Mechanism capable of improving wafer conveying reliability and thin film deposition equipment thereof

Abstract

The utility model discloses a mechanism capable of improving wafer conveying reliability. The mechanism comprises a heating disc, a supporting plate, a lifting ejector pin and a counter weight cap. The supporting plate is arranged below the heating disc and can be controlled to move close to or away from the heating disc, and a plurality of through holes are formed in the heating disc; a heavy hammer is arranged at the lower end of the lifting ejector pin, the top end of the lifting ejector pin penetrates through the through hole, and the heavy hammer is embedded in a heavy hammer cap; a containing cavity is formed in the heavy hammer cap, the heavy hammer cap is connected to the supporting plate, the heavy hammer is located in the containing cavity, and the heavy hammer is not separated from the containing cavity in the descending process of the heavy hammer cap. According to the mechanism capable of improving the wafer conveying reliability and the thin film deposition equipment thereof, the heavy hammer cap is additionally arranged outside the heavy hammer of the lifting ejector pin, and the stroke limitation between the lifting ejector pin and the heating disc is relieved at the same time; and the heavy hammer cap applies pulling force to the lifting ejector pin, so that the lifting ejector pin smoothly falls, and the wafer is prevented from being damaged.

Description

Technical Field

[0001] This utility model relates to the field of thin film deposition equipment technology, and in particular to a mechanism that can improve the reliability of film transfer and its thin film deposition equipment. Background Technology

[0002] In the application of CVD (Chemical Vapor Deposition) and ALD (Atomic Layer Deposition) processes, the wafer transfer system generally uses a lift pin to perform lifting actions to transfer the wafer from the robotic arm to the heating plate, where it is heated and then subjected to thin film deposition.

[0003] The lifting pins are inserted into the heating plate. Their upward movement is driven by an external drive unit, while their downward movement relies on the gravity of the lifting pins and a counterweight. However, during long-term thin-film deposition processes, the perforations on the heating plate used to insert the lifting pins are prone to blockage, leading to increased friction. This can cause the lifting pins to fail to fall naturally under gravity, resulting in wafer transfer problems or even damage. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a mechanism and thin film deposition equipment that can improve the reliability of film transfer, so as to solve the technical problem that the existing lifting pin is easily jammed and cannot fall naturally.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] In a first aspect, embodiments of this utility model provide a mechanism that can improve the reliability of the transfer plate, which includes: a heating plate, a support plate, a lifting pin, and a counterweight cap.

[0007] The support plate is located below the heating plate and can be moved closer to or further away from the heating plate in a controlled manner. The heating plate is provided with several through holes.

[0008] The lower end of the lifting pin is provided with a counterweight, the top end of the lifting pin passes through the through hole, and the counterweight is embedded in the counterweight cap.

[0009] The hammer cap has a cavity inside, the hammer cap is connected to the support plate, the hammer is located inside the cavity, and the hammer does not detach from the cavity during the descent of the hammer cap.

[0010] The upper end of the lifting pin can extend out of the top surface of the heating plate through the through hole or sink into the through hole.

[0011] The counterweight is connected to the lifting pin by a snap-fit.

[0012] The hammer has an axially extending opening, and several elastic plates extend upward from the top edge of the opening. The elastic plates form a conical guide opening, and the lifting pin is inserted into the opening through the conical guide opening and engaged in the hammer.

[0013] The inner wall of the elastic sheet is provided with a slot, and the lower outer wall of the lifting pin is provided with a protrusion corresponding to the slot.

[0014] The hammer cap is snapped together with the support plate.

[0015] The support plate is provided with a connecting hole, and the side wall of the connecting hole is recessed with an annular groove. The lower outer wall of the weight cap is provided with several locking protrusions, which are engaged with the annular groove.

[0016] The hammer cap includes an annular top plate and several spaced side plates that are vertically bent out from the outer edge of the annular top plate. The locking protrusion is disposed on the outer side surface of the spaced side plates.

[0017] The distance between the sidewall of the hammer and the inner edge of the annular top plate is greater than 5mm, the distance between the annular top plate and the hammer in the vertical direction is less than 5mm, and the distance between the sidewall of the hammer and the inner wall of the cavity is greater than 5mm.

[0018] Secondly, embodiments of the present invention provide a thin film deposition apparatus, the thin film deposition apparatus including the mechanism described in any of the above to improve wafer transfer reliability.

[0019] The present invention relates to a mechanism for improving wafer transfer reliability and a thin film deposition equipment. By adding a weight cap to the outside of the weight of the lifting pin, and simultaneously removing the travel restriction between the lifting pin and the heating plate, when the through hole on the heating plate is blocked due to thin film deposition and the lifting pin cannot fall naturally, the weight cap applies a pulling force to the lifting pin, allowing it to fall smoothly, thereby avoiding damage to the wafer.

[0020] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model, it can be implemented according to the contents of the specification. In order to make the above and other objects, features and advantages of this utility model more obvious and easy to understand, the following are preferred embodiments, which are described in detail below. Attached Figure Description

[0021] Figure 1 This is a cross-sectional view of a process equipment used for wafer thin film deposition in the prior art.

[0022] Figure 2 This is a cross-sectional view of a thin film deposition apparatus with a mechanism for improving wafer transfer reliability, according to an embodiment of the present invention.

[0023] Figure 3 This is a partial structural diagram of a mechanism that can improve the reliability of the transfer chip according to an embodiment of the present invention.

[0024] Figure 4 and Figure 5 for Figure 2 Two enlarged structural diagrams of the middle section.

[0025] Explanation of reference numerals in the attached figures:

[0026] Traditional thin film deposition equipment 100, thin film deposition equipment 200, process chamber 21, process cavity 211, support plate 22, connecting hole 221, annular groove 222, heating plate 23, through hole 231, lifting pin 24, upper end 241, slot 242, counterweight 25, counterweight body 251, opening 2511, elastic sheet 250, strip hole 2501, clamping piece 252, locking protrusion 2521, guide piece 253, conical guide port 254, counterweight cap 26, cavity 2611, annular top plate 261, spacer hole 2612, round hole 2613, spacer side plate 262, locking protrusion 263, robot arm 27, support structure 28, wafer 300, process chamber 11, heating plate 12, robot arm 13, pin 14, counterweight 15, end cap 16, support plate 17. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0029] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0031] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral molding; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0032] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0033] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0034] In the application of CVD (Chemical Vapor Deposition) and ALD (Atomic Layer Deposition) processes, the wafer transfer system generally uses a lift pin to perform lifting actions to transfer the wafer from the robotic arm to the heating plate, where it is heated and then subjected to thin film deposition.

[0035] In this process, the lifting pins are inserted into the heating plate. Their upward movement is driven by an external drive unit, while their downward movement relies on their own weight. However, during long-term thin film deposition processes, the perforations on the heating plate used to insert the lifting pins are prone to blockage, leading to increased friction. This can cause the lifting pins to fail to fall naturally under their own weight, resulting in wafer transfer problems or even damage. To address these issues, this embodiment discloses a thin film deposition apparatus 200 with a mechanism that improves wafer transfer reliability.

[0036] Please refer to the following first. Figure 1 , Figure 1 This is a partial structural diagram of a conventional thin-film deposition apparatus 100 commonly used in the prior art. The conventional thin-film deposition apparatus 100 includes: a process chamber 11, a heating plate 12, a support plate 17, and a lifting pin assembly disposed within the process chamber 11. The heating plate 12 and the support plate 17 are vertically aligned, with the middle portion of the heating plate 12 supported by a support unit. The bottom of the lifting pin assembly is supported on the upper surface of the support plate 17, and the top of the lifting pin assembly passes through the heating plate 12. The lifting pin assembly includes: a pin 14, a counterweight 15 disposed at the lower end of the pin 14, and an end cap 16 disposed at the top of the pin 14. The counterweight 15 is disposed on the top surface of the support plate 17, and the two are not fixedly connected. The end cap 16 limits the descent stroke of the ejector pin 14. That is, when the ejector pin 14 reaches its lowest position, the end cap 16 engages with the heating plate 12, preventing the ejector pin 14 from falling further. During wafer transfer, the robot arm 13 moves the wafer 300 directly above the heating plate 12. Then, the support plate 17, controlled by the drive unit, rises. As the support plate 17 rises, it simultaneously pushes all the ejector pin assemblies upwards, causing the upper end of the ejector pin 14 to protrude from the upper surface of the heating plate 12. At this point, the robot arm descends, transferring the wafer 300 to the top of the ejector pin 14, where multiple ejector pins 14 collectively support the wafer 300. Then, the support plate 17 is lowered again, and the ejector pins 14 fall naturally under the action of the counterweight 15 until the wafer 300 is lowered and placed on the upper surface of the heating plate 12. Finally, the heating plate 12 is activated to heat the wafer 300 and introduce process gas to deposit a thin film on the surface of the wafer 300.

[0037] In the aforementioned conventional thin film deposition equipment 100, a large amount of process gas is introduced during the thin film deposition process. After long-term use, the process gas will block the through holes on the heating plate 12, and the ejector pin 14 will not be able to fall naturally under the weight of the counterweight 15 and its own gravity. This will cause the wafer 300 to be placed unevenly, and may also cause the wafer 300 to slip, damaging its surface and ultimately affecting the quality of thin film deposition. In order to solve the problems existing in the aforementioned conventional thin film deposition equipment 100, this embodiment proposes a new thin film deposition equipment 100, which includes a mechanism that can improve the reliability of wafer transfer.

[0038] Please see Figures 2 to 5 The mechanism that can improve the reliability of the transfer plate includes: a heating plate 23, a support plate 22, a lifting pin 24, and a counterweight cap 26.

[0039] The support plate 22 is disposed below the heating plate 23 and can be controlled to move closer to or further away from the heating plate 23. The heating plate 23 is provided with a plurality of through holes 231.

[0040] The lower end of the lifting pin 24 is provided with a counterweight 25, the top end of the lifting pin 24 passes through the through hole 231, and the counterweight 25 is embedded in the counterweight cap 26.

[0041] The hammer cap 26 has a cavity 2611 inside. The hammer cap 26 is connected to the support plate 22. The hammer 25 is located inside the cavity 2611, and the hammer 25 does not detach from the cavity 2611 during the descent of the hammer cap 26.

[0042] In this embodiment, in order to solve the problem that the lifting pin 24 may get stuck in the through hole 231 and cannot fall automatically after long-term use of the thin film deposition equipment, a weight cap 26 is provided on the outside of the weight 25. The weight cap 26 is connected to the support plate 22. When the support plate 22 descends, the weight cap 26 will exert a downward pulling force on the weight 25 so that the lifting pin 24 falls along the through hole 231, and finally the top of the lifting pin 24 descends below the top surface of the heating plate 23, thereby avoiding adverse effects on the wafer 300.

[0043] The upper end 241 of the lifting pin 24 can extend out of the top surface of the heating plate 23 through the through hole 231 or sink into the through hole 231. Compared with the conventional thin film deposition equipment 100, in this mechanism that improves the reliability of wafer transfer, the end cap of the upper end 241 of the lifting pin 24 is removed. At this time, the lifting pin 24 can move up and down with the support plate 22 within a larger stroke. The heating plate 23 will not restrict the vertical direction of the lifting pin 24, and will not cause damage to the lifting pin 24 due to the restriction of the heating plate 23.

[0044] Of course, it is understandable that if the lifting pin 24 is not stuck in the through hole 231, the lifting pin 24 will descend naturally by its own weight and the weight of the counterweight 25, and the counterweight cap 26 will not play a pulling role in this process.

[0045] In this embodiment, the counterweight 25 is snapped together with the lifting pin 24.

[0046] The hammer 25 has an axially extending opening 2511. The top edge of the opening 2511 has several elastic pieces 250 extending upward. The elastic pieces 250 form a conical guide opening 254. The lifting pin 24 is inserted into the opening 2511 through the conical guide opening 254 and is engaged in the hammer 25.

[0047] The inner wall of the elastic sheet 250 is provided with a locking protrusion 2521, and the lower outer wall of the lifting pin 24 is provided with a locking groove 242 corresponding to the locking protrusion 2521. Of course, the locking protrusion 2521 and the locking groove 242 can be interchanged on the elastic sheet 250 and the lifting pin 24.

[0048] Specifically, the hammer 25 includes: a hammer body 251, which has an axially oriented opening 2511. Several clamping pieces 252 extend upward from the top edge of the opening 2511, and guide pieces 253 extend outward from the top edge of the clamping pieces 252. The clamping pieces 252 and the guide pieces 253 together form the elastic piece 250. The clamping pieces 252 are axially parallel to the opening 2511, and the guide pieces 253 extend outward from bottom to top, with several guide pieces 253 collectively forming the conical guide opening 254. In this embodiment, the hammer body 251 is a cylinder, and the opening 2511 is located at the axial center of the cylinder. The corresponding multiple elastic pieces 250 also form a roughly symmetrical structure around the axis of the opening 2511, so that the lifting pin 24 can perform lifting and lowering actions under the action of the hammer 25 more stably and precisely, without lateral deviation, thus preventing any impact on the horizontality of the wafer support.

[0049] Please refer to it again. Figure 3 A strip-shaped hole 2501 is provided between multiple spaced elastic plates 250. The strip-shaped hole 2501 provides a larger elastic space for the multiple elastic plates 250 to expand outward, so as to provide a larger elastic force on the small-sized counterweight 25 to engage with the lifting pin 24.

[0050] Please refer to it again. Figure 2 , Figure 3 and Figure 5 The hammer cap 26 is snapped together with the support plate 22.

[0051] The support plate 22 is provided with a connecting hole 221, and the side wall of the connecting hole 221 is recessed with an annular groove 222. The lower outer wall of the hammer cap 26 is provided with several locking protrusions 263, which are engaged with the annular groove 222.

[0052] In this embodiment, the connecting hole 221 is a circular hole, and the annular groove 222 is recessed outward along the radial direction of the connecting hole 221. The annular groove 222 forms a slot structure for locking and fixing the counterweight cap 26.

[0053] Specifically, the counterweight cap 26 includes an annular top plate 261 and several spaced side plates 262 that are vertically bent from the outer edge of the annular top plate 261. The locking protrusion 263 is disposed on the outer surface of the spaced side plates 262. The bottom of the counterweight cap 26 has an open structure, and a circular hole 2613 is formed in the middle of the annular top plate 261. Spacing holes 2612 are reserved between adjacent spaced side plates 262. The counterweight cap 26 is engaged with the support plate 22 in the following manner: the spaced side plates 262 of the counterweight cap 26 are radially pressed to shrink them inward, then the counterweight cap 26 is inserted into the connecting hole 221, and finally the spaced side plates 262 are released. At this time, the locking protrusion 263 engages with the annular groove 222, and finally the counterweight cap 26 is engaged with the support plate 22.

[0054] Please refer to it again. Figures 2 to 5 The assembly process of the mechanism that improves the reliability of the transfer plate in this embodiment is as follows: First, the lifting pin 24 is inserted into the opening 2511 through the conical guide 254 of the weight 25, so that its locking protrusion 2521 engages with the locking groove 242, thereby assembling the lifting pin 24 with the weight 25. Then, the assembled lifting pin 24 and weight 25 are inserted into the cavity 2611 through the bottom opening of the weight cap 26, wherein the weight body 261 is located in the cavity 2611, and the elastic plate 250 extends out of the round hole 2613, which facilitates subsequent alignment and assembly with the heating plate 23. Finally, the spacer side plate 262 is radially compressed to shrink it, inserted into the connecting hole 221, and then the spacer side plate 262 is released, so that the locking protrusion 263 engages with the annular groove 222, and finally the weight cap 26 is assembled onto the support plate 22.

[0055] Please refer to it again. Figure 5 In this embodiment, the distance A between the sidewall of the counterweight 25 and the inner edge of the annular top plate 261 is greater than 5mm, the vertical distance B between the annular top plate 261 and the counterweight 25 is less than 5mm, and the distance C between the sidewall of the counterweight 25 and the inner wall of the cavity 2611 is greater than 5mm, that is, the distance C between the sidewall of the counterweight 25 and the inner wall of the spacer side plate 262 is greater than 5mm. This spacing arrangement effectively balances the ease of assembly between components and improves the reliability of the transfer mechanism during use.

[0056] An embodiment of this utility model provides a thin film deposition apparatus 200, which includes a mechanism as described above for improving wafer transfer reliability. The mechanism for improving wafer transfer reliability is disposed within the process chamber 211 of the process cavity 21. A robotic arm 27 is also provided above the heating plate 23, and the robotic arm 27 is used to transfer the wafer 300 from the previous station to the heating plate 23 within the process chamber 211. A support structure 28 is also provided at the bottom center of the heating plate 23. The heating plate 23 and the support plate 22 are generally of a disc structure. A plurality of lifting pins 24 and counterweight caps 26 are evenly distributed around the center of the disc structure in a circular pattern.

[0057] The mechanism and thin film deposition equipment of this embodiment that can improve wafer transfer reliability adds a counterweight cap to the counterweight of the lifting pin and removes the travel restriction between the lifting pin and the heating plate. When the through hole on the heating plate is blocked due to thin film deposition and the lifting pin cannot fall naturally, the counterweight cap applies a pulling force to the lifting pin, so that it falls smoothly, thereby avoiding damage to the wafer.

[0058] The above examples are merely illustrative of the technical content of this utility model to facilitate reader understanding, but do not imply that the implementation of this utility model is limited to these embodiments. Any technical extensions or re-creations made based on this utility model are protected by this utility model. The scope of protection of this utility model is defined by the claims.

Claims

1. A mechanism for improving the reliability of wafer transfer, characterized in that, include: Heating plate, support plate, lifting pin, and counterweight cap; The support plate is located below the heating plate and can be moved closer to or further away from the heating plate in a controlled manner. The heating plate is provided with several through holes. The lower end of the lifting pin is provided with a counterweight, the top end of the lifting pin passes through the through hole, and the counterweight is embedded in the counterweight cap. The hammer cap has a cavity inside, the hammer cap is connected to the support plate, the hammer is located inside the cavity, and the hammer does not detach from the cavity during the descent of the hammer cap.

2. The mechanism for improving the reliability of wafer transfer according to claim 1, characterized in that, The upper end of the lifting pin can extend out of the top surface of the heating plate through the through hole or sink into the through hole.

3. The mechanism for improving the reliability of wafer transfer according to claim 2, characterized in that, The weight is connected to the lifting pin by a buckle.

4. The mechanism for improving the reliability of wafer transfer according to claim 3, characterized in that, The hammer has an axially extending opening, and several elastic plates extend upward from the top edge of the opening. The elastic plates form a conical guide opening, and the lifting pin is inserted into the opening through the conical guide opening and engaged in the hammer.

5. The mechanism for improving the reliability of wafer transfer according to claim 4, characterized in that, The inner wall of the elastic sheet is provided with a slot, and the lower outer wall of the lifting pin is provided with a protrusion corresponding to the slot.

6. The mechanism for improving the reliability of wafer transfer according to claim 2, characterized in that, The hammer cap is snapped together with the support plate.

7. The mechanism for improving the reliability of wafer transfer according to claim 6, characterized in that, The support plate is provided with a connecting hole, and the side wall of the connecting hole is recessed with an annular groove. The lower outer wall of the hammer cap is provided with several locking protrusions, which are engaged with the annular groove.

8. The mechanism for improving the reliability of wafer transfer according to claim 7, characterized in that, The hammer cap includes an annular top plate and several spaced side plates that are vertically bent out from the outer edge of the annular top plate. The locking protrusion is disposed on the outer side surface of the spaced side plates.

9. The mechanism for improving the reliability of wafer transfer according to claim 8, characterized in that, The distance between the sidewall of the hammer and the inner edge of the annular top plate is greater than 5mm, the distance between the annular top plate and the hammer in the vertical direction is less than 5mm, and the distance between the sidewall of the hammer and the inner wall of the cavity is greater than 5mm.

10. A thin film deposition apparatus, characterized in that, The thin film deposition apparatus includes a mechanism as described in any one of claims 1 to 9 that can improve wafer transfer reliability.

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