Semiconductor refrigeration module

Abstract

The utility model discloses a semiconductor refrigeration module which comprises a semiconductor refrigeration sheet, a hot end heat dissipation device and a cold end cold conduction block, and the cold end of the semiconductor refrigeration sheet further comprises a wind tunnel exhaust fan connected with the cold conduction block. The cold end improves the cold conduction effect through a red copper cold conduction block and a wind tunnel exhaust fan made of an aluminum alloy material, and meanwhile, light weight and low cost of the semiconductor refrigeration module are guaranteed; a hot end heat dissipation device selects a water cooling block, heat generated by the hot end is taken away through a micro-channel, the heat dissipation area is large, the heat dissipation efficiency is high, and the refrigeration effect is further improved; efficient cold end cold conduction and hot end heat dissipation effects are achieved, and it is prevented that after the cold end and the hot end reach a certain temperature difference, forward and reverse heat transfer counteracts, the temperature of the cold end and the temperature of the hot end tend to be balanced, and consequently power consumption of the semiconductor chilling plate is increased, and the refrigeration effect becomes poor; and an overheat protection device is arranged at the output end of the hot-end heat dissipation device, and after external cooling liquid is heated to a fixed temperature, the overheat protection device can be interrupted in time, the refrigeration effect is improved, and meanwhile the running safety of the system is guaranteed.

Description

A semiconductor cooling module Technical Field

[0001] This utility model relates to a refrigeration device, and more particularly to a semiconductor refrigeration module. Background Technology

[0002] Semiconductor refrigeration, also known as thermoelectric refrigeration, uses PN junctions made of special semiconductor materials to form thermocouple pairs. When current flows from the N-type semiconductor to the P-type semiconductor, heat is absorbed, forming the cold junction; when current flows from the P-type semiconductor to the N-type semiconductor, heat is released, forming the hot junction. The N-type and P-type semiconductors are arranged alternately, transferring heat from the cold junction to the hot junction, thus achieving cooling. Due to its advantages such as small size, high cooling efficiency, no refrigerant required, and no pollution, it is widely used in electronics, military, medical, scientific research, and daily life. However, existing semiconductor refrigeration chips have limited cooling capacity, and most can only be attached to the target object, unable to effectively cool large spaces. Furthermore, the cold junction typically transfers cold energy to a specific space or object through a cooling block or a spiral water channel, but the cooling efficiency of the cooling block is limited by the small space, and the spiral water channel generates condensate, requiring additional condensate collection devices, which increases size and manufacturing cost, limiting its application in some fields. The cold end lacks an effective cooling device, and the heat conduction efficiency of the hot end is limited. When the cold and hot ends reach a certain temperature difference, the forward and reverse heat transfer cancel each other out, and the temperature of the cold and hot ends will not continue to change, resulting in increased power consumption and poorer cooling effect of the semiconductor refrigeration chip. Summary of the Invention

[0003] Purpose of the utility model: The purpose of this utility model is to improve the cooling efficiency of semiconductor refrigeration chips in large spaces and to provide a semiconductor refrigeration module.

[0004] Technical solution: The semiconductor cooling module of this utility model includes a semiconductor cooling chip, a hot end heat dissipation device and a cold end cooling block. The cold end of the semiconductor cooling chip also includes a wind tunnel exhaust fan connected to the cooling block.

[0005] Furthermore, heat insulation cotton is provided between the semiconductor cooling chip and the heat-conducting block to isolate the cold end and the hot end of the semiconductor cooling chip, preventing the heat transfer between the cold and hot ends from canceling each other out and further ensuring the cooling effect.

[0006] Furthermore, the material of the heat-conducting block is selected from copper, which has higher conductivity and can quickly remove the cold energy from the cooling end. The two adjacent surfaces of the wind tunnel exhaust fan are arranged to form a first fan and a second fan with dual air ducts, which can quickly conduct the cold energy removed by the heat-conducting block into the cooling cavity, prevent the cold end from freezing and improve the heat conduction effect of the cooling end. The wind tunnel exhaust fan can be made of aluminum alloy, which is lightweight, low cost and easy to process. Combined with the high conductivity of the copper heat-conducting block, it can ensure the heat conduction effect while ensuring the lightweight and low cost of the semiconductor cooling module.

[0007] Furthermore, the heat dissipation device at the hot end is a water-cooled block, which contains multiple S-shaped microchannels divided by fins. At least one water-cooled block is used. The width of the fins is 1mm to 2mm, and the width of the liquid channels in the microchannels is 1.5mm to 5mm. The number of water-cooled blocks is selected according to the heat dissipation requirements. By setting the fin width and the liquid channel width within the effective space, the contact area of ​​the coolant is maximized, further improving the heat dissipation effect. Heat dissipation efficiency directly determines the cooling effect; efficient heat dissipation further enhances the cooling effect.

[0008] Furthermore, the efficient cold-end cooling and hot-end heat dissipation prevents the forward and reverse heat transfer from canceling each other out after the cold and hot ends reach a certain temperature difference, causing the cold and hot ends to tend to balance, which would lead to increased power consumption and poor cooling effect of the semiconductor cooling chip.

[0009] Furthermore, the input and output ends of the microchannel are connected to the external circulating coolant via a pagoda connector; the output end is equipped with an overheat protection device, which can promptly interrupt the cooling process after the external coolant is heated to a fixed temperature, thereby improving the cooling effect while ensuring the safety of system operation.

[0010] Beneficial effects: Compared with the prior art, this utility model has the following advantages: 1. The cold end uses a copper cooling block and an aluminum alloy wind tunnel exhaust fan to improve the cooling effect while ensuring the lightweight and low cost of the semiconductor cooling module; 2. The hot end heat dissipation device uses a water-cooled block, which removes the heat generated at the hot end through microchannels, resulting in a large heat dissipation area and high heat dissipation efficiency, further improving the cooling effect; 3. The efficient cold end cooling and hot end heat dissipation prevents the forward and reverse heat transfer from canceling each other out after the cold and hot ends reach a certain temperature difference, causing the cold and hot ends to tend to balance, which would lead to increased power consumption and poor cooling effect of the semiconductor cooling chip; 4. The output end of the hot end heat dissipation device is equipped with an overheat protection device, which can promptly interrupt the system operation after the external coolant backheats to a fixed temperature, improving the cooling effect while ensuring the safety of system operation. Attached Figure Description

[0011] Figure 1 is a schematic diagram of the structure of this utility model;

[0012] Figure 2 is an exploded view of the structure of this utility model;

[0013] Figure 3 is a schematic diagram of the heat dissipation device of this utility model;

[0014] Figure 4 is a schematic diagram of the microchannel structure in the water-cooled block of this utility model. Detailed Implementation

[0015] The technical solution of this utility model will be further described below with reference to the accompanying drawings.

[0016] As shown in Figure 1-2, a semiconductor cooling module includes a semiconductor cooling chip 2 fixed on a base 1, a hot-end heat dissipation device 6, and a cold-end cooling block 4. It also includes a wind tunnel exhaust fan 5 connected to the cooling block 4. Two adjacent surfaces of the wind tunnel exhaust fan 5 are configured to form a first fan 5-1 and a second fan 5-2, creating a dual-airflow system. Thermal insulation cotton 3 is placed between the semiconductor cooling chip 2 and the cooling block 4. The base 1 is made of polyoxymethylene (POM) plastic with low thermal conductivity, and the cooling block 4 is made of copper with higher conductivity.

[0017] As shown in Figure 3, the hot-end heat dissipation device 6 is a water-cooled block, including a water-cooled base 6-1 and a water-cooled cover 6-2. The water-cooled base 6-1 is provided with a sealing groove 6-4 around its perimeter, and a sealing ring 6-3 is provided inside to seal the water-cooled base 6-1 and the water-cooled cover 6-2. As shown in Figure 4, the water-cooled base 6-1 has multiple S-shaped microchannels 6-6 divided by fins 6-5 inside the sealing groove 6-4. The input end 6-7 and the output end 6-8 of the microchannel 6-6 are connected to the external circulating coolant through a pagoda connector 8. An overheat protection device 7 is provided on the pagoda connector at the output end 6-8. One water-cooling block is set up, with the width of the fins 6-5 being 1.6mm and the width of the liquid passage of the microchannel 6-6 being 2mm. This ensures that the area of ​​the S-shaped microchannel 6-6 formed by the division of the fins 6-5 meets the heat dissipation requirements. Alternatively, multiple water-cooling blocks can be set up according to the heat dissipation requirements, with the width of the fins 6-5 ranging from 1.5mm to 5mm and the width of the liquid passage of the microchannel 6-6 ranging from 1mm to 2mm, maximizing the contact area of ​​the coolant within the effective space.

[0018] In use, the input end 6-7 and output end 6-8 of the microchannel 6-6 are connected to the external circulating coolant via the pagoda connector 8. The wind tunnel exhaust fan 5 and the semiconductor refrigeration chip 2 are connected to the circuit and fixed in the cooling cavity by the base 1, with the cold end facing into the cavity. The number of water-cooled blocks in the hot end heat dissipation device 6 and the width of the fins 6-5 and the microchannel 6-6 are configured according to the volume of the cooling cavity and the target temperature to maximize the contact area of ​​the coolant. The coolant carries away the heat generated by the hot end of the semiconductor refrigeration chip 2 through the microchannel 6-6 in the water-cooled block. The more heat is carried away, the better the cooling effect of the cold end of the semiconductor refrigeration module. Meanwhile, the copper cooling block 4 and the aluminum alloy wind tunnel exhaust fan 5 quickly guide the cold energy from the cold end into the cooling cavity. The first fan 5-1 and the second fan 5-2 form a dual air duct in the aluminum alloy wind tunnel exhaust fan 5, which greatly improves the cooling effect, increases the cooling area, prevents icing at the cold end, and has a highly efficient cold end cooling and hot end heat dissipation effect. This prevents the forward and reverse heat transfer from canceling each other out after the cold and hot ends reach a certain temperature difference, causing the cold and hot ends to tend to balance, which would lead to increased power consumption and poor cooling effect of the semiconductor cooling chip.

Claims

1. A semiconductor cooling module, comprising a semiconductor cooling chip (2) fixed on a base (1), a hot-end heat dissipation device (6), and a cold-end cooling block (4), characterized in that, The cold end of the semiconductor cooling chip (2) also includes a wind tunnel exhaust fan (5) connected to the cooling block (4).

2. The semiconductor cooling module according to claim 1, characterized in that, Insulating cotton (3) is provided between the semiconductor cooling chip (2) and the cooling block (4).

3. The semiconductor cooling module according to claim 1, characterized in that, The material of the cooling block (4) is selected from copper.

4. The semiconductor cooling module according to claim 1, characterized in that, The wind tunnel exhaust fan (5) has a first fan (5-1) and a second fan (5-2) arranged on two adjacent surfaces to form a double air duct; the wind tunnel exhaust fan (5) is made of aluminum alloy.

5. The semiconductor cooling module according to claim 1, characterized in that, The heat dissipation device (6) is a water-cooled block, which is provided with multiple S-shaped microchannels (6-6) divided by fins (6-5).

6. The semiconductor cooling module according to claim 5, characterized in that, The width of the fins (6-5) is 1mm to 2mm.

7. The semiconductor cooling module according to claim 5, characterized in that, The width of the microchannel (6-6) is 1.5mm to 5mm.

8. The semiconductor cooling module according to claim 5, characterized in that, At least one water-cooling block shall be provided.

9. The semiconductor cooling module according to claim 5, characterized in that, The input end (6-7) and output end (6-8) of the microchannel (6-6) are connected to the external circulating coolant through a pagoda connector (8); the output end (6-8) is equipped with an overheat protection device (7).

10. The semiconductor cooling module according to claim 1, characterized in that, The base (1) is made of polyoxymethylene plastic.

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