Graphic design product surface packaging device for graphic design
By combining the guiding pressure unit with the worktable assembly, the problem of uneven pressure on the hot press plate is solved, ensuring that the packaging material adheres evenly to the product surface, improving packaging quality and protective performance, and extending the product's service life.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CENT SOUTH UNIV
- Filing Date
- 2025-06-03
- Publication Date
- 2026-05-01
AI Technical Summary
Existing surface encapsulation devices for planar designs suffer from uneven pressure distribution during thermoforming, affecting encapsulation quality and protective performance, leading to easy detachment of the encapsulation layer and reduced product lifespan.
By employing a guide pressure unit in conjunction with a worktable assembly, the pressure distribution of the hot press plate is monitored through guide rods and pressure sensors. The pressure is evenly distributed by using a second cylinder to drive the push rod mechanism, ensuring that the encapsulation material fully adheres to the product surface and avoiding the generation of bubbles and wrinkles.
This achieves uniform pressure distribution between the packaging material and the product surface, improving packaging quality and adhesion strength, preventing packaging layer detachment, and extending product lifespan.
Smart Images

Figure CN224183779U_ABST
Abstract
Description
A surface encapsulation device for graphic design products. Technical Field
[0001] This utility model relates to the field of packaging technology, and in particular to a surface encapsulation device for graphic design products. Background Technology
[0002] In the field of graphic design, surface encapsulation of the designed product is crucial after the design is completed. It not only protects the work from external physical damage and moisture, but also enhances its overall texture and durability. As the core equipment for this critical step, the surface encapsulation device for graphic design products works by melting the encapsulation material (such as hot melt adhesive film) at high temperatures. Under pressure, the molten encapsulation material is tightly bonded to the surface of the graphic design product, forming a robust encapsulation layer after cooling.
[0003] During thermopress packaging, due to the large contact area between the thermopress plate and the product surface, it is difficult to ensure that the pressure is evenly distributed across the entire product surface. Uneven pressure may cause the packaging material to be over-compressed in some areas, while it may not adhere tightly in other areas, affecting the overall quality and protective performance of the packaging. In addition, uneven pressure can lead to different bonding forces between the packaging material and the product surface, which can easily cause the packaging layer to fall off during subsequent use, reducing the product's protective performance and service life. Summary of the Invention
[0004] The purpose of this utility model is to solve the problem that the uneven pressure distribution of the hot plate during the use of existing surface encapsulation devices for planar design products affects the overall quality and protective performance of the encapsulation, and reduces the protective performance and service life of the product. Therefore, a surface encapsulation device for planar design products is proposed.
[0005] To achieve the above objectives, this utility model employs the following technology: a surface encapsulation device for planar design products, comprising a base with a controller, a top plate provided on the top of the base via a column, a first cylinder provided in the middle of the top plate, a hot press plate that can be raised and lowered above the base being provided at the output end of the first cylinder via a connecting seat, a guide and pressure unit provided on the connecting seat for guiding the hot press plate and applying pressure to its edges, and a workbench assembly capable of pressure detection provided on the base;
[0006] The guiding pressure unit, in conjunction with the worktable assembly, ensures uniform pressure distribution on the hot press plate, thereby improving the encapsulation effect.
[0007] As a further description of the above technical solution: the guiding pressure unit includes a guide sleeve disposed on the top plate, and a hollow guide rod disposed on the connecting seat and passing through the guide sleeve.
[0008] As a further description of the above technical solution: the guiding pressure unit also includes a second cylinder disposed on the guide rod, and the output end of the second cylinder is provided with a push rod mechanism that can move along the axis of the guide rod via a connecting plate.
[0009] As a further description of the above technical solution: the top rod mechanism includes a rod body arranged coaxially with the guide rod, and the top of the rod body is detachably connected to the connecting plate through a threaded end and a nut.
[0010] As a further description of the above technical solution: the bottom of the rod body passes through the connecting seat and is provided with a top assembly that contacts the hot press plate;
[0011] The top head assembly includes a pressure top head connected to the rod body via a connecting end, wherein a spring is fitted on the connecting end, and a buffer pad is provided inside the pressure top head.
[0012] As a further description of the above technical solution: the second cylinder is detachably connected to the guide rod via a mounting bracket, and the output end of the second cylinder is detachably connected to the connecting plate via a connecting screw and a locking nut.
[0013] As a further description of the above technical solution: the workbench assembly includes a mounting base fixedly disposed on the surface of the machine base, a platform located below the hot press plate on the mounting base, and a pressure sensor disposed at the bottom of the platform.
[0014] In summary, due to the adoption of the above technical solution, the beneficial effects of this utility model are:
[0015] The combination of the guiding pressure unit and the worktable assembly can solve the problem of uneven pressure distribution of the hot press plate, so that the encapsulation material can be fully and evenly bonded to the surface of the planar product, effectively eliminating the air between them and preventing the formation of air bubbles. At the same time, it can also avoid wrinkles in the encapsulation material due to excessive local pressure, thereby ensuring that the surface of the encapsulated product is flat and smooth, and improving the appearance quality of the product.
[0016] The uniform pressure distribution of the hot press plate ensures that the bonding force between the encapsulation material and all parts of the product surface is uniform and consistent. This results in stable adhesion strength between the encapsulation layer and the product, making it less likely for the encapsulation layer to detach in subsequent use, thereby improving the product's protective performance and service life. Attached Figure Description
[0017] Figure 1 shows a schematic diagram of the overall structure according to an embodiment of the present utility model;
[0018] Figure 2 shows a partial structural schematic diagram according to an embodiment of the present invention;
[0019] Figure 3 shows a schematic diagram of the guiding pressure unit provided according to an embodiment of the present invention;
[0020] Figure 4 shows a schematic diagram of the push rod mechanism provided according to an embodiment of the present utility model;
[0021] Figure 5 shows a schematic diagram of the top assembly provided according to an embodiment of the present invention;
[0022] Figure 6 shows a schematic diagram of the workbench assembly provided according to an embodiment of the present invention;
[0023] Figure 7 shows a schematic diagram of the steps of the control system provided according to an embodiment of the present invention.
[0024] Legend:
[0025] 1. Base; 2. Column; 3. Top plate; 4. First cylinder; 5. Connecting seat; 6. Hot press plate; 7. Guide pressure unit; 71. Guide sleeve; 72. Guide rod; 73. Mounting bracket; 74. Second cylinder; 75. Connecting plate; 76. Push rod mechanism; 761. Rod body; 762. Threaded end; 763. Push head assembly; 7631. Pressure push head; 7632. Connecting end; 7633. Spring; 7634. Buffer pad; 8. Workbench assembly; 81. Mounting seat; 82. Table; 83. Pressure sensor; 9. Controller. Detailed Implementation
[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.
[0027] Referring to Figures 1-7, this embodiment provides a surface encapsulation device for planar design products, including a base 1 with a controller 9. A top plate 3 is provided on the top of the base 1 via a column 2. A first cylinder 4 is provided in the middle of the top plate 3. A hot press plate 6 that can move up and down above the base 1 is provided at the output end of the first cylinder 4 via a connecting seat 5. A guide and pressure unit 7 is provided on the connecting seat 5 for guiding the hot press plate 6 and applying pressure to its edges. A worktable assembly 8 that can perform pressure detection is provided on the base 1.
[0028] In this invention, the encapsulation device is placed and fixed by the base 1. After the design of the planar product is completed, the designed product is placed on the workbench assembly 8. The controller 9 starts the first cylinder 4 on the top plate 3 at the top of the column 2. After the first cylinder 4 is started, it drives the hot press plate 6 at the bottom of the connecting seat 5 to descend. The surface of the hot press plate 6 has encapsulation material. As the hot press plate 6 comes into contact with the planar product, the high temperature of the hot press plate 6 melts the encapsulation material. Under pressure, the molten encapsulation material is tightly bonded to the surface of the planar product. After cooling, a strong encapsulation layer is formed, thus completing the encapsulation work. During the encapsulation process, the guide pressure unit 7 and the workbench assembly 8 work together to ensure that the pressure distribution of the hot press plate 6 is uniform, thereby improving the encapsulation effect.
[0029] It should be noted that the hot press plate 6 is made of aluminum alloy with good thermal conductivity and has an electric heating wire inside. When the electric heating wire is activated, it heats up, thereby generating high temperature in the hot press plate 6, which in turn melts the packaging material. The controller 9 of the packaging device adopts a common PLC control structure, which can be programmed according to different packaging process requirements, making it easy to adjust and change the control strategy to adapt to the packaging needs of various planar design products.
[0030] Specifically, as shown in Figures 3, 4, and 6, the guiding pressure unit 7 includes a guide sleeve 71 mounted on the top plate 3 and a hollow guide rod 72 mounted on the connecting seat 5 and passing through the guide sleeve 71. The guiding pressure unit 7 also includes a second cylinder 74 mounted on the guide rod 72. The output end of the second cylinder 74 is provided with a push rod mechanism 76 that can move along the axis of the guide rod 72 via a connecting plate 75. The worktable assembly 8 includes a mounting seat 81 fixedly mounted on the surface of the machine base 1. A platform 82 located below the hot press plate 6 is mounted on the mounting seat 81. A pressure sensor 83 is provided at the bottom of the platform 82.
[0031] The bottom of the guide rod 72 is detachably connected to the connecting seat 5 via a connecting piece. When the first cylinder 4 drives the connecting seat 5 and the hot press plate 6 to move, the guide rod 72 cooperates with the guide sleeve 71 to provide precise guidance for the up-and-down movement of the hot press plate 6. This restricts the lateral displacement and swaying of the hot press plate 6 during movement, ensuring that it can only move in a straight line along the axis of the guide rod 72, thereby guaranteeing the accuracy and repeatability of the hot press plate 6's movement. When the hot press plate 6 presses against the planar product on the surface of the top platform 82 of the mounting base 81, the pressure sensor 83 can monitor the pressure of the platform 82. The pressure sensor 83 corresponds to the output end of the first cylinder 4 and the position of the guide rod 72, thus monitoring whether the pressure of the hot press plate 6 is uniform during hot pressing. When the pressure of the hot press plate 6 is uneven due to excessive contact area, the sensor detects the pressure unevenness. Feedback from force sensor 83 triggers controller 9 to activate the second cylinder 74 on the corresponding guide rod 72. The second cylinder 74 drives the push rod mechanism 76 to move along the axis of the hollow guide rod 72, thereby applying pressure to the edge of the hot press plate 6. Based on feedback from pressure sensor 83, the pressure of the hot press plate 6 is evenly distributed, ensuring that the encapsulation material adheres fully and evenly to the surface of the planar product. This effectively eliminates air between the two, preventing bubble formation. It also avoids wrinkles in the encapsulation material due to excessive local pressure, ensuring a smooth and flat surface after encapsulation and improving the product's appearance quality. Furthermore, the consistent pressure of the hot press plate 6 ensures stable adhesion between the encapsulation layer and the product, reducing the likelihood of localized detachment during subsequent use, thus improving the product's protective performance and lifespan.
[0032] It should be noted that the push rod mechanism 76 includes a rod body 761 arranged coaxially with the guide rod 72. The top of the rod body 761 is detachably connected to the connecting plate 75 through a threaded end 762 and a nut. The second cylinder 74 is detachably connected to the guide rod 72 through a mounting bracket 73, and the output end of the second cylinder 74 is detachably connected to the connecting plate 75 through a connecting screw and a locking nut. The rod body 761 of the push rod mechanism 76 can be easily disassembled and assembled with the connecting plate 75 through the threaded end 762. The second cylinder 74 can be easily disassembled from the guide rod 72 and the connecting plate 75 through the mounting bracket 73 and the connecting screw. This allows for easy disassembly and maintenance of the pressure applying structure on the guide rod 72, ensuring that the pressure applying structure can stably and accurately apply pressure to the edge of the hot press plate 6. The pressure sensor 83 on the platform 82 used for pressure detection of the hot press plate 6 is a sensor of brand FGP and model XPCM10, which is suitable for pressure monitoring of the hot press plate 6 in high-temperature environments.
[0033] Specifically, as shown in Figures 4 and 5, the bottom of the rod 761 passes through the connecting seat 5 and is provided with a top assembly 763 that contacts the hot press plate 6. The top assembly 763 includes a pressure top 7631 connected to the rod 761 through a connecting end 7632. A spring 7633 is sleeved on the connecting end 7632, and a buffer pad 7634 is provided inside the pressure top 7631.
[0034] The bottom of the connecting end 7632 is connected to the top of the pressure applying head 7631. When the rod 761 applies pressure to the hot press plate 6 under the action of the second cylinder 74, the pressure applying head 7631 first acts on the hot press plate 6. At this time, the spring 7633 and the buffer pad 7634 can play a buffering role, effectively buffering the pressure applied by the rod 761, avoiding damage to the hot press plate 6 caused by excessive instantaneous impact force, and avoiding damage to the surface of the hot press plate 6 caused by the rod 761, thereby preventing the hot press sealing effect and product quality from being affected.
[0035] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.
Claims
1. A surface encapsulation device for graphic design products, characterized in that, The device includes a base (1) with a controller (9), a top plate (3) is provided on the top of the base (1) via a column (2), a first cylinder (4) is provided in the middle of the top plate (3), and a hot press plate (6) that can move up and down above the base (1) is provided on the output end of the first cylinder (4) via a connecting seat (5). A guide pressure unit (7) is provided on the connecting seat (5) for guiding the hot press plate (6) and applying pressure to its edges. A workbench assembly (8) that can perform pressure detection is provided on the base (1). The guide pressure unit (7) and the workbench assembly (8) cooperate to ensure that the pressure distribution of the hot press plate (6) is uniform, so as to improve the sealing effect.
2. The surface encapsulation device for graphic design products according to claim 1, characterized in that, The guiding pressure unit (7) includes a guide sleeve (71) disposed on the top plate (3) and a hollow guide rod (72) disposed on the connecting seat (5) and passing through the guide sleeve (71).
3. The surface encapsulation device for graphic design products according to claim 2, characterized in that, The guiding pressure unit (7) also includes a second cylinder (74) mounted on the guide rod (72). The output end of the second cylinder (74) is provided with a push rod mechanism (76) that can move along the axis of the guide rod (72) via a connecting plate (75).
4. The surface encapsulation device for graphic design products according to claim 3, characterized in that, The top rod mechanism (76) includes a rod body (761) arranged coaxially with the guide rod (72), and the top of the rod body (761) is detachably connected to the connecting plate (75) through a threaded end (762) and a nut.
5. A surface encapsulation device for graphic design products according to claim 4, characterized in that, The bottom of the rod (761) passes through the connecting seat (5) and is provided with a top head assembly (763) that contacts the hot press plate (6); the top head assembly (763) includes a pressure top head (7631) connected to the rod (761) through a connecting end head (7632), a spring (7633) is sleeved on the connecting end head (7632), and a buffer pad (7634) is provided inside the pressure top head (7631).
6. The surface encapsulation device for graphic design products according to claim 3, characterized in that, The second cylinder (74) is detachably connected to the guide rod (72) via the mounting bracket (73), and the output end of the second cylinder (74) is detachably connected to the connecting plate (75) via the connecting screw and the locking nut.
7. A surface encapsulation device for graphic design products according to claim 1 or 3, characterized in that, The workbench assembly (8) includes a mounting base (81) fixedly mounted on the surface of the base (1), and a platform (82) located below the hot press plate (6) is provided on the mounting base (81). A pressure sensor (83) is provided at the bottom of the platform (82).