Side light emitting LED light source

Abstract

The utility model is suitable for the field of LED light source packaging, and provides a side light-emitting LED light source, which comprises a substrate, a light-emitting diode (LED) light source, a light-emitting diode (LED) light source and a light-emitting diode (LED) light source, the first bonding pad is arranged at the bottom of the substrate and is used for connecting an external electric signal; the second bonding pad is arranged at the top of the substrate and is connected with the first bonding pad through a micropore; the plurality of wafers are fixed on the second bonding pad; and the optical unit is arranged on the light emitting side of the wafer and is used for reflecting and / or transmitting light rays emitted by the wafer. The wafer is attached to the substrate, so that the solid crystal face is in direct contact with the second bonding pad, the second bonding pad is arranged on the substrate, the contact area between the second bonding pad and the substrate is large, the welding face is tightly attached to the solid crystal face, the heat dissipation area is greatly increased, heat conduction paths are reduced, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This utility model belongs to the field of LED light source packaging, and particularly relates to a side-emitting LED light source. Background Technology

[0002] LEDs are electronic components that use semiconductor materials to achieve electroluminescence. They are characterized by high efficiency, energy saving, and long lifespan, and are widely used in lighting, displays, backlighting, and other fields. As application demands diversify, LED packaging technology has continuously developed, resulting in various packaging forms. Each form has its own characteristics in terms of structure, performance, and application scenarios, such as through-hole LEDs, COB (Chip-on-Board), front-emitting SMD (Surface Mount Devices), and side-emitting SMD.

[0003] Currently, side-emitting LEDs employ a structure where the die-bonding surface is perpendicular to the bonding surface. This vertical layout leads to an extended heat conduction path, significantly reducing heat dissipation efficiency and resulting in poor heat dissipation performance of the LED light source. This limits the increase in its operating power and ultimately restricts the application range of side-emitting LED light sources. To overcome this technical bottleneck, a side-emitting LED light source solution is proposed. Utility Model Content

[0004] The purpose of this utility model embodiment is to provide a side-emitting LED light source, which aims to solve the problem of poor heat dissipation performance of existing LED light sources.

[0005] This utility model embodiment is implemented as follows: a side-emitting LED light source, the side-emitting LED light source comprising:

[0006] substrate;

[0007] The first pad is located on the bottom of the substrate and is used to connect external electrical signals;

[0008] The second pad is disposed on the top of the substrate and connected to the first pad through a microhole;

[0009] Several chips are fixed on the second pad;

[0010] An optical unit, disposed on the light-emitting side of the wafer, is used to reflect and / or transmit light emitted by the wafer.

[0011] Furthermore, the optical unit includes:

[0012] Optical components;

[0013] An incident light surface is disposed on one side of the optical element for incident light onto the wafer;

[0014] The light-emitting surface is disposed on one side of the optical element, adjacent to but not parallel to the light-incident surface;

[0015] A reflective surface is disposed on one side of the optical element and is used to reflect light onto the light-emitting surface.

[0016] Furthermore, the optical unit also includes a suction nozzle plane, which is disposed on one side of the optical element and opposite to the light incident surface.

[0017] Furthermore, apart from the light-emitting surface and the light-receiving surface, the remaining surfaces of the optical element are all non-light-emitting surfaces. The optical element is integrally formed, and the non-light-emitting surfaces are coated with a high-reflectivity, low-transmittance adhesive.

[0018] Furthermore, the reflecting surface is curved, so that the reflected light is perpendicular to the light-emitting surface.

[0019] Furthermore, the reflecting surface is curved, so that the reflected light is parallel to the incident light surface.

[0020] Furthermore, the first pad is flatly attached to the bottom of the substrate, and the second pad is flatly attached to the top of the substrate.

[0021] Furthermore, both the first pad and the second pad are provided with a positive pad and a negative pad, the positive pad and the negative pad are flatly attached to the substrate, and the wafer is simultaneously attached to the positive pad and the negative pad of the second pad.

[0022] Furthermore, the contact surface between the wafer and the second pad is the die-bonding surface, and apart from the die-bonding surface, the other surfaces of the wafer are encapsulated with lens adhesive.

[0023] Furthermore, the lens adhesive is selected from adhesives with a refractive index of 1.5 to 1.54.

[0024] This utility model provides a side-emitting LED light source. In this embodiment, the chip is bonded to the substrate so that the die-bonding surface is in direct contact with the second pad. The second pad is arranged on the substrate and has a large contact area with the substrate. The bonding surface is close to the die-bonding surface, which greatly increases the heat dissipation area and reduces the heat conduction path, thereby improving the heat dissipation efficiency. Attached Figure Description

[0025] Figure 1 Optical path diagram of the side-emitting LED light source provided in the embodiments of this utility model;

[0026] Figure 2 An exploded view of the side-emitting LED light source provided in the embodiment of this utility model;

[0027] Figure 3 A perspective view of a side-emitting LED light source provided for an embodiment of this utility model;

[0028] 100, Optical unit; 110, Optical element; 120, Light-incident surface; 130, Light-exit surface; 140, Reflecting surface; 150, Suction nozzle plane;

[0029] 200, substrate; 210, microvia; 300, first pad; 400, second pad; 500, chip. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0031] It is understood that the terms “first,” “second,” etc., used in this application may be used herein to describe various elements, but unless otherwise stated, these elements are not limited by these terms. These terms are used only to distinguish one element from another.

[0032] like Figure 1-3 As shown, in one embodiment, a side-emitting LED light source is provided, the side-emitting LED light source comprising:

[0033] substrate 200;

[0034] The first pad 300 is disposed at the bottom of the substrate 200 and is used to connect external electrical signals;

[0035] The second pad 400 is disposed on the top of the substrate 200 and is connected to the first pad 300 through the microhole 210.

[0036] Several chips 500 are fixed on the second pad 400;

[0037] An optical unit 100 is disposed on the light-emitting side of the wafer 500 for reflecting and / or transmitting light emitted by the wafer 500.

[0038] In this embodiment, the first pad 300 is used to connect to an external PCB board to achieve electrical connection; the second pad 400 is disposed on the top of the substrate 200 to place the chip 500 for die bonding and wire bonding operations. The first pad 300 and the second pad 400 on the substrate 200 are connected through microvias 210. External electrical signals are transmitted to the second pad 400 through the first pad 300. The second pad 400 connects to the positive and negative terminals of the chip 500, and the chip 500 emits light when energized. The contact surface between the chip 500 and the second pad 400 is called the die bonding surface. In this embodiment, the chip 500 is bonded to the substrate 200, so that the die bonding surface is in direct contact with the second pad 400. The second pad 400 is arranged on the substrate 200, with a large contact area with the substrate 200. The bonding surface is close to the die bonding surface, which greatly increases the heat dissipation area and reduces the heat conduction path, thereby improving heat dissipation efficiency.

[0039] In this embodiment, the first pad 300 is divided into two parts: a positive pad and a negative pad, with a certain gap between them, both flatly attached to the bottom of the substrate 200. Similarly, the second pad 400 is also provided with a positive pad and a negative pad, both flatly attached to the top of the substrate 200; the chip 500 is simultaneously attached to both the positive and negative pads. This flat-attach arrangement also increases the heat conduction area. The second pad 400 on the substrate 200 is directly flatly attached to the external heat sink, resulting in a large heat dissipation area, a short heat conduction path, and good heat dissipation effect. Due to the good heat dissipation effect of this embodiment, multiple chips 500 can be placed, allowing for higher power output and increased brightness while ensuring functional stability.

[0040] In this embodiment, the wafer 500 is encapsulated on the substrate 200 using lens adhesive. Except for the die-bonding surface, the remaining surfaces of the wafer 500 are covered by the lens adhesive. The lens adhesive is selected with a refractive index of 1.5 to 1.54. A portion of the light emitted from the wafer 500 can pass through the lens adhesive and through the light-incident surface 120, while another portion of the light is parallel to the light-incident surface 120.

[0041] like Figure 1 As shown, in one optimized scheme, the side-emitting optical unit 100 is specifically optimized. The optical unit 100 includes:

[0042] Optical element 110;

[0043] The light-incident surface 120 is disposed on one side of the optical element 110 and is used to incident light onto the wafer 500;

[0044] The light-emitting surface 130 is disposed on one side of the optical element 110, adjacent to but not parallel to the light-incident surface 120;

[0045] A reflective surface 140 is disposed on one side of the optical element 110 and is used to reflect light onto the light-emitting surface 130.

[0046] In this embodiment, the optical element 110 is a lens, and a chip 500 is disposed at the bottom of the light-incident surface 120. The light-incident surface 120 and the chip 500 are bonded together by lens adhesive. The gap between the light-incident surface 120 and the substrate 200 is also filled with lens adhesive to ensure the stability of the bonding. In actual operation, the adhesive is directly injected and heated on the substrate 200 by a mold top machine.

[0047] In this embodiment, the optical unit 100 further includes a suction nozzle plane 150, which is disposed on one side of the optical element 110 and opposite to the light incident surface 120. The suction nozzle plane 150 is the plane in contact between the suction nozzle and the optical element 110. During the packaging or assembly of the optical element of the LED lamp, vacuum adsorption or mechanical clamping is used to ensure that the optical element 110 remains stable during the transfer process, avoiding displacement or tilting.

[0048] In this embodiment, apart from the light-emitting surface 130 and the light-incident surface 120, all other surfaces on the optical element 110 are non-light-emitting surfaces. The light-emitting surface 130 is adjacent to the light-incident surface 120, forming a side-emitting optical unit 100. The light-emitting surface 130 does not necessarily have to be perpendicular to the light-incident surface 120. In this embodiment, the optical element 110 is molded and can be integrally formed. The non-light-emitting surfaces are coated with a high-reflectivity, low-transmittance adhesive. High-reflectivity, low-transmittance adhesives are mainly used in scenarios where light needs to be reflected rather than transmitted. Common high-reflectivity, low-transmittance adhesives include LED high-reflectivity white glue, metal-based reflective adhesive, and silicone-based high-reflectivity adhesive. In the mold design, the reflective surface 140 is set as a curved surface with total internal reflection. The reflected light is emitted towards the light-emitting surface 130 in near-parallel form, and the reflected light is perpendicular to the light-emitting surface 130. Alternatively, the reflected light can be parallel to the light-incident surface 120, or both conditions can be satisfied simultaneously. Figure 1 As shown, the chip 500 emits light (solid line), which passes through the light-incident surface 120. Part of the light is emitted directly from the light-emitting surface, while the other part is reflected by the reflective surface 140 and then emitted from the light-emitting surface 130.

[0049] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0050] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A side-emitting LED light source, characterized in that, The side-emitting LED light source includes: substrate; The first pad is located on the bottom of the substrate and is used to connect external electrical signals; The second pad is disposed on the top of the substrate and connected to the first pad through a microhole; Several chips are fixed on the second pad; An optical unit, disposed on the light-emitting side of the wafer, is used to reflect and / or transmit light emitted by the wafer.

2. The side-emitting LED light source according to claim 1, characterized in that, The optical unit includes: Optical components; An incident light surface is disposed on one side of the optical element for incident light onto the wafer; The light-emitting surface is disposed on one side of the optical element, adjacent to but not parallel to the light-incident surface; A reflective surface is disposed on one side of the optical element and is used to reflect light onto the light-emitting surface.

3. The side-emitting LED light source according to claim 2, characterized in that, The optical unit also includes a suction nozzle plane, which is disposed on one side of the optical element and opposite to the light incident surface.

4. The side-emitting LED light source according to claim 3, characterized in that, Apart from the light-emitting surface and the light-receiving surface, all other surfaces on the optical element are non-light-emitting surfaces. The optical element is integrally formed, and the non-light-emitting surfaces are coated with a high-reflectivity, low-transmittance adhesive.

5. The side-emitting LED light source according to any one of claims 2-4, characterized in that, The reflecting surface is curved, so that the reflected light is perpendicular to the light emitting surface.

6. The side-emitting LED light source according to any one of claims 2-4, characterized in that, The reflecting surface is curved, so that the reflected light is parallel to the incident light surface.

7. The side-emitting LED light source according to any one of claims 1-4, characterized in that, The first pad is flat against the bottom of the substrate, and the second pad is flat against the top of the substrate.

8. The side-emitting LED light source according to claim 7, characterized in that, Both the first pad and the second pad are provided with a positive pad and a negative pad. The positive pad and the negative pad are flatly attached to the substrate. The chip is simultaneously attached to the positive pad and the negative pad of the second pad.

9. The side-emitting LED light source according to any one of claims 1-4, characterized in that, The contact surface between the wafer and the second pad is the die-bonding surface. Apart from the die-bonding surface, the other surfaces of the wafer are encapsulated with lens adhesive.

10. The side-emitting LED light source according to claim 9, characterized in that, The lens adhesive is selected from adhesives with a refractive index of 1.5 to 1.54.

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