Anti-static flexible packaging bag structure for microelectronic element

Abstract

The utility model relates to the technical field of packaging bags, in particular to a microelectronic element anti-static flexible packaging bag structure which comprises a packaging bag, an opening used for containing an electronic element is formed in the front end of the packaging bag, a protective lining is fixedly connected to the inner side of the packaging bag, and a reinforcing rubber strip is further fixedly connected to the outer side of the packaging bag. The four reinforcing rubber strips are arranged, every two reinforcing rubber strips arranged in a staggered mode form a group, the reinforcing rubber strips are distributed on the upper side face and the lower side face of the packaging bag in a staggered mode, and the reinforcing edge strips are fixed to the corners of the rear side of the packaging bag and the left side face and the right side face of the packaging bag. And the reinforcing adhesive tape and the reinforcing edge strip can reinforce and protect the corners of the packaging bag through the structural characteristics and the fixing positions of the reinforcing adhesive tape and the reinforcing edge strip, so that the device can more safely and reliably package the screened microelectronic elements by enhancing the strength of the corners, and the effect that the elements are damaged due to breakage of the corners is reduced.

Description

Technical Field

[0001] This application relates to the field of packaging bag technology, and in particular to an antistatic flexible packaging bag structure for microelectronic components. Background Technology

[0002] With the rapid development of microelectronics technology, microelectronic components have been widely used in various fields. These components are usually very sensitive to static electricity. During production, transportation and storage, they are easily damaged by the instantaneous high voltage generated by static electricity, resulting in a decline in product performance or even scrapping. Most of the flexible packaging bags commonly found on the market only have basic sealing functions and lack effective corner protection structures. This makes it easy for the corners of the packaging bags to deform when they are under stress for a long time, resulting in damage to the corners of the packaging bags.

[0003] A search revealed Chinese Patent Publication No. CN212922722U, which discloses a shock-absorbing electronic component packaging bag. The bag includes a main body, a placement cavity, an outer layer, a first arc-shaped block, a second arc-shaped block, and an inner layer. The main body comprises an outer bag body with a sealing end at one end. Adhesive is applied to one end of the sealing end, and release paper is adhered to one side of the adhesive. The placement cavity is located inside the bag body. An outer layer is located on the outer side of the bag body, and a first arc-shaped block is located on the inner side of the outer layer. A second arc-shaped block is adhered to one side of the first arc-shaped block, and an inner layer is located on one side of the second arc-shaped block. This invention features a novel structure and ingenious design. By utilizing the deformation of the first and second arc-shaped blocks, it absorbs the vibration energy of the electronic components, effectively reducing vibration.

[0004] Regarding the aforementioned technologies, the inventors have discovered the following defects: most existing flexible packaging bags only have basic sealing functions and lack effective corner protection structures, which makes it easy for the corners of the packaging bags to deform under stress for a long time, resulting in damage to the corners of the packaging bags. Utility Model Content

[0005] To address the problems mentioned in the background section, this application provides a structure for an antistatic flexible packaging bag for microelectronic components.

[0006] This application provides a microelectronic component antistatic soft packaging bag structure, which adopts the following technical solution: A microelectronic component antistatic soft packaging bag structure includes a packaging bag: the front end of the packaging bag is provided with an opening for holding electronic components, and a protective liner is fixedly connected to the inner side of the packaging bag.

[0007] The outer side of the packaging bag is also fixedly connected with reinforcing strips. There are four reinforcing strips in total, with each pair of reinforcing strips staggered together forming a group. The two groups of reinforcing strips are fixedly connected to the upper and lower sides of the packaging bag in opposite directions.

[0008] Optionally, the top of the packaging bag is fixedly connected with a fastening assembly, and there are two fastening assemblies.

[0009] Optionally, the two fastening components are fixedly connected in a linear array to the left and right sides of the top surface of the packaging bag, and a reinforcing strip is fixedly connected to the rear corner of the packaging bag.

[0010] Optionally, the main body of the reinforcing strip is an L-shaped structure, and the reinforcing strip is provided in two places.

[0011] Optionally, the two reinforcing strips are fixedly connected to the left and right sides of the packaging bag in opposite directions, and two flexible partitions are fixedly connected to the inner side of the protective liner.

[0012] Optionally, two flexible partitions are arranged in a linear array on the inside of the packaging bag, and cushioning foam is inserted inside both flexible partitions.

[0013] Optionally, the outer side of the packaging bag is heat-fused with a flexible sealing element, and two snap fasteners are fixedly connected in a linear array on the side of the sealing element closest to the packaging bag.

[0014] Optionally, the snap fastener assembly matches the fastening assembly and together they form a closed structure for the front opening of the packaged bag.

[0015] In summary, this application includes the following beneficial technical effects:

[0016] This invention incorporates reinforcing strips and edge strips. The reinforcing strips are staggered on the top and bottom sides of the packaging bag, while the edge strips are fixed to the rear corners and left and right sides. This interplay allows the reinforcing strips and edge strips to reinforce and protect the corners of the packaging bag through their structural characteristics and fixed positions. Consequently, this device can more safely and reliably package the selected microelectronic components by enhancing the corner strength, reducing damage to the components caused by corner breakage.

[0017] This invention utilizes components such as a protective liner, flexible partition, cushioning foam, snap fasteners, and fastening components. The protective liner is located inside the packaging bag; the flexible partition is fixed inside the protective liner and has cushioning foam inserted inside; and the snap fasteners and fastening components match to form a closed structure. This allows the protective liner, flexible partition, and cushioning foam to protect the microelectronic components through direct contact and cushioning. The snap fasteners and fastening components seal the microelectronic components by closing the opening of the packaging bag. Therefore, this device provides comprehensive protection for the selected microelectronic components through multiple protective and sealing measures, reducing the risk of damage to the components during storage and transportation due to collisions, vibrations, and external environmental influences. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall axial side view structure after disassembly in an embodiment of this application;

[0019] Figure 2 This is a schematic diagram of the overall axial side view of the combined structure in the embodiments of this application;

[0020] Figure 3 This is a schematic diagram of the combined structure of the sealing element and the snap fastener assembly in an embodiment of this application;

[0021] Figure 4 This is a schematic diagram of the combined structure of the packaging bag and the protective liner in an embodiment of this application.

[0022] Figure 5 This is a schematic diagram of the overall top view structure in the embodiments of this application;

[0023] Figure 6 This is a front view schematic diagram of some structures in the embodiments of this application.

[0024] Reference numerals: 1. Packaging bag; 101. Fastening assembly; 1011. Reinforcing strip; 1012. Reinforcing edge strip; 2. Protective liner; 201. Flexible partition; 2011. Cushioning foam; 3. Sealing component; 301. Snap fastener assembly. Detailed Implementation

[0025] The following is in conjunction with the appendix Figure 1-6 This application will be described in further detail.

[0026] This application discloses an antistatic flexible packaging bag structure for microelectronic components. For example... Figure 1-6 As shown, a microelectronic component antistatic soft packaging bag structure includes a packaging bag 1. A fastening assembly 101 is fixedly connected to the top of the packaging bag 1. There are two fastening assemblies 101, which are fixedly connected in a linear array on the left and right sides of the top surface of the packaging bag 1. A reinforcing strip 1012 is fixedly connected to the rear corner of the packaging bag 1. The two fastening assemblies 101 at the top of the packaging bag 1 are distributed in a linear array on the left and right sides, and the reinforcing strip 1012 at the rear corner can further reinforce the corner of the packaging bag. At the same time, the fastening assembly 101 also provides a connection point for the sealing structure. The front end of the packaging bag 1 is provided with an opening for holding electronic components. A protective liner 2 is fixedly connected to the inner side of the packaging bag 1.

[0027] Please see Figure 3The main body of the reinforcing strip 1012 is an L-shaped structure. There are two reinforcing strips 1012, which are fixedly connected to the left and right sides of the packaging bag 1 in opposite directions. Two flexible partitions 201 are fixedly connected to the inner side of the protective liner 2. The two L-shaped reinforcing strips 1012 are fixed to the left and right sides of the packaging bag 1 in opposite directions. The two flexible partitions 201 on the inner side of the protective liner 2 can separate the electronic components inside the bag and prevent the components from colliding with each other.

[0028] A reinforcing strip 1011 is also fixedly connected to the outside of the packaging bag 1. There are four reinforcing strips 1011 in total. Each pair of reinforcing strips 1011 is arranged in an alternating manner as a group. The two groups of reinforcing strips 1011 are fixedly connected to the upper and lower sides of the packaging bag 1 in opposite directions.

[0029] The packaging bag 1 has an opening at the front end for holding electronic components, and the inner protective liner 2 protects the components. Four reinforcing strips 1011 are arranged on the upper and lower sides of the packaging bag 1 in two sets, which can enhance the structural strength of the packaging bag and reduce the damage caused by stress deformation at the corners.

[0030] Please see Figure 2 Two flexible partitions 201 are arranged in a linear array on the inner side of the packaging bag 1. Buffer foam 2011 is inserted into the interior of both flexible partitions 201. A flexible sealing component 3 is heat-fused to the outer side of the packaging bag 1. Two snap fasteners 301 are fixedly connected in a linear array on the side of the sealing component 3 closest to the packaging bag 1. The snap fasteners 301 match the fastening components 101 and together with the fastening components 101 form a closed structure for the front opening of the packaging bag 1.

[0031] The snap fastener 301 and the fastening assembly 101 are matched to form a closed structure of the front opening of the packaging bag 1, which ensures the sealing of the packaging and prevents electronic components from being exposed.

[0032] The implementation principle of the anti-static soft packaging bag structure for microelectronic components in this application embodiment is as follows: The user first puts the microelectronic component into the bag through the opening at the front end of the packaging bag 1. At this time, the protective liner 2 is in direct contact with the microelectronic component. The protective liner 2 is made of a soft and tough material, which can effectively prevent the component from directly rubbing against the inner wall of the packaging bag 1, and avoid damage to the microelectronic component caused by static electricity or mechanical damage during the placement process.

[0033] During handling and transportation, the packaging bag 1 will inevitably be subjected to various external forces. At this time, the four reinforcing strips 1011 on the upper and lower sides of the packaging bag 1 play a key role. These four reinforcing strips 1011 are arranged in pairs, with the two groups facing each other. When external forces such as squeezing or collision are applied to the packaging bag 1, the reinforcing strips 1011, with their good adhesion and high toughness, act like a "buffer pad" to distribute the external force over a larger area. For example, when subjected to pressure from above, the two reinforcing strips 1011 in the upper group will transmit the pressure along the side of the packaging bag 1, while the reinforcing strips 1011 in the lower group will play a reverse support role, enabling the entire packaging bag 1 to withstand greater external forces and avoid excessive local stress, thereby reducing the possibility of deformation or damage at the corners of the packaging bag 1 due to stress.

[0034] After the microelectronic components are placed, the packaging bag 1 needs to be sealed. Two fastening components 101 are fixed on the top left and right sides of the packaging bag 1. At the same time, two snap fastening components 301 are fixedly connected in a straight array on the flexible structure sealing piece 3 heat-fused to the outside of the packaging bag 1, near the side of the packaging bag 1. The user covers the front opening of the packaging bag 1 with the sealing piece 3, so that the snap fastening components 301 correspond one-to-one with the fastening components 101. Then, by pressing or other operations, the snap fastening components 301 and the fastening components 101 are tightly fastened together. In this way, a reliable closed structure is formed to ensure that the microelectronic components are sealed in the bag, effectively preventing them from being exposed and avoiding external dust, moisture and other impurities from entering the bag and causing adverse effects on the microelectronic components.

[0035] In practical applications, the corners of the packaging bag 1 are easily subjected to impacts such as collisions. The two L-shaped reinforcing strips 1012 at the rear corners of the packaging bag 1 play an important role in this situation. The special L-shaped structure design allows it to fit better against the corners of the packaging bag 1. When the corners are impacted, the L-shaped structure of the reinforcing strip 1012 can disperse the impact force along its two right-angled sides. At the same time, the material of the reinforcing strip 1012 itself has a certain degree of hardness and toughness, which can absorb some of the impact energy, thereby effectively protecting the corners of the packaging bag 1 from being easily damaged, and further ensuring the safety of the storage environment for microelectronic components.

[0036] Two flexible partitions 201 are provided on the inner side of the protective liner 2 to divide the interior of the packaging bag 1 into different areas. When multiple microelectronic components are placed, the flexible partitions 201 can prevent the components from colliding and rubbing against each other. The flexible partitions 201 are made of soft and elastic materials, which can also play a buffering role even when subjected to a certain amount of compression. In addition, cushioning foam 2011 is inserted inside each of the flexible partitions 201. The cushioning foam 2011 has good shock absorption performance. When the packaging bag 1 is subjected to vibration during transportation or handling, the cushioning foam 2011 can absorb the vibration energy and minimize the impact of vibration on the microelectronic components, further protecting the microelectronic components and reducing the risk of component damage caused by vibration.

[0037] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A structure for an antistatic flexible packaging bag for microelectronic components, comprising a packaging bag (1), characterized in that: The front end of the packaging bag (1) is provided with an opening for holding electronic components, and a protective liner (2) is fixedly connected to the inside of the packaging bag (1). The outer side of the packaging bag (1) is also fixedly connected with a reinforcing strip (1011). There are four reinforcing strips (1011) in total. Each pair of reinforcing strips (1011) is arranged in an alternating manner as a group. The two groups of reinforcing strips (1011) are fixedly connected to the upper and lower sides of the packaging bag (1) in opposite directions.

2. The structure of an antistatic soft packaging bag for microelectronic components according to claim 1, characterized in that: The top of the packaging bag (1) is fixedly connected to a fastening assembly (101), and there are two fastening assemblies (101).

3. The structure of an antistatic soft packaging bag for microelectronic components according to claim 2, characterized in that: The two fastening components (101) are fixedly connected in a straight line array to the left and right sides of the top surface of the packaging bag (1), and a reinforcing strip (1012) is fixedly connected to the rear corner of the packaging bag (1).

4. The structure of an antistatic soft packaging bag for microelectronic components according to claim 3, characterized in that: The main body of the reinforcing strip (1012) is an L-shaped structure, and there are two reinforcing strips (1012).

5. The structure of an antistatic soft packaging bag for microelectronic components according to claim 4, characterized in that: The two reinforcing strips (1012) are fixedly connected to the left and right sides of the packaging bag (1) in opposite directions, and the inner side of the protective liner (2) is fixedly connected to two flexible partitions (201).

6. The structure of an antistatic soft packaging bag for microelectronic components according to claim 5, characterized in that: Two flexible partitions (201) are arranged in a straight line array on the inside of the packaging bag (1), and cushioning foam (2011) is inserted inside both flexible partitions (201).

7. The structure of an antistatic soft packaging bag for microelectronic components according to claim 1, characterized in that: The outer side of the packaging bag (1) is heat-fused with a flexible sealing member (3), and two snap fasteners (301) are fixedly connected in a straight array on the side of the sealing member (3) closest to the packaging bag (1).

8. The structure of an antistatic soft packaging bag for microelectronic components according to claim 7, characterized in that: The snap fastener assembly (301) matches the fastening assembly (101) and together they form a closed structure for the front opening of the packaging bag (1).

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