADCs can convert the first pixel signal or the second pixel signal into a digital signal, which is convenient for the subsequent image processor to generate a first image based on the first pixel signal or a second image based on the second pixel signal.

[0067] like Figure 2 and Figure 13 As shown, in some embodiments of this application, the first photosensitive component 117 includes: a first photosensitive element PD1, the positive terminal of the first photosensitive element PD1 being grounded; a third switch transistor T3, the first terminal of the third switch transistor T3 being connected to the negative terminal of the first photosensitive element PD1; a fourth switch transistor T4, the first terminal of the fourth switch transistor T4 being connected to the second terminal of the third switch transistor T3, the second terminal of the fourth switch transistor T4 being used to receive a power supply signal; a fifth switch transistor T5, the first terminal of the fifth switch transistor T5 being used to receive a power supply signal, the control terminal of the fifth switch transistor T5 being connected to the second terminal of the third switch transistor T3; and a sixth switch transistor T6, the first terminal of the sixth switch transistor T6 being connected to the second terminal of the fifth switch transistor T5, the second terminal of the sixth switch transistor T6 being the output terminal of the first photosensitive component 117.

[0068] In this embodiment, the first photosensitive component 117 includes a third switch T3, a fourth switch T4, a fifth switch T5, and a sixth switch T6 for controlling the first photosensitive element PD1. When the first photosensitive element PD1 acquires light signals, the third switch T3, the fourth switch T4, the fifth switch T5, and the sixth switch T6 are controlled to be in a conducting state. The second end of the sixth switch T6 is the output end of the first photosensitive component 117. Signals can be transmitted outward through the second end of the sixth switch T6, thereby converting the light signals acquired by the first photosensitive element PD1 into first pixel signals and transmitting them to the switching component 119. The signals are then transmitted outward through the switching component 119, improving the accuracy of first pixel signal acquisition. Furthermore, the fourth switch T4 and the fifth switch T5 are both connected to the power supply VC and can receive power supply signals, thereby enabling individual control over whether the first photosensitive component 117 is operating. This further improves the flexibility of the camera module 100 in switching between the first photosensitive component 117 and the second photosensitive component 118 for imaging.

[0069] like Figure 2 and Figure 13 As shown, in some embodiments of this application, the second photosensitive component 118 includes: a second photosensitive element PD2, the positive terminal of the second photosensitive element PD2 being grounded; a seventh switch T7, the first terminal of the seventh switch T7 being connected to the negative terminal of the second photosensitive element PD2; an eighth switch T8, the first terminal of the eighth switch T8 being connected to the second terminal of the seventh switch T7, the second terminal of the eighth switch T8 being used to receive a power supply signal; a ninth switch T9, the first terminal of the ninth switch T9 being used to receive a power supply signal, the control terminal of the ninth switch T9 being connected to the second terminal of the seventh switch T7; and a tenth switch T10, the first terminal of the tenth switch T10 being connected to the second terminal of the ninth switch T9, the second terminal of the tenth switch T10 being the output terminal of the second photosensitive component 118.

[0070] In this embodiment, the second photosensitive component 118 includes a seventh switch T7, an eighth switch T8, a ninth switch T9, and a tenth switch T10 for controlling the second photosensitive element PD2. When the second photosensitive element PD2 acquires light signals, the seventh switch T7, the eighth switch T8, the ninth switch T9, and the tenth switch T10 are controlled to be in a conducting state. The second end of the tenth switch T10 is the output end of the second photosensitive component 118. Signals can be transmitted outward through the second end of the tenth switch T10, thereby converting the light signals acquired by the second photosensitive element PD2 into first pixel signals and transmitting them to the switching component 119. The signals are then transmitted outward through the switching component 119, improving the accuracy of first pixel signal acquisition. Furthermore, the eighth switch T8 and the ninth switch T9 are both connected to the power supply VC and can receive power supply signals, thereby enabling individual control over whether the second photosensitive component 118 is operating. This further improves the flexibility of the camera module 100 in switching between the second photosensitive component 118 and the second photosensitive component 118 imaging.

[0071] In some embodiments of this application, an electronic device is provided. Figure 14 This illustration shows one of the structural schematic diagrams of the electronic device provided in some embodiments of this application. Figure 15 The second schematic diagram of the structure of the electronic device provided in some embodiments of this application is shown, such as... Figure 14 and Figure 15 As shown, the electronic device 200 includes: a camera module 100 in any of the above embodiments; a rear cover plate 201, on which a first lens 120 of the camera module 100 is disposed; and a front cover plate 202, which is disposed opposite to the rear cover plate 201, on which a second lens 130 of the camera module 100 is disposed.

[0072] In this embodiment, the first lens 120 and the first photosensitive component in the image sensor form a first imaging system, and the second lens 130 and the second photosensitive component in the image sensor form a second imaging system. The first and second imaging systems share the same image sensor, eliminating the need for separate image sensors and corresponding electrical components for each imaging system. This reduces the size of the camera module 100 and the space it occupies within the electronic device 200. It should be noted that the first lens 120 and the second lens 130 are axially aligned, making the lateral dimension of the camera module 100 only the size of one lens, thus saving space in the lateral direction.

[0073] In this embodiment, the first and second photosensitive components in the image sensor can share the same circuit board, further reducing the space occupied by the camera module 100 within the electronic device 200, and saving the hardware and circuit design costs of one circuit board. Furthermore, when switching between outputting a first pixel signal via the first photosensitive component and outputting a second pixel signal via the second photosensitive component, there is no need to disconnect the power supply signal from the circuit board to the image sensor; switching can be performed quickly via software, improving the rapid switching and capture effect of the camera module 100. Because the image sensor includes both a first and a second photosensitive component, the metal content inside the image sensor is relatively increased. This increases the operating time for the image sensor to reach its temperature equilibrium point during operation, thus improving the imaging effect of the image sensor.

[0074] The first and second photosensitive surfaces are two photosensitive surfaces that are opposite to each other in the image sensor. That is, the light-inlet end of the first lens 120 and the light-inlet end of the second lens 130 are also set opposite to each other. Therefore, when the camera module 100 is set inside the electronic device 200, the first lens 120 and the second lens 130 can be used as the front lens and the rear lens of the electronic device 200, respectively. This allows the front lens and the rear lens of the electronic device 200 to share the same image sensor, reducing the space occupied by the camera module 100 inside the electronic device 200. Furthermore, when the electronic device 200 switches between the front lens and the rear lens, there is no need to power off the image sensor, saving the power-on and power-off time required for switching between the front lens and the rear lens, which is convenient for quick capture.

[0075] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0076] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A camera module, comprising: include: An image sensor, the image sensor including a first photosensitive surface and a second photosensitive surface opposite to each other, the first photosensitive surface being provided with a first photosensitive component, and the second photosensitive surface being provided with a second photosensitive component; A first lens is disposed opposite to the first photosensitive surface, and the first lens is used to transmit light to the first photosensitive surface; The second lens is positioned opposite the second photosensitive surface and is used to transmit light to the second photosensitive surface.

2. The camera module of claim 1, wherein, Also includes: A circuit board is located between the first lens and the second lens. The circuit board has a groove with a cutout inside. The image sensor is disposed inside the groove. The first photosensitive surface is disposed away from the circuit board, and the second photosensitive surface is disposed towards the circuit board. The cutout is used to allow light to be transmitted to the second photosensitive surface.

3. The camera module of claim 2, wherein, The first photosensitive surface includes a first imaging area and a first connecting area. The first connecting area is located outside the first imaging area, the first photosensitive component is located within the first imaging area, and the first connecting area is used to connect to the circuit board. The second photosensitive surface includes a second imaging area and a second connecting area. The second connecting area is located outside the second imaging area, the second photosensitive component is located within the second imaging area, and the second imaging area is disposed opposite to the cutout. The second connecting area is used to connect to the circuit board. The area of ​​the cutout is larger than the area of ​​the second imaging region.

4. The camera module of claim 2, wherein, Also includes: The frame, the circuit board, the first lens and the second lens are all disposed in the frame, and the first lens and the second lens are located on both sides of the circuit board; A first filter is disposed in the frame and is located between the image sensor and the first lens; A second filter is disposed in the frame and is located between the image sensor and the second lens.

5. The camera module according to any one of claims 1 to 4, wherein, The image sensor also includes: A switching assembly, wherein a first end of the switching assembly is connected to the output end of the first photosensitive component, a second end of the switching assembly is connected to the second photosensitive component, and a control end of the switching assembly is used to receive a control signal, the control signal being used to control the on / off state of the first end to the output end of the switching assembly, and to control the on / off state of the second end to the output end of the switching assembly.

6. The camera module of claim 5, wherein, The switching assembly includes: A first switching transistor, the first end of which is connected to the output end of the first photosensitive component, the second end of which is the output end of the switching component, and the control end of which is used to receive the control signal. The second switch has a first end connected to the output end of the second photosensitive component, a second end of the second switch being the output end of the switch component, and a control end of the second switch being used to receive the control signal.

7. The camera module of claim 5, wherein, The number of the first photosensitive component, the second photosensitive component, and the switching component are all at least two, and the image sensor further includes: At least two analog-to-digital converters are provided, with the input terminals of the at least two analog-to-digital converters connected one-to-one with the output terminals of the at least two switching components, and the output terminals of the at least two analog-to-digital converters are connected to a data output bus.

8. The camera module of claim 5, wherein, The first photosensitive component includes: The first photosensitive element, with its positive terminal grounded; The third switch transistor, the first end of which is connected to the negative terminal of the first photosensitive element; The fourth switch is connected at its first end to the second end of the third switch, and the second end of the fourth switch is used to receive power supply signals. The fifth switch has a first terminal for receiving power supply signals and a control terminal connected to the second terminal of the third switch. The sixth switch is connected at its first end to the second end of the fifth switch, and the second end of the sixth switch is the output end of the first photosensitive component.

9. The camera module of claim 5, wherein, The second photosensitive component includes: The second photosensitive element, with its positive terminal grounded; The seventh switch transistor, the first end of which is connected to the negative terminal of the second photosensitive element; The eighth switch is connected at its first end to the second end of the seventh switch, and the second end of the eighth switch is used to receive power supply signals. The ninth switch has a first terminal for receiving a power supply signal and a control terminal connected to the second terminal of the seventh switch. The tenth switch is connected at its first end to the second end of the ninth switch, and the second end of the tenth switch is the output end of the second photosensitive component.

10. An electronic device, comprising: include: The camera module as described in any one of claims 1 to 9; The rear cover plate, on which the first lens of the camera module is disposed; A front cover is disposed opposite to the rear cover, and the second lens of the camera module is disposed on the front cover.

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