Laser processing device

Abstract

The utility model discloses a laser processing device which comprises a laser device, a switching assembly, a galvanometer assembly, a cutting assembly and a camera assembly. A first light path and a second light path are configured outside the laser; the galvanometer assembly comprises a galvanometer and a field lens which are arranged at the tail end of the first light path, and the field lens is arranged downwards; the cutting assembly comprises a cutting head arranged at the tail end of the second light path, and the cutting head is arranged downwards and is spaced from the galvanometer assembly; the first light path and the second light path can be switched to input laser beams emitted by the laser through the switching assembly, so that the device can perform laser engraving through the galvanometer assembly and can perform laser cutting through the cutting assembly, and compatibility of the two functions is achieved. In addition, the camera assembly is arranged on one side of the galvanometer assembly and used for obtaining image information of the lower machining area, and the machining process can be monitored.

Description

Technical Field

[0001] This application relates to the field of laser equipment, and in particular to a laser processing apparatus. Background Technology

[0002] As the manufacturing industry transforms towards high-end and intelligent manufacturing, the requirements for processing precision, efficiency, and quality are increasing. Laser processing equipment is being used more and more widely in China, not only in traditional manufacturing sectors such as electronics, automobiles, and aerospace, but also showing great potential in emerging fields such as wearable devices and smart homes. Consequently, domestic femtosecond laser processing equipment and technology are developing rapidly. Currently, existing laser processing equipment, such as laser cutting machines and laser engraving machines, are independently designed, and their functions cannot be compatible on a single device, resulting in a limitation on functionality. Utility Model Content

[0003] This application proposes a laser processing device that can solve the problem of limited functionality in laser processing equipment.

[0004] This application discloses a laser processing apparatus, comprising:

[0005] A laser, wherein a first optical path and a second optical path are externally configured on the laser;

[0006] A switching component is used to receive the laser beam emitted by the laser and switch the input laser beam between the first optical path and the second optical path;

[0007] The galvanometer assembly includes a galvanometer and a field lens disposed at the end of the first optical path, wherein the field lens is disposed downwards;

[0008] The cutting assembly includes a cutting head disposed at the end of the second optical path, the cutting head being disposed downward and spaced apart from the galvanometer assembly;

[0009] A camera assembly, located on one side of the galvanometer assembly, is used to acquire image information of the processing area below.

[0010] In some embodiments, the camera assembly includes a rangefinder camera and a coaxial camera; the rangefinder camera is disposed on one side of the galvanometer assembly, and the optical axis of the rangefinder camera is parallel to the first optical path; the coaxial camera is disposed on one side of the cutting assembly, and the optical axis of the coaxial camera is coaxial with the second optical path.

[0011] In some embodiments, a main optical path is established between the laser and the switching component, and the laser processing apparatus further includes a power adjustment component disposed in the main optical path. The power adjustment component includes a half-wave plate disposed near the laser, a polarizing beam splitter disposed near the switching component, and a first driving member for driving the half-wave plate to rotate.

[0012] In some embodiments, the laser processing apparatus further includes:

[0013] A first beam expander is disposed in the first optical path and located between the switching component and the galvanometer component;

[0014] The second beam expander is disposed in the second optical path and located between the switching component and the cutting component.

[0015] In some embodiments, the laser processing apparatus further includes a third beam expander disposed in the second optical path, the third beam expander being located between the second beam expander and the cutting assembly, wherein the second beam expander is a fixed-magnification beam expander and the third beam expander is a variable-magnification beam expander.

[0016] In some embodiments, the laser processing apparatus further includes a point laser source and a beam combiner disposed in the first optical path. The beam combiner is used to combine the laser beam emitted by the point laser source with the laser beam emitted by the laser in the first optical path.

[0017] In some embodiments, the laser processing apparatus further includes:

[0018] Machine tool;

[0019] A mounting bracket, located above the machine base, is used to mount the laser, switching assembly, galvanometer assembly, cutting assembly, and camera assembly.

[0020] A movable stage is mounted on the machine platform and located below the galvanometer assembly, the cutting assembly, and the camera assembly.

[0021] In some embodiments, the laser processing apparatus further includes a first lifting module disposed on the mounting frame, the first lifting module being used to drive the galvanometer assembly and the cutting assembly to rise and fall.

[0022] In some embodiments, the mobile platform includes:

[0023] Mounting base;

[0024] A vacuum adsorption plate is disposed on the mounting base;

[0025] A threaded adjusting rod is provided on the mounting base and abuts against the lower surface of the vacuum adsorption plate, used to adjust the tilt angle of the vacuum adsorption plate;

[0026] The second lifting module is used to drive the mounting base to lift.

[0027] A translation module is mounted on the machine platform and is used to drive the second lifting module to translate along the X-axis and Y-axis directions.

[0028] In some embodiments, the laser processing apparatus further includes an air blowing assembly and a dust extraction assembly disposed on the mounting base.

[0029] The laser processing apparatus in this embodiment includes a laser, a switching component, a galvanometer component, a cutting component, and a camera component. The laser has a first optical path and a second optical path externally configured. The galvanometer component includes a galvanometer and a field lens located at the end of the first optical path, with the field lens facing downwards. The cutting component includes a cutting head located at the end of the second optical path, facing downwards and spaced apart from the galvanometer component. The switching component allows switching between the first and second optical paths to input the laser beam emitted from the laser. Therefore, this apparatus can perform laser engraving via the galvanometer component and laser cutting via the cutting component, achieving compatibility between the two functions. Furthermore, the camera component is located on one side of the galvanometer component to acquire image information of the processing area below, enabling monitoring of the processing process. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structure of a laser processing apparatus in one embodiment of this application;

[0031] Figure 2 This is a schematic diagram of the optical path structure of the laser processing apparatus in another embodiment of this application;

[0032] Figure 3 This is a schematic diagram of the structure of the galvanometer assembly and the cutting assembly in another embodiment of this application;

[0033] Figure 4 This is a schematic diagram of the switching component in another embodiment of this application;

[0034] Figure 5 for Figure 4 A schematic diagram of the structure of the switching component from another perspective in the embodiment;

[0035] Figure 6 This is a schematic diagram of the power regulation component in one embodiment of this application;

[0036] Figure 7 for Figure 6 Cross-sectional view of the power regulation component in the embodiment;

[0037] Figure 8 This is a schematic diagram of the beam expander assembly in one embodiment of this application;

[0038] Figure 9 This is a schematic diagram of the structure of the mobile platform in one embodiment of this application;

[0039] Label Explanation:

[0040] 10. Laser; 11. Machine base; 12. Mounting frame; 13. Dust extraction assembly; 14. Air blowing assembly; 15. First lifting module; 20. Power adjustment assembly; 21. Half-wave plate; 22. Polarizing beam splitter; 23. First driving component; 24. Rotating sleeve; 25. Beam splitter base; 26. Refractive cavity; 27. Telescopic cylinder; 28. Fixed sleeve; 29. ​​Beam entrance base; 30. Switching assembly; 31. Optical shutter cavity; 32. Stepper motor; 33. Optical shutter lens; 34. Photoelectric switch; 35. Sensor plate; 37. First reflector; 38. Second reflector; 40. Galvanometer assembly; 41. Galvanometer; 42. Field lens; 43. Point 44. Beam combiner; 50. Cutting assembly; 51. Cutting head; 52. Objective lens; 60. Beam expander assembly; 61. First beam expander; 62. Second beam expander; 63. Third beam expander; 64. Beam expander cavity; 65. Second mounting component; 66. Second movable pressure block; 67. First mounting component; 68. First movable pressure block; 69. First fixed pressure block; 70. Moving stage; 71. Mounting base; 72. Vacuum adsorption plate; 73. Threaded adjustment rod; 74. Second lifting module; 75. Translation module; 76. Heightening block; 80. Camera assembly; 81. Rangefinder camera; 82. Coaxial camera; 83. Coaxial light source.

[0041] The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0042] The solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0043] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0044] It should also be noted that when a component is described as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intervening component present. When a component is described as "connected to" another component, it can be directly connected to the other component or there may be an intervening component present.

[0045] Furthermore, the descriptions involving "first," "second," etc., in the embodiments of this application are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0046] This application discloses a laser processing apparatus, with reference to... Figures 1 to 3 The laser processing apparatus includes a laser 10, with a first optical path and a second optical path externally configured on the laser 10; a switching assembly 30 for receiving the laser beam emitted by the laser 10 and switching the input laser beam between the first optical path and the second optical path; a galvanometer assembly 40, including a galvanometer 41 and a field lens 42 disposed at the end of the first optical path, with the field lens 42 facing downwards; a cutting assembly 50, including a cutting head 51 disposed at the end of the second optical path, with the cutting head 51 facing downwards and spaced apart from the galvanometer assembly 40; and a camera assembly 80 disposed on one side of the galvanometer assembly 40 for acquiring image information of the processing area below.

[0047] In this embodiment, the switching component 30 can be a 45° reflective mirror that can change position. It is used to control the switching between the first and second optical paths. When this mirror is working, the laser beam enters the first optical path; when it is not working, the laser beam enters the second optical path. By switching the first and second optical paths, the laser beam emitted from the laser 10 can be switched. Thus, this device can perform laser engraving via the galvanometer assembly 40 and laser cutting via the cutting assembly 50, achieving compatibility of two functions. In addition, the camera assembly 80 is located on one side of the galvanometer assembly 40 and is used to acquire image information of the processing area below, allowing for monitoring of the processing process. The camera assembly 80 can be used to acquire image information during laser engraving, laser cutting, or only one type of image information.

[0048] In this embodiment, the laser 10 can be a 1030nm laser source, and the switching component 30 is used to control the dual optical paths. The first optical path corresponds to the galvanometer component 40, and the second optical path corresponds to the cutting component 50. The galvanometer component 40 is suitable for large-area, high-speed scanning processing. The cutting component 50 includes a cutting head 51 and an objective lens 52, and is suitable for high-precision, microstructure processing.

[0049] Further reference Figure 4 and Figure 5The switching component 30 includes: a shutter cavity 31; a stepper motor 32 for driving the shutter lens 33; the shutter lens 33, which includes a 45° lens and a lens mounting base; two photoelectric switches 34 for zeroing the position of the shutter lens 33 and for positive and negative limit switching; a sensor 35 for sensing the photoelectric switches 34; and a pair of 45° reflecting mirrors for adjusting the output of the laser beam to ensure that the beam is output in the desired direction after passing through the shutter lens 33. Its working principle is as follows: After the laser beam enters the shutter cavity 31, when the shutter lens 33 is in the working state, the beam is reflected at a 45° angle and changes direction before entering the pair of 45° reflecting mirrors, i.e., it passes through the first reflecting mirror 37 and the second reflecting mirror 38 before being output, as shown by the solid line in the figure. When the shutter lens 33 rotates under the action of the stepper motor 32 and is in the non-working state, the beam passes directly through the shutter cavity 31 and is output.

[0050] In some embodiments, refer to Figures 1 to 3 The camera assembly 80 includes a rangefinder camera 81 and a coaxial camera 82. The rangefinder camera 81 is located on one side of the galvanometer assembly 40, and its optical axis is parallel to the first optical path. The coaxial camera 82 is located on one side of the cutting assembly 50, and its optical axis is coaxial with the second optical path. In this embodiment, the galvanometer assembly 40 and the cutting assembly 50 can be mounted on a mounting plate, spaced apart from each other. The rangefinder camera 81 consists of a camera, a lens, and mounting components, and is located on the side of the galvanometer 41 away from the cutting assembly 50. The rangefinder structure facilitates observation of a large processing area. The coaxial camera 82 is located at the upper end of the cutting assembly 50, and the two remain coaxial. In addition, a ring-shaped rangefinder light source can be provided below the rangefinder camera 81, and a coaxial light source 83 can be provided on one side of the coaxial camera 82. The coaxial light source 83 passes through a mirror and a reflector located between the cutting head 51 and the coaxial camera 82 and is incorporated into the second optical path. The rangefinder light source can provide better lighting conditions for the rangefinder camera 81, and the coaxial light source 83 can provide better lighting conditions for the coaxial camera 82.

[0051] Further reference Figure 2 A main optical path is established between the laser 10 and the switching assembly 30. The laser processing apparatus also includes a power adjustment assembly 20 disposed in the main optical path. The power adjustment assembly 20 includes a half-wave plate 21 disposed near the laser 10, a polarizing beam splitter 22 disposed near the switching assembly 30, and a first driving member 23 for driving the rotation of the half-wave plate 21. The working principle of the power adjustment assembly 20 is as follows: Figure 5As shown in the schematic diagram of the laser beam, the laser beam is emitted by the laser 10. The emitted light is linearly polarized light. The linearly polarized light is incident on the half-wave plate 21, and the polarization direction of the emitted light is deflected. After the emitted light is incident on the polarizing beam splitter 22, it is split into two beams with mutually perpendicular polarization directions. By rotating the half-wave plate 21, any light intensity ratio can be achieved, thereby obtaining the required laser power to match the laser engraving requirements of the galvanometer assembly 40 and the cutting requirements of the cutting assembly 50.

[0052] like Figure 6 and Figure 7 As shown, the power adjustment assembly 20 includes a light inlet seat 29, a telescopic cylinder 27, a refractive cavity 26, two reflectors, a fixed sleeve 28, a rotating sleeve 24, a half-wave plate 21, an electric rotary table (first driving component 23), a beam splitter seat 25, a polarizing beam splitter 22, and a heat sink. The light inlet seat 29 and the telescopic cylinder 27 form a single optical path protection structure for easy disassembly. The refractive cavity 26 is used to fix the reflector mounting base, which is used to fix a pair of 45° reflectors. This reflector mounting base can drive the lenses to adjust their angle. The fixed sleeve 28 is located on one side of the refractive cavity 26, and the rotating sleeve 24 is rotatably connected to the fixed sleeve 28. The wave plate seat is located at one end of the rotating sleeve 24 within the fixed sleeve 28 and is used to fix the half-wave plate 21. The half-wave plate 21 is used to change the laser polarization direction. The other end of the rotating sleeve 24 is connected to the beam splitter seat 25 and is driven to rotate by the electric rotary table located on the beam splitter seat 25. The beam splitter 25 also includes a polarizing beam splitter 22, which splits the beam into two beams with mutually perpendicular polarization directions. A heat sink is mounted on the beam splitter 25 to recover waste light and release the heat generated by it. Furthermore, sealing rings can be installed at the connections of the components in the aforementioned pipeline protection structure to seal the optical path and prevent dust from entering.

[0053] In some embodiments, refer to Figure 1 , Figure 2 and Figure 8 The laser processing apparatus further includes: a first beam expander 61, disposed in the first optical path and located between the switching assembly 30 and the galvanometer assembly 40; and a second beam expander 62, disposed in the second optical path and located between the switching assembly 30 and the cutting assembly 50. In this embodiment, as... Figure 7As shown, the first beam expander 61 and the second beam expander 62 constitute the beam expanding assembly 60. The beam expanding assembly 60 further includes: the first beam expander 61, which expands the diameter of the laser beam and reduces the divergence angle of the laser beam to ensure optical path transmission; a first mounting member 67, a first fixing block 69, and a first movable block 68, used to fix the first beam expander 61 and capable of fine adjustment to ensure that the beam can be perpendicularly incident on the first beam expander 61. The laser processing apparatus further includes: a second beam expander 62 disposed in the beam expander cavity 64, used to expand the diameter of the laser beam and reduce the divergence angle of the laser beam to ensure optical path transmission; a second mounting member 65, a second fixing block, and a second movable block 66, used to fix the second beam expander 62 and capable of fine adjustment to ensure that the beam can be perpendicularly incident on the second beam expander 62.

[0054] Furthermore, the laser processing apparatus also includes a third beam expander 63 disposed in the second optical path. The third beam expander 63 is located between the second beam expander 62 and the cutting assembly 50. The second beam expander 62 is a fixed-magnification beam expander, and the third beam expander 63 is a variable-magnification beam expander. The fixed-magnification beam expander is used to increase the diameter of the laser beam and reduce the divergence angle of the laser beam, ensuring optical path transmission. The variable-magnification beam expander is used to change the diameter of the beam to achieve the desired beam size.

[0055] In some embodiments, refer to Figure 2 The laser processing apparatus also includes a point laser source 43 and a beam combiner 44 disposed in the first optical path. The beam combiner 44 is used to combine the laser beam emitted by the point laser source 43 with the laser beam emitted by the laser 10 in the first optical path. The beam combiner 44 can be a transmission-reflection mirror. The point laser source 43 is a visible red light source. Since 1030nm femtosecond laser is invisible light, this visible red light simulated beam is used for processing preview to facilitate processing preview. The transmission-reflection mirror can transmit the laser beam emitted by the laser 10, and the red light simulated beam located on one side of the transmission-reflection mirror is reflected by the transmission-reflection mirror. Its reflected light is coaxial with the first optical path, realizing beam combining.

[0056] In some embodiments, refer to Figure 1 and Figure 9 The laser processing apparatus further includes: a machine base 11; a mounting frame 12, disposed above the machine base 11, for mounting the laser 10, switching component 30, galvanometer component 40, cutting component 50, and camera component 80; and a movable stage 70, disposed on the machine base 11 and located below the galvanometer component 40, cutting component 50, and camera component 80. In this embodiment, the laser processing apparatus includes a marble machine base 11, with the mounting frame 12 disposed above the machine base 11 for mounting all laser components. The marble machine base 11 has excellent shock absorption and vibration resistance, high precision, and is not easily deformed.

[0057] In addition, the laser processing apparatus also includes a first lifting module 15 mounted on the mounting frame 12. The first lifting module 15 is used to drive the galvanometer assembly 40 and the cutting assembly 50 to rise and fall. The first lifting module 15 may consist of a servo screw platform and a grating ruler, used for focusing the laser focus. The drive end of the servo screw platform is connected to the aforementioned mounting plate to drive the galvanometer assembly 40 and the cutting assembly 50 on the other side of the mounting plate to rise and fall.

[0058] Furthermore, the movable platform 70 includes: a mounting base 71; a vacuum adsorption plate 72 disposed on the mounting base 71; a threaded adjusting rod 73 disposed on the mounting base 71 and abutting against the lower surface of the vacuum adsorption plate 72, used to adjust the tilt angle of the vacuum adsorption plate 72; a second lifting module 74 used to drive the mounting base 71 to rise and fall; and a translation module 75 disposed on the machine base 11 used to drive the second lifting module 74 to translate along the X-axis and Y-axis directions. In this embodiment, the vacuum adsorption plate 72 is used to support the workpiece. It has a grid-threaded mounting hole and a large-format vacuum adsorption hole on its upper surface, which can conveniently fix fixtures or adsorb workpieces. The vacuum adsorption plate 72 has a vacuum adsorption cavity, which provides a large-format uniform vacuum adsorption force when negative pressure is applied. The threaded adjusting rod 73 can be a micro-head, which is disposed at the four corners of the mounting base 71 and abuts against the vacuum adsorption plate 72, used to finely adjust the pitch angle of the platform. The second lifting module 74 is used for fine-tuning in the Z direction, which can be adjusted manually or electrically. In this embodiment, a heightening block 76 can also be set between the translation module 75 and the second lifting module 74. The heightening block 76 is used to raise the vacuum adsorption plate 72 to meet the working distance of different field lenses 42, such as F32 lenses and F160 lenses. The translation component can be composed of two translation modules 75 stacked together, one with a driving direction along the X-axis and the other with a driving direction along the Y-axis. The translation component drives the moving stage 70 to translate as a whole, realizing the alignment of the field lens 42 above with the set processing area on the workpiece, and cooperating with the cutting head 51 to cut the workpiece according to the set cutting path. It is worth noting that in this embodiment, the cutting head 51 is stationary while the workpiece is driven to move.

[0059] Furthermore, the laser processing apparatus also includes an air blowing assembly 14 and a dust extraction assembly 13 mounted on the mounting base 71. The air blowing assembly 14 can be used to blow air into the processing area to keep the waste residue and fumes generated during processing away from the processing area, while the dust extraction assembly 13 is used to extract the aforementioned fumes to prevent them from entering the laser beam path.

[0060] In this embodiment, the working principle of the laser processing device is as follows: The laser processing device in this embodiment includes a laser 10, a switching component 30, a galvanometer component 40, a cutting component 50, and a camera component 80. The laser 10 is externally configured with a first optical path and a second optical path. The galvanometer component 40 includes a galvanometer 41 and a field lens 42 located at the end of the first optical path, with the field lens 42 facing downwards. The cutting component 50 includes a cutting head 51 located at the end of the second optical path, with the cutting head 51 facing downwards and spaced apart from the galvanometer component 40. The switching component 30 can switch the input laser beam emitted from the laser 10 to the first and second optical paths, thus enabling the device to perform laser engraving via the galvanometer component 40 and laser cutting via the cutting component 50, achieving compatibility of both functions. Furthermore, the camera component 80 is located on one side of the galvanometer component 40 and is used to acquire image information of the processing area below, allowing for monitoring of the processing process.

[0061] The above are only some or preferred embodiments of this application. Neither the text nor the drawings should limit the scope of protection of this application. All equivalent structural transformations made using the content of this application's specification and drawings under the overall concept of this application, or direct / indirect applications in other related technical fields, are included within the scope of protection of this application.

Claims

1. A laser processing apparatus, characterized in that, include: A laser, wherein a first optical path and a second optical path are externally configured on the laser; A switching component is used to receive the laser beam emitted by the laser and switch the input laser beam between the first optical path and the second optical path; The galvanometer assembly includes a galvanometer and a field lens disposed at the end of the first optical path, wherein the field lens is disposed downwards; The cutting assembly includes a cutting head disposed at the end of the second optical path, the cutting head being disposed downward and spaced apart from the galvanometer assembly; A camera assembly, located on one side of the galvanometer assembly, is used to acquire image information of the processing area below.

2. The laser processing apparatus according to claim 1, characterized in that, The camera assembly includes a rangefinder camera and a coaxial camera; the rangefinder camera is located on one side of the galvanometer assembly, and the optical axis of the rangefinder camera is parallel to the first optical path; the coaxial camera is located on one side of the cutting assembly, and the optical axis of the coaxial camera is coaxial with the second optical path.

3. The laser processing apparatus according to claim 1, characterized in that, A main optical path is constructed between the laser and the switching component. The laser processing device also includes a power adjustment component disposed in the main optical path. The power adjustment component includes a half-wave plate disposed near the laser, a polarizing beam splitter disposed near the switching component, and a first driving member for driving the half-wave plate to rotate.

4. The laser processing apparatus according to claim 1, characterized in that, The laser processing device also includes: A first beam expander is disposed in the first optical path and located between the switching component and the galvanometer component; The second beam expander is disposed in the second optical path and located between the switching component and the cutting component.

5. The laser processing apparatus according to claim 4, characterized in that, The laser processing device further includes a third beam expander disposed in the second optical path. The third beam expander is located between the second beam expander and the cutting assembly. The second beam expander is a fixed-magnification beam expander, and the third beam expander is a variable-magnification beam expander.

6. The laser processing apparatus according to claim 1, characterized in that, The laser processing apparatus further includes a point laser source and a beam combiner disposed in the first optical path. The beam combiner is used to combine the laser beam emitted by the point laser source with the laser beam emitted by the laser in the first optical path.

7. The laser processing apparatus according to any one of claims 1 to 6, characterized in that, The laser processing device also includes: Machine tool; A mounting bracket, located above the machine base, is used to mount the laser, switching assembly, galvanometer assembly, cutting assembly, and camera assembly. A movable stage is mounted on the machine platform and located below the galvanometer assembly, the cutting assembly, and the camera assembly.

8. The laser processing apparatus according to claim 7, characterized in that, The laser processing device further includes a first lifting module disposed on the mounting frame, the first lifting module being used to drive the galvanometer assembly and the cutting assembly to lift.

9. The laser processing apparatus according to claim 8, characterized in that, The mobile platform includes: Mounting base; A vacuum adsorption plate is disposed on the mounting base; A threaded adjusting rod is provided on the mounting base and abuts against the lower surface of the vacuum adsorption plate, used to adjust the tilt angle of the vacuum adsorption plate; The second lifting module is used to drive the mounting base to lift. A translation module is mounted on the machine platform and is used to drive the second lifting module to translate along the X-axis and Y-axis directions.

10. The laser processing apparatus according to claim 9, characterized in that, The laser processing device also includes an air blowing assembly and a dust extraction assembly mounted on the mounting base.

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