Embedded industrial control mainboard reflow soldering device capable of stably clamping

Abstract

The utility model relates to the field of embedded industrial control mainboards, in particular to an embedded industrial control mainboard reflow soldering device with stable clamping, which comprises a reflow soldering machine body, a main body for welding an embedded industrial control mainboard, and a soldering groove arranged inside the reflow soldering machine body and used for bearing the embedded industrial control mainboard. The reflow soldering device for the embedded industrial control mainboard is provided with the soldering frame, the bearing plate support, the threaded rod, the clamping sleeve, the telescopic buffer spring, the hexagonal nut, the clamping grating, the positioning point and the vacuum chuck, when the reflow soldering device for the embedded industrial control mainboard is used, the position of the bearing plate support on the soldering frame can be adjusted through the bolt according to the size of the current embedded industrial control mainboard, so that the embedded industrial control mainboard can be conveniently and rapidly welded. The embedded industrial control mainboard is placed in the groove of the bearing plate support, the threaded rods are sleeved with the clamping sleeves at the four corners of the clamping grating respectively, the hexagonal nuts are twisted to enable the clamping sleeves to press the telescopic buffer springs downwards, and the embedded industrial control mainboard is clamped and fixed from the upper portion through the clamping grating.

Description

Technical Field

[0001] This utility model relates to the field of embedded industrial control motherboards, specifically to a reflow soldering device for securely clamping embedded industrial control motherboards. Background Technology

[0002] Embedded industrial control motherboards are computer motherboards specifically designed for industrial control applications. They integrate core components such as processors, memory, storage, and input / output interfaces, and have high reliability and stability. They can operate stably for extended periods in harsh industrial environments. These motherboards typically employ a fanless design and possess characteristics such as dustproof, moisture-proof, and vibration-resistant properties to adapt to various challenges in industrial settings. Embedded industrial control motherboard reflow soldering equipment is specifically used for soldering surface-mount components on embedded industrial control motherboards. Reflow soldering is a soldering process that achieves highly reliable mechanical and electrical connections between components and the PCB board by precisely controlling the temperature profile to melt and then re-solidify the solder paste.

[0003] A search revealed CN219292952U, a reflow soldering apparatus for electronic devices. Specifically, this apparatus includes a soldering machine, a movable box, and a movable frame. The movable frame is movably mounted inside the soldering machine. A fixed box is fixedly connected to the inner side of the movable frame. The movable box is embedded in the top of the fixed box. A separator is fixedly connected to the inner side of the movable box. A support plate is movably mounted inside the movable box at the bottom of the separator. This application, through the coordinated use of the movable box, support plate, and fixed box, allows workers to quickly and conveniently remove soldered electronic device circuit boards without needing to use tools to remove the processed workpieces sequentially, saving manpower and time, improving work efficiency. Furthermore, two quickly removable movable boxes can be used for continuous soldering, avoiding energy loss due to prolonged removal of electronic device circuit boards, which would otherwise require more energy for subsequent processing.

[0004] Existing embedded industrial control motherboard reflow soldering equipment lacks the ability to hold the motherboard securely during use. This allows the motherboard to move or vibrate during the soldering process, resulting in poor contact, cold solder joints, and other soldering defects. Furthermore, the embedded industrial control motherboard reflow soldering equipment in the aforementioned comparative case also lacks the ability to hold the motherboard securely. Over time, this unstable holding will also lead to uneven temperature in the soldering area, affecting the melting and solidification process of the solder paste and further reducing the soldering quality.

[0005] Therefore, it is necessary to invent a reflow soldering device for securely clamping embedded industrial control motherboards to solve the above problems. Utility Model Content

[0006] The purpose of this invention is to provide a stable clamping reflow soldering device for embedded industrial control motherboards. Through a welding frame, support plate, threaded rod, clamping sleeve, telescopic buffer spring, hexagonal nut, clamping grid, positioning points, and vacuum suction cup, this device achieves stable clamping of the embedded industrial control motherboard. This clamping and fixing improves the stability of reflow soldering, ensuring the motherboard remains secure during the soldering process. Furthermore, the contact surface between the clamping grid and the motherboard is buffered by the telescopic buffer spring, achieving flexible clamping and preventing excessive local pressure that could deform the motherboard or damage components. This ensures the motherboard's stability even after long-term use. This invention aims to ensure a secure fixation, prevent displacement, guarantee welding accuracy, and reduce welding defects. It addresses the shortcomings of existing embedded industrial control motherboard reflow soldering devices, which lack stable clamping capabilities. This allows the motherboard to move or vibrate during soldering, leading to poor contact, cold solder joints, and other welding defects. Furthermore, the embedded industrial control motherboard reflow soldering devices in the aforementioned comparative case also lack stable clamping capabilities. Over long-term use, this unstable clamping can cause uneven temperature distribution in the soldering area, affecting the melting and solidification of the solder paste and further reducing welding quality.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a reflow soldering device for firmly clamping embedded industrial control motherboards, comprising a reflow soldering machine body and a main body for soldering embedded industrial control motherboards;

[0008] The welding tank is located inside the reflow soldering machine body and is used to support the embedded industrial control motherboard. Fixed slide rails are fixedly installed on both sides of the inside of the welding tank. Fixed slide sleeves are slidably connected to the outside of the fixed slide rails. A welding frame is fixedly installed above the fixed slide sleeves. The welding frame is threadedly connected to the support plate inside.

[0009] A threaded rod is fixedly installed above the support plate and is used for external sliding connection with a clamping sleeve. A telescopic buffer spring is sleeved on the outside of the threaded rod. A hexagonal nut is threaded to the outside of the threaded rod. A clamping grid is fixedly installed on the outside of the clamping sleeve. Positioning points are fixedly installed on the bottom of the clamping grid.

[0010] A vacuum suction cup is fixedly installed inside the welding frame. A vacuum tube is fixedly connected to the bottom of the vacuum suction cup, and a vacuum pump is fixedly installed inside the reflow soldering machine body. A pumping pipe is fixedly installed at the output end of the vacuum pump.

[0011] Preferably, the welding frame is slidably connected to the reflow soldering machine body, and the support plates are evenly distributed on the welding frame.

[0012] Preferably, the top end of the telescopic buffer spring is fixedly connected to the inside of the clamping sleeve, and the clamping sleeve is threadedly connected to the threaded rod via a hexagonal nut.

[0013] Preferably, the other end of the vacuum pump is fixedly connected to the vacuum tube, and the vacuum pump is symmetrically arranged with respect to the central axis of the reflow soldering machine body.

[0014] Preferably, hot air vents are provided on both sides of the interior of the reflow soldering machine body, and electric heating tubes are fixedly installed inside each of the hot air vents.

[0015] Preferably, a reflow cavity is fixedly installed on both sides of the reflow soldering machine body, an air inlet is opened on the outside of the reflow cavity, a blower is fixedly installed inside the reflow cavity, and an infrared emitter is fixedly installed inside the reflow soldering machine body.

[0016] The technical effects and advantages provided by this utility model in the above technical solution are as follows:

[0017] 1. This utility model includes a welding frame, a support plate, a threaded rod, a clamping sleeve, a telescopic buffer spring, a hexagonal nut, a clamping grid, positioning points, and a vacuum suction cup. When using this embedded industrial control motherboard reflow soldering device, the position of the support plate on the welding frame can be adjusted according to the size of the embedded industrial control motherboard using bolts. Then, the embedded industrial control motherboard is placed in the groove of the support plate. Next, the clamping sleeves at the four corners of the clamping grid are respectively fitted onto the threaded rod. Then, the hexagonal nut is turned to cause the clamping sleeves to press down on the telescopic buffer spring, allowing the clamping grid to clamp and fix the embedded industrial control motherboard from above. The positioning points abut against the embedded... On the embedded industrial control motherboard, the vacuum pump then applies suction to the vacuum suction cup, allowing the vacuum suction cup to pick up the embedded industrial control motherboard from the bottom. This combination gives the embedded industrial control motherboard reflow soldering device a stable clamping ability. This clamping and fixing improves the stability of reflow soldering, ensuring that the motherboard does not loosen during the soldering process. Moreover, the contact surface between the clamping grid and the motherboard is buffered by the telescopic buffer spring, achieving flexible clamping and avoiding excessive local pressure that could cause the motherboard to deform or damage components. With long-term use, this ensures that the motherboard is accurately fixed, prevents displacement, guarantees soldering accuracy, and reduces soldering defects.

[0018] 2. This utility model is equipped with a hot air vent, an electric heating element, a reflow chamber, an air inlet, a blower fan, and an infrared emitter. When using this embedded industrial control motherboard reflow soldering device, the infrared emitter emits infrared rays to the embedded industrial control motherboard below to heat and melt the solder paste. The blower fan can blow the heat emitted by the electric heating element inside the hot air vent, causing the hot air to circulate back in the welding space inside the reflow soldering machine. This combination of hot air circulation and infrared radiation heating methods can ensure temperature uniformity and use infrared radiation to quickly heat specific areas. With this coordinated operation, the temperature difference on the motherboard surface is controlled within a limited range, significantly reducing the solder joint void rate and the risk of cold solder joints. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0021] Figure 2 This is a schematic diagram of the welding frame structure of this utility model;

[0022] Figure 3 This is a schematic diagram of the clamping sleeve structure of this utility model;

[0023] Figure 4 This is a schematic diagram of the vacuum suction cup structure of this utility model;

[0024] Figure 5 This is a schematic diagram of the reflux cavity structure of this utility model;

[0025] Figure 6 For the present utility model Figure 3 Enlarged structural diagram at point A in the middle.

[0026] Explanation of reference numerals in the attached figures:

[0027] 1. Reflow soldering machine body; 2. Welding tank; 3. Fixed slide rail; 4. Fixed slide sleeve; 5. Welding frame; 6. Support plate; 7. Threaded rod; 8. Clamping sleeve; 9. Telescopic buffer spring; 10. Hexagonal nut; 11. Clamping grid; 12. Positioning point; 13. Vacuum suction cup; 14. Vacuum tube; 15. Vacuum pump; 16. Air extraction pipe; 17. Hot air outlet; 18. Electric heating element; 19. Reflow chamber; 20. Air inlet; 21. Blowing fan; 22. Infrared emitter. Detailed Implementation

[0028] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0029] This utility model provides, for example Figure 1-6 The reflow soldering device shown includes a reflow soldering body 1, which is a main body for soldering embedded industrial control motherboards.

[0030] Welding tank 2 is located inside the reflow soldering machine body 1 and is used to support the embedded industrial control motherboard. Fixed slide rails 3 are fixedly installed on both sides inside the welding tank 2. Fixed slide sleeves 4 are slidably connected to the outside of the fixed slide rails 3. Welding frame 5 is fixedly installed above the fixed slide sleeves 4. The inside of the welding frame 5 is threadedly connected to the support plate 6.

[0031] The threaded rod 7 is fixedly installed above the support plate 6 and is externally slidably connected to the clamping sleeve 8. The threaded rod 7 is externally fitted with a telescopic buffer spring 9. The threaded rod 7 is externally threaded with a hexagonal nut 10. The clamping sleeve 8 is externally fixedly installed with a clamping grid 11. The bottom of the clamping grid 11 is fixedly installed with positioning points 12.

[0032] Vacuum suction cup 13 is fixedly installed inside the welding frame 5. Vacuum tube 14 is fixedly connected to the bottom of vacuum suction cup 13. A vacuum pump 15 is fixedly installed inside the reflow soldering machine body 1. A suction pipe 16 is fixedly installed at the output end of vacuum pump 15, so that vacuum pump 15 provides suction to vacuum suction cup 13, allowing vacuum suction cup 13 to pick up the embedded industrial control motherboard from the bottom. In this way, together with clamping grid 11, the reflow soldering device for embedded industrial control motherboard has the ability to clamp firmly.

[0033] like Figure 1 , Figure 2 , Figure 3 and Figure 6 As shown, the welding frame 5 is slidably connected to the reflow soldering machine body 1. The support plate 6 is evenly distributed on the welding frame 5. The position of the support plate 6 on the welding frame 5 can be adjusted by bolts according to the size of the current embedded industrial control motherboard. The top of the telescopic buffer spring 9 is fixedly connected to the inside of the clamping sleeve 8. The clamping sleeve 8 is threadedly connected to the threaded rod 7 through the hexagonal nut 10. The clamping sleeves 8 at the four corners of the clamping grid 11 are respectively fitted onto the threaded rod 7. Then, the hexagonal nut 10 is twisted to make the clamping sleeve 8 press down the telescopic buffer spring 9, so that the clamping grid 11 clamps and fixes the embedded industrial control motherboard from above.

[0034] like Figure 1 , Figure 4 and Figure 5As shown, the other end of the vacuum pump 15 is fixedly connected to the vacuum tube 14. The vacuum pump 15 is symmetrically arranged around the central axis of the reflow soldering machine body 1. The overall structure of the vacuum tube 14 is simple, easy to operate, and convenient to maintain in case of failure. Hot air vents 17 are opened on both sides inside the reflow soldering machine body 1. Electric heating tubes 18 are fixedly installed inside the hot air vents 17. The infrared emitter 22 emits infrared rays to the embedded industrial control motherboard below. When heating and melting the solder paste, the blower fan 21 can blow the heat emitted by the electric heating tubes 18 inside the hot air vents 17, so that the hot air circulates back in the welding space inside the reflow soldering machine body 1. Reflow chambers 19 are fixedly installed on both sides outside the reflow soldering machine body 1. Air inlets 20 are opened on the outside of the reflow chambers 19. Blower fans 21 are fixedly installed inside the reflow chambers 19. Infrared emitters 22 are fixedly installed inside the reflow soldering machine body 1. The two heating methods of hot air circulation and infrared radiation can ensure temperature uniformity and use infrared radiation to quickly heat specific areas.

[0035] The working principle of this practical application is as follows: First, connect the external power supply. Then, using the fixed slide rail 3 and fixed sliding sleeve 4, pull the welding frame 5 out of the welding groove 2 of the reflow soldering machine body 1. Next, adjust the position of the support plate 6 on the welding frame 5 using bolts, according to the size of the embedded industrial control motherboard to be welded. Then, place the embedded industrial control motherboard into the groove of the support plate 6. Next, fit the clamping sleeves 8 at the four corners of the clamping grid 11 onto the threaded rod 7. Then, twist the hexagonal nut 10 to press down the telescopic buffer spring 9, allowing the clamping grid 11 to clamp and fix the embedded industrial control motherboard from above. Positioning point 1. 2. The device is placed against the embedded industrial control motherboard, and then the vacuum pump 15 is turned on. The vacuum pump 15 provides suction to the vacuum suction cup 13 through the vacuum tube 14, allowing the vacuum suction cup 13 to pick up the embedded industrial control motherboard from the bottom. This gives the embedded industrial control motherboard reflow soldering device a stable clamping capability. This clamping and fixing improves the stability of reflow soldering, ensuring that the motherboard does not loosen during the soldering process. Moreover, the contact surface between the clamping grid 11 and the motherboard is buffered by the telescopic buffer spring 9, achieving flexible clamping and avoiding excessive local pressure that could cause motherboard deformation or component damage. Then, the device is placed... The main control chip to be soldered is placed on top of the embedded industrial control motherboard, and solder paste is applied. Then, the soldering rack 5 can be pushed into the reflow soldering machine body 1 to begin soldering. The reflow soldering machine body 1 is then started, allowing the internal infrared emitter 22 to emit infrared rays towards the embedded industrial control motherboard below, heating and melting the solder paste. The fan 21 then blows heat from the electric heating element 18 inside the hot air vent 17, causing the hot air to circulate within the soldering space of the reflow soldering machine body 1. This combination of hot air circulation and infrared radiation ensures temperature uniformity and utilizes infrared... Radiation rapidly heats a specific area, and through coordinated operation, the temperature difference on the motherboard surface is controlled within a limited range, significantly reducing the solder joint void rate and the risk of cold solder joints. After soldering is completed, the reflow soldered embedded industrial control motherboard is removed, and the soldering work of the next embedded industrial control motherboard is continued. Finally, after completing the installation and use of all embedded industrial control motherboard reflow soldering devices according to the above operations, the vacuum pump 15 switch and the blower fan 21 switch are turned off. If not used for a long time, the external power supply can be disconnected. In this way, the use of the securely clamped embedded industrial control motherboard reflow soldering device is completed.

[0036] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A reflow soldering device for securely clamping embedded industrial control motherboards, characterized in that: include Reflow soldering machine body (1), the main body used for welding embedded industrial control motherboards; Welding groove (2) is opened inside the reflow soldering machine body (1) and is used to support the embedded industrial control motherboard. Fixed slide rails (3) are fixedly installed on both sides inside the welding groove (2). Fixed slide sleeves (4) are slidably connected to the outside of the fixed slide rails (3). Welding frame (5) is fixedly installed above the fixed slide sleeves (4). The inside of the welding frame (5) is threadedly connected to the support plate (6). A threaded rod (7) is fixedly installed above the support plate (6) and is externally slidably connected to a clamping sleeve (8). A telescopic buffer spring (9) is sleeved on the outside of the threaded rod (7). A hexagonal nut (10) is threadedly connected to the outside of the threaded rod (7). A clamping grid (11) is fixedly installed on the outside of the clamping sleeve (8). A positioning point (12) is fixedly installed at the bottom of the clamping grid (11). A vacuum suction cup (13) is fixedly installed inside the welding frame (5). A vacuum tube (14) is fixedly connected to the bottom of the vacuum suction cup (13), and a vacuum pump (15) is fixedly installed inside the reflow soldering machine body (1). A pumping pipe (16) is fixedly installed at the output end of the vacuum pump (15).

2. The reflow soldering device for embedded industrial control mainboard according to claim 1, characterized in that: The welding frame (5) is slidably connected to the reflow soldering machine body (1), and the support plate (6) is evenly distributed on the welding frame (5).

3. The reflow soldering device for embedded industrial control mainboard according to claim 1, characterized in that: The top end of the telescopic buffer spring (9) is fixedly connected to the inside of the clamping sleeve (8), and the clamping sleeve (8) is threadedly connected to the threaded rod (7) through a hexagonal nut (10).

4. The reflow soldering device for embedded industrial control mainboard according to claim 1, characterized in that: The other end of the vacuum pump (15) is fixedly connected to the vacuum tube (14), and the vacuum pump (15) is symmetrically arranged with respect to the central axis of the reflow soldering machine body (1).

5. The reflow soldering device for embedded industrial control mainboard according to claim 1, characterized in that: Hot air vents (17) are provided on both sides of the interior of the reflow soldering machine body (1), and electric heating tubes (18) are fixedly installed inside each hot air vent (17).

6. The reflow soldering device for embedded industrial control mainboard according to claim 1, characterized in that: The reflow oven body (1) has reflow chambers (19) fixedly installed on both sides of its exterior. The reflow chambers (19) have air inlets (20) on their exterior. The reflow chambers (19) are all fixedly installed with blowing fans (21) inside. The reflow oven body (1) has an infrared emitter (22) fixedly installed inside.

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