Packaging device for plastic mould of semiconductor IGBT (Insulated Gate Bipolar Translator) tube

Abstract

The utility model discloses a packaging device for a plastic mould of a semiconductor IGBT (Insulated Gate Bipolar Translator) tube, which relates to the technical field of semiconductors, and is characterized in that the packaging device for the plastic mould of the semiconductor IGBT tube comprises a rack, a lower groove arranged on a lower seat of the rack, and a lower mould fixed at the top of the lower groove; according to the packaging device for the plastic mould of the semiconductor IGBT tube disclosed by the utility model, the ejection piece, the cutting piece and the ejection piece are matched, the movable plate is driven to translate upwards, so that pouring gate waste cutting, waste ejection and packaged chip ejection can be realized at one time, the cost is saved, the ejection sleeve of the ejection piece slides outside the blocking needle, and the sealing effect is good. When the ejection sleeve starts to carry out ejection work and emits a small section, the air supply assembly supplies air into the mold cavity through the hose, the inclined groove and the upper portion of the exposed needle groove, the adhesion position of a packaged chip is evenly ejected open through the air, the ejection assembly can be assisted to evenly demold the packaged chip in the vertical direction, and the demolding effect is good.

Description

A packaging device for a semiconductor IGBT tube plastic mold Technical Field

[0001] This utility model relates to the field of semiconductor technology, and more specifically, it relates to a packaging device for a semiconductor IGBT tube plastic mold. Background Technology

[0002] An Insulated Gate Bipolar Transistor (IGBT) is a widely used semiconductor device, particularly suitable for high-power and high-voltage applications. Chip packaging molds are an indispensable part of chip manufacturing, playing a crucial role in the performance and stability of the circuit. The molding process includes: 1. Loading the chip and lead frame into the mold cavity; 2. Preheating the mold; 3. Once the mold temperature reaches the preset temperature, the upper and lower parts of the mold are closed under pressure, firmly clamping the mold; 4. Under pressure, preheated liquid epoxy resin is injected into the mold through the gate, completely encapsulating the chip and lead frame, filling the entire mold cavity; 5. After injection, the epoxy resin needs further curing through heating, transforming it from a semi-solid state into a robust protective shell; 6. After curing, the mold is opened, and the molded device is removed; 7. Removing excess epoxy resin around the molded body, such as burrs or the gate.

[0003] Product demolding mainly relies on the mold's ejection system, which mainly consists of the following types: ejector pins, ejector sleeves, angled ejectors, sliders, stripper plates, air ejectors, etc. Among them, ejector pins are an important component inside the mold, usually made of stainless steel or high wear-resistant materials. Their main function is to mechanically push the molded part out of the mold to ensure the integrity and quality of the finished product.

[0004] When existing packaging devices for semiconductor IGBT tube plastic molds are used for ejection, single-point ejection can easily cause the packaged chip to become misaligned and the chip pins to be damaged. Since the plastic-encapsulated chip mainly uses epoxy resin, the cured epoxy resin is relatively brittle and fragile, and the ejection point is also easily damaged. Therefore, in order to solve the above technical problems, this application proposes a packaging device for semiconductor IGBT tube plastic molds. Summary of the Invention

[0005] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a packaging device for a semiconductor IGBT tube plastic mold, so as to solve the technical problem of poor ejection effect of the current packaging device for semiconductor IGBT tube plastic mold.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a packaging device for a semiconductor IGBT tube plastic mold, comprising a frame, a lower groove formed on the lower seat of the frame, a lower mold fixed on the top of the lower groove, a demolding assembly slidably installed below the lower mold and capable of cooperating with the lower mold, a fixing frame disposed below the demolding assembly and fixed in the lower groove, and a second electric telescopic rod installed on the fixing frame and capable of driving the demolding assembly to rise and fall;

[0007] The lower mold has several mold cavities and a pouring channel at its top, and the pouring channel connects the several mold cavities.

[0008] The demolding assembly includes an ejector inserted into the mold cavity. The ejector includes an ejector sleeve inserted into the inner wall of the ejector hole at the bottom of the mold cavity, a pin groove formed in the ejector sleeve, an inclined groove communicating with the pin groove, a plug pin slidably connected to the inner wall of the pin groove and fixed on a fixed frame, a first slider fixed to the bottom of the ejector sleeve, a first sliding sleeve slidably connected to the outer wall of the first slider, and a first spring disposed at the bottom of the first slider.

[0009] Preferably, the bottom of the upper frame is connected to the upper mold via a first electric telescopic rod.

[0010] Preferably, the inclined groove is connected to the air supply assembly via a flexible hose.

[0011] Preferably, the demolding assembly further includes a movable plate slidably connected in the lower groove, wherein a cutting component and an ejector component are mounted on the movable plate, and both the cutting component and the ejector component are slidably connected to the lower mold.

[0012] Preferably, the ejector component includes an ejector pin that is slidably connected to the lower mold and communicates with the casting channel. The bottom of the ejector pin is fixed with a second slider and is slidably connected to the inner side wall of a second sliding sleeve through the second slider. A second spring is installed at the bottom of the second slider, and the second sliding sleeve is fixed to the movable plate.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. The ejector sleeve of the packaging device for semiconductor IGBT tube plastic mold disclosed in this utility model slides outside the plug pin. When the ejector sleeve starts to eject and protrudes a small section, the air supply component supplies air into the mold cavity through the hose, inclined groove and the upper part of the protruding pin groove. The gas makes the adhesive part of the packaged chip more evenly pushed open, which can help the ejector component to demold the packaged chip more evenly along the vertical direction. The demolding effect is good, which solves the technical problem of poor ejection effect of the current packaging device for semiconductor IGBT tube plastic mold.

[0015] 2. In this utility model, by cooperating with the ejector, the cutting component, and the ejector, the movable plate can be driven to move upwards, thereby achieving the cutting of casting waste, ejection of waste material, and ejection of packaged chips in one go, saving costs and further solving the technical problem of poor ejection effect of the current packaging device for semiconductor IGBT tube plastic molds. Attached Figure Description

[0016] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0017] Figure 1 is a cross-sectional structural diagram of this utility model;

[0018] Figure 2 is a schematic diagram of the structure at point A in Figure 1;

[0019] Figure 3 is a top view of the structure of this utility model;

[0020] Figure 4 is a schematic diagram of the structure of this utility model from a bottom view.

[0021] 1. Frame; 2. First electric telescopic rod; 3. Upper mold; 4. Lower groove; 5. Lower mold; 6. Demolding assembly; 7. Ejector; 8. Cutting component; 9. Ejector component; 10. Movable plate; 11. Fixed frame; 12. Second electric telescopic rod; 13. Mold cavity; 14. Sprue;

[0022] 701. Ejector sleeve; 702. Needle groove; 703. Inclined groove; 704. Flexible tube; 705. Plug needle; 706. First slider; 707. First sliding sleeve; 708. First spring;

[0023] 901, ejector pin; 902, second sliding sleeve; 903, second slider; 904, second spring. Detailed Implementation

[0024] As shown in Figures 1-4, this utility model provides a packaging device for a semiconductor IGBT tube plastic mold, including a frame 1, a lower groove 4 opened on the lower seat of the frame 1, a lower mold 5 fixed on the top of the lower groove 4, a demolding component 6 slidably installed below the lower mold 5 and capable of cooperating with the lower mold 5, a fixing frame 11 set below the demolding component 6 and fixed in the lower groove 4, and a second electric telescopic rod 12 installed on the fixing frame 11 and capable of driving the demolding component 6 to rise and fall. The lower mold 5 has several mold cavities 13 and a pouring channel 14 opened on the top, and the pouring channel 14 connects several mold cavities 13. The upper mold 3 is connected to the bottom of the upper seat of the frame 1 through the first electric telescopic rod 2. The packaging device for a semiconductor IGBT tube plastic mold disclosed in this utility model can achieve cutting the pouring waste, ejecting the waste and ejecting the packaged chip in one go by driving the movable plate 10 to move upward through the cooperation of the ejector 7, the cutting component 8 and the ejector 9, thus saving costs.

[0025] Furthermore, the demolding assembly 6 includes an ejector 7 inserted into the mold cavity 13. The ejector 7 includes an ejector sleeve 701 inserted into the inner wall of the ejector hole at the bottom of the mold cavity 13, a pin groove 702 formed in the ejector sleeve 701, an inclined groove 703 communicating with the pin groove 702, a plug pin 705 slidably connected to the inner wall of the pin groove 702 and fixed to the fixing bracket 11, a first slider 706 fixed to the bottom of the ejector sleeve 701, a first sliding sleeve 707 slidably connected to the outer wall of the first slider 706, and a first slider... The first spring 708 at the bottom of 706 and the inclined groove 703 are connected to the air supply component through the hose 704. The ejector sleeve 701 of the ejector 7 slides outside the plug pin 705. When the ejector sleeve 701 starts to eject and protrudes a small section, the air supply component supplies air into the mold cavity 13 through the hose 704, the inclined groove 703 and the upper part of the protruding pin groove 702. The gas makes the adhesive part of the packaged chip more evenly pushed open, which can help the ejector component to demold the packaged chip more evenly along the vertical, resulting in a good demolding effect.

[0026] Furthermore, the demolding assembly 6 also includes a movable plate 10 that is slidably connected in the lower groove 4. The movable plate 10 is equipped with a cutting component 8 and an ejector component 9. Both the cutting component 8 and the ejector component 9 are slidably connected to the lower mold 5. By driving the movable plate 10 to move upward, the waste material at the pouring gate, the waste material, and the packaged chip can be cut off and ejected in one go, saving costs.

[0027] Furthermore, the ejector component 9 includes an ejector pin 901 that is slidably connected to the lower mold 5 and communicates with the casting channel 14. The bottom of the ejector pin 901 is fixed with a second slider 903 and is slidably connected to the inner side wall of the second sleeve 902 through the second slider 903. A second spring 904 is installed at the bottom of the second slider 903. The second sleeve 902 is fixed on the movable plate 10 to facilitate ejecting the casting waste in the casting channel 14.

[0028] Working Principle: The packaging device for the semiconductor IGBT tube plastic mold disclosed in this utility model, through the cooperation of the ejector 7, the cutting part 8, and the ejector 9, drives the movable plate 10 to move upward, thereby realizing the cutting of the sprue waste, ejection of the waste, and ejection of the packaged chip in one go, saving costs; the chip to be packaged and the lead frame are loaded into the mold cavity 13 of the lower mold 5, preheated, the mold is closed, and liquid epoxy resin is injected into the mold through the sprue 14. The flowing epoxy resin completely wraps the chip and the lead frame, filling the entire mold cavity 13. After curing, the external power supply drives the first electric telescopic rod 2 to shorten through an external switch, thereby raising the upper mold 3. Then, the external power supply drives the second electric telescopic rod 2 through an external switch. The telescopic rod 12 moves the movable plate 10 at its top upwards. The ejector 7, cutter 8, and ejector 9 on the movable plate 10 move upwards simultaneously. Since the ejector 7 and ejector 9 are both connected to the movable plate 10 via elastic sliding components, when the ejector sleeve 701 and ejector pin 901 push upwards, the reaction force of the poured material pushes downwards. The first slider 706 and the second slider 903 at the base of the ejector sleeve 701 and ejector pin 901 slide downwards along the first sliding sleeve 707 and the second sliding sleeve 902, respectively, squeezing the first spring 708 and the second spring 904. Since the restoring force of both the first spring 708 and the second spring 904 is insufficient to push open the springs containing the poured material, the cutter 8, which is fixedly connected to the movable plate 10... Material 8 first moves upward to cut the material at the casting port, separating it from the cast chip. Movable plate 10 then moves upward, causing the first slider 706 and second slider 903 to stop sliding downward. This drives the first slider 706, second slider 903, first sliding sleeve 707, second sliding sleeve 902, ejector sleeve 701, and ejector pin 901 to continue moving upward. The ejector pin 901 pushes the casting waste upward. Simultaneously, the ejector sleeve 701 of ejector 7 slides outside the plug pin 705, which is fixed to the fixing frame 11. When the ejector sleeve 701 begins ejection and protrudes a small section, the external air supply assembly, such as an air pump, supplies air through the hose 704, inclined groove 703, and the upper part of the protruding pin groove 702. Gas is supplied into the mold cavity 13, which helps to evenly push open the adhesive joints of the packaged chip. This assists the ejector assembly in evenly and vertically demolding the packaged chip, resulting in a good demolding effect. It effectively reduces the risk of chip skewing, chip pin damage, or ejection point damage caused by excessive force at a single point or displacement of the force point. After the ejection is completed, the ejector sleeve 701 resets to the plug pin 705 to block the pin groove 702, preventing the pin groove 702 from being blocked by the casting liquid during pouring. Furthermore, the gas demolding and ejector pin demolding work together, which reduces the sealing requirements of the mold cavity 13 compared to the mold cavity 13 with pure start-up demolding (the first electric telescopic rod 2 and the second electric telescopic rod 12 are both existing products and are connected to an external power supply and an external switch).

[0029] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any way. Those skilled in the art can readily implement this utility model based on the accompanying drawings and the above description. However, any modifications, alterations, or equivalent variations made by those skilled in the art without departing from the scope of the utility model's technical solution, utilizing the disclosed technical content, are considered equivalent embodiments of this utility model. Furthermore, any equivalent changes, alterations, or variations made to the above embodiments based on the essential technology of this utility model are still within the protection scope of this utility model's technical solution.

Claims

1. A packaging device for a semiconductor IGBT tube plastic mold, characterized in that, The assembly includes a frame (1), a lower groove (4) on the lower seat of the frame (1), a lower mold (5) fixed to the top of the lower groove (4), a demolding assembly (6) slidably installed below the lower mold (5) and capable of cooperating with the lower mold (5), a fixing frame (11) set below the demolding assembly (6) and fixed in the lower groove (4), and a second electric telescopic rod (12) installed on the fixing frame (11) and capable of driving the demolding assembly (6) to rise and fall; the lower mold (5) has several mold cavities (13) and a pouring channel (14) on its top, the pouring channel (14) connecting the several mold cavities (13); the demolding assembly (6) includes... The ejector (7) is inserted into the mold cavity (13). The ejector (7) includes an ejector sleeve (701) inserted into the inner wall of the ejector hole at the bottom of the mold cavity (13), a pin groove (702) opened in the ejector sleeve (701), an inclined groove (703) communicating with the pin groove (702), a plug pin (705) slidably connected to the inner wall of the pin groove (702) and fixed on the fixing frame (11), a first slider (706) fixed to the bottom of the ejector sleeve (701), a first sliding sleeve (707) slidably connected to the outer wall of the first slider (706), and a first spring (708) provided at the bottom of the first slider (706).

2. The packaging device for a semiconductor IGBT tube plastic mold according to claim 1, characterized in that: The upper mold (3) is connected to the bottom of the upper seat of the frame (1) via the first electric telescopic rod (2).

3. The packaging device for a semiconductor IGBT tube plastic mold according to claim 2, characterized in that: The inclined groove (703) is connected to the air supply assembly via a hose (704).

4. The packaging device for a semiconductor IGBT tube plastic mold according to claim 3, characterized in that: The demolding assembly (6) also includes a movable plate (10) slidably connected in the lower groove (4). A cutting component (8) and a ejector component (9) are installed on the movable plate (10). Both the cutting component (8) and the ejector component (9) are slidably connected to the lower mold (5).

5. The packaging device for a semiconductor IGBT tube plastic mold according to claim 4, characterized in that: The ejector component (9) includes an ejector pin (901) that is slidably connected to the lower mold (5) and communicates with the casting channel (14). The bottom of the ejector pin (901) is fixed with a second slider (903) and is slidably connected to the inner wall of the second sleeve (902) through the second slider (903). The bottom of the second slider (903) is equipped with a second spring (904), and the second sleeve (902) is fixed on the movable plate (10).

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