High-heat-dissipation-performance module box and combined structure thereof

Abstract

The utility model relates to the field of structural design and heat dissipation of electronic equipment, in particular to a module box with high heat dissipation performance and a combined structure thereof, which comprises a shell and a front panel assembly connected with the shell. Wherein the shell is at least integrated with a lattice structure, cold pipe type heat dissipation fins and a liquid cooling flow channel, the lattice structure and the cold pipe type heat dissipation fins are arranged on the outer surface of the shell, and the liquid cooling flow channel is arranged in the side wall of the shell; according to the utility model, the shell is integrally constructed by adopting an additive manufacturing technology, so that a complex internal liquid cooling flow channel, a radiating fin with an embedded cooling pipe and a lattice structure with a specific function, which are difficult to realize by a traditional process, can be precisely and integrally manufactured, thereby breaking through the design and manufacturing limitation of a traditional radiator; and a greater degree of freedom is provided for the optimal design of the heat dissipation structure.

Description

Technical Field

[0001] This utility model relates to the structural design and heat dissipation of electronic devices, specifically to a high heat dissipation module box and its combined structure. Background Technology

[0002] With the rapid development of electronic technology, the integration and power density of electronic components such as processors and power semiconductor devices are constantly increasing, resulting in a large amount of heat being generated during equipment operation. If this heat cannot be dissipated in a timely and effective manner, it will cause the equipment temperature to rise, which may not only reduce the operating performance and stability of electronic components, but may even shorten their service life.

[0003] High-performance processors, semiconductors, and other power devices have high requirements for heat dissipation performance, and various electronic components are generally quite sensitive to operating temperature. Therefore, the industry continuously demands high-performance and stable heat dissipation methods to effectively ensure the stable operation of related devices and modules.

[0004] Currently, independent heat sinks are commonly used in industry for heat dissipation, such as those manufactured using integral extrusion molding, brazing, or insert-type processes. While these traditional heat sinks are relatively easy to process, their heat dissipation effect, especially when using contact cooling or natural air cooling, is often affected by factors such as the contact between the device and the heat sink, the limited heat dissipation area of ​​the heat sink itself, and the ambient temperature. For devices with high heat output, they may not be able to achieve sufficient and efficient heat transfer and dissipation, thus failing to meet the ever-increasing heat dissipation demands. Utility Model Content

[0005] The technical problem to be solved by this utility model is the need for a more optimized heat dissipation structure design and manufacturing method at the present stage, in order to meet the ever-increasing heat dissipation requirements of high-performance electronic devices. The purpose is to provide a high heat dissipation performance module box and its combination structure, which effectively extends from natural heat dissipation to air cooling and liquid cooling, improves the external heat dissipation capability of modules and devices, and meets the device operating temperature requirements of electronic products.

[0006] This utility model is achieved through the following technical solution:

[0007] A high heat dissipation module box, comprising:

[0008] shell;

[0009] Front panel assembly, which is connected to the housing;

[0010] The outer shell integrates at least: a dot matrix structure, cold pipe heat dissipation fins, and liquid cooling channels. The dot matrix structure and the cold pipe heat dissipation fins are disposed on the outer surface of the outer shell, and the liquid cooling channels are disposed inside the side wall of the outer shell.

[0011] Specifically, the outer shell is integrally formed using additive manufacturing technology; the cold pipe type heat dissipation fins include heat dissipation fins and embedded cold pipes embedded in the heat dissipation fins;

[0012] The embedded cold pipe and the liquid cooling channel are connected to the external liquid cooling system.

[0013] Optionally, the dot matrix structure is disposed on the upper and / or lower surface of the housing, and the cold pipe heat dissipation fins are disposed on the side wall of the housing.

[0014] Optionally, the front panel assembly includes a front panel, a side panel, and a PCB board. The PCB board is fixedly disposed within the module box, and the PCB board is electrically connected to the front panel via a connector.

[0015] Specifically, the front panel assembly includes: the PCB board includes a PCB vertical board and a front PCB board, a plurality of the PCB vertical boards are fixed between the side plate and the cold pipe heat sink fins by studs, the front PCB board is disposed between the PCB vertical boards and the front panel, and the front PCB board and the plurality of the PCB vertical boards are electrically connected by the connector.

[0016] Optionally, the module box further includes a rear panel disposed opposite to the front panel, wherein the inlet and outlet of the embedded cold pipe and the liquid cooling channel are both disposed on the rear panel, and the external liquid cooling system is connected to the rear panel.

[0017] Optionally, the embedded cold pipes and the liquid cooling channels are arranged in a meandering, circuitous, or zigzag pattern.

[0018] Optionally, the lattice structure is a multi-layer lattice structure, and ventilation gaps are provided between the constituent units of the lattice structure.

[0019] A combined structure of a high heat dissipation module box includes:

[0020] Multiple module boxes as described above;

[0021] Pipe connectors, wherein multiple pipe connectors are respectively connected to the inlet and outlet of the embedded cold pipe and the liquid cooling channel;

[0022] The splitter pipe and the merging pipe are connected to the pipe connectors of all pipe inlets and then to the coolant inlet pipe. The merging pipe is connected to the outlet pipes of all pipes and then to the coolant outlet pipe. The coolant inlet pipe and the coolant outlet pipe are connected to the external liquid cooling system.

[0023] Optionally, multiple module boxes are arranged in parallel, and heat dissipation gaps are provided between adjacent module boxes.

[0024] Compared with the prior art, this utility model has the following advantages and beneficial effects:

[0025] This invention utilizes additive manufacturing technology to integrate the outer shell, enabling the precise and integrated fabrication of complex internal liquid cooling channels, heat dissipation fins with embedded cooling pipes, and dot matrix structures with specific functions—all of which are difficult to achieve with traditional processes. This breaks through the limitations of traditional radiator design and manufacturing, providing greater freedom for the optimized design of heat dissipation structures.

[0026] Secondly, this invention features a liquid cooling channel inside the outer shell wall, allowing the coolant to flow directly and efficiently through the shell area near the heat source or requiring temperature control. This enables the coolant to quickly absorb and remove the heat generated inside the module, effectively reducing the shell temperature.

[0027] Finally, by integrating embedded cooling pipes into the heat dissipation fin structure and allowing coolant to flow through them, the efficient transfer of heat from the shell to the fins and then to the coolant is greatly enhanced. This is equivalent to adding a forced liquid cooling channel inside the fins. Combined with air convection heat dissipation on the outer surface of the fins, a synergistic heat dissipation effect of liquid cooling and air cooling is formed, thus significantly improving the heat dissipation efficiency per unit volume or unit area. Attached Figure Description

[0028] The accompanying drawings illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the principles of the present invention. These drawings are included to provide a further understanding of the present invention, and are included in and constitute a part of this specification, but do not constitute a limitation on the embodiments of the present invention.

[0029] Figure 1 This is a structural schematic diagram of a high heat dissipation module box according to the present invention.

[0030] Figure 2 This is an assembly diagram of a high heat dissipation module box according to the present invention.

[0031] Figure 3 This is an assembly diagram of a high heat dissipation module box according to the present invention.

[0032] Figure 4 This is a schematic diagram of the cold pipe type heat sink fin structure according to the present invention.

[0033] Figure 5 This is a schematic diagram of the liquid cooling channel according to the present invention.

[0034] Figure 6 This is a schematic diagram of the front panel structure according to the present invention.

[0035] Reference numerals: 1-Outer shell, 2-Front panel assembly, 201-Diverter pipe, 202-Pipe connector, 203-Coolant inlet pipe, 204-Coolant outlet pipe, 3-Dot matrix structure, 4-Cold pipe heat sink fins, 401-Heat sink fins, 402-Embedded cold pipes, 5-Liquid cooling channel, 501-Front panel, 502-PCB vertical board, 503-Stud, 504-Front PCB board, 505-Connector. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this utility model.

[0037] It should also be noted that, for ease of description, only the parts related to this utility model are shown in the accompanying drawings.

[0038] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0039] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0040] Where there is no conflict, the embodiments and features of the present invention can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0041] Currently, common heat dissipation methods in electronic equipment include natural convection, forced air cooling, and liquid cooling. Correspondingly, the heat dissipation structures are typically made of thermally conductive metal materials (such as aluminum alloys and copper), and are formed into heat sinks, heat sink bases, or heat sinks containing flow channels through traditional manufacturing processes such as profile extrusion, machining, stamping, welding (such as brazing), and interlocking (such as insert-type).

[0042] However, facing increasingly stringent heat dissipation requirements, especially in space-constrained or high-heat-flux-density applications, traditional heat dissipation technologies and manufacturing processes face several challenges. For example, traditional processes may be limited by processing capabilities, or involve cumbersome procedures and high costs, when manufacturing heat sinks with complex internal structures (such as finely designed and optimized embedded cooling channels) or irregular external features (such as fin arrays optimized for specific airflow). For some compact or modular electronic devices, achieving efficient integration of heat dissipation structures with the device housing within limited space, and effectively managing the heat dissipation of multiple heat sources, is also a direction that requires continuous improvement in existing technologies. Therefore, the industry still needs to explore more optimized heat dissipation structure designs and manufacturing methods to meet the ever-increasing heat dissipation requirements of high-performance electronic devices.

[0043] Example 1

[0044] like Figure 1 , Figure 2 , Figure 4 , Figure 5 As shown, a high heat dissipation module box includes: a shell 1 and a front panel assembly 2. The shell 1 is integrally formed using additive manufacturing technology (usually referring to industrial-grade 3D printing technology); that is, the shell 1 is manufactured as a complete single part, rather than being assembled from multiple parts. The front panel assembly 2 is connected to the shell 1.

[0045] The complex structures integrated on the one-piece molded shell 1 include at least: a dot matrix structure 3, cold pipe heat dissipation fins 4 and liquid cooling channels 5. The dot matrix structure 3 and cold pipe heat dissipation fins 4 are disposed on the outer surface of the shell 1, and the liquid cooling channels 5 are disposed inside the side wall of the shell 1.

[0046] The cold pipe type heat sink 4 includes heat sink 401 and embedded cold pipe 402 embedded in the heat sink 401; the embedded cold pipe 402 and the liquid cooling channel 5 are connected to the external liquid cooling system.

[0047] To achieve efficient heat dissipation, the module box relies on liquid cooling. The embedded cold pipes 402 of the cold pipe heat sink fins 4 and the liquid cooling channels 5 can both be connected to an external liquid cooling system. External cooling circulation equipment (e.g., a cooling unit containing a water pump, cold source, etc.) can supply coolant (such as water, coolant, etc.) to the module box. The coolant flows into and circulates through both the embedded cold pipes 402 and the sidewall liquid cooling channels 5, removing heat generated inside the module box through forced convection heat transfer.

[0048] In summary, this embodiment utilizes additive manufacturing (3D printing) technology to fabricate an integrated modular housing 1, structurally integrating three components: a lattice structure 3 on the outer surface, cold-pipe heat dissipation fins 4 (containing cooling pipes within the fins), and liquid cooling channels 5 located inside the sidewalls. By connecting to an external liquid cooling system, the coolant can simultaneously circulate in the embedded cooling pipes within the fins and in the liquid cooling channels 5 within the housing sidewalls, thereby forming a highly efficient, multi-path liquid cooling and heat dissipation system to achieve high heat dissipation performance.

[0049] Example 2

[0050] This embodiment further describes some specific structural details or optional configuration methods of the high heat dissipation module box based on the foregoing embodiments.

[0051] The dot matrix structure 3 is disposed on the upper and / or lower surface of the outer casing 1, and the cold pipe heat dissipation fins 4 are disposed on the side wall of the outer casing 1.

[0052] like Figure 6 As shown, the front panel assembly 2 includes a front panel 501, a side panel, and a PCB board. The PCB board is fixedly installed inside the module box and is electrically connected to the front panel 501 via a connector 505. The side panel is part of the front panel assembly 2 and plays a certain structural or supporting role. It is positioned opposite to the heat pipe cooling fins 401. The side panel, front panel 501, rear panel, and heat pipe cooling fins 401 constitute a space for accommodating the PCB board.

[0053] The PCB board is the core component inside the module box that carries electronic components. It is fixedly installed inside the module box and establishes an electrical signal connection with the front panel 501 through connector 505.

[0054] The front panel assembly 2 includes: a PCB board including a PCB vertical plate 502 and a front PCB board 504. Multiple PCB vertical plates 502 are fixed between the side plate and the cold pipe heat sink fins 4 by studs 503. The front PCB board 504 is disposed between the PCB vertical plates 502 and the front panel 501. The front PCB board 504 and multiple PCB vertical plates 502 are electrically connected by connectors 505.

[0055] The internal PCB board can be specifically divided into two types: vertical PCB boards 502 and a front PCB board 504. Multiple vertical PCB boards 502 are fixedly installed using columnar fasteners called studs 503. The vertical PCB boards 502 are positioned between the side plate of the front panel assembly 2 and the cold-pipe heat sink fins 4 on the side wall of the module housing 1. The front PCB board 504 is installed in the area between these vertical PCB boards 502 and the front panel 501 body. Finally, electrical signal interconnection between the front PCB board 504 and the multiple vertical PCB boards 502 is achieved through connectors 505. This structural design may be intended to make full use of space and facilitate the layout of circuits for specific functions.

[0056] The module box also includes a rear panel opposite the front panel 501. The inlet and outlet of the embedded cold pipe 402 and liquid cooling channel 5 are both located on the rear panel, and the external liquid cooling system is connected to the rear panel. The external liquid cooling system only needs to be connected to the corresponding interface on the rear panel to complete the establishment of the coolant circulation loop.

[0057] The embedded cold pipe 402 and liquid cooling channel 5 are arranged in a meandering, circuitous, or zigzag pattern, rather than a simple straight line. This can effectively increase the flow length of the coolant in the pipe, expand the heat exchange contact area with the pipe wall, or optimize the fluid residence time, thereby improving the efficiency of heat exchange. In addition, the cross-sectional shape of the channel can be circular, polygonal, or other different shapes. By changing the size and distribution density of the channel, different effective contact heat dissipation areas can be obtained.

[0058] To enhance ventilation and heat dissipation, reduce weight, and increase strength of the module box shell, the multi-layer lattice structure 3 can effectively strengthen the shell frame and improve material utilization. That is, the lattice structure 3 is a multi-layer lattice structure 3, and ventilation gaps are provided between the constituent units of the lattice structure 3.

[0059] Example 3

[0060] like Figure 3 As shown, this embodiment uses the aforementioned high-heat-dissipation module box as a basic unit to construct a combined structure of high-heat-dissipation module boxes, solving application scenarios that require efficient heat dissipation for multiple electronic modules simultaneously. Its core idea is to integrate multiple independent module boxes, each with its own high heat dissipation capacity, through a single piping system, and connect them uniformly to an external centralized liquid cooling system to achieve heat management for the entire system.

[0061] The combined structure includes:

[0062] The above are multiple module boxes;

[0063] Pipe connector 202, multiple pipe connectors 202 are respectively connected to the pipe inlet and pipe outlet of the embedded cold pipe 402 and the liquid cooling channel 5; the interface element equipped for each module box through the pipe connector 202 is used to realize the reliable connection between the module box and the system piping.

[0064] The branch pipe 201 and the confluence pipe are connected. The branch pipe 201 is connected to the pipe connector 202 of all pipe inlets and then connected to the coolant inlet pipe 203. The confluence pipe is connected to the coolant outlet pipe 204 after connecting to all pipe outlets. The coolant inlet pipe 203 and the coolant outlet pipe 204 are connected to the external liquid cooling system.

[0065] The function of the branch pipe 201 is to distribute the coolant from the independent coolant inlet pipe 203 to the inlet connectors 505 of all module boxes. The confluence pipe is responsible for collecting the coolant flowing out of the outlet connectors 505 of all module boxes and guiding it to the main coolant outlet pipe 204.

[0066] Multiple module boxes are connected in parallel, and heat dissipation gaps are provided between adjacent module boxes.

[0067] In this combined structure, the coolant circulation path is as follows: Coolant enters the coolant inlet pipe 203 from the external liquid cooling system and then flows into the distribution pipe 201. The distribution pipe 201 distributes the coolant evenly (or according to the design ratio) to each module box, and the coolant enters the two cooling circuits inside the module box—the embedded cold pipe 402 and the liquid cooling channel 5—through their respective pipe connectors 202. The coolant absorbs heat during its flow inside the module box. The heated coolant flows out from the outlet of the embedded cold pipe 402 and the outlet of the liquid cooling channel 5, and merges into the confluence pipe through the corresponding pipe connectors 202. Finally, the coolant flowing out of all the module boxes is collected in the confluence pipe and returns to the external liquid cooling system via the coolant outlet pipe 204 for cooling, thus completing the entire heat dissipation cycle.

[0068] In terms of physical arrangement, the multiple module boxes in this combined structure are arranged in parallel. That is, they are usually placed side by side or in an array. Importantly, heat dissipation gaps are reserved between adjacent module boxes. Heat dissipation gaps refer to the physical space or distance between module boxes. The purpose of setting this gap is usually to ensure that the outer surface of each module box (especially the side wall with heat dissipation fins 401 or other surfaces) has sufficient space for heat exchange with the surrounding air, which is conducive to natural air convection or forced air cooling, while also avoiding direct heat conduction interference between modules.

[0069] In the description of this specification, the references to terms such as "one embodiment / mode," "some embodiments / modes," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment / mode or example is included in at least one embodiment / mode or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment / mode or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments / modes or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate the different embodiments / modes or examples described in this specification, as well as the features of different embodiments / modes or examples.

[0070] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0071] Those skilled in the art should understand that the above embodiments are merely for clearly illustrating the present invention and are not intended to limit the scope of the present invention. For those skilled in the art, other changes or modifications can be made based on the above-described invention, and these changes or modifications still fall within the scope of the present invention.

Claims

1. A high heat dissipation module box, characterized in that, include: Outer shell (1); Front panel assembly (2), which is connected to the housing (1); The outer shell (1) integrates at least: a dot matrix structure (3), a cold pipe heat dissipation fin (4), and a liquid cooling channel (5). The dot matrix structure (3) and the cold pipe heat dissipation fin (4) are disposed on the outer surface of the outer shell (1), and the liquid cooling channel (5) is disposed inside the side wall of the outer shell (1).

2. The high heat dissipation module box according to claim 1, characterized in that, The outer shell (1) is integrally formed using additive manufacturing technology; the cold pipe heat dissipation fins (4) include heat dissipation fins (401) and embedded cold pipes (402) embedded in the heat dissipation fins (401); The embedded cold pipe (402) and the liquid cooling channel (5) are connected to the external liquid cooling system.

3. A high heat dissipation module box according to claim 2, characterized in that, The dot matrix structure (3) is disposed on the upper and / or lower surface of the outer shell (1), and the cold pipe heat dissipation fins (4) are disposed on the side wall of the outer shell (1).

4. A high heat dissipation module box according to claim 2, characterized in that, The front panel assembly (2) includes a front panel (501), a side panel, and a PCB board. The PCB board is fixedly disposed inside the module box and is electrically connected to the front panel (501) via a connector (505).

5. A high heat dissipation module box according to claim 4, characterized in that, The front panel assembly (2) includes: the PCB board includes a PCB vertical plate (502) and a front PCB board (504), a plurality of the PCB vertical plates (502) are fixed between the side plate and the cold pipe heat sink fins (4) by studs (503), the front PCB board (504) is disposed between the PCB vertical plates (502) and the front panel (501), and the front PCB board (504) and the plurality of the PCB vertical plates (502) are electrically connected by the connector (505).

6. A high heat dissipation module box according to claim 4, characterized in that, The module box also includes a rear panel disposed opposite to the front panel (501), the inlet and outlet of the embedded cold pipe (402) and the liquid cooling channel (5) are disposed on the rear panel, and the external liquid cooling system is connected to the rear panel.

7. A high heat dissipation module box according to claim 6, characterized in that, The embedded cold pipe (402) and the liquid cooling channel (5) are arranged in a meandering, circuitous or reversible manner.

8. A high heat dissipation module box according to claim 3, characterized in that, The lattice structure (3) is a multi-layer lattice structure (3), and ventilation gaps are provided between the constituent units of the lattice structure (3).

9. A combined structure of a high heat dissipation module box, characterized in that, include: Multiple module boxes as described in any one of claims 2-8; Pipe connectors (202), a plurality of the pipe connectors (202) are respectively connected to the pipe inlet and pipe outlet of the embedded cold pipe (402) and the liquid cooling channel (5); The system consists of a branch pipe (201) and a confluence pipe. The branch pipe (201) is connected to the pipe connector (202) of all pipe inlets and then connected to the coolant inlet pipe (203). The confluence pipe is connected to the coolant outlet pipe (204) of all pipe outlets. The coolant inlet pipe (203) and the coolant outlet pipe (204) are connected to an external liquid cooling system.

10. The combined structure of a high heat dissipation module box according to claim 9, characterized in that, Multiple module boxes are arranged in parallel, and heat dissipation gaps are provided between adjacent module boxes.

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