Constant-voltage COB light source

Abstract

The utility model discloses a constant-voltage COB (Chip On Board) light source, which comprises a mirror substrate; the plurality of LED chips are arranged in the central area of the mirror substrate; the fluorescent glue layer covers the area where the LED chip is located; the BT insulating layer is arranged around the side surface of the fluorescent glue layer; the copper foil layer is arranged on the BT insulating layer; the protective oil layer wraps the copper foil circuit layer; at least two grooves are formed in the BT insulating layer, each groove penetrates through the BT insulating layer in the thickness direction, and the surface of the mirror surface substrate serves as the groove bottom; a constant-voltage IC chip is arranged in each groove; each groove is filled with a light blocking glue layer covering the upper surface and the side face of the constant-voltage IC chip. According to the constant-voltage COB light source, multiple light blocking and shading of the constant-voltage IC chip are achieved, the shading effect of the constant-voltage IC chip is improved, and therefore the good working performance of the constant-voltage COB light source is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor light source device technology, and in particular to a constant voltage COB light source. Background Technology

[0002] COB (Chip on Board) light sources are a high-power integrated surface light source technology. They achieve high luminous efficiency and uniform light distribution by directly mounting LED chips onto a mirrored metal substrate to form a polycrystalline array. Constant-voltage COB light sources, by connecting multiple constant-voltage IC chips in series within the COB light source, enable constant current operation within a certain voltage range, solving the problem of each LED lamp typically requiring a separate driver.

[0003] However, constant voltage IC chips are extremely sensitive to light; when light shines on a constant voltage IC chip, a photoelectric effect occurs, which interferes with the normal operation of the chip and causes it to fail. Therefore, effectively shielding the constant voltage IC chip in a constant voltage COB light source is of great significance for ensuring the good working performance of the constant voltage COB light source. Utility Model Content

[0004] The purpose of this invention is to provide a constant voltage COB light source that can effectively shield the constant voltage IC chip and ensure the good working performance of the constant voltage COB light source.

[0005] To solve the above-mentioned technical problems, this utility model provides a constant voltage COB light source, comprising: a mirror substrate; a plurality of LED chips disposed in the central region of the mirror substrate; a phosphor layer covering the region where the LED chips are located; a BT insulating layer disposed around the side of the phosphor layer; a copper foil layer disposed on the BT insulating layer; a protective oil layer disposed around the copper foil circuit layer; and a damming adhesive layer disposed on the BT insulating layer surrounding the phosphor layer.

[0006] The BT insulating layer has at least two grooves, each groove penetrating the thickness of the BT insulating layer and having the surface of the mirror substrate as its bottom. A constant voltage IC chip is disposed in each groove. Each groove is filled with a light-blocking adhesive layer covering the upper surface and sides of the constant voltage IC chip.

[0007] In one optional embodiment of this application, the constant voltage IC chip is a bare IC die.

[0008] In one alternative embodiment of this application, the light-blocking adhesive layer includes a white adhesive layer.

[0009] In an optional embodiment of this application, the light-blocking adhesive layer further includes a black adhesive layer covering the upper surface of the white adhesive layer.

[0010] In one optional embodiment of this application, the LED chip includes at least two chips that output two different wavelengths of light; and the LED chips that output different wavelengths of light are uniformly mixed and arranged.

[0011] In one optional embodiment of this application, the fluorescent adhesive layer comprises multiple layers stacked sequentially; and each of the fluorescent adhesive layers is excited to output light of different wavelengths.

[0012] In one optional embodiment of this application, a reflective film layer is provided on the side of the fluorescent adhesive layer.

[0013] In one optional embodiment of this application, the damming adhesive is a white damming adhesive.

[0014] In one alternative embodiment of this application, the damming adhesive covers the opening of the groove.

[0015] In one optional embodiment of this application, the mirror substrate is a mirror aluminum plate.

[0016] The constant voltage COB light source provided by this utility model includes: a mirror substrate; multiple LED chips disposed in the central area of ​​the mirror substrate; a phosphor layer covering the area where the LED chips are located; a BT insulating layer disposed around the side of the phosphor layer; a copper foil layer disposed on the BT insulating layer; a protective oil layer disposed on the copper foil circuit layer; at least two grooves are formed on the BT insulating layer, each groove penetrating the thickness of the BT insulating layer, and the surface of the mirror substrate is the bottom of the groove; a constant voltage IC chip is disposed in each groove; and each groove is filled with a light-blocking adhesive layer covering the upper surface and sides of the constant voltage IC chip.

[0017] In the constant voltage COB light source of this application, a BT insulating layer is disposed around the area where the LED chip is located on a mirror substrate, and at least two grooves for accommodating the constant voltage IC chip are formed in the BT insulating layer. The constant voltage IC chip is placed in the groove, and a light-blocking adhesive layer is further filled into the groove to cover the constant voltage IC chip. Thus, the constant voltage IC chip and the LED chip in this application are directly disposed on the mirror substrate, i.e., at the same height, preventing light emitted from the upper surface of the LED chip from illuminating the constant voltage IC chip. Simultaneously, the BT insulating layer can block light emitted from the side of the LED chip from illuminating the constant voltage IC chip. Furthermore, the groove containing the constant voltage IC chip is filled with a light-blocking adhesive layer to encapsulate the chip, thereby achieving multiple light-blocking and shielding effects on the constant voltage IC chip, improving the shielding effect and ensuring the good working performance of the constant voltage COB light source. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A cross-sectional structural schematic diagram of the constant voltage COB light source provided in the embodiments of this application;

[0020] Figure 2 A top view of the constant-pressure COB light source provided in the embodiments of this application;

[0021] Figure 3 This is another cross-sectional structural diagram of the constant-pressure COB light source provided in the embodiments of this application;

[0022] In the attached diagram: 1 is the mirror substrate, 2 is the LED chip, 3 is the fluorescent adhesive layer, 31 is the first fluorescent adhesive layer, 32 is the second fluorescent adhesive layer, 4 is the BT insulating layer, 41 is the adhesive, 5 is the copper foil layer, 6 is the protective oil layer, 7 is the constant voltage IC chip, 8 is the light-blocking adhesive layer, 81 is the white adhesive layer, 82 is the black adhesive layer, and 9 is the damming adhesive layer. Detailed Implementation

[0023] The core of this invention is to provide a constant voltage COB light source that has a good light-shielding effect on constant voltage IC chips, thereby ensuring the good working performance of the constant voltage COB light source.

[0024] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] like Figures 1 to 3 As shown, Figure 1 A cross-sectional structural schematic diagram of the constant voltage COB light source provided in the embodiments of this application; Figure 2 A top view of the constant-pressure COB light source provided in the embodiments of this application; Figure 3 This is another cross-sectional structural diagram of the constant pressure COB light source provided in the embodiment of this application.

[0026] Instructions are required. Figure 2The structure with the middle outline as a dashed line is a structure that is not visible from above, but it is easy to understand. The dashed line shows part of the structure of the constant pressure COB light source that is not visible from above.

[0027] In one specific embodiment of this application, the constant-pressure COB light source may include:

[0028] Mirror substrate 1; multiple LED chips 2 disposed in the central area of ​​mirror substrate 1; phosphor adhesive layer 3 covering the area where LED chips 2 are located; BT insulating layer 4 disposed around the side of phosphor adhesive layer 3; copper foil layer 5 disposed on BT insulating layer 4; protective oil layer 6 disposed on copper foil circuit layer; and dammed adhesive layer 9 disposed on BT insulating layer 4 surrounding phosphor adhesive layer 3.

[0029] The BT insulating layer 4 has at least two grooves, each groove penetrating the thickness of the BT insulating layer 4 and with the surface of the mirror substrate 1 as the bottom of the groove; a constant voltage IC chip 7 is disposed in each groove; and a light-blocking adhesive layer 8 covering the upper surface and sides of the constant voltage IC chip 7 is filled in each groove.

[0030] like Figure 1 and Figure 2 As shown, in this embodiment, a mirror substrate 1 is used as the substrate to support various optical components. Specifically, the mirror substrate 1 can be a mirror aluminum plate.

[0031] Multiple LED chips 2 are evenly arranged in the central region of the mirror substrate 1; for example Figure 2 As shown, in Figure 2 In the illustrated embodiment, a large number of LED chips 2 are uniformly arranged in the central circular region of the mirror substrate 1. Furthermore, the LED chips 2 can be electrically connected to each other via metal wires. Specifically, the LED chips 2 can be connected in series sequentially. Each LED chip 2 connected in series can be electrically connected to an external power supply via at least two constant voltage IC chips 7. Alternatively, the LED chips 2 can be divided into multiple groups, with each LED chip 2 in the same group connected in series, while LED chips 2 in different groups are connected in parallel via two constant voltage IC chips 7, sharing the positive and negative terminals of the external power supply. Furthermore, based on the division of the LED chips 2 into multiple groups and the series connection of each LED chip 2 within the same group, each group of LED chips 2 can also be connected to the LED chips 2 of the external power supply via two constant voltage IC chips. This allows for the provision of different constant voltage supply voltages to different groups of LED chips 2 based on their varying operational requirements.

[0032] Based on this, each LED chip 2 can be identical, all of which are chips capable of outputting blue light; alternatively, each LED chip 2 can also contain multiple different LED chips 2, that is, chips capable of outputting multiple different colors of light, and the LED chips 2 used to output different colors of light are uniformly mixed and arranged, thereby ensuring that the different colors of light output by each LED chip 2 are uniformly mixed and output.

[0033] A phosphor layer 3 is further applied to each LED chip 2. This phosphor layer 3 fully and tightly wraps the upper surface and sides of each LED chip 2, thereby fully exciting the phosphor layer 3 with the light output from the LED chip 2 and outputting excited light.

[0034] In practical applications, the phosphor layer 3 covering the LED chip 2 can be a layer structure containing the same type of phosphor particles; alternatively, in this embodiment, multiple layers of different phosphor layers 3 can be stacked sequentially on the LED chip 2, and the types of phosphor particles in each phosphor layer 3 are different; that is to say, after each phosphor layer 3 is excited by the light output by the LED chip 2, the wavelength of the excited light output is different.

[0035] It is understandable that the fluorescent adhesive layer 3 is an adhesive layer structure formed by the solidification of a mixture of phosphor particles and transparent adhesive. The wavelength of light emitted by the fluorescent adhesive layer 3 when excited is determined by the type of phosphor particles. Furthermore, although the fluorescent adhesive layer 3 contains phosphor particles, it also has light transmittance.

[0036] Therefore, as Figure 3 As shown, in one embodiment of this application, the fluorescent adhesive layer 3 may include a first fluorescent adhesive layer 31 and a second fluorescent adhesive layer 32; wherein, the first fluorescent adhesive layer 31 is excited to output red light, and the second fluorescent adhesive layer 32 is excited to output green light; each LED chip 2 is capable of outputting blue laser light.

[0037] Thus, the blue excitation light output by each LED chip 2 is first incident on the first phosphor layer 31. Part of the blue excitation light is emitted as infrared light by the phosphor particles in the first phosphor layer 31, while the other part of the blue excitation light and the red light are incident on the second phosphor layer 32. Part of the blue excitation light incident on the second phosphor layer 32 is absorbed by the phosphor particles in the second phosphor layer 32 and emits green light. The other part of the blue light, red light and green light are mixed together to form white light, which is emitted from the second phosphor layer 32.

[0038] In another optional embodiment of this application, the fluorescent adhesive layer 3 can be an adhesive layer that is excited to output green light; and each LED chip 2 includes a red LED chip and a blue LED chip.

[0039] Therefore, in this embodiment, the blue light output from the blue LED chip is incident on the phosphor layer 3, and part of it is absorbed by the phosphor layer 3, causing the phosphor layer 3 to be excited and output green light. The remaining blue light, along with the green light and the red light output from the red LED chip, mixes uniformly to output white light. Of course, in this embodiment, the number of blue LED chips should be greater than the number of red LED chips to ensure that the final output white light contains sufficient blue light energy.

[0040] The two embodiments described above use white light output from a constant voltage COB light source as an example. In practical applications, the constant voltage COB light source can also output light beams of other colors. Correspondingly, the fluorescent adhesive layer 3 and the LED chip 2 can also have more different implementation methods, which will not be listed here.

[0041] Based on the above discussion, a ring-shaped BT insulating layer 4 is disposed around the central area where the LED chip 2 and the phosphor layer 3 are located. Specifically, the BT insulating layer 4 is an insulating structure layer formed by BT resin. BT resin is a thermosetting resin formed by adding epoxy resin, polyphenylene ether resin (PPE), or allyl compounds as modifying components, with bismaleimide (BMI) and triazine as the main resin components. The BT insulating layer 4 is bonded to the surface of the mirror substrate 1 by an adhesive layer. In addition, a copper foil layer 5 forming an electrical pattern and a protective oil layer 6 covering the copper foil layer 5 are disposed on the surface of the BT insulating layer 4.

[0042] Based on this, at least two grooves are formed on the BT insulating layer 4, each groove penetrating the thickness of the BT resin, meaning that the bottom surface of each groove is the surface of the mirror substrate 1. Thus, the constant voltage IC chip 7 placed in each groove is directly attached to the surface of the mirror substrate 1. It is understood that in this embodiment, the thickness of the BT insulating layer 4 is much greater than the thickness of the constant voltage IC chip 7. Therefore, placing the constant voltage IC chip 7 at the bottom of the groove effectively forms a light-blocking wall around the constant voltage IC chip 7, to a certain extent preventing the laser light output from the LED chip 2 and the phosphor layer 3 from illuminating the constant voltage IC chip 7. Furthermore, a light-blocking adhesive layer 8 can be further filled into the groove. This light-blocking adhesive layer 8 fully fills the gap between the groove wall and the constant voltage IC chip 7, placing the constant voltage IC chip 7 in a closed and light-shielding space, further enhancing the light-shielding effect of the constant voltage IC chip 7.

[0043] Furthermore, in this embodiment, the light-blocking adhesive layer 8 can specifically be a white adhesive layer 81; the white adhesive layer 81 is a milky white adhesive layer structure with low light transmittance. In addition, in order to further improve the light-blocking effect of the light-blocking adhesive layer 8 on the constant voltage IC chip 7, the light-blocking adhesive layer 8 may also include a black adhesive layer 82 covering the upper surface of the white adhesive layer 81. Through the cooperation between the black adhesive layer 82 and the white adhesive layer 81, the light-blocking effect of the light-blocking adhesive layer 8 on the constant voltage IC chip 7 is maximized.

[0044] In an alternative embodiment of this invention, the constant voltage IC chip 7 can be a bare IC chip. Compared to packaged IC chips, unpackaged bare IC chips are smaller in size, which can reduce the overall size of the constant voltage COB light source to a certain extent; especially in light sources that require a large number of constant voltage IC chips 7, this can greatly simplify the light source structure and reduce the size of the light source.

[0045] Furthermore, even though the thickness of the BT insulating layer 4 is greater than the thickness of the constant voltage IC chip 7, it is still less than the thickness of the phosphor layer 3. Therefore, in this embodiment, a surrounding adhesive layer 9 is further provided around the phosphor layer 3 on the BT insulating layer 4 to prevent light leakage from the sides of the phosphor layer 3. The upper surface of the surrounding adhesive layer 9 can be flush with the upper surface of the phosphor layer 3, or slightly higher than the upper surface of the phosphor layer 3.

[0046] Furthermore, in practical applications, the damming adhesive layer 9 can specifically be a white damming adhesive with low light transmittance. A reflective film layer can also be further provided between the inner ring side of the damming adhesive layer 9 and the side of the fluorescent adhesive layer 3. This reflective film layer reflects the light incident on the side of the fluorescent adhesive layer 3, thereby maximizing the output of light from the top surface of the fluorescent adhesive layer 3.

[0047] It is understood that in this embodiment, the BT insulating layer 4 should cover all areas on the mirror substrate 1 except for the areas where the LED chip 2 and the phosphor layer 3 are located, and the outer diameter of the damming adhesive layer 9 should be smaller than the outer diameter of the BT insulating layer 4. Furthermore, the outer diameter of the damming adhesive layer 9 should not be too small; its bottom end face should be able to cover the top opening of the groove in the BT insulating layer 4, thereby enabling the damming adhesive layer 9 to also provide some degree of light shielding for the constant voltage IC chip 7 within the groove.

[0048] In summary, in the constant voltage COB light source of this application, a BT insulating layer is disposed around the area where the LED chip is located on the mirror substrate. At least two grooves for accommodating the constant voltage IC chip are formed in the BT insulating layer. The constant voltage IC chip is placed within these grooves, and a light-blocking adhesive layer is further filled into the grooves to cover the constant voltage IC chip. Thus, the constant voltage IC chip and the LED chip in this application are directly disposed on the mirror substrate, i.e., at the same height. This prevents light emitted from the upper surface of the LED chip from illuminating the constant voltage IC chip. Simultaneously, the BT insulating layer can block light emitted from the side of the LED chip from illuminating the constant voltage IC chip. Furthermore, the grooves containing the constant voltage IC chip are filled with a light-blocking adhesive layer to encapsulate the chip, thereby achieving multiple light-blocking and shielding effects on the constant voltage IC chip, improving its shielding effect, and ensuring the good working performance of the constant voltage COB light source.

[0049] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that the elements inherent in a process, method, article, or apparatus that includes a list of elements are included. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. Additionally, portions of the technical solutions provided in the embodiments of this application that are consistent with the implementation principles of corresponding technical solutions in the prior art have not been described in detail to avoid excessive elaboration.

[0050] This article uses specific examples to illustrate the principles and implementation methods of this utility model. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made to this utility model without departing from the principles of this utility model, and these improvements and modifications also fall within the protection scope of this utility model.

Claims

1. A constant-voltage COB light source, characterized in that, include: Mirror substrate; Multiple LED chips are disposed in the central region of the mirror substrate; A phosphor adhesive layer covering the area where the LED chip is located; a BT insulating layer surrounding the side of the phosphor adhesive layer; a copper foil layer disposed on the BT insulating layer; a protective oil layer wrapping the copper foil layer; and a damming adhesive layer disposed on the BT insulating layer surrounding the phosphor adhesive layer. The BT insulating layer has at least two grooves, each groove penetrating the thickness of the BT insulating layer and having the surface of the mirror substrate as its bottom. A constant voltage IC chip is disposed in each groove. Each groove is filled with a light-blocking adhesive layer covering the upper surface and sides of the constant voltage IC chip.

2. The constant-pressure COB light source as described in claim 1, characterized in that, The constant voltage IC chip is a bare IC die chip.

3. The constant-pressure COB light source as described in claim 1, characterized in that, The light-blocking adhesive layer includes a white adhesive layer.

4. The constant-pressure COB light source as described in claim 3, characterized in that, The light-blocking adhesive layer also includes a black adhesive layer covering the upper surface of the white adhesive layer.

5. The constant-pressure COB light source as described in claim 1, characterized in that, The LED chip includes at least two chips that output two different wavelengths of light, and the LED chips that output different wavelengths of light are uniformly mixed and arranged.

6. The constant-pressure COB light source as described in claim 1, characterized in that, The fluorescent adhesive layer comprises multiple layers stacked sequentially; and each layer of the fluorescent adhesive layer is excited to output light of different wavelengths.

7. The constant-pressure COB light source as described in claim 1, characterized in that, A reflective film layer is provided on the side of the fluorescent adhesive layer.

8. The constant-pressure COB light source as described in claim 1, characterized in that, The damming adhesive is white.

9. The constant-pressure COB light source as described in claim 1, characterized in that, The dammed adhesive covers the opening of the groove.

10. The constant-pressure COB light source as described in claim 1, characterized in that, The mirror substrate is a mirror aluminum plate.

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