High-temperature-resistant inductor
By employing a honeycomb microporous ferrite core, composite enameled wire winding, and multi-layer packaging structure in the inductor, the heat dissipation and short-circuit problems of the inductor under high temperature and high humidity environments are solved, achieving high temperature resistance performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHANGXING CHAONENG ELECTRONICS
- Filing Date
- 2025-04-22
- Publication Date
- 2026-04-28
AI Technical Summary
In high temperature and high humidity environments, inductors are prone to reduced lifespan due to decreased permeability and short circuits in the coil, resulting in poor heat dissipation.
It adopts a ferrite core, honeycomb microporous structure, composite enameled wire winding, mica tape insertion and multi-layer encapsulation structure, combined with metal heat sink and high temperature resistant epoxy resin layer to enhance heat dissipation and prevent high temperature short circuit.
Maintaining stable inductor performance in high-temperature environments, preventing core failure, and extending service life.
Smart Images
Figure CN224177203U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of electronic component technology, and is particularly suitable for a high-temperature resistant inductor. Background Technology
[0002] An inductor is a component that converts electrical energy into magnetic energy and stores it. The structure of an inductor is similar to a transformer, but it has only one winding. An inductor has a certain inductance, which only impedes changes in current. Inductors operating under high temperature and humidity are prone to a decrease in permeability due to high temperatures, and the coil may sometimes experience interlayer short circuits due to high temperatures; at the same time, poor heat dissipation reduces its lifespan. Utility Model Content
[0003] The purpose of this invention is to provide a high-temperature resistant inductor that effectively prevents core failure, reduces winding end temperature rise, and maintains stable performance in high-temperature environments. It is especially suitable for high-temperature and high-humidity environments such as new energy vehicle motor controllers and industrial frequency converters.
[0004] The technical solution of this utility model is as follows: a high-temperature resistant inductor, comprising a magnetic core and a package body. A support base is provided on the outer side of the bottom wall of the package body. The magnetic core is housed inside the package body. The magnetic core includes a magnetic core body and a winding assembly is wound around the magnetic core body. The magnetic core body is a ferrite core with honeycomb micropores inside. The winding assembly includes composite enameled wire. The composite enameled wire is wound around the magnetic core body with a winding structure of dense winding in the middle and sparse winding at the ends. Mica tape is inserted between the enameled wire winding layers. Multiple heat sinks are embedded around the inside of the package body. Multiple heat sink grooves are provided on the outer wall of the package body. The package body includes a high-temperature resistant epoxy resin layer and a ceramic layer arranged sequentially from the inside to the outside. Two pins are connected to the lower end of the magnetic core, and the two pins pass through holes on the bottom wall of the package body and holes on the support base, respectively, and are located below the support base. A silicone buffer layer is filled between the magnetic core and the package body.
[0005] Preferably, the heat sink is a metal heat sink.
[0006] Preferably, the honeycomb micropores have a pore size of 20-100 μm and a porosity of 15-20%.
[0007] Preferably, the outer surface of the magnetic core body is provided with a fish scale pattern, which increases the heat dissipation area by more than 30%.
[0008] Preferably, the composite enameled wire comprises, from the inside out, a copper core, a polyimide layer, a nano-magnesium oxide coating, a polyethersulfone (PES) layer, and a fluorinated ethylene propylene (FEP) layer.
[0009] The advantages and positive effects of this utility model are as follows: due to the adoption of the above technical solution, the encapsulation body includes a high-temperature resistant epoxy resin layer and a ceramic layer in sequence, which enhances its heat resistance; the winding assembly adopts a medium-dense and end-sparse winding method, and mica tape is inserted between the winding layers to reduce the end temperature rise and block high-temperature interlayer short circuits. Attached Figure Description
[0010] Figure 1 This is a schematic diagram of the structure of this utility model.
[0011] Figure 2 This is an internal cross-sectional view of the magnetic core.
[0012] In the picture:
[0013] 1. Encapsulation body; 2. Support base; 3. Magnetic core body
[0014] 4. Honeycomb micropores 5. Composite enameled wire 6. Mica tape
[0015] 7. Heat sink 8. Silicone buffer layer 9. Pins Detailed Implementation
[0016] like Figure 1 , 2 As shown, the technical solution of this utility model is a high-temperature resistant inductor, including a magnetic core and a package body 1. A support base 2 is provided on the outer side of the bottom wall of the package body 1. The magnetic core is housed inside the package body 1. The magnetic core includes a magnetic core body 3, around which a winding assembly is wound. The magnetic core body 3 is a ferrite core with honeycomb-shaped micropores 4 inside to reduce thermal stress. The winding assembly includes composite enameled wire 5, which is wound around the magnetic core body 3 with a dense winding in the middle and a sparse winding at the ends to reduce end temperature rise. Mica tape 6 is inserted between the enameled wire winding layers to prevent high-temperature interlayer short circuits.
[0017] The encapsulation body 1 has multiple heat sinks 7 embedded around its interior and multiple heat dissipation grooves on its outer wall. The heat sinks 7 and heat dissipation grooves improve its heat dissipation. The encapsulation body 1 includes a high-temperature resistant epoxy resin layer and a ceramic layer arranged sequentially from the inside to the outside. The encapsulation resin is combined with ceramic powder to enhance heat resistance. The lower end of the magnetic core is connected to two pins 9, and the two pins 9 pass through holes on the bottom wall of the encapsulation body 1 and holes on the support base 2, respectively, and are located below the support base 2. The magnetic core and the encapsulation body 1 are filled with a silicone buffer layer 8 to reduce thermal stress and adapt to thermal expansion deformation.
[0018] In this embodiment, the heat sink 7 is a metal heat sink.
[0019] In this embodiment, the honeycomb micropores 4 have a pore size of 20-100 μm and a porosity of 15-20%.
[0020] In this embodiment, the outer surface of the magnetic core body 3 is provided with a fish scale pattern, which increases the heat dissipation area by more than 30%.
[0021] In this embodiment, the composite enameled wire 5 includes, from the inside out, a copper core, a polyimide layer, a nano-magnesium oxide coating, a polyethersulfone (PES) layer, and a fluorinated ethylene propylene (FEP) layer.
[0022] The working process and principle of this example are as follows: the magnetic core blank is formed by 3D printing, sintered in a nitrogen-hydrogen mixed atmosphere at 1350℃, and the surface is laser-processed with fish scale pattern; honeycomb micropores are formed inside the magnetic core by chemical etching.
[0023] Five-layer composite enameled wire with a diameter of 0.7mm is used. 150 turns are wound in a stepped manner in the core body, with 100 turns in the middle and 25 turns at each end. A 0.03mm thick mica tape is inserted between each layer of winding to prevent high-temperature interlayer short circuits.
[0024] The above description provides a detailed account of one embodiment of the present invention. However, this description is merely a preferred embodiment and should not be construed as limiting the scope of the present invention. All equivalent variations and improvements made within the scope of the claims of the present invention should still fall within the patent coverage of the present invention.
Claims
1. A high-temperature resistant inductor, characterized in that: The package includes a magnetic core and a packaging body. A support base is located on the outer side of the bottom wall of the packaging body. The magnetic core is housed within the packaging body and comprises a magnetic core body. A winding assembly is wound around the magnetic core body. The magnetic core body is a ferrite core with honeycomb-shaped micropores inside. The winding assembly includes composite enameled wire, which is wound around the magnetic core body with a dense winding in the middle and a sparse winding at the ends. Mica tape is inserted between the enameled wire winding layers. Multiple heat sinks are embedded around the circumference of the packaging body, and multiple heat dissipation grooves are provided on the outer wall of the packaging body. The packaging body includes a high-temperature resistant epoxy resin layer and a ceramic layer arranged sequentially from the inside to the outside. Two pins are connected to the lower end of the winding assembly, and the two pins pass through holes on the bottom wall of the packaging body and holes on the support base, respectively, and are located below the support base. A silicone buffer layer is filled between the magnetic core and the packaging body.
2. The high-temperature resistant inductor according to claim 1, characterized in that: The heat sink is a metal heat sink.
3. A high-temperature resistant inductor according to claim 1, characterized in that: The honeycomb-shaped micropores have a pore size of 20-100 μm and a porosity of 15-20%.
4. A high-temperature resistant inductor according to claim 1, characterized in that: The outer surface of the magnetic core body is decorated with a fish-scale pattern.
5. A high-temperature resistant inductor according to claim 1, characterized in that: The composite enameled wire comprises, from the inside out, a copper core, a polyimide layer, a nano-magnesium oxide coating, a polyethersulfone (PES) layer, and a fluorinated ethylene propylene (FEP) layer.