Pressure induction welding device

Abstract

The utility model relates to a pressure induction welding device, and relates to the technical field of welding, the pressure induction welding device comprises a first shell, one end of the first shell is connected with a second shell, the other end of the first shell is connected with a dormant ring, a limiting piece is sleeved with the dormant ring, a soldering pen core PCB sliding plate used for containing a soldering pen core is slidably arranged in the first shell, and the soldering pen core PCB sliding plate is slidably arranged in the dormant ring; a control assembly is installed in the second shell, one end of the control assembly is connected with the pressure sensing assembly, the other end of the control assembly is connected with a connecting line, the connecting line is connected with a plug used for being connected with a soldering station host, the soldering station host is connected with the soldering pen core, and the soldering pen core is connected with the control assembly. The pressure sensing assembly is arranged on the side close to the pressing assembly, and a gap is formed between the pressing assembly and the pressure sensing assembly. The method has the effects that the welding power is dynamically adjusted according to the actual welding pressure, manual frequent adjustment of operators is not needed, and the welding efficiency is greatly improved.

Description

A pressure induction welding device Technical Field

[0001] This application relates to the technical field of welding, and in particular to a pressure-induction welding apparatus. Background Technology

[0002] In modern electronics manufacturing, machinery repair, and many other fields, the quality and efficiency of soldering work are crucial. In practice, solder joint sizes vary greatly, ranging from the soldering of tiny electronic chip pins to the connection of large metal structural components. For larger solder joints, higher currents are needed to ensure sufficient heat to melt more solder and achieve a stable weld; however, for tiny solder joints, excessive current can generate too much heat instantly, easily damaging surrounding precision components. Traditional soldering pens, when dealing with solder joints of different sizes, rely solely on manual current adjustments by the operator. This frequent manual adjustment of the current based on the solder joint size increases the operator's workload, distracts their attention, and severely impacts soldering efficiency.

[0003] Regarding the aforementioned technologies, the inventors believe that the soldering pen has the drawback that, when dealing with solder joints of different sizes, the operator can only manually adjust the current, which increases the operator's workload and affects the soldering efficiency. Summary of the Invention

[0004] To address the issue that soldering pens rely solely on manual current adjustment by operators when handling solder joints of varying sizes, which increases operator workload and reduces soldering efficiency, this application provides a pressure-sensitive soldering device.

[0005] This application provides a pressure induction welding device, which adopts the following technical solution:

[0006] A pressure-sensitive welding device includes a first housing, one end of which is connected to a second housing, and the other end of which is connected to a dormant ring. A limiting member is sleeved inside the dormant ring. A soldering pen PCB sliding plate for accommodating soldering pen leads is slidably disposed inside the first housing. One end of the soldering pen PCB sliding plate is slidably disposed inside the dormant ring, and the other end is connected to a clamping component. The soldering pen lead passes through the dormant ring and the limiting member in sequence and extends into the soldering pen PCB sliding plate. A control component is installed inside the second housing. One end of the control component is connected to a pressure sensing component, and the other end is connected to a connecting wire. The connecting wire is connected to a plug for electrical connection with a soldering station host. The soldering station host is communicatively connected to the soldering pen lead. The pressure sensing component is disposed on the side close to the clamping component, and a gap is provided between the clamping component and the pressure sensing component.

[0007] By adopting the above technical solution, the first housing serves as the main support structure of the welding device, providing a relatively stable installation space and protective barrier for the soldering pen PCB sliding plate and the soldering pen. The second housing is used to install the control components. The sleep ring, in conjunction with the limiting component, positions and guides the soldering pen. The soldering pen PCB sliding plate accommodates the soldering pen and can slide within the first housing. When the soldering pen is subjected to pressure, the soldering pen PCB sliding plate slides accordingly, driving the pressing component to move, thereby transmitting the pressure to the pressure sensing component. The pressure sensing component transmits the pressure signal to the control component. The control component receives the electrical signal output by the pressure sensing component, processes and converts the pressure value, and transmits the processed signal to the MCU microcomputer chip of the welding station host. Based on the instructions of the MCU microcomputer chip, the output power of the soldering pen is controlled, realizing the processing and transmission of pressure signals and the control of the soldering pen power. This achieves automatic adjustment of welding parameters according to welding pressure, avoiding frequent manual adjustment of the current by the operator and improving welding efficiency.

[0008] Optionally, a first fixing plate and a second fixing plate are provided on both sides of the first housing, and the soldering pen refill PCB sliding plate is placed between the first fixing plate and the second fixing plate.

[0009] By adopting the above technical solution, the first and second fixing plates provide a stable sliding track for the PCB sliding plate of the soldering pen refill, ensuring the stability and accuracy of the movement of the PCB sliding plate of the soldering pen refill, making the pressure transmission more stable and reliable, and thus improving the accuracy of pressure sensing and current adjustment.

[0010] Optionally, sliding grooves are provided on both sides of the limiting member, and one end of the soldering pen refill PCB sliding plate is slidably disposed in the sliding groove, while the other end is slidably disposed between the first fixing plate and the second fixing plate and extends into the clamping assembly.

[0011] By adopting the above technical solution, the sliding groove further guides and limits the movement of the PCB sliding plate of the soldering pen refill, enhances the stability of the movement of the PCB sliding plate of the soldering pen refill, effectively prevents the PCB sliding plate of the soldering pen refill from deviating during the movement, ensures that the pressure can be accurately transmitted to the pressure sensing component, and improves the reliability of pressure sensing.

[0012] Optionally, the soldering pen refill PCB sliding plate has a receiving groove, and a top plate is installed at one end of the receiving groove near the clamping component. The soldering pen refill is inserted into the receiving groove and pressed against the top plate. The soldering pen refill PCB sliding plate is provided with a plurality of clamping components for holding the soldering pen refill.

[0013] By adopting the above technical solution, the receiving groove, top plate and clamping parts cooperate with each other to achieve stable installation of the soldering pen refill on the soldering pen refill PCB sliding plate. This ensures that the soldering pen refill can reliably transmit pressure to the soldering pen refill PCB sliding plate when it is subjected to pressure, and at the same time facilitates the installation and replacement of the soldering pen refill.

[0014] Optionally, the clamping assembly includes a base and a push rod, the push rod is sleeved on the base, the soldering pen refill PCB sliding plate is connected to the base, a spring is sleeved on the push rod, and a gap is provided between the end of the push rod and the pressure sensing assembly.

[0015] By adopting the above technical solution, the spring plays a role in buffering and resetting, avoiding excessive impact on the pressure sensing component by the push rod, protecting the pressure sensing component, and ensuring that the push rod can accurately reset after each pressure application, maintaining the stability and repeatability of the pressure sensing function.

[0016] Optionally, the control component includes a PCBA board, with a third fixing plate and a fourth fixing plate provided on both sides inside the second housing. The side of the PCBA board is located between the third fixing plate and the fourth fixing plate. A button module is provided on the PCBA board, and a button is sleeved on the button module. The button passes through and extends to the outside of the second housing. One end of the PCBA board is connected to the connecting line, and the other end is fixedly connected to the pressure sensing component.

[0017] By adopting the above technical solution, the third and fourth fixing plates play a role in fixing the PCBA board, ensuring the stable operation of the PCBA board; the button module and buttons provide users with a way to manually control and interact, making it convenient for users to adjust the working mode and parameters of the welding device according to actual needs.

[0018] Optionally, a connecting wire SR is connected to the end of the second housing, the connecting wire is passed through the connecting wire SR, and the other end of the connecting wire SR is connected to the plug.

[0019] By adopting the above technical solution, the SR connecting line protects the internal connecting lines from wear, pulling and other damage, while making the wire harness more neat and orderly, facilitating management and maintenance, and ensuring the stability of power and signal transmission.

[0020] Optionally, a silicone sleeve is provided on the outside of the first housing.

[0021] By adopting the above technical solution, the silicone sleeve increases the friction for operators to hold the welding device, thus preventing slippage and improving operational stability. At the same time, the silicone sleeve has a cushioning effect, which can reduce damage to internal components when the welding device is accidentally dropped, and extend the service life of the welding device.

[0022] In summary, this application includes at least one of the following beneficial technical effects:

[0023] 1. This welding device automatically adjusts the welding power based on the applied pressure during welding. The operator can change the force applied to the solder pen tip according to the size of the solder joint. When the solder pen tip is subjected to pressure, it drives the clamping component to squeeze the pressure sensing component through the solder pen tip PCB sliding plate. The pressure sensing component detects the pressure change and converts the pressure change into an electrical signal through the control component, which is then transmitted to the main welding station. The main welding station controls the output of different heating power resistance values ​​of the solder pen tip according to the pressure value, thereby realizing intelligent welding operation. The operator does not need to manually adjust the welding power frequently. They only need to apply different pressures according to the size of the solder joint, and the welding device can automatically adjust the power. This reduces the workload of manual power adjustment by the operator, saves adjustment time, increases welding speed, reduces labor intensity, and allows the operator to focus more on the welding operation itself, improving the accuracy and stability of the work.

[0024] 2. The spring in the clamping assembly acts as a buffer and reset mechanism. When the push rod applies pressure to the pressure sensing component, the spring is compressed, absorbing some energy and preventing excessive impact on the pressure sensing component, thus protecting it from damage. When the pressure is released, the spring returns to its original state, pushing the push rod back to its original position, restoring the initial gap between the push rod end and the pressure sensing component. If the pressure sensing component is not desired to be engaged, the welding device and its internal welding pen core can be slightly lifted. The internal spring will push the push rod back to its original position, and the welding pen core will operate at its minimum power value, outputting heat. Attached Figure Description

[0025] Figure 1 is a schematic diagram of the pressure induction welding device according to an embodiment of this application;

[0026] Figure 2 is an exploded view of the pressure induction welding apparatus according to an embodiment of this application;

[0027] Figure 3 is a cross-sectional view of the pressure induction welding apparatus according to an embodiment of this application;

[0028] Figure 4 is a cross-sectional view of the first housing in the pressure induction welding apparatus of this application embodiment;

[0029] Figure 5 is a cross-sectional view of the second housing in the pressure induction welding apparatus of this application embodiment.

[0030] Explanation of reference numerals in the attached figures:

[0031] 1. First housing; 11. First fixing plate; 12. Second fixing plate; 13. Silicone sleeve; 14. Limiting component; 141. Sliding groove; 15. Sliding plate for soldering pen refill PCB; 151. Receiving groove; 16. Top plate; 17. Clamping component; 2. Second housing; 21. Third fixing plate; 22. Fourth fixing plate; 3. Sleep ring; 4. Pressing assembly; 41. Base; 42. Top rod; 43. Spring; 5. Pressure sensing assembly; 6. PCBA board; 7. Connecting wire; 71. Connecting wire SR; 72. Plug; 8. Soldering pen refill. Detailed Implementation

[0032] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0033] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0034] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0035] The present application will be further described in detail below with reference to Figures 1-5.

[0036] This application discloses a pressure-sensitive welding device. Referring to Figures 1, 2, and 3, the pressure-sensitive welding device includes a first housing 1. One end of the first housing 1 is connected to a second housing 2, and the other end is connected to a dormant ring 3. A limiting member 14 is sleeved inside the dormant ring 3. A soldering pen PCB sliding plate 15 for accommodating a soldering pen refill 8 is slidably disposed inside the first housing 1. One end of the soldering pen PCB sliding plate 15 is slidably disposed inside the dormant ring 3, and the other end is connected to a clamping component 4. The soldering pen refill 8 passes through the dormant ring 3 and the limiting member 14 in sequence and extends into the soldering pen PCB sliding plate 15. A control component is installed inside the second housing 2. One end of the control component is connected to a pressure sensing component 5, and the other end is connected to a connecting wire 7. The connecting wire 7 is connected to a plug 72 for electrical connection with the soldering station host. The soldering station host is communicatively connected to the soldering pen refill 8. The pressure sensing component 5 is disposed on the side close to the clamping component 4, and a gap is provided between the clamping component 4 and the pressure sensing component 5.

[0037] In this pressure-sensitive welding device, the first housing 1 serves as the main support structure of the entire welding device, providing a relatively stable installation space and protective barrier for the internal soldering pen PCB sliding plate 15 and soldering pen 8. The first housing 1 connects to the second housing 2 and the dormant ring 3, playing a role in integrating the various structural parts, making the welding device a complete whole, ensuring the stability and safety of the internal components, avoiding interference and damage to the internal structure from external factors, and ensuring that the various components can work together normally.

[0038] The second housing 2 is used to install the control components, providing them with a fixed position and a relatively enclosed working environment. It also protects the control components from external impacts, dust, and moisture. The sleep ring 3, in conjunction with the limiting component 14, positions and guides the soldering pen refill 8, ensuring accurate insertion and operation. This improves the motion accuracy and stability of the soldering pen refill PCB sliding plate 15 and the soldering pen refill 8, reducing soldering errors caused by unstable motion. The limiting component 14 limits and fixes the soldering pen refill 8, preventing it from shifting or shaking during operation, ensuring its positional accuracy, and thus improving the accuracy and quality of soldering.

[0039] The soldering pen refill PCB sliding plate 15 is used to accommodate the soldering pen refill 8 and can slide within the first housing 1. When the soldering pen refill 8 is subjected to pressure, the soldering pen refill PCB sliding plate 15 will slide accordingly, driving the pressing component 4 to move, thereby transmitting the pressure to the pressure sensing component 5, realizing the transmission and conversion of pressure, and converting the pressure on the soldering pen refill 8 into a force acting on the pressure sensing component 5, thus providing a basis for pressure sensing.

[0040] The clamping component 4 is connected to one end of the PCB sliding plate 15 for soldering pen refills. When the PCB sliding plate 15 for soldering pen refills slides, the clamping component 4 will squeeze the pressure sensing component 5, so that the pressure sensing component 5 can sense the change in pressure. This effectively converts the movement of the PCB sliding plate 15 for soldering pen refills into pressure on the pressure sensing component 5, ensuring that the pressure sensing component 5 can accurately detect the pressure signal.

[0041] The soldering pen core 8 is the direct execution component for soldering. It generates sufficient heat to melt the solder and perform the soldering operation. At the same time, the soldering pen core 8 is also a pressure transmission medium, transmitting the pressure applied by the operator to the soldering pen core PCB sliding plate 15 and the clamping assembly 4. Furthermore, the pressure transmission enables the pressure sensing function, allowing the soldering device to adjust the soldering power according to different pressures.

[0042] The control component receives the electrical signal output from the pressure sensing component 5, processes and converts the pressure value, and transmits the processed signal to the MCU microprocessor chip of the welding station host. Simultaneously, it can control the output power of the welding pen tip 8 according to the instructions of the MCU microprocessor chip, realizing the processing and transmission of the pressure signal and the control of the welding pen tip 8's power. This allows the welding device to automatically adjust the welding power according to different pressures, improving welding efficiency and quality.

[0043] The pressure sensing component 5 is used to sense the pressure applied by the clamping component 4 and convert the pressure value into an electrical signal output to the control component, providing a pressure sensing function for the welding device, enabling the welding device to detect pressure changes during welding in real time, and providing a basis for power adjustment.

[0044] The connecting cable 7 is used to connect the control component and the plug 72. The plug 72 is used to electrically connect the welding device to the welding station host. They realize the power transmission and signal communication between the welding device and the welding station host, ensuring that the welding device can obtain the required power from the welding station host and interact with the welding station host, so that the welding device can work normally under the control of the welding station host.

[0045] The soldering station host can receive electrical signals transmitted by the control components, identify and analyze the pressure values, and control the output of different heating power resistance values ​​of the soldering pen core 8 according to different pressure values. This realizes intelligent control of the power of the soldering pen core 8, enabling the soldering device to automatically adjust the soldering power according to different solder joint sizes, thereby improving the efficiency and quality of soldering.

[0046] This pressure-sensitive welding device automatically adjusts the welding power based on the applied pressure. The operator can adjust the force applied to the solder pen tip 8 according to the size of the solder joint. The device detects the pressure change through the pressure sensor 5, converts it into an electrical signal via a control component, and transmits the signal to the main welding station. The main welding station then controls the solder pen tip 8 to output different heating power values ​​based on the pressure value, thus achieving intelligent welding operation. Operators no longer need to manually adjust the welding power frequently; they only need to apply different pressures according to the size of the solder joint, and the welding device automatically adjusts the power. This reduces the workload of manual power adjustments, saves adjustment time, increases welding speed, reduces labor intensity, and allows operators to focus more on the welding operation itself, improving work accuracy and stability. This welding device can precisely adjust the welding power according to different solder joint sizes, avoiding welding defects caused by excessive or insufficient power, such as cold solder joints and solder buildup, thus improving welding quality and reliability.

[0047] The first housing 1 is covered with a silicone sleeve 13, which provides significant friction when the operator holds the welding device for welding operations. When the hand grips the first housing 1 covered with the silicone sleeve 13, it effectively prevents the welding device from slipping from the hand, especially during prolonged operation or when hands may be sweaty; the anti-slip effect is even more pronounced then.

[0048] During the welding process, the welding device may be subject to accidental collisions or drops. The silicone sleeve 13 has a certain degree of elasticity, which can absorb and buffer external impacts, reduce damage to the first housing 1 and internal precision components (such as the soldering pen PCB sliding plate 15, soldering pen 8, etc.), and play a role in protecting the overall structure and performance of the welding device.

[0049] Silicone is a good insulating material. When it is placed on the outside of the first housing 1, it can further enhance the insulation performance of the welding device, effectively prevent operators from being electrocuted during use, and improve the safety of use. This insulating protection is especially important when welding operations are carried out in some complex electrical environments.

[0050] Referring to Figures 2, 3, and 4, a first fixing plate 11 and a second fixing plate 12 are provided on both sides of the first housing 1. The soldering pen refill PCB sliding plate 15 is placed between the first fixing plate 11 and the second fixing plate 12. The first fixing plate 11 and the second fixing plate 12 provide a precise sliding track for the soldering pen refill PCB sliding plate 15. They define the direction of movement of the soldering pen refill PCB sliding plate 15, ensuring that the soldering pen refill PCB sliding plate 15 can only slide along a specific path between the two. When the soldering pen refill 8 is subjected to pressure and drives the soldering pen refill PCB sliding plate 15 to move, the soldering pen refill PCB sliding plate 15 can move stably and accurately in the predetermined direction, avoiding deviation or shaking during the sliding process.

[0051] The first fixing plate 11 and the second fixing plate 12 limit the sliding range of the soldering pen refill PCB sliding plate 15, preventing the soldering pen refill PCB sliding plate 15 from exceeding the reasonable position during movement. By setting appropriate spacing and length, it can be ensured that the soldering pen refill PCB sliding plate 15 moves within the normal working stroke, avoiding damage to other components due to excessive sliding, such as preventing the soldering pen refill PCB sliding plate 15 from colliding with or detaching from the dormant ring 3, the clamping assembly 4, etc.

[0052] The first fixing plate 11 and the second fixing plate 12 provide a stable support structure for the soldering pen refill PCB sliding plate 15. During the soldering process, the soldering pen refill PCB sliding plate 15 will bear the pressure transmitted from the soldering pen refill 8. The first fixing plate 11 and the second fixing plate 12 can share these pressures, so that the soldering pen refill PCB sliding plate 15 remains stable when under force. Together with the first housing 1, they form a stable support system to ensure that the soldering pen refill PCB sliding plate 15 can move back and forth smoothly.

[0053] The limiting member 14 has sliding grooves 141 on both sides. One end of the soldering pen refill PCB sliding plate 15 is slidably disposed within the sliding groove 141, and the other end is slidably disposed between the first fixed plate 11 and the second fixed plate 12 and extends into the clamping assembly 4. The sliding groove 141 provides a precise sliding path for one end of the soldering pen refill PCB sliding plate 15. When the soldering pen refill PCB sliding plate 15 slides between the first fixed plate 11 and the second fixed plate 12, one end slides within the sliding groove 141, ensuring that the soldering pen refill PCB sliding plate 15 will not deviate laterally during movement. This allows the soldering pen refill PCB sliding plate 15 to move stably along a predetermined straight trajectory, helping to accurately transmit the pressure on the soldering pen refill 8 to the clamping assembly 4 and the pressure sensing assembly 5, ensuring the accuracy and reliability of pressure sensing. Operators can more easily adjust the pressure applied to the soldering pen refill 8 according to the size of the solder joint, achieving more precise soldering control and improving the comfort and convenience of operation.

[0054] The cooperation between the sliding groove 141 and the soldering pen refill PCB sliding plate 15 increases the stability of the soldering pen refill PCB sliding plate 15 during movement. Through the combined action of the first fixed plate 11 and the second fixed plate 12, a relatively stable motion support system is formed, restricting the degrees of freedom of the soldering pen refill PCB sliding plate 15 in multiple directions and reducing shaking and vibration during the sliding process. During the soldering process, even if the soldering device is subjected to certain external force interference, the soldering pen refill PCB sliding plate 15 can maintain a stable motion state under the constraint of the sliding groove 141, ensuring the normal operation of pressure sensing and soldering power adjustment.

[0055] One end of the soldering pen refill PCB sliding plate 15 slides within the sliding groove 141, while the other end is connected to the clamping assembly 4, making the internal structure of the entire soldering device more compact. By making reasonable use of space and tightly integrating various components, unnecessary space waste is reduced, which helps to reduce the overall size of the soldering device and improves its portability and operational flexibility. The sliding groove 141 can provide a certain degree of protection for the soldering pen refill PCB sliding plate 15, limiting its range of motion and preventing excessive collisions or friction between it and other components, thus reducing wear and damage. At the same time, it also prevents external impurities from entering the movement area of ​​the soldering pen refill PCB sliding plate 15, ensuring smooth sliding of the soldering pen refill PCB sliding plate 15 and normal operation of the soldering device.

[0056] The soldering pen refill PCB sliding plate 15 has a receiving groove 151. A top plate 16 is installed at one end of the receiving groove 151 near the clamping component 4. The soldering pen refill 8 is inserted into the receiving groove 151 and pushed against the top plate 16. The soldering pen refill PCB sliding plate 15 is provided with multiple clamping parts 17 for holding the soldering pen refill 8. The receiving groove 151 provides a specific installation space for the soldering pen refill 8, ensuring that the soldering pen refill 8 has a stable position within the soldering pen refill PCB sliding plate 15. It defines the installation position and orientation of the soldering pen refill 8, enabling the soldering pen refill 8 to work accurately with other components, ensuring the accuracy and stability of the installation of the soldering pen refill 8, and preventing the soldering pen refill 8 from shaking or shifting during use, thereby improving the precision and quality of soldering.

[0057] The top plate 16 provides a support and positioning end point for the soldering pen refill 8 inserted into the receiving slot 151. When the soldering pen refill 8 is inserted into the receiving slot 151 and presses against the top plate 16, the top plate 16 can withstand the pressure transmitted by the soldering pen refill 8 and accurately transmit the pressure to the soldering pen refill PCB sliding plate 15, and then to the clamping assembly 4 and the pressure sensing assembly 5. This ensures that the soldering pen refill 8 can stably transmit pressure when under force, guaranteeing the accuracy and reliability of pressure sensing, and helping to realize the function of adjusting the soldering power according to the pressure.

[0058] The clamping member 17 is used to clamp the soldering pen refill 8. The clamping member 17 can provide a certain clamping force to firmly fix the soldering pen refill 8 in the receiving groove 151, preventing the soldering pen refill 8 from loosening or falling off during operation. It enhances the connection stability between the soldering pen refill 8 and the soldering pen refill PCB sliding plate 15, ensuring that the soldering pen refill 8 can move together with the soldering pen refill PCB sliding plate 15, effectively transmitting pressure to other components. At the same time, it also facilitates the installation and replacement of the soldering pen refill 8, improving the convenience of use.

[0059] The clamping assembly 4 includes a base 41 and a push rod 42. The push rod 42 is sleeved on the base 41. The soldering pen refill PCB sliding plate 15 is connected to the base 41. A spring 43 is sleeved on the push rod 42. A gap is set between the end of the push rod 42 and the pressure sensing assembly 5. The base 41 serves as the basic structure of the clamping assembly 4, providing support and mounting position for the push rod 42. The base 41 is connected to the soldering pen refill PCB sliding plate 15. When the soldering pen refill PCB sliding plate 15 slides within the first housing 1, the base 41 moves accordingly, thereby driving the push rod 42 to move. The base 41 plays the role of transmitting the movement of the soldering pen refill PCB sliding plate 15, enabling the push rod 42 to accurately apply pressure to the pressure sensing assembly 5. This ensures the stability and accuracy of the push rod 42's movement, ensuring that the pressure can be smoothly transmitted from the soldering pen refill PCB sliding plate 15 to the push rod 42, and then to the pressure sensing assembly 5, making the entire pressure transmission process more reliable and improving the accuracy of pressure sensing.

[0060] The push rod 42 is a key component for pressure transmission. When the soldering pen refill PCB sliding plate 15 moves the base 41, the push rod 42 moves towards the pressure sensing component 5. When the end of the push rod 42 contacts the pressure sensing component 5, it applies pressure to the pressure sensing component 5, allowing it to sense the pressure change. This realizes the pressure transmission from the soldering pen refill PCB sliding plate 15 to the pressure sensing component 5, which is an important step in realizing the pressure sensing function. Through the movement of the push rod 42, the pressure on the soldering pen refill 8 is converted into a physical quantity that the pressure sensing component 5 can detect, providing a basis for subsequent power adjustment.

[0061] Spring 43 acts as a buffer and reset mechanism. When the push rod 42 applies pressure to the pressure sensing component 5, spring 43 is compressed, absorbing some energy to prevent excessive impact from the push rod 42 on the pressure sensing component 5 and protect it from damage. When the pressure disappears, spring 43 returns to its original state, pushing the push rod 42 back to its original position, restoring the initial gap between the end of the push rod 42 and the pressure sensing component 5. This extends the service life of the pressure sensing component 5 and ensures that the push rod 42 can accurately reset after each pressure application, ensuring the stability and repeatability of the pressure sensing function. If the pressure sensing component 5 is not to be engaged, the welding device and its internal welding pen core 8 can be slightly lifted. The internal spring 43 will push the push rod 42 back to its original position, and the welding pen core 8 will operate at its original minimum power value, outputting heat.

[0062] The gap provides sufficient space for the movement of the push rod 42. Only when the soldering pen lead 8 is subjected to sufficient pressure, causing the soldering pen lead PCB sliding plate 15 to drive the push rod 42 to overcome the elastic force of the spring 43 and move a certain distance, will the end of the push rod 42 contact the pressure sensing component 5, thereby triggering the pressure sensing. This gap can prevent the pressure sensing component 5 from being falsely triggered due to slight vibration or misoperation, thus improving the accuracy and reliability of pressure sensing, reducing false triggering, and enabling the welding device to adjust the power more accurately according to the actual welding pressure.

[0063] Referring to Figures 2, 3, and 5, the control component includes a PCBA board 6. A third fixing plate 21 and a fourth fixing plate 22 are disposed on both sides of the second housing 2. The side of the PCBA board 6 is positioned between the third fixing plate 21 and the fourth fixing plate 22. A button module is disposed on the PCBA board 6, with a button sleeved on the button module. The button passes through and extends outside the second housing 2. One end of the PCBA board 6 is connected to a connecting line 7, and the other end is fixedly connected to a pressure sensing component 5. As the core of the control component, the PCBA board is responsible for receiving pressure signals from the pressure sensing component 5, processing and analyzing these signals, and converting the pressure signals into control commands according to a preset program and algorithm to control the output power of the soldering pen core 8, thereby achieving the function of automatically adjusting welding parameters according to the welding pressure.

[0064] The PCBA board integrates various electronic components and circuits, including processors, resistors, and capacitors, enabling multiple functions such as signal amplification, filtering, and data storage, ensuring the accuracy and stability of the entire control process. The PCBA board communicates with the soldering station host via connection cable 7, transmitting processed signals to the host and simultaneously receiving instructions from the host, coordinating the operation between the soldering device and the host.

[0065] The third fixing plate 21 and the fourth fixing plate 22 are used to fix the PCBA board 6. The third fixing plate 21 and the fourth fixing plate 22 are arranged on both sides inside the second housing 2, fixing the side of the PCBA board 6 between them, providing a stable mounting position for the PCBA board 6, and preventing the PCBA board 6 from shaking or shifting during the use of the soldering device. The third fixing plate 21 and the fourth fixing plate 22 limit the range of movement of the PCBA board 6, preventing it from colliding or rubbing against other components inside the second housing 2, and protecting the PCBA board 6 from damage.

[0066] The button module and buttons provide users with an interface to interact with the welding equipment. Users can perform specific operations by pressing the buttons, thus achieving manual control of the welding equipment's functions.

[0067] The second housing 2 has a connecting wire SR71 connected to one end, and a connecting wire 7 is threaded through the connecting wire SR71. The other end of the connecting wire SR71 is connected to a plug 72. The connecting wire SR71 acts as an external protective structure, enclosing the internal connecting wire 7 and preventing it from being damaged by wear, pulling, squeezing, or other external forces during daily use. In welding operations, various complex environments may exist, such as friction or collisions with other tools or equipment. The connecting wire SR71 can act as a buffer and isolation, extending the service life of the connecting wire 7. Storing the connecting wire 7 inside the connecting wire SR71 makes the wire bundle more neat and orderly, preventing the connecting wires 7 from tangling and knotting, which facilitates installation, maintenance, and management. This is especially important for welding equipment that needs to be frequently moved or operated, improving ease of use.

[0068] Connector 7 transmits power from the soldering station host to the control components of the soldering device and the soldering tip 8, providing energy support for the normal operation of the soldering device and ensuring that the soldering tip 8 can generate heat to achieve the soldering function. Connector 7 is responsible for transmitting various signals, such as pressure sensing signals and control commands, between the control components of the soldering device and the soldering station host, enabling the soldering station host to understand the working status of the soldering device in real time and adjust the soldering device as needed. Plug 72 is the electrical interface between the soldering device and the soldering station host. By inserting it into the corresponding socket of the soldering station host, the electrical connection between the soldering device and the soldering station host is achieved, allowing power and signals to be transmitted between the two. The design of plug 72 allows the soldering device to be easily connected and disconnected from the soldering station host, facilitating maintenance, replacement, or portability when needed.

[0069] The soldering station host is equipped with an MCU microcomputer chip, which receives pressure electrical signals transmitted from the control component (PCBA board) of the pressure-sensing soldering device and performs precise processing and analysis on these signals. Through built-in algorithms and programs, the pressure signals are converted into corresponding numerical values ​​and compared with a preset pressure-power mapping table. Based on the analyzed pressure values ​​and according to preset rules and algorithms, the appropriate heating power resistance value that the soldering pen tip 8 should output is determined. Then, a control command is sent to the control component of the soldering device to adjust the working state of the soldering pen tip 8, achieving precise control of the soldering power.

[0070] The 72 connector is a 7-pin aviation connector. With multiple pins, it can simultaneously transmit various types of signals and power, meeting the complex communication and power requirements between the welding equipment and the main welding station. For example, it can simultaneously transmit pressure sensing signals, control command signals, and provide the power required for the welding equipment. The 72 connector typically features excellent mechanical structure and electrical performance, providing a stable and reliable connection. It employs a special plug-in design, exhibiting strong resistance to vibration, shock, and interference, ensuring the stability and accuracy of signal and power transmission even in complex working environments.

[0071] The implementation process of a pressure-sensitive welding device according to an embodiment of this application is as follows: The 7-pin connector at the end of the welding device is connected to the welding station host, and the welding pen core 8 is inserted into the end of the first housing 1. When working, the welding pen core 8 is subjected to pressure. The welding pen core 8 drives the top rod 42 to squeeze the pressure sensing component 5 through the welding pen core PCB sliding plate 15. The pressure sensing component 5 obtains the pressure value. The PCBA board 6 converts the pressure value into an electrical signal and outputs it to the MCU microcomputer chip of the welding station host. The MCU microcomputer chip of the welding station host controls the welding pen core 8 to output different heating power resistance values ​​according to the identified pressure value.

[0072] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A pressure sensitive welding device, characterized by: The device includes a first housing (1), one end of which is connected to a second housing (2), and the other end is connected to a dormant ring (3). A limiting member (14) is fitted inside the dormant ring (3). A soldering pen PCB sliding plate (15) for accommodating a soldering pen refill (8) is slidably disposed inside the first housing (1). One end of the soldering pen PCB sliding plate (15) is slidably disposed inside the dormant ring (3), and the other end is connected to a pressing component (4). The soldering pen refill (8) passes through the dormant ring (3) and the limiting member (14) in sequence. 4) and extends into the PCB sliding plate (15) of the soldering pen refill. A control component is installed in the second housing (2). One end of the control component is connected to a pressure sensing component (5), and the other end is connected to a connecting line (7). The connecting line (7) is connected to a plug (72) for electrical connection with the soldering station host. The soldering station host is communicatively connected to the soldering pen refill (8). The pressure sensing component (5) is located on the side close to the clamping component (4). A gap is provided between the clamping component (4) and the pressure sensing component (5).

2. The pressure-sensing welding device of claim 1, wherein: The first housing (1) has a first fixing plate (11) and a second fixing plate (12) on both sides, and the soldering pen core PCB sliding plate (15) is placed between the first fixing plate (11) and the second fixing plate (12).

3. The pressure induction welding device according to claim 2, characterized in that: The limiting member (14) has sliding grooves (141) on both sides. One end of the soldering pen core PCB sliding plate (15) is slidably disposed in the sliding groove (141), and the other end is slidably disposed between the first fixing plate (11) and the second fixing plate (12) and extends into the pressing assembly (4).

4. The pressure-sensing welding device of claim 1, wherein: The soldering pen refill PCB sliding plate (15) has a receiving groove (151). A top plate (16) is installed at one end of the receiving groove (151) near the clamping assembly (4). The soldering pen refill (8) is inserted into the receiving groove (151) and pushed against the top plate (16). The soldering pen refill PCB sliding plate (15) is provided with a plurality of clamping parts (17) for clamping the soldering pen refill (8).

5. The pressure-sensing welding device of claim 1, wherein: The pressing assembly (4) includes a base (41) and a top rod (42). The top rod (42) is sleeved on the base (41). The soldering pen refill PCB sliding plate (15) is connected to the base (41). A spring (43) is sleeved on the top rod (42). The gap is provided between the end of the top rod (42) and the pressure sensing assembly (5).

6. The pressure-sensing welding device of claim 1, wherein: The control component includes a PCBA board (6). A third fixing plate (21) and a fourth fixing plate (22) are provided on both sides of the second housing (2). The side of the PCBA board (6) is located between the third fixing plate (21) and the fourth fixing plate (22). A button module is provided on the PCBA board (6). A button is sleeved on the button module. The button passes through and extends to the outside of the second housing (2). One end of the PCBA board (6) is connected to the connecting line (7), and the other end is fixedly connected to the pressure sensing component (5).

7. The pressure-sensing welding device of claim 1, wherein: The second housing (2) is connected to a connecting line SR (71) at one end. The connecting line (7) passes through the connecting line SR (71), and the other end of the connecting line SR (71) is connected to the plug (72).

8. The pressure-sensing welding device of claim 1, wherein: The first housing (1) is covered with a silicone sleeve (13).

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