Cooling and heat dissipation mechanism for plastic mold processing
By installing a cooling and heat dissipation mechanism around the mold processing slot, and utilizing a multi-stage heat dissipation path consisting of a heat-conducting container, heat dissipation fins, and heat-conducting copper pipes, the problem of overheating of the mold frame is solved, thereby improving processing accuracy and maintenance efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN GESHANG PLASTIC MOLD CO LTD
- Filing Date
- 2025-04-29
- Publication Date
- 2026-04-21
AI Technical Summary
During the plastic mold processing, the mold frame is prone to overheating, which affects processing accuracy and maintenance efficiency.
A cooling and heat dissipation mechanism was designed, including a frame, a heat-conducting container, heat dissipation fins, and heat-conducting copper pipes. Combined with coolant and a cooling fan, it forms a multi-stage heat dissipation path. Connecting arms and rectangular slots facilitate the installation and expansion of heat dissipation modules. Rubber seals and a buffer base are used to improve stability.
This technology enables rapid reduction of mold edge temperature, improves machining accuracy and maintenance efficiency, and reduces maintenance frequency.
Smart Images

Figure CN224145125U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of mold processing technology, and in particular to a cooling and heat dissipation mechanism for plastic mold processing. Background Technology
[0002] Plastic mold processing is an indispensable and crucial step in the molding and production of plastic products, and it is widely used in industries such as home appliances, automobiles, and medical devices. With the increasing demands for precision and functionality in plastic products, higher requirements are being placed on the precision, structural complexity, and heat dissipation performance of molds.
[0003] Plastic mold processing mainly includes design, material selection, CNC machining, EDM, polishing, and assembly. During processing, the mold is prone to overheating due to prolonged heating or concentrated temperature during plastic injection, leading to decreased product precision or deformation. Generally, this is addressed by using a mold base made of high thermal conductivity material and installing exhaust fans around the mold base. While this can reduce mold temperature and provide heat dissipation to some extent, it also increases material costs and the difficulty of subsequent maintenance, hindering efficiency. Utility Model Content
[0004] The technical problem this invention aims to solve is that during the processing of plastic molds, the mold frame is prone to overheating, which affects maintenance operations.
[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows: a cooling and heat dissipation mechanism for plastic mold processing, including a frame, a connecting guide plate fixedly provided on one side of the frame, and connecting ear plates fixedly provided on both sides of the connecting guide plate, with fastening bolts passing through the connecting ear plates, a heat-conducting container fixedly connected to the center of the frame, and the heat-conducting container having a cavity, the cavity being filled with coolant, a plurality of evenly arranged heat dissipation fins fixedly provided on one side of the heat-conducting container, and a pair of connecting arms fixedly provided at the top and bottom of the frame, with a rectangular slot provided at one end of the connecting arm.
[0006] As a further improvement of this utility model, the heat-conducting container has convex plates fixed vertically on both sides of the top, and a sealing plate is fastened to the top of the heat-conducting container by the convex plates. A rubber sealing block is fixedly connected to the bottom of the sealing plate, and the sealing block is fitted and sealed with the heat-conducting container.
[0007] As a further improvement of this utility model, the spacing between the heat dissipation fins is maintained at 2-3cm, and the heat dissipation fins are connected through a heat-conducting copper pipe, which is connected to the chamber of the heat-conducting container.
[0008] As a further improvement of this utility model, the liquid level of the coolant is set to be 3-5 cm higher than the opening of the heat-conducting copper pipe.
[0009] As a further improvement of this utility model, the connecting guide plate is configured as a square plate structure, and the outer contact surface of the connecting guide plate is configured as a frosted surface.
[0010] As a further improvement of this utility model, a rubber buffer base is fixedly connected to the outer side of each connecting arm.
[0011] The beneficial effects of this utility model are as follows: By assembling this utility model around the mold processing slot, a stable and efficient heat-conducting contact surface is constructed, which can quickly dissipate the heat accumulated in the edge area during processing. A heat-conducting container filled with coolant is located in the center, forming a multi-stage heat dissipation path with heat-conducting copper pipes and evenly distributed heat dissipation fins, achieving rapid reduction of the mold edge temperature. The top is sealed with a sealing plate and sealing block, facilitating coolant replenishment and maintenance; the connecting arms and rectangular slots at the top and bottom support the expansion of external heat dissipation modules, further enhancing heat dissipation capacity. The overall structure is modular and easy to install, effectively solving the problems of overheating and difficult maintenance at the mold processing edge, improving processing accuracy and maintenance efficiency. Attached Figure Description
[0012] Figure 1 This is a schematic diagram of a cooling and heat dissipation mechanism for plastic mold processing according to this utility model. Figure 1 ;
[0013] Figure 2 This is a partial disassembly diagram of a cooling and heat dissipation mechanism for plastic mold processing according to this utility model;
[0014] Figure 3 This is a diagram showing part A of a cooling and heat dissipation mechanism for plastic mold processing according to this utility model;
[0015] Figure 4 This is a schematic diagram of a cooling and heat dissipation mechanism for plastic mold processing according to this utility model. Figure 2 .
[0016] As shown in the figure: 1. Connecting guide plate; 2. Connecting ear plate; 3. Heat-conducting container; 4. Sealing plate; 5. Connecting arm; 6. Rectangular slot; 7. Protruding plate; 8. Sealing block; 9. Heat-conducting copper pipe; 10. Buffer base. Detailed Implementation
[0017] The directional terms such as up, down, left, right, front, back, front, back, top, and bottom mentioned or possibly mentioned in this specification are defined relative to their structure and are relative concepts. Therefore, they may vary depending on their location and usage; thus, these or other directional terms should not be interpreted as restrictive terms.
[0018] The singular forms “a,” “the,” and “the” used in this specification are intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes one or more of the associated listed items, any or all possible combinations thereof.
[0019] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the embodiments described herein are merely illustrative and not intended to limit the scope of this application.
[0020] This utility model provides a cooling and heat dissipation mechanism for plastic mold processing, including a frame;
[0021] As attached Figure 1-4 As shown, a connecting guide plate 1 is fixedly installed on one side of the frame. The connecting guide plate 1 is attached to both sides or around the mold processing slot. The connecting guide plate 1 is a square plate structure, and the outer contact surface of the connecting guide plate 1 is a frosted surface to increase the contact friction at the connection point. Connecting ear plates 2 are fixedly installed on both sides of the connecting guide plate 1, and fastening bolts are inserted through the center of the connecting ear plates 2. Through the connecting ear plates 2 and fastening bolts, a stable and tightly fitting heat-conducting mounting surface is formed around the mold processing slot. A heat-conducting container 3 is fixedly connected to the center of the frame. The heat-conducting container 3 has a chamber filled with coolant. The coolant uses deionized water as the base liquid and adds ethylene glycol for antifreeze and anti-boiling purposes. Several evenly arranged heat dissipation fins are fixedly installed on one side of the heat-conducting container 3. A pair of connecting arms 5 are fixedly installed at the top and bottom of the frame. One end of the connecting arm 5 has a rectangular slot 6. The connecting arm 5 with the rectangular slot 6 facilitates the subsequent addition of external heat dissipation mechanisms such as cooling fans and heat dissipation fins. Rubber buffer bases 10 are fixedly connected to the outer sides of the connecting arm 5 to provide a buffer effect during placement and assembly.
[0022] As attached Figure 2 , 3 As shown, vertically arranged protruding plates 7 are fixedly connected to both sides of the top inlet of the heat conduction container 3. A sealing plate 4 is fastened to the top of the heat conduction container 3 through the protruding plates 7. A rubber sealing block 8 is fixedly connected to the bottom of the sealing plate 4, and the sealing block 8 is fitted and sealed with the top inlet of the heat conduction container 3. The heat conduction container 3 is detachable to ensure easy filling of coolant.
[0023] As attached Figure 2 , 3As shown, the spacing between several heat dissipation fins is maintained at 2-3 cm; heat dissipation gaps are reserved between the heat dissipation fins, and heat dissipation fins are connected through heat-conducting copper pipes 9. The heat-conducting copper pipes 9 are connected to the chamber of the heat-conducting container 3, allowing the coolant in the chamber of the heat-conducting container 3 to enter the heat-conducting copper pipes 9. The coolant level is set to be 3-5 cm higher than the opening of the heat-conducting copper pipes 9, ensuring that the inside of the heat-conducting copper pipes 9 is filled with coolant.
[0024] Working Principle: In practical implementation, the connecting guide plate 1 is fixedly installed on both sides or around the processing slot, and its stable fit is ensured by the connecting ear plate 2 and fastening bolts. During processing, as the mold and processing slot are continuously heated, the heat is first conducted through the connecting guide plate 1 to the heat-conducting container 3 on one side. Because the heat-conducting container 3 is filled with coolant, the heat is quickly absorbed. At the same time, some of the unabsorbed heat is transferred to the heat-conducting copper pipe 9 on the outside, and then the heat energy is diffused through the heat-conducting copper pipe 9 that runs through several heat dissipation fins. The coolant level is 4cm higher than the opening of the heat-conducting copper pipe 9 to ensure that the pipe is always filled with cooling medium, achieving continuous and effective heat dissipation.
[0025] Meanwhile, the top of the heat-conducting container 3 is fixed to the sealing plate 4 by a protruding plate 7, and the sealing block 8 at the bottom of the sealing plate fits tightly with the top opening of the heat-conducting container 3 to prevent coolant leakage. The upper and lower connecting arms 5 provide stable support, and the rectangular slots 6 can be used to embed additional devices such as cooling fans and heat dissipation fins to enhance heat dissipation capacity. Finally, the bottom buffer support 10 alleviates vibration and impact during the overall assembly process, improving stability. This structure, through a reasonable layout of the heat conduction path and modular auxiliary heat dissipation design, enables dynamic adjustment and control of the mold edge temperature during processing, thereby significantly improving the mold processing accuracy and service life, and reducing the frequency and difficulty of later maintenance.
[0026] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.
Claims
1. A cooling mechanism for a plastic mold processing apparatus, comprising a frame, characterized in that: A connecting guide plate (1) is fixedly installed on one side of the frame, and connecting ear plates (2) are fixedly installed on both sides of the connecting guide plate (1). A fastening bolt is passed through the center of the connecting ear plate (2). A heat-conducting container (3) is fixedly connected to the center of the frame, and the heat-conducting container (3) has a cavity. The cavity is filled with coolant. Several evenly arranged heat dissipation fins are fixedly installed on one side of the heat-conducting container (3). A pair of connecting arms (5) are fixedly installed at the top and bottom of the frame. A rectangular slot (6) is opened at one end of the connecting arm (5).
2. The cooling mechanism for plastic mold processing according to claim 1, characterized in that: On both sides of the top inlet of the heat-conducting container (3), vertically arranged protruding plates (7) are fixedly connected. A sealing plate (4) is fastened to the top of the heat-conducting container (3) through the protruding plates (7). A rubber sealing block (8) is fixedly connected to the bottom of the sealing plate (4), and the sealing block (8) is fitted and sealed with the top inlet of the heat-conducting container (3).
3. The cooling mechanism for plastic mold processing according to claim 2, characterized in that: The spacing between several heat dissipation fins is maintained at 2-3 cm, and the heat dissipation fins are connected by a heat-conducting copper pipe (9), which is connected to the cavity of the heat-conducting container (3).
4. The cooling mechanism for plastic mold processing according to claim 3, characterized in that: The coolant level is set to be 3-5 cm above the opening of the heat-conducting copper pipe (9).
5. The cooling mechanism for plastic mold processing according to claim 1, wherein: The connecting guide plate (1) is configured as a square plate structure, and the outer side of the connecting guide plate (1) is configured as a frosted surface.
6. The cooling mechanism for plastic mold processing according to claim 1, wherein: Each of the connecting arms (5) is fixedly connected to a rubber buffer base (10).