Refrigeration assembly and refrigerator

Abstract

According to the refrigeration assembly and the refrigerator, the refrigeration assembly comprises a refrigeration inner container, an air duct assembly, a refrigeration evaporator and a semiconductor chilling plate, the refrigeration inner container is provided with a first refrigeration chamber, an unfreezing chamber and a second refrigeration chamber, and the unfreezing chamber is arranged between the first refrigeration chamber and the second refrigeration chamber; a return air inlet and a first air outlet are formed in the part, where the first refrigerating chamber is located, of the refrigerating liner, and a second air outlet is formed in the part, where the second refrigerating chamber is located, of the refrigerating liner; the air duct assembly is provided with a refrigeration air duct communicating with the air return opening, the first air outlet and the second air outlet. The semiconductor chilling plate is arranged at the position, where the unfreezing chamber is located, of the refrigerating inner container and provided with a heating face and a refrigerating face, the heating face faces the unfreezing chamber and is used for providing heat for the unfreezing chamber, and the refrigerating face faces the refrigerating air channel and is used for providing cold for the refrigerating air channel. In this way, the heat load of the refrigeration assembly can be reduced, and the effect of improving the energy efficiency ratio of the refrigerator with the refrigeration assembly is achieved.

Description

Refrigeration components and refrigerators Technical Field

[0001] This utility model belongs to the field of refrigerator refrigeration technology, and in particular relates to a refrigeration component and a refrigerator. Background Technology

[0002] Currently, there are three main defrosting technologies for refrigerators: microwave defrosting, electric heating element defrosting, and natural defrosting. However, all three have certain limitations. Specifically, microwave defrosting requires a separate microwave module, resulting in high integration costs; electric heating element defrosting requires additional circuitry and insulation structures, making the design complex and costly; and natural defrosting in the refrigerator compartment takes a long time and occupies refrigerator space. Clearly, all three solutions suffer from low space utilization and inflexible temperature control. Microwave defrosting and electric heating element defrosting both require additional heat dissipation and insulation devices, which not only increases manufacturing costs but also increases the refrigerator's heat load due to the interference between defrosting and refrigeration temperatures. This results in defrosting energy consumption accounting for a large proportion of the refrigerator's total energy consumption, thus lowering the refrigerator's energy efficiency ratio. Summary of the Invention

[0003] In view of this, it is necessary to provide a refrigeration component and refrigerator for solving the above-mentioned technical problems.

[0004] A refrigeration component for use in a refrigerator, the refrigeration component comprising:

[0005] The refrigerator liner has a first refrigerator compartment, a thawing compartment and a second refrigerator compartment. The thawing compartment is located between the first refrigerator compartment and the second refrigerator compartment. The refrigerator liner has a return air vent and a first air outlet in the location of the first refrigerator compartment. The refrigerator liner has a second air outlet in the location of the second refrigerator compartment.

[0006] An air duct assembly is disposed on one side of the refrigerator liner. The air duct assembly has a refrigerator air duct, which is connected to the return air vent, the first air outlet, and the second air outlet respectively.

[0007] A refrigerated evaporator is located between the return air inlet and the first air outlet and is housed within the refrigerated air duct.

[0008] A semiconductor cooling chip is disposed on the refrigerated inner liner at the location of the defrosting chamber. The semiconductor cooling chip has a heating surface and a cooling surface. The heating surface faces the defrosting chamber and is used to provide heat to the defrosting chamber. The cooling surface faces the refrigerated air duct and is used to provide cooling to the refrigerated air duct.

[0009] It is understandable that by utilizing the bidirectional temperature control characteristics of the semiconductor cooling chip, the semiconductor cooling chip can, on the one hand, provide heat to the defrosting chamber using its heating surface to raise the ambient temperature of the defrosting chamber and achieve the purpose of defrosting the items inside; on the other hand, it can also recover the cold energy generated by the cooling surface of the semiconductor cooling chip using the refrigeration air duct to reduce the heat load of the refrigeration component, thereby improving the energy efficiency ratio of the refrigerator using this refrigeration component.

[0010] In one embodiment, the refrigerator liner includes a partition, and the defrosting chamber is isolated from the refrigerator air duct by the partition;

[0011] The partition plate has mounting holes, and the semiconductor cooling chip is disposed in the mounting holes and connected and sealed to the partition plate.

[0012] Understandably, mounting the thermoelectric cooler directly onto the partition used to isolate the defrosting chamber from the refrigeration air duct simplifies the structure required for its installation.

[0013] In one embodiment, the partition is configured as a vacuum insulation panel.

[0014] It is understandable that vacuum insulation panels are used to insulate the thawing chamber and the refrigeration duct to prevent heat transfer between them. This avoids the ambient temperature of the thawing chamber being affected by the cold air in the refrigeration duct, while ensuring the airflow of the cold air in the refrigeration duct.

[0015] In one embodiment, the thermoelectric cooler is disposed at the center of the partition.

[0016] In one embodiment, the defrosting chamber is insulated from the first and second cold storage chambers by heat insulation panels.

[0017] It is understandable that heat insulation panels are used to insulate the thawing chamber from the first and second cold storage chambers to prevent heat transfer between them. This avoids the ambient temperature of the thawing chamber being affected by the cold air in the first and second cold storage chambers, while ensuring sufficient cold air in the first and second cold storage chambers.

[0018] In one embodiment, the refrigeration assembly further includes a controller electrically connected to the thermoelectric cooler for controlling the power supply to / from the thermoelectric cooler.

[0019] It is understandable that a controller is used to control the power supply to and from the thermoelectric cooler and to control the operation of the thermoelectric cooler, so that the refrigeration unit can start the defrosting operation as needed.

[0020] In one embodiment, the air duct assembly is disposed on the rear side of the refrigerator liner.

[0021] In one embodiment, the air duct assembly includes a baffle plate, and the baffle plate and the refrigerator inner liner enclose each other to form the refrigerator air duct;

[0022] Furthermore, the refrigerated evaporator is mounted on the wind deflector.

[0023] It is understandable that using a baffle plate and the inner liner of the refrigerator to form a refrigerated air duct simplifies the structure of the air duct assembly and increases the size of the refrigerated air duct.

[0024] In one embodiment, the second refrigerator compartment includes a plurality of drawer refrigerator compartments, each of the drawer refrigerator compartments being used to house a refrigerator drawer;

[0025] Furthermore, the refrigerated inner liner is provided with a second air outlet at the location of each drawer refrigeration compartment.

[0026] This application also provides a refrigerator, including the refrigeration components described above.

[0027] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art:

[0028] The refrigeration component and refrigerator claimed in this application utilize the bidirectional temperature control characteristics of a semiconductor cooling chip. On the one hand, the semiconductor cooling chip can provide heat to the defrosting chamber using its heating surface to raise the ambient temperature of the defrosting chamber and achieve the purpose of defrosting items inside the defrosting chamber. On the other hand, the cooling energy generated by the cooling surface of the semiconductor cooling chip can be recovered by the refrigeration air duct to reduce the heat load of the refrigeration component, thereby improving the energy efficiency ratio of the refrigerator using the refrigeration component. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 is a schematic diagram of the structure of the refrigeration component provided in this application.

[0031] Figure 2 is a cross-sectional view of the refrigeration component provided in this application.

[0032] Figure 3 is an enlarged view of part P in Figure 2.

[0033] Reference numerals: 100, Refrigeration component; 10, Refrigeration liner; 101, First Refrigeration compartment; 102, Defrost compartment; 103, Second Refrigeration compartment; 1031, Drawer Refrigeration compartment; 11, Return air vent; 12, First air outlet; 13, Second air outlet; 110, Heat insulation plate; 120, Partition; 121, Mounting hole; 20, Air duct assembly; 201, Refrigeration air duct; 21, Baffle plate; 30, Refrigeration evaporator; 40, Semiconductor cooling chip; 41, Heating surface; 42, Cooling surface. Detailed Implementation

[0034] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] It should be noted that when a component is said to be "located on" another component, it can be directly located on the other component or may have an intervening component. When a component is considered to be "located on" another component, it can be directly located on the other component or may have an intervening component. When a component is considered to be "fixed to" another component, it can be directly fixed to the other component or may have an intervening component.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0037] As shown in Figures 1 and 2, the refrigeration assembly 100 provided in this application includes a refrigeration liner 10, an air duct assembly 20, a refrigeration evaporator 30, and a semiconductor cooling chip 40. The refrigeration liner 10 has a first refrigeration compartment 101, a defrosting compartment 102, and a second refrigeration compartment 103. The defrosting compartment 102 is located between the first refrigeration compartment 101 and the second refrigeration compartment 103. The refrigeration liner 10 has a return air vent 11 and a first air outlet 12 at the location of the first refrigeration compartment 101, and a second air outlet 13 at the location of the second refrigeration compartment 103. The air duct assembly 20 is disposed in one of the refrigeration liner 10. On one side, the air duct assembly 20 has a refrigerated air duct 201, which is connected to the return air inlet 11, the first air outlet 12, and the second air outlet 13. A refrigerated evaporator 30 is positioned between the return air inlet 11 and the first air outlet 12 and housed within the refrigerated air duct 201. A semiconductor cooling chip 40 is disposed on the refrigerated inner liner 10 at the location of the defrosting chamber 102. The semiconductor cooling chip 40 has a heating surface 41 and a cooling surface 42. The heating surface 41 faces the defrosting chamber 102 and is used to provide heat to the defrosting chamber 102. The cooling surface 42 faces the refrigerated air duct 201 and is used to provide cooling to the refrigerated air duct 201. It should be noted that the specific structure and working principle of the semiconductor cooling chip 40 can be implemented using existing conventional methods, and will not be elaborated upon here.

[0038] As can be seen from the above, the refrigeration component 100 of this application utilizes the bidirectional temperature control characteristics of the semiconductor cooling chip 40, so that the semiconductor cooling chip 40 can provide heat to the defrosting chamber 102 through the heating surface 41 to increase the ambient temperature of the defrosting chamber 102 and achieve the purpose of defrosting the items in the defrosting chamber 102; on the other hand, the cold air duct 201 can also recover the cold energy generated by the cooling surface 42 of the semiconductor cooling chip 40 to reduce the heat load of the refrigeration component 100, thereby improving the energy efficiency ratio of the refrigerator using the refrigeration component 100.

[0039] It should be noted that since the defrosting chamber 102 is an independent chamber and there is no cold air introduced into the defrosting chamber 102 from the refrigeration air duct 201, the air in the area where the defrosting chamber 102 is located only flows naturally. It can be inferred that the amount of air overflowing from the defrosting chamber 102 and participating in the circulation of the refrigeration component 100 is relatively small. In addition, the refrigeration air duct 201 recovers the cold energy generated by the cooling surface 42 of the semiconductor cooling chip 40, which can be used to neutralize the heat carried in the air overflowing from the defrosting chamber 102. This can reduce the heat load increased by the refrigeration component 100 due to the integrated defrosting function, thereby improving the energy efficiency ratio of the refrigerator using the refrigeration component 100.

[0040] As shown in Figures 1 and 2, in one embodiment, the defrosting chamber 102 is insulated from the first refrigerator compartment 101 and the second refrigerator compartment 103 by heat insulation panels 110. That is, the refrigerator liner 10 specifically uses heat insulation panels 110 to separate the defrosting chamber 102 from the first refrigerator compartment 101 and the second refrigerator compartment 103. This prevents heat transfer between the defrosting chamber 102 and the first and second refrigerator compartments 101 and 103. This avoids interference of the ambient temperature of the defrosting chamber 102 with the cooling capacity of the first and second refrigerator compartments 101 and 103, while ensuring sufficient cooling capacity in both compartments. Specifically, the heat insulation panel 110 can be a double-layer vacuum insulation panel.

[0041] As shown in Figures 1 and 2, in this application, the return air vent 11 is located at the top of the first refrigerator compartment 101 in the height direction of the refrigerator, and the first air outlet 12 is located on the side of the first refrigerator compartment 101 facing the defrost compartment 102, so that the first refrigerator compartment 101 of this application has air outlet at the bottom and return air at the top. Here, the number of first air outlets 12 is configured to be multiple, and the multiple first air outlets 12 are spaced apart along the width direction of the refrigerator.

[0042] As shown in Figure 2, in one embodiment, the air duct assembly 20 is disposed on the rear side of the refrigerator inner liner 10; wherein, the air duct assembly 20 includes a baffle plate 21, and the baffle plate 21 and the refrigerator inner liner 10 enclose to form a refrigerator air duct 201. That is to say, in this embodiment, the refrigerator assembly 100 can use the baffle plate 21 and the refrigerator inner liner 10 to enclose and form a refrigerator air duct 201, which simplifies the structure of the air duct assembly 20 and increases the size of the refrigerator air duct 201. Here, the refrigerator evaporator 30 is mounted on the baffle plate 21.

[0043] As shown in Figure 1, in one embodiment, the second refrigerator compartment 103 includes multiple drawer refrigerator compartments 1031, each drawer refrigerator compartment 1031 being used to house a refrigerator drawer (not shown); and the refrigerator liner 10 has a second air outlet 13 at the location of each drawer refrigerator compartment 1031. That is to say, in this embodiment, the refrigerator assembly 100 can independently vent cold air from each drawer refrigerator compartment 1031 to meet the needs of independently refrigerating items in the refrigerator drawer. Here, the number of drawer refrigerator compartments 1031 is configured as two, and the two drawer refrigerator compartments 1031 are arranged at intervals along the width direction of the refrigerator.

[0044] As shown in Figures 1 to 3, in one embodiment, the refrigerator inner liner 10 includes a partition 120, which isolates the defrosting chamber 102 from the refrigerator air duct 201. The partition 120 has mounting holes 121, and a thermoelectric cooler 40 is disposed within the mounting holes 121 and connected and sealed to the partition 120. In other words, this embodiment directly mounts the thermoelectric cooler 40 onto the partition 120 used to isolate the defrosting chamber 102 from the refrigerator air duct 201, thus simplifying the structure required for installing the thermoelectric cooler 40.

[0045] In this embodiment, the partition 120 is configured as a vacuum insulation panel, specifically an insulation panel with a double-layer vacuum structure, so that the refrigeration assembly 100 can use the vacuum insulation panel to insulate the defrosting chamber 102 and the refrigeration air duct 201 to prevent heat transfer between the defrosting chamber 102 and the refrigeration air duct 201. This avoids the ambient temperature of the defrosting chamber 102 being disturbed by the cold air in the refrigeration air duct 201, and ensures the airflow of the cold air in the refrigeration air duct 201.

[0046] As shown in Figure 1, in this embodiment, the thermoelectric cooler 40 is disposed in the middle of the partition 120, so that the thermoelectric cooler 40 can provide heat to the environment of the defrosting chamber 102 from the middle position of the defrosting chamber 102, thereby improving the uniformity of heat distribution inside the defrosting chamber 102. Here, the number of thermoelectric coolers 40 is configured as one. It is understood that in other embodiments, the thermoelectric cooler 40 may also be disposed in other ways on the partition 120, which will not be elaborated here.

[0047] In this embodiment, the refrigeration assembly 100 of this application also includes a controller (not shown), which is electrically connected to the thermoelectric cooler 40 and is used to control the power supply / power-off of the thermoelectric cooler 40. That is, the refrigeration assembly 100 can use the controller to control the operation of the thermoelectric cooler 40, so that the thermoelectric cooler 40 can be turned on as needed. In other words, the refrigeration assembly 100 can initiate the defrosting operation as needed. Therefore, when the refrigeration assembly 100 does not initiate the defrosting operation, the defrosting chamber 102 can be used as a conventional refrigeration space to refrigerate items. It should be noted that the specific structure of the controller and the working principle of how it controls the operation of the thermoelectric cooler 40 can adopt existing conventional methods, and will not be elaborated here.

[0048] This application also provides a refrigerator, including the refrigeration component 100 described above.

[0049] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0050] Those skilled in the art should recognize that the above embodiments are only used to illustrate the present utility model and are not intended to limit the present utility model. Any appropriate changes and variations made to the above embodiments within the scope of the essential spirit of the present utility model shall fall within the scope of protection claimed by the present utility model.

Claims

1. A refrigeration component, used in a refrigerator, characterized in that, The refrigeration assembly (100) includes: a refrigeration liner (10) having a first refrigeration compartment (101), a defrosting compartment (102), and a second refrigeration compartment (103), wherein the defrosting compartment (102) is located between the first refrigeration compartment (101) and the second refrigeration compartment (103), wherein the refrigeration liner (10) has a return air vent (11) and a first air outlet (12) at the location of the first refrigeration compartment (101), and a second air outlet (13) at the location of the second refrigeration compartment (103); and an air duct assembly (20) located on one side of the refrigeration liner (10), wherein the air duct assembly (20) has a refrigeration air duct (201), wherein the refrigeration air duct (201) is divided into The return air inlet (11), the first air outlet (12), and the second air outlet (13) are not connected; the refrigerated evaporator (30) is located between the return air inlet (11) and the first air outlet (12) and is housed in the refrigerated air duct (201); the semiconductor refrigeration chip (40) is located on the refrigerated inner liner (10) at the location of the defrosting chamber (102), the semiconductor refrigeration chip (40) has a heating surface (41) and a cooling surface (42), the heating surface (41) is arranged facing the defrosting chamber (102) and is used to provide heat to the defrosting chamber (102), the cooling surface (42) is arranged facing the refrigerated air duct (201) and is used to provide cold energy to the refrigerated air duct (201).

2. The refrigeration component according to claim 1, characterized in that, The refrigerated inner liner (10) includes a partition (120), and the defrosting chamber (102) and the refrigerated air duct (201) are isolated by the partition (120); the partition (120) has an installation hole (121), and the semiconductor cooling chip (40) is disposed in the installation hole (121) and connected and sealed to the partition (120).

3. The refrigeration component according to claim 2, characterized in that, The partition (120) is configured as a vacuum insulation panel.

4. The refrigeration assembly according to claim 2, characterized in that, The semiconductor cooling chip (40) is disposed in the middle of the partition (120).

5. The refrigeration component according to claim 1, characterized in that, The thawing chamber (102) is insulated from the first cold storage chamber (101) and the second cold storage chamber (103) by heat insulation panels (110).

6. The refrigeration assembly according to claim 1, characterized in that, The refrigeration assembly (100) also includes a controller electrically connected to the thermoelectric cooler (40) for controlling the power on / off of the thermoelectric cooler (40).

7. The refrigeration assembly according to claim 1, characterized in that, The air duct assembly (20) is located on the back side of the refrigerator liner (10).

8. The refrigeration assembly according to claim 7, characterized in that, The air duct assembly (20) includes a baffle plate (21), which forms the refrigerated air duct (201) by enclosing the refrigerated inner liner (10); and the refrigerated evaporator (30) is mounted on the baffle plate (21).

9. The refrigeration assembly according to claim 1, characterized in that, The second refrigerator compartment (103) includes multiple drawer refrigerator compartments (1031), each of the drawer refrigerator compartments (1031) is used to house a refrigerator drawer; and the refrigerator liner (10) is provided with a second air outlet (13) at the location of each of the drawer refrigerator compartments (1031).

10. A refrigerator, characterized in that, Includes the refrigeration assembly (100) as described in any one of claims 1 to 9.

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