Edge cleaning equipment for perovskite thin film battery

Abstract

The utility model discloses a perovskite thin film battery edge cleaning device, comprising a laser etching mechanism used for cleaning the edge of an incoming material substrate; the laser etching mechanism is arranged on the driving mechanism, and the driving mechanism can drive the laser etching mechanism to move in the X-axis direction of the substrate; and the conveying mechanism is used for conveying the substrate close to one side of the laser etching mechanism along the Y-axis direction. Compared with a single-head machining mode, the double-head multi-path simultaneous machining mode is adopted, higher machining efficiency is achieved, meanwhile, by adopting the mode that the galvanometer is matched with DOE large light spot homogenization in a single light path, due to the fact that the DOE homogenizer is additionally arranged in the light path, laser energy is evenly distributed, and the linear effect machining quality can be improved; and meanwhile, the homogenized square light spots optimize the circuit layout relative to the circular light spots, so that the purpose of improving the processing efficiency is achieved.

Description

A perovskite thin-film battery edge cleaning device Technical Field

[0001] This utility model relates to the field of battery processing technology, and in particular to a perovskite thin-film battery edge cleaning device. Background Technology

[0002] The statements herein provide only background information related to this invention and do not necessarily constitute prior art.

[0003] To facilitate battery encapsulation, the edge regions of the perovskite battery film need to be removed. The width of the removed edge regions is generally controlled between 5 and 10 millimeters. The diameter of the laser focusing spot is mostly 30-60 micrometers. To achieve a width in the 5-10 millimeter range, the lines must be densely filled to achieve the required line width.

[0004] Current battery edge cleaning equipment uses a collimating head filling and scribing method. After the collimating head focuses, a linear motor drives the collimating head to scribing. The speed depends on the speed of the linear motor and is generally no more than 1m / s, which is very slow. In addition, the laser spot has a Gaussian distribution and uneven energy distribution, resulting in poor edge effect. The characteristics of the circular Gaussian spot make it difficult to reduce the overlap rate of line filling. This not only indirectly affects the efficiency, but also causes serrated edges and melted curling, affecting the production quality of the product. Summary of the Invention

[0005] The purpose of this invention is to address the aforementioned shortcomings by providing a perovskite thin-film battery edge cleaning device, thereby improving processing efficiency and quality.

[0006] To solve the above-mentioned technical problems, this utility model adopts the following technical solution: a perovskite thin-film battery edge cleaning device, comprising:

[0007] Laser etching mechanism, used to clean the edges of incoming substrates;

[0008] A driving mechanism is provided, wherein the laser etching mechanism is mounted on the driving mechanism, and the driving mechanism can drive the laser etching mechanism to move along the X-axis direction of the substrate;

[0009] A conveying mechanism is used to convey a substrate along the Y-axis towards the side of the laser etching mechanism.

[0010] Furthermore, the laser etching mechanism includes:

[0011] Laser assembly, used to emit edge-clearing laser beams;

[0012] The first lifting component is mounted on the drive mechanism, and the laser component is mounted on the first lifting component.

[0013] Furthermore, the laser component includes:

[0014] The body is used to connect with the first lifting assembly and can be driven by the lifting assembly to move up and down;

[0015] The laser generator, located inside the fuselage, is used to emit laser beams;

[0016] A shaping component, located at the laser beam emission end of the laser generator, is used to shape the laser beam;

[0017] A galvanometer, located on the side of the shaping component away from the laser generator, is used to control the movement path of the laser beam.

[0018] Furthermore, the shaping component includes:

[0019] A beam expander is placed at the laser beam emission end of a laser generator to change the diameter and divergence angle of the laser beam.

[0020] The DOE homogenizer, located between the beam expander and the galvanometer, is used to shape the laser beam.

[0021] Furthermore, the laser assembly also includes:

[0022] A focusing lens is located at the laser beam emission end of the galvanometer and is used to control the focusing shape of the laser beam.

[0023] Furthermore, there are two laser etching mechanisms and two driving mechanisms, and the two laser etching mechanisms are driven by the driving mechanism to clean the edges of the perovskite solar cell film simultaneously.

[0024] Furthermore, the conveying mechanism includes:

[0025] Two parallel feeding components are used to receive the substrate and transfer it to the feeding station;

[0026] The positioning component is used to position the substrate on the feeding component in the X and Y axis directions;

[0027] Two second lifting components are used to push the corresponding feeding components to lift and move.

[0028] A conveying assembly is used to fix the substrate and move the substrate toward the laser etching mechanism.

[0029] The unloading assembly is used to remove the substrate after it has been processed by the laser etching mechanism.

[0030] Furthermore, the positioning component includes two shaping guide components, a flat pushing component, and a lifting blocking positioning component. The shaping guide components can move towards and away from the substrate and can move up and down synchronously with the corresponding feeding component, positioning the substrate in the X-axis direction by closely adhering to both sides of the substrate. The flat pushing component is located on the input direction side of the feeding component and is used to push the substrate to adhere closely to the lifting blocking positioning component. The lifting blocking positioning component is located on the output direction side of the feeding component and can move up and down into the substrate output path to block the substrate from moving further.

[0031] Furthermore, the transmission component includes:

[0032] The adsorption platform is located below the feeding assembly and between the two shaping guide components. It is used to draw air to adsorb the substrate and blow air to push the substrate away from the adsorption platform.

[0033] A servo-driven moving platform is used to move the adsorption platform between the loading station and the laser etching mechanism.

[0034] Furthermore, it also includes a dust removal pipe for guiding the discharge of processing fly ash and an air intake hood set on the drive mechanism and moving synchronously with the laser etching mechanism. One end of the dust removal pipe is connected to the air intake hood, and the other end is connected to the dust extraction equipment. The air intake hood is provided with perforations for the laser beam to pass through.

[0035] The beneficial effects of this utility model are reflected in:

[0036] This invention employs a dual-head, multi-path simultaneous processing method, which offers faster processing efficiency compared to a single-head processing method. Furthermore, by using a galvanometer in conjunction with a large-spot homogenizer (DOE) in the single optical path, the laser energy distribution becomes more uniform due to the addition of the DOE homogenizer, thus improving the linear processing quality. Additionally, the homogenized square spot optimizes the circuit layout compared to a circular spot, thereby achieving the goal of improving processing efficiency. Attached Figure Description

[0037] Figure 1 is a perspective view of this utility model;

[0038] Figure 2 is a structural view of the laser etching mechanism of this utility model;

[0039] Figure 3 is a structural view of the conveying mechanism of this utility model;

[0040] Figure 4 is a structural view of the conveying component of this utility model;

[0041] Figure 5 is a schematic diagram of the installation of the dust removal pipe of this utility model;

[0042] Figure 6 shows the moving path of the laser etching mechanism of this utility model.

[0043] In the picture:

[0044] 1. Laser etching mechanism; 11. Machine body; 12. Laser generator; 13. Beam expander; 14. DOE homogenizer; 15. Galvanometer; 16. Focusing lens; 17. First lifting assembly; 2. Drive mechanism; 3. Conveying mechanism; 31. Loading assembly; 32. Positioning assembly; 321. Shaping guide component; 322. Horizontal push component; 323. Lifting blocking positioning component; 33. Second lifting assembly; 34. Conveying assembly; 341. Adsorption platform; 342. Servo moving platform; 35. Unloading assembly; 4. Dust removal pipe; 5. Air inlet hood. Detailed Implementation

[0045] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present utility model, and not all of them. Unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0046] Please refer to Figures 1-6. This utility model discloses a perovskite thin-film battery edge cleaning device, comprising:

[0047] Laser etching mechanism 1 is used to clean the edges of incoming substrates;

[0048] The drive mechanism 2 and the laser etching mechanism 1 are mounted on the drive mechanism 2. The drive mechanism 2 can drive the laser etching mechanism 1 to move along the X-axis direction of the substrate.

[0049] The conveying mechanism 3 is used to convey the substrate along the Y-axis direction to the side of the laser etching mechanism 1.

[0050] In this invention, the substrate to be processed is transported to the side close to the laser etching mechanism 1 by the conveying mechanism 3. When the laser etching mechanism 1 processes the substrate in the X-axis direction, the conveying mechanism 3 stops operating. The driving mechanism 2 drives the laser etching mechanism 1 to move along the X-axis direction to achieve block edge cleaning. After the substrate is cleaned in the X-axis direction, the driving mechanism 2 drives the laser etching mechanism 1 to move to the Y-axis direction of the substrate. Then, the conveying mechanism 3 transports the substrate so that the substrate passes through the laser etching mechanism 1 to achieve edge cleaning.

[0051] In one embodiment, the laser etching mechanism 1 includes:

[0052] Laser assembly, used to emit edge-clearing laser beams;

[0053] The first lifting assembly 17 is mounted on the drive mechanism 2, and the laser assembly is mounted on the first lifting assembly 17.

[0054] This design allows the installation height of the laser component to be adjusted by moving the first lifting component 17 up and down, thus adapting to the edge cleaning processing needs of substrates with different thicknesses.

[0055] In one embodiment, the laser component includes:

[0056] The body 11 is used to connect with the first lifting component 17 and can be driven by the first lifting component 17 to move up and down;

[0057] A laser generator 12 is installed inside the body 11 and is used to emit a laser beam;

[0058] A shaping component is located at the laser beam emission end of the laser generator 12 and is used to shape the laser beam.

[0059] The galvanometer 15 is located on the side of the shaping component away from the laser generator 12 and is used to control the movement path of the laser beam.

[0060] This design allows the laser to first deflect and scan a small section of the line segment that needs to be cleaned by controlling the laser beam deflection through the galvanometer 15 during laser edge cleaning. Then, the laser assembly is moved to the next section of the line segment that needs to be cleaned by using the drive mechanism 2 or the conveying mechanism 3. The above scanning and edge cleaning steps are repeated to clean the edges.

[0061] In one embodiment, the shaping component includes:

[0062] A beam expander 13 is located at the laser beam emission end of the laser generator 12 and is used to change the laser beam diameter and divergence angle.

[0063] The DOE homogenizer 14 is positioned between the beam expander 13 and the galvanometer 15 and is used to shape the laser beam.

[0064] This design, through the DOE homogenizer 14 shaping the laser beam, makes the shaped square homogenized spot, relative to the circular homogenized spot, optimize the overlap rate of the processing path and the serrated effect of the processing edge, thereby improving processing efficiency.

[0065] Preferably, the DOE homogenizer 14 can be a large spot DOE with a linewidth of 500um, which can further improve the processing efficiency compared to the 30-50um spot of the focusing lens.

[0066] In one embodiment, the laser assembly further includes:

[0067] The focusing mirror 16 is located at the laser beam emission end of the galvanometer 15 and is used to control the focusing shape of the laser beam.

[0068] This design, through the focusing lens 16, controls the laser illumination distribution, further improving the processing effect during laser edge clearing.

[0069] In one embodiment, there are two laser etching mechanisms 1 and two driving mechanisms 2. The two laser etching mechanisms 1 are driven by the driving mechanism 2 to clean the edges of the perovskite solar cell film.

[0070] This design allows the edge cleaning equipment to divide the X-axis and Y-axis sides of the substrate to be cleaned into multiple areas according to the size of the galvanometer 15. Then, based on the number of areas, the areas are roughly divided into two groups, so that the two laser etching mechanisms 1 can clean the two groups of areas at the same time, thereby improving the edge cleaning efficiency of the substrate.

[0071] It should be noted that when the number of X-axis edge-cleaning areas is even, the two laser etching mechanisms 1 clean the same number of areas; when the number of X-axis edge-cleaning areas is odd, one laser etching mechanism 1 cleans one more area than the other laser etching mechanism 1.

[0072] Please refer to Figure 6. The specific edge cleaning process of laser etching mechanism 1 is as follows:

[0073] First, the two laser etching mechanisms 1 move to the X-axis edge clearing positions of 1-1 and 1-3 respectively to complete the X-axis edge clearing of 1-1 and 1-3;

[0074] Then, the two laser etching mechanisms 1 move to the X-edge cleaning positions of 1-2 and 1-4 respectively to complete the X-edge cleaning of 1-2 and 1-4;

[0075] Next, the two laser etching mechanisms 1 perform edge cleaning in the Y direction. The laser etching mechanism 1 moves to the Y-direction edge cleaning position of the substrate and remains stationary. After the Y-sides of 1-1 and 1-4 are cleaned, the conveying mechanism 3 will move the substrate forward one grid to perform edge cleaning of the Y-sides of 2-1 and 2-4. After the conveying mechanism 3 moves the substrate forward and completes the edge cleaning of the last grid of the Y-side, the two laser etching mechanisms 1 move to the X-direction edge cleaning positions of 5-1 and 5-3 respectively to complete the X-direction edge cleaning of 5-1 and 5-3.

[0076] Finally, the two laser etching mechanisms 1 move to the X-edge cleaning positions of 5-2 and 5-4 respectively to complete the X-edge cleaning of 1-2 and 1-4, thus completing the cleaning operation at the edge of the entire substrate.

[0077] In one embodiment, the conveying mechanism 3 includes:

[0078] Two parallel feeding components 31 are used to receive the substrate and transfer the substrate to the feeding station;

[0079] Positioning component 32 is used to position the substrate on the feeding component 31 in the X and Y axis directions;

[0080] Two second lifting components 33 are used to push the corresponding feeding component 31 to lift and move.

[0081] Conveying component 34 is used to fix the substrate and move the substrate toward the laser etching mechanism 1.

[0082] The unloading assembly 35 is used to remove the substrate processed by the laser etching mechanism 1.

[0083] This design, by setting the second lifting component 33 to drive the loading component 31 to move up and down, enables it to receive substrates of different heights and transfer them to the loading station, thus achieving compatibility with multiple material receiving methods. By setting the positioning component 32 to position the substrates on the loading component 31 in the X and Y axes, the substrates can maintain a stable position when they are fixedly conveyed by the conveying component 34, thereby making the product stability during processing higher and ensuring higher processing accuracy.

[0084] In one embodiment, the positioning component 32 includes two shaping guide components 321, a flat pushing component 322, and a lifting blocking positioning component 323. The shaping guide component 321 can move towards and away from the substrate and can move up and down synchronously with the corresponding feeding component 31, positioning the substrate in the X-axis direction by closely adhering to both sides of the substrate. The flat pushing component 322 is located on the input direction side of the feeding component 31 and is used to push the substrate to adhere to the lifting blocking positioning component 323. The lifting blocking positioning component 323 is located on the output direction side of the feeding component 31 and can move up and down into the substrate output path to block the substrate from moving further.

[0085] This design, by placing the shaping guide component 321, which is used to position the substrate in the X-axis direction, on the second lifting component 33, allows the shaping guide component 321 to move synchronously with the loading component 31. This restricts the substrate's movement in the X-axis direction when it moves on the loading component 31, thereby improving the stability of the substrate's movement when the loading component 31 receives the substrate and preventing the substrate from falling off. Furthermore, after the substrate moves to the loading station, the lifting blocking positioning component 323 and the flat pushing component 322 can be located on both sides of the substrate in the Y-axis direction. The flat pushing component 322 pushes the substrate to press against the lifting blocking positioning component 323 to achieve positioning of the substrate in the Y-axis direction. At the same time, since the lifting blocking positioning component 323 can move up and down into the substrate output path, it can move up and down with the loading component 31 before the substrate enters the loading station. This prevents one side of the substrate from moving further after contacting the lifting blocking positioning component 323, thus achieving initial positioning of the substrate.

[0086] It should be noted that the unloading component 35 consists of two loading components 31, two second lifting components 33, and a lifting blocking positioning component 323, so that the processed substrate can be moved above the loading component 31, positioned by the lifting blocking positioning component 323, pushed up to the required height by the second lifting components 33, and then transported to the next station by the loading component 31.

[0087] In one embodiment, the transmission component 34 includes:

[0088] The adsorption platform 341 is located below the feeding component 31 and between the two shaping guide components 321. It is used to draw air to adsorb the substrate and blow air to push the substrate away from the adsorption platform 341.

[0089] The servo moving platform 342 is used to drive the adsorption platform 341 to move between the loading station and the laser etching mechanism 1.

[0090] This design allows the substrate to be placed on the adsorption platform 341 below when the second lifting component 33 lowers the substrate. When the substrate is positioned, air is blown in the opposite direction through the adsorption platform to reduce the frictional resistance between the substrate and the loading component 31 and the adsorption platform 341, thereby improving the smoothness of the substrate's movement during positioning. After the substrate is positioned, the negative pressure suction of the adsorption platform 341 is used to adsorb and fix the positioned substrate on the adsorption platform 341, so that the precisely positioned substrate can be transferred to the laser etching mechanism 1 by the servo moving platform 342.

[0091] In one embodiment, the perovskite thin-film battery edge cleaning equipment further includes a dust removal pipe 4 for guiding the discharge of processing fly ash and an air intake hood 5 disposed on the drive mechanism 2 and moving synchronously with the laser etching mechanism 1. One end of the dust removal pipe 4 is connected to the air intake hood 5, and the other end is connected to a dust extraction device. The air intake hood 5 is provided with perforations for the laser beam to pass through.

[0092] This design allows the fumes and dust generated during the laser edge cleaning process to be promptly extracted and discharged by the dust extraction equipment, thus protecting the equipment, improving the environment, and enhancing processing quality.

[0093] It should be noted that the drive mechanism 2 can adopt the linear module in the prior art, and the first lifting component 17 and the second lifting component 33 can adopt the hydraulic telescopic component, pneumatic telescopic component and electric telescopic component in the prior art. The feeding component 31, the shaping guide component 321, the flat pushing component 322 and the lifting blocking positioning component 323 are all common knowledge in the field, so their specific structural composition and working principle will not be described in detail in this article.

[0094] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0095] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0096] Additionally, "multiple" refers to two or more.

[0097] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A perovskite thin-film battery edge cleaning device, characterized in that, include: Laser etching mechanism (1) is used to clean the edge of the incoming substrate; drive mechanism (2) is mounted on the drive mechanism (2), and the drive mechanism (2) can drive the laser etching mechanism (1) to move along the X-axis direction of the substrate; conveying mechanism (3) is used to convey the substrate along the Y-axis direction close to the side of the laser etching mechanism (1).

2. The perovskite thin-film battery edge cleaning device according to claim 1, characterized in that: The laser etching mechanism (1) Includes: a laser component for emitting a clearing laser beam; and a first lifting component (17), which is mounted on the drive mechanism (2), and the laser component is mounted on the first lifting component (17).

3. The perovskite thin-film battery edge cleaning device according to claim 2, characterized in that: The laser assembly includes: a body (11) for connection to a first lifting assembly (17) and capable of being driven to move up and down by the first lifting assembly (17); a laser generator (12) disposed inside the body (11) for emitting a laser beam; a shaping component disposed at the laser beam emitting end of the laser generator (12) for shaping the laser beam; and a galvanometer (15) disposed on the side of the shaping component away from the laser generator (12) for controlling the movement path of the laser beam.

4. The perovskite thin-film battery edge cleaning device according to claim 3, characterized in that: The shaping components include: a beam expander (13), which is located at the laser beam emission end of the laser generator (12) and is used to change the diameter and divergence angle of the laser beam; and a DOE homogenizer (14), which is located between the beam expander (13) and the galvanometer (15) and is used to shape the laser beam.

5. The perovskite thin-film battery edge cleaning device according to claim 4, characterized in that: The laser assembly further includes a focusing lens (16), which is disposed at the laser beam emitting end of the galvanometer (15) and is used to control the focusing shape of the laser beam.

6. The perovskite thin-film battery edge cleaning device according to claim 1, characterized in that: The number of laser etching mechanism (1) and driving mechanism (2) are both two. The two laser etching mechanisms (1) are driven by the driving mechanism (2) to clean the edges of the perovskite solar cell film.

7. The perovskite thin-film battery edge cleaning device according to claim 1, characterized in that: The conveying mechanism (3) includes: two parallel feeding components (31) for receiving the substrate and transferring it to the feeding station; a positioning component (32) for positioning the substrate on the feeding component (31) in the X and Y directions; two second lifting components (33) for pushing the corresponding feeding component (31) to move up and down; a conveying component (34) for fixing the substrate and moving it towards the laser etching mechanism (1); and a discharging component (35) for removing the substrate processed by the laser etching mechanism (1).

8. The perovskite thin-film battery edge cleaning device according to claim 7, characterized in that: The positioning component (32) includes two shaping guide components (321), a flat pushing component (322), and a lifting blocking positioning component (323). The shaping guide component (321) can move towards and away from the substrate and can move up and down synchronously with the corresponding feeding component (31) to position the substrate in the X-axis direction by closely adhering to both sides of the substrate in the X-axis direction. The flat pushing component (322) is located on the input direction side of the feeding component (31) and is used to push the substrate to adhere to the lifting blocking positioning component (323). The lifting blocking positioning component (323) is located on the output direction side of the feeding component (31) and can move up and down into the substrate output path to block the substrate from moving further.

9. The perovskite thin-film battery edge cleaning device according to claim 8, characterized in that: The conveying assembly (34) includes: an adsorption platform (341) located below the loading assembly (31) and between two shaping guide components (321) for suction adsorption of the substrate and blowing air to push the substrate away from the adsorption platform (341); and a servo moving platform (342) for driving the adsorption platform (341) to move between the loading station and the laser etching mechanism (1).

10. The perovskite thin-film battery edge cleaning device according to claim 1, characterized in that: It also includes a dust removal pipe (4) for guiding the discharge of processing fly ash and an air intake hood (5) set on the drive mechanism (2) and moving synchronously with the laser etching mechanism (1). One end of the dust removal pipe (4) is connected to the air intake hood (5) and the other end is connected to the dust extraction equipment. The air intake hood (5) is provided with a perforation for the laser beam to pass through.

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