Radiator mold, radiator and electronic equipment

Abstract

The utility model provides a radiator mold, a radiator and electronic equipment, the radiator mold comprises an upper mold, a lower mold and a support pillar structure, the upper mold is provided with a plurality of pillar holes, the plurality of pillar holes are arranged at intervals to form a growth area, and the position, corresponding to the growth area, of the lower mold is used for placing a to-be-processed plate. The top column structure comprises a first sub-part, the first sub-part comprises a plurality of first top columns and a first substrate, the first top columns are connected to the first substrate, the first top columns are arranged around the edge of the growth area, the first top columns correspond to column holes in the edge of the growth area in a one-to-one mode, the first top columns are inserted into the corresponding column holes, and the first substrate is arranged on the first sub-part. The first base plate is movably arranged on the upper die along the forming path of the column hole, the upper die is further provided with an elastic piece, and the elastic piece is located on the moving path of the first base plate and used for providing pressure towards the lower die for the first base plate. When the radiator die is used for forging a radiator, the overall yield of the radiator can be remarkably improved, returned materials are reduced, and the forging tonnage and the forging difficulty can be reduced.

Description

Technical Field

[0001] This application relates to the field of radiator technology, and more particularly to a radiator mold, a radiator, and electronic equipment. Background Technology

[0002] In recent years, the new energy vehicle industry has developed rapidly, and many automotive-related electronic and electrical devices involve heat dissipation issues. Furthermore, with the development of high-voltage platforms and fast-charging technologies in new energy vehicles, power density is constantly increasing, placing increasingly higher demands on heat dissipation. As a high-power-density component, the motor controller of a new energy vehicle inevitably generates a large amount of heat during the prolonged operation of its IGBT power modules. To ensure the stable operation of the IGBT power modules, one of the core components is the heat sink. The heat sink effectively dissipates heat, ensuring the components operate within a suitable temperature range, extending their lifespan; simultaneously, it reduces power loss caused by high temperatures, improving efficiency.

[0003] The current radiator manufacturing process generally involves: blanking → forging → shaping and needle cutting → machining → sandblasting → cleaning → electroplating → arc pressing. The forging dies currently used include... Figure 1 As shown, it includes two mold bodies, A and B. The upper mold body has a pin hole that penetrates through the upper mold body. The lower mold body is used to place the workpiece to be processed. The workpiece to be processed is generally a metal plate structure. During forging, the workpiece to be processed is placed in the lower mold body, and then the upper and lower mold bodies are closed. During the process of closing the upper and lower mold bodies, the workpiece to be processed is squeezed, and the material of the workpiece to be processed flows into the pin hole of the upper mold body to form a pin column.

[0004] In existing forging processes for radiators, the stress distribution during forging is uneven due to process characteristics. This results in greater stress at the edges of the workpiece compared to the center. Furthermore, current technologies typically use plate-like structures of uniform thickness for the workpiece. This leads to uneven material flow during pin formation. While material flows into the pin holes corresponding to the workpiece's pin locations, material near the edges is squeezed into the edge areas, resulting in more material flowing into them. This causes a stronger growth trend in the edge regions, while the center region experiences less material flow, limiting pin growth. Consequently, the forged pins on the workpiece are uneven in height, exhibiting a shape that is higher around the edges and lower in the center, with the edge pins significantly taller than those in the center. This has a significant impact on the yield of the pins during production, resulting in more waste material during the subsequent pin cutting process. On the other hand, because the minimum pin needs to meet the minimum requirements of the radiator application equipment, the overall height of the pins needs to be increased, which requires greater pressure during forging and increases the difficulty of forging. Utility Model Content

[0005] This application provides a radiator mold, a radiator, and an electronic device. When manufacturing a radiator using the radiator mold, the overall yield of the radiator can be significantly improved, the amount of recycled material can be reduced, and the forging tonnage and forging difficulty can be reduced.

[0006] The first aspect of this application provides a heat sink mold, including an upper mold, a lower mold, and a top pillar structure. The upper mold is provided with a plurality of pillar holes, which are arranged at intervals to form a growth area. The lower mold is movably disposed relative to the upper mold and is used to place a plate to be processed at a position corresponding to the growth area. The top pillar structure includes a first sub-part, which includes a first top pillar and a first base plate. A plurality of first top pillars are provided and are all connected to the first base plate. The plurality of first top pillars are disposed around the edge of the growth area, and the pillar holes of the first top pillars and the edge of the growth area correspond one-to-one. The end of the first top pillar away from the pillar hole is inserted into the corresponding pillar hole. The first base plate is movably disposed on the upper mold along the opening path of the pillar hole. The upper mold is also provided with an elastic member located on the moving path of the first base plate and used to provide pressure to the first base plate toward the lower mold.

[0007] The heat sink mold of this application inserts a first ejector pin into a pin hole at the edge of the growth area. When the heat sink pins are grown using the extrusion action between the upper and lower molds, the pins at the edge of the growth area can abut against the first ejector pin during growth. Because the first substrate has an elastic element that provides elastic force, the elastic force can be transmitted from the first substrate to the first ejector pin. Therefore, the growth of the pins at the edge of the growth area is affected by the elastic force on the first ejector pin, which obstructs the flow of the workpiece toward the edge. This makes the flow of material into the pin hole at the edge of the workpiece more uniform than that in the middle position. This slows down the growth rate of the pins at the edge of the workpiece, thereby reducing the height difference between the growth height of the pins at the edge and the growth height of the pins in the middle position. This helps to make the height of the pins at the edge and the height of the pins in the middle position flush, reducing the amount of recycled material when cutting the pins flat. This can significantly improve the overall yield of the heat sink, saving materials and reducing costs.

[0008] Furthermore, this application restricts the flow of material from the workpiece into the column holes at the edge of the growth area by using the first top column, so that the material of the workpiece can flow evenly to each column hole, making the amount of material in each column hole approximately the same. Therefore, the length of the needle column grown in each column hole is approximately the same. Thus, when the upper and lower dies apply pressure to the workpiece to grow the needle column, the pressure between the two does not need to be too large to grow the middle needle column to the preset height, reducing the forging tonnage and the difficulty of forging.

[0009] In addition, since the growth of the edge pins of the workpiece is restricted, in addition to the force exerted by the hole wall on the peripheral wall of the pin during growth, the first top pin also applies force to the end of the pin. This causes the pin to be subjected to pressure in more directions during forming. These pressures together compress the pin, making the structure of the pin more compact and the quality better.

[0010] In one possible implementation, the upper mold has an internal accommodating space that is connected to the end of the post hole away from the lower mold. The opening direction of the accommodating space is the same as the opening direction of the post hole. The first substrate moves within the accommodating space, and the shape and size of the first substrate are the same as the shape and size of the accommodating space.

[0011] In one possible implementation, the upper mold includes a first mold body and a locking plate, the locking plate being detachably connected to the first mold body, the column hole being formed in the first mold body, a receiving groove being formed at one end of the locking plate, the end of the locking plate having the receiving groove being connected to the first mold body, the receiving groove communicating with the column hole, and the receiving groove being used to form the receiving space.

[0012] In one possible implementation, the elastic member is located within the receiving groove, with its two ends abutting against the bottom of the receiving groove and the end of the first substrate facing away from the first top post, respectively.

[0013] And / or, the locking plate is further provided with a guide post, the guide post protruding from the bottom of the receiving groove toward the first substrate, and the elastic element is sleeved on the guide post.

[0014] In one possible implementation, the top post structure further includes a second sub-part comprising a second substrate and a second top post, the second top post being connected to the second substrate and inserted into a post hole in the middle of the growth region.

[0015] In one possible implementation, the first substrate is arranged in a ring, and the second substrate passes through the space enclosed by the inner ring of the first substrate, wherein the shape and size of the inner ring of the first substrate are the same as the shape and size of the second substrate.

[0016] In one possible implementation, the second substrate is fixedly connected to the upper mold, and the initial length of the second top post inserted into the post hole is less than the initial length of the first top post inserted into the post hole.

[0017] In one possible implementation, the second substrate is fixedly connected to the first substrate, and the initial length of the second top post inserted into the post hole is equal to the initial length of the first top post inserted into the post hole.

[0018] In one possible implementation, the lower mold includes a second mold body and a pusher, the second mold body being provided with a through groove, the pusher being disposed within the through groove, and the workpiece to be processed being located within the through groove and placed on the pusher.

[0019] In one possible implementation, the workpiece is a metal plate structure, and the thickness of the edge of the workpiece is less than the thickness of the middle of the workpiece.

[0020] The second aspect of this application provides a radiator formed using the aforementioned radiator mold.

[0021] A third aspect of this application provides an electronic device, including a device body and a heat sink as described above. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 A cross-sectional view of a radiator mold provided according to some embodiments of this application is shown;

[0024] Figure 2 An exploded view of a radiator mold provided according to some embodiments of this application is shown;

[0025] Figure 3 A cross-sectional view of the upper mold provided according to some embodiments of this application is shown.

[0026] Figure 4 A schematic diagram of the structure of a locking plate provided according to some embodiments of this application is shown;

[0027] Figure 5 A cross-sectional view of the top column structure provided according to some embodiments of this application is shown;

[0028] Figure 6 A front view of a workpiece to be processed according to some embodiments of this application is shown;

[0029] Figure 7 A side view of a workpiece to be processed according to some embodiments of this application is shown.

[0030] Figure label:

[0031] 10. Upper mold; 11. First mold body; 111. Column hole; 12. Screw hole; 13. Locking plate; 131. Countersunk hole; 132. Receiving groove; 133. Guide post; 14. Connector; 20. Lower mold; 21. Second mold body;

[0032] 211. Through slot; 22. Pusher component; 30. Top pillar structure; 31. First sub-section; 311. First substrate;

[0033] 312, guide hole; 313, first top post; 32, second sub-part; 321, second substrate; 322, second top post; 40, elastic element; 50, workpiece to be processed. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0035] See Figure 1 and Figure 2 As shown, this application provides a radiator mold for manufacturing radiators. In some feasible embodiments, the radiator mold includes an upper mold 10, a lower mold 20, and a top column structure 30. The upper mold 10 and the lower mold 20 of this application are the main body of the mold. Through the cooperation of the upper mold 10 and the lower mold 20, pin columns can be generated on the workpiece to be processed located between the upper mold 10 and the lower mold 20.

[0036] Specifically, the upper mold 10 is provided with a plurality of column holes 111, which are spaced apart and are opened along a straight line. One end of each column hole 111 is opened towards the lower mold 20, and the end of each column hole 111 extends to the end face of the upper mold 10 facing the lower mold 20 and is opened on the end face.

[0037] The lower mold 20 and the upper mold 10 are relatively movable. For example, the lower mold 20 can be fixed and the upper mold 10 can move relatively closer to or away from the lower mold 20, or the upper mold 10 can be fixed and the lower mold 20 can move relatively closer to or away from the upper mold 10, or both the upper mold 10 and the lower mold 20 can move, and the upper mold 10 and the lower mold 20 can move relative to each other and away from each other.

[0038] The lower mold 20 has a column hole 111 at the position corresponding to the upper mold 10 for placing the plate to be processed. The multiple column holes 111 of the upper mold 10 are arranged at intervals to form a growth area. When the plate to be processed needs to be processed, the plate to be processed is first placed on the lower mold 20. Then, through the relative movement of the upper mold 10 and the lower mold 20, the end face of the upper mold 10 facing the lower mold 20 abuts against the plate to be processed. Continuing to move the upper mold 10 and the lower mold 20 toward each other can squeeze the plate to be processed. Part of the structure of the plate to be processed is squeezed into the column hole 111 due to the force, thereby forming heat dissipation pins.

[0039] The top pillar structure 30 is disposed on the upper mold 10. The top pillar structure 30 includes a first sub-part 31, which includes a first top pillar 313 and a first substrate 311. Multiple first top pillars 313 are provided, and all of the multiple first top pillars 313 are connected to the first substrate 311. The first top pillars 313 can be connected to the first substrate 311 by bonding or welding, or the first top pillars 313 can be integrally formed with the first substrate 311.

[0040] The first substrate 311 of this application is connected to the upper mold 10. When the first substrate 311 is connected to the upper mold 10, a plurality of first top posts 313 are arranged around the edge of the growth area. The plurality of first top posts 313 are spaced apart, and the plurality of first top posts 313 correspond one-to-one with the post holes 111 located at the edge of the growth area.

[0041] It should be noted that the shape and dimensions of the first ejector pin 313 are consistent with those of the pin hole 111, allowing the first ejector pin 313 to be inserted into the pin hole 111. Specifically, the first ejector pin 313 is inserted into the pin hole 111 from the end away from the lower mold 20. The first substrate 311 is movably disposed along the opening path of the pin hole 111, and when the first substrate 311 moves, it can drive the first ejector pin 313 to move within the pin hole 111. The upper mold 10 is also provided with an elastic member 40, which is located on the moving path of the first substrate 311 and is used to provide pressure to the first substrate 311 toward the lower mold 20, so that the first ejector pin 313 has a tendency to move toward the lower mold 20.

[0042] It should be noted that the first top post 313 is inserted into the post hole 111, that is, the first top post 313 is located on the growth path of the heat sink pin. When the first top post 313 of this application is inserted into the post hole 111, the remaining empty length inside the post hole 111 needs to be less than the length of the heat sink pin that needs to be formed in the post hole 111, so that the pin can abut against the first top post 313 during the growth process.

[0043] The heat sink mold of this application is provided with a top pillar structure 30. The top pillar structure 30 includes a first sub-part 31. The first sub-part 31 includes a first base plate 311 and a plurality of first top pillars 313. The first base plate 311 is movably disposed relative to the upper mold 10. The plurality of first top pillars 313 are all connected to the first base plate 311. By connecting the plurality of first top pillars 313 to the first base plate 311, the first top pillars 313 and the first base plate 311 can form an integral structure, which is beneficial to uniformly transmit the elastic force of the elastic member 40 from the first base plate 311 to each first top pillar 313. This application inserts the first ejector pin 313 into the pin hole 111 at the edge of the growth area. When the heat sink pins are grown using the extrusion action between the upper die 10 and the lower die 20, the pins located at the edge of the growth area can abut against the first ejector pin 313 during growth. Furthermore, because the first substrate 311 has the elastic force provided by the elastic element 40, this elastic force can be transmitted from the first substrate 311 to the first ejector pin 313. Therefore, the growth of the pins at the edge of the growth area is affected by the elastic force on the first ejector pin 313, causing the flow of the workpiece towards the edge to be controlled. This design ensures a more uniform flow of material into the column holes 111 at the edges and the middle of the workpiece. This slows down the growth rate of the needles at the edges, reducing the height difference between the edge and middle needles. This helps to make the needle heights at the edges and the middle needle heights equal, reducing the amount of recycled material when cutting the needles flat. This significantly improves the overall yield of the radiator, saving materials and reducing costs.

[0044] In related technologies, when growing pins on a workpiece, the material flowing into the pin holes 111 at the edge of the growth area is relatively more than the material flowing into the middle pin holes 111. Therefore, the pins at the upper edge of the workpiece grow faster than the middle pins, and the height of the middle pins is easily lower than the preset height. Thus, it is necessary to increase the forging tonnage so that the extrusion pressure between the upper die 10 and the lower die 20 is greater than the preset pressure to compress the height of the middle pins to meet the preset height. This application restricts the flow of material from the workpiece into the pin holes 111 at the edge of the growth area using the first top post 313, allowing the material to flow evenly into each pin hole 111, making the amount of material in each pin hole 111 approximately the same. Therefore, the length of the pins grown in each pin hole 111 is approximately the same. Thus, when applying pressure to the workpiece using the upper die 10 and the lower die 20 to grow the pins, the pressure between them does not need to be excessive to grow the middle pins to the preset height, reducing the forging tonnage and the difficulty of forging.

[0045] In addition, since the growth of the edge pins of the workpiece is restricted, in addition to the force exerted by the hole wall of the pin hole 111 on the peripheral wall of the pin during growth, the first top pin 313 also applies force to the end of the pin. This causes the pin to be subjected to pressure in more directions during forming. These pressures together compress the pin, making the structure of the pin more compact and the quality better.

[0046] See Figures 1 to 4 As shown, in some feasible implementations, the upper mold 10 has an accommodating space located inside the pillar hole 111 away from the lower mold 20, and the accommodating space is connected to the end of the pillar hole 111 away from the lower mold 20. The opening direction of the accommodating space is consistent with the opening direction of the pillar hole 111. The first substrate 311 moves within the accommodating space, and the first substrate 311 can move towards or away from the pillar hole 111 within the accommodating space. It should be noted that the external dimensions of the first substrate 311 are consistent with the shape dimensions of the accommodating space, so that the first substrate 311 fits within the accommodating space. The accommodating space can serve as the moving space for the first substrate 311, and at the same time, the accommodating space can also restrict the moving direction of the first substrate 311, so that the first substrate 311 moves in a straight line, and the moving direction is consistent with the opening direction of the pillar hole 111.

[0047] In this embodiment, the upper mold 10 includes a first mold body 11 and a locking plate 13, with one end of the locking plate 13 connected to the first mold body 11. A post hole 111 is formed in the first mold body 11, extending through the first mold body 11 from the end face of the first mold body 11 used for connection with the locking plate 13 in a direction opposite to the locking plate 13. A receiving groove 132 is formed on the end face of the locking plate 13 used for connection with the first mold body 11, creating a receiving space. One end of the locking plate 13 with the receiving groove 132 is connected to the first mold body 11, and the receiving groove 132 communicates with each post hole 111.

[0048] The elastic element 40 in this application can be a structural component made of an elastic material such as silicone or rubber. In this application, the elastic element 40 is described as a spring. Both the elastic element 40 and the first substrate 311 are located within the receiving groove 132. The elastic element 40 is located between the first substrate 311 and the groove wall (bottom of the receiving groove 132) away from the post hole 111. The two ends of the elastic element 40 abut against the bottom wall of the receiving groove 132 and the end of the first substrate 311 facing away from the first top post 313, respectively.

[0049] In the free state, the elastic element 40 is either compressed or neither compressed nor stretched. At this time, the end face of the first substrate 311 facing away from the elastic element 40 abuts against the end of the post hole 111 away from the lower mold 20. It can be understood that when the first substrate 311 moves away from the post hole 111, it will squeeze the elastic element 40, causing the elastic element 40 to compress and generate elastic force. This elastic force acts on the first substrate 311 to restrict its movement. When the edge pins of the workpiece grow to abut the first top post 313, the continued growth of the pins requires overcoming the elastic force of the elastic element 40. This prevents the material of the workpiece from flowing into the edge post hole 111, thus hindering the growth rate of the edge pins.

[0050] It should be noted that the locking plate 13 is also provided with a guide post 133, which is located in the receiving groove 132. When the locking plate 13 is connected to the first mold body 11, the guide post 133 extends toward the first mold body 11. The elastic element 40 of this application is sleeved on the guide post 133. By providing the guide post 133, the elastic element 40 can be sleeved on the guide post 133, which can prevent the elastic element 40 from bending during compression and ensure the stability of the magnitude and direction of the force applied by the elastic element 40 to the first substrate 311.

[0051] It is worth mentioning that the first substrate 311 is also provided with a guide hole 312 for accommodating the guide post 133 at the position corresponding to the guide post 133. When the first substrate 311 moves toward the guide post 133, the guide post 133 can be inserted into the guide hole 312. The guide hole 312 is used to make way for the guide post 133, preventing the first substrate 311 from hitting the guide post 133 and getting stuck during the movement. In addition, by providing the guide hole 312, the length of the guide post 133 can be made longer, so that the elastic member 40 is completely sleeved outside the guide post 133, ensuring that the elastic member 40 is not easily bent.

[0052] See Figure 1 and Figure 2As shown, in some feasible ways, the first mold body 11 and the locking plate 13 of this application are detachably connected. For example, the locking plate 13 can be connected to the first mold body 11 by a snap-fit ​​structure, a snap-fit ​​structure, or screws. Specifically, when the locking plate 13 and the first mold body 11 are connected by screws, the locking plate 13 is provided with a countersunk hole 131, which is a stepped hole that penetrates the locking plate 13. The first mold body 11 is provided with a screw hole 12, the position of which corresponds to the position of the countersunk hole 131 on the locking plate 13. The upper mold 10 is also provided with a connector 14, which is a bolt. The connector 14 can pass through the countersunk hole 131, the head of which can abut against the stepped position of the countersunk hole 131, and the connecting part (the part with external threads) of the connector 14 can be threadedly connected to the screw hole 12. The locking plate 13 can be connected to the first mold body 11 through the cooperation of the connector 14, the countersunk hole 131 and the screw hole 12, so that the two are not easy to separate.

[0053] In this embodiment, both the locking plate 13 and the first mold 11 are square structures. In order to ensure the stability of the connection between the locking plate 13 and the first mold 11, the four corners of the locking plate 13 and the four corners of the first mold 11 can be connected together by connectors 14.

[0054] See Figure 1 and Figure 2 As shown, in some possible implementations, the top pillar structure 30 further includes a second sub-part 32, which includes a second substrate 321 and a second top pillar 322. The second substrate 321 is connected to the first substrate 311, and the second top pillar 322 can be connected to the second substrate 321 by bonding or welding, or the second top pillar 322 can be integrally formed with the second substrate 321.

[0055] The first top post 313 is arranged around the edge of the workpiece to be processed, thus forming an enclosed space. The second top post 322 is located within the enclosed space of the first top post 313. Multiple second top posts 322 are provided, and each of the multiple second top posts 322 corresponds to a post hole 111 located in the middle of the growth area. The shape and size of the second top post 322 are adapted to the shape and size of the post hole 111. The second top post 322 is used to insert into the post hole 111 adapted to the middle of the growth area, so that all post holes 111 can be inserted with a top post.

[0056] The second ejector post 322 of this application can limit the growth length of the pin post at the middle position of the workpiece. Specifically, the second ejector post 322 is inserted into the pin hole 111 from the end facing away from the lower mold 20 and extends towards the lower mold 20. A certain amount of unfilled space is left at the end of the pin hole 111 near the lower mold 20, and the length of this unfilled space is greater than or equal to the length of the pin post to be grown on the workpiece. Thus, when the thickness of the workpiece has a significant error, the first ejector post 313 and the second ejector post 322 can limit the growth length of the pin post, ensuring that the length of the pin post does not exceed the predetermined length by too much.

[0057] See Figure 1 and Figure 2 As shown in the embodiment of this application, the first substrate 311 is arranged in a ring shape, and the second substrate 321 is disposed within the ring space enclosed by the first substrate 311. The shape and size of the inner ring of the first substrate 311 are the same as the outer dimensions of the second substrate 321. By arranging the first substrate 311 in a ring shape and disposing of the second substrate 321 within the inner ring of the first substrate 311, the thickness dimension when the two substrates are connected can be reduced, avoiding the problem of excessive thickness caused by the stacking of the two substrates and reducing the space occupied between the two substrates.

[0058] It should be noted that the inner ring shape of the first substrate 311 can be square, round or elliptical, etc., or the inner ring of the first substrate 311 is provided with a toothed groove, and the peripheral wall of the second substrate 321 is provided with a toothed connecting block. When the second substrate 321 is inserted into the inner ring of the first substrate 311, the toothed connecting block can be inserted into and adapted to the toothed groove.

[0059] In some feasible ways, the second substrate 321 can be fixedly connected to the upper mold 10, specifically by bonding or welding to the locking plate 13. The second substrate 321 is located in the receiving groove 132 of the locking plate 13. At this time, the initial length of the second top post 322 inserted into the post hole 111 is less than the initial length of the first top post 313 inserted into the post hole 111.

[0060] By fixing the second substrate 321 to the locking plate 13, the position of the second top post 322 in the post hole 111 can be fixed, thereby limiting the growth size of the pin post in the middle of the workpiece and making the growth size of the pin post more precise.

[0061] It should be noted that, combined together Figure 5As shown, the second substrate 321 can also be fixedly connected to the first substrate 311, allowing the second substrate 321 to move with the first substrate 311. In this case, the length of the first top post 313 inserted into the post hole 111 is equal to the length of the second top post 322 inserted into the post hole 111. By connecting the second substrate 321 to the first substrate 311, the second substrate 321 will also be subjected to the elastic force of the elastic member 40 when it moves away from the post hole 111. Thus, when the needle post grows on the workpiece, the needle post abuts against the second top post 322, and the second top post 322 can provide pressure to the end of the needle post, so that the needle post located in the middle position on the workpiece will also be subjected to forces in multiple directions during its growth, making the middle needle post structure more compact.

[0062] See Figure 1 and Figure 2 As shown, in some possible implementations, the lower mold 20 includes a second mold body 21 and a pusher 22. The second mold body 21 is provided with a through groove 211, and the pusher 22 passes through the through groove 211. The workpiece to be processed can be accommodated in the through groove 211, and the workpiece to be processed can be placed on the pusher 22.

[0063] Combination Figure 1 , Figure 6 and Figure 7 As shown, in some feasible methods, the workpiece 50 is a metal plate structure, such as a copper plate structure. In related technologies, the workpiece 50 produced has a uniform thickness. Due to the influence of material flow characteristics, when needles are grown on the workpiece 50, the needles at the edges of the workpiece 50 grow faster and are taller. Specifically, in the forging process of a copper busbar with uniform thickness, the position of the copper busbar used for growing needles is set directly opposite the needle hole 111. When the upper die 10 and the lower die 20 are used to extrude the copper busbar to grow needles, the material at the position of the copper busbar corresponding to the needle hole 111 can flow into the needle hole 111 to grow and form needles. The position of the copper busbar not used for growing needles will also generate material flow when it is extruded. The position of the copper busbar not used for growing needles is relatively close to the edge of the growth area. At this time, when the material flows, it must first pass through the needle hole 111 located at the edge of the growth area. That is, the material flowing into the needle hole 111 at the edge of the growth area increases. Therefore, the needles near the middle of the needle area grow shorter and the needles at the edge grow longer.

[0064] This application can make the growth of the needles more uniform by changing the shape of the workpiece 50. Specifically, the thickness of the edge of the workpiece 50 is set to be less than the thickness of the middle part of the workpiece 50. For example, the workpiece 50 of this application can be an irregular structure, and the middle part can be a plate-like structure with uniform thickness. The thickness of its edge can be reduced by setting chamfers or rounded corners.

[0065] Alternatively, the workpiece 50 can be designed to consist of two parts: a thicker middle section and a thinner edge section. This design allows the middle region of the workpiece 50 to protrude relative to the edge region, thereby reducing the height difference between the edge and the middle pin.

[0066] The following description uses one embodiment of this application as an example. In this embodiment, the middle of the workpiece 50 is a rectangular structure, and both ends of the workpiece 50 in the width direction are integrally formed with edges, which are also rectangular structures. The length direction of the edges is parallel to the length direction of the middle position of the workpiece 50, and the thickness of the edges of the workpiece 50 is less than the thickness of the middle of the workpiece 50.

[0067] This application sets the workpiece 50 to be processed as an irregular shape, making the thickness of the middle part of the workpiece 50 greater than the thickness of the edge. In this way, when forging the workpiece 50, the upper die 10 first contacts the middle position of the workpiece 50, so that growth material flows into the column hole 111 in the middle position of the growth area in advance to pre-grow the needle column. In this way, the height of the needle column at the surrounding positions can be basically the same as the height of the needle column at the middle position, which reduces the amount of material removed during the needle cutting process. At the same time, since the height of the highest needle column is reduced during needle column growth, the overall forging height of the needle column is reduced, which can reduce the overall forging pressure. The forging pressure can be reduced by more than 20%, which is conducive to reducing the tonnage of the equipment and making it easier to control the quality of the product.

[0068] In this embodiment, when forging the workpiece, a forging die can be designed first, and the height of the pins can be obtained based on the actual pin growth or simulation calculation. For example, when the second substrate 321 passes through the first substrate 311 and the second substrate 321 is fixedly connected to the locking plate 13, the second top pin 322 is inserted into the pin hole 111, and the end of the pin hole 111 near the lower die 20 has a spare space. The length of this space is L, and L is equal to the height of the lowest pin growing on the workpiece. The lowest pin height here refers to the lowest height of the normally growing pins on the workpiece when the top pin structure 30 is not set. This height needs to be greater than or equal to the pin height required for the finished radiator.

[0069] In this embodiment, the initial length of the first top post 313 inserted into the post hole 111 is longer than the initial length of the second top post 322 inserted into the post hole 111. In this application, the length of the first top post 313 inserted into the post hole 111 is 1-3mm longer than the length of the second top post 322 inserted into the post hole 111. The first top post 313 can be flush with the end face of the post hole 111 facing the lower mold 20.

[0070] After setting up the mold, a suitable elastic element 40 needs to be selected, and the elastic element 40 is a spring. Specifically, based on the type of heat sink, the pressure of the fast-growing pin is analyzed and set as F0. The spring compression is selected such that the total pressure of each spring is equal to F0 when the length difference between the first ejector pin 313 and the second ejector pin 322 is reached. For example, if F0 is 600 kgf, the length difference between the first ejector pin 313 and the second ejector pin 322 is 2 mm, and four springs are arranged, the total pressure is 600 kgf when the four springs are compressed by 2 mm.

[0071] After the mold is manufactured, it is used for forging. During the forging process, when the fastest-growing needle first contacts the first ejector pin 313, the spring begins to generate elastic force and acts on the first ejector pin 313. As subsequent needles grow further, they are affected by the pressure applied by the first ejector pin 313, causing the growth rate to gradually slow down. At the same time, the needles in the middle position are not significantly restricted by pressure, and their growth rate is relatively fast. Ultimately, this makes the overall growth of the needles tend to be uniform, achieving a relatively flat effect.

[0072] After the radiator is forged, the pins are flattened. Because the pin length is controlled during forging, the pin height is relatively even, resulting in less scrap material being removed during flattening and more material being retained. Therefore, the yield of the pins alone can be increased by about 5%-10%. The pins account for about 15%-30% of the total volume of the radiator. When the yield of the pins is increased by 5%-10%, the overall yield of the radiator also increases accordingly. The increase rate is the product of the increase in the yield of the pins themselves and the proportion of the pins in the volume of the radiator, that is, the total yield of the radiator can be increased by about 0.75-1.5%. After flattening, subsequent processes include CNC (Computerized Numerical Control) machining such as flash removal and dimensional control, as well as cleaning, sandblasting, electroplating, pre-bending, and inspection.

[0073] A second aspect of this application also provides a radiator formed using the aforementioned radiator mold, the radiator including a substrate and pins formed on the substrate.

[0074] A third aspect of this application also provides an electronic device, which includes a device body and the aforementioned heat sink.

[0075] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0076] In the description of this application, it should be understood that the terms "comprising" and "having" and any variations thereof used in the embodiments of this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0077] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the connection within two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0078] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A heat spreader mold characterized by, include: The upper mold is provided with multiple column holes, which are arranged at intervals to form a growth area; The lower mold is movably disposed relative to the upper mold, and the position of the lower mold corresponding to the growth area is used to place the plate to be processed; The top pillar structure includes a first sub-part comprising a first top pillar and a first substrate. Multiple first top pillars are provided and connected to the first substrate. The multiple first top pillars are arranged around the edge of the growth region, and the first top pillars correspond one-to-one with the pillar holes on the edge of the growth region. The end of the first top pillar away from the lower mold is inserted into the corresponding pillar hole. The first substrate is movably disposed on the upper mold along the opening path of the pillar holes. The upper mold is also provided with an elastic element located on the movement path of the first substrate, used to provide pressure to the first substrate towards the lower mold.

2. The heat spreader die of claim 1, wherein, The upper mold has an internal accommodating space that is connected to the end of the column hole away from the lower mold. The opening direction of the accommodating space is the same as the opening direction of the column hole. The first substrate moves within the accommodating space, and the shape and size of the first substrate are the same as the shape and size of the accommodating space.

3. The heat spreader die of claim 2, wherein, The upper mold includes a first mold body and a locking plate. The locking plate is detachably connected to the first mold body. The column hole is opened in the first mold body. One end of the locking plate is provided with a receiving groove. The end of the locking plate with the receiving groove is connected to the first mold body. The receiving groove communicates with the column hole. The receiving groove is used to form the receiving space.

4. The heat spreader die of claim 3, wherein, The elastic element is located in the receiving groove, and its two ends abut against the bottom of the receiving groove and the end of the first substrate facing away from the first top post, respectively. And / or, the locking plate is further provided with a guide post, the guide post protruding from the bottom of the receiving groove toward the first substrate, and the elastic element is sleeved on the guide post.

5. The heat spreader die of claim 2, wherein, The top post structure also includes a second sub-part, which includes a second substrate and a second top post. The second top post is connected to the second substrate and is inserted into a post hole in the middle of the growth region.

6. The heat spreader die of claim 5, wherein, The first substrate is arranged in a ring, and the second substrate passes through the space enclosed by the inner ring of the first substrate. The shape and size of the inner ring of the first substrate are the same as those of the second substrate.

7. The radiator mold according to claim 5 or 6, characterized in that, The second substrate is fixedly connected to the upper mold, and the initial length of the second top post inserted into the post hole is less than the initial length of the first top post inserted into the post hole. And / or, the second substrate is fixedly connected to the first substrate, and the initial length of the second top post inserted into the post hole is equal to the initial length of the first top post inserted into the post hole.

8. The heat sink mold according to any one of claims 1-6, wherein, The lower mold includes a second mold body and a pusher. The second mold body is provided with a through groove, and the pusher passes through the through groove. The plate to be processed is located in the through groove and is placed on the pusher.

9. The heat sink mold according to any one of claims 1-6, wherein, The plate to be processed is a metal plate structure, and the thickness of the edge of the plate to be processed is less than the thickness of the middle of the plate to be processed.

10. A heat spreader, comprising: formed using a heat sink mold as claimed in any one of claims 1 to 9.

11. An electronic device, comprising: comprising a device body and a heat sink as claimed in claim 10.

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