Piezoelectric sensor

Abstract

The embodiment of the utility model provides a piezoelectric sensor. The piezoelectric sensor comprises a shell assembly, a piezoelectric layer located in a containing cavity, an electrode block located in the containing cavity, an insulation assembly and a conductive assembly. The piezoelectric layer is electrically connected with the shell assembly along one side of the first direction, and the electrode block is arranged on the other side of the piezoelectric layer along the first direction and electrically connected with the piezoelectric layer. The insulation assembly comprises an insulation pad, and the insulation pad is arranged between the electrode block and the shell assembly and located on the side, away from the piezoelectric layer, of the electrode block; the thickness of the electrode block in the first direction is larger than that of the insulating pad in the first direction. The conductive assembly is provided with a connecting end electrically connected with the electrode block and an output end extending out of the shell assembly. The piezoelectric sensor provided by the embodiment of the utility model is small in size.

Description

A piezoelectric sensor Technical Field

[0001] This application relates to the field of sensor technology, and in particular to a piezoelectric sensor. Background Technology

[0002] A piezoelectric sensor is a sensor based on the piezoelectric effect. The piezoelectric material is the core component of the piezoelectric sensor. When the piezoelectric material is subjected to force, it can generate charges on its surface and collect the charges through electrode plates for output conduction.

[0003] In related technologies, piezoelectric sensors employ a dual-quartz plate design, with an electrode plate placed between the two quartz plates to collect charge. The charge generated on the outer surface of the two quartz plates facing away from the electrode plate is transferred through the housing assembly. However, the dual-quartz plate design results in an excessively thick piezoelectric sensor, making it difficult to reduce its size and thus hindering miniaturization. Summary of the Invention

[0004] In view of this, the main objective of the embodiments of this application is to provide a piezoelectric sensor that can reduce its size.

[0005] To achieve the above objectives, the technical solution of this application embodiment is implemented as follows:

[0006] This application provides a piezoelectric sensor, which includes:

[0007] Housing assembly having a receiving cavity;

[0008] A piezoelectric layer located within the receiving cavity, the piezoelectric layer being electrically connected to the housing assembly on one side along a first direction;

[0009] An electrode block located within the receiving cavity, the electrode block being disposed on the other side of the piezoelectric layer along the first direction and electrically connected to the piezoelectric layer;

[0010] An insulating component, the insulating component including an insulating pad located within the receiving cavity, the insulating pad being disposed between the electrode block and the housing assembly, and located on the side of the electrode block facing away from the piezoelectric layer; the thickness of the electrode block along the first direction is greater than the thickness of the insulating pad along the first direction;

[0011] A conductive component having a connection end electrically connected to the electrode block and an output end extending outside the housing assembly.

[0012] In one embodiment, the electrode block has a connecting cavity located between the piezoelectric layer and the insulating pad, and the connecting end passes through the connecting cavity.

[0013] In one embodiment, the electrode block has an inlet on one side along the second direction and an opening on the other side along the second direction. The opposite ends of the connecting cavity are respectively connected to the inlet and the opening. The connecting end extends from the inlet into the connecting cavity and extends to the opening. The second direction is perpendicular to the first direction.

[0014] In one embodiment, the electrode block is recessed in at least a portion of the periphery of the opening to form an adhesive cavity communicating with the connecting cavity.

[0015] In one embodiment, the conductive component includes a coaxial cable having the output end and the connection end, wherein at the connection end, the copper wires of the coaxial cable pass through the connection cavity.

[0016] In one embodiment, the thickness of the piezoelectric sensor along the first direction is greater than or equal to 2.5 mm and less than or equal to 12 mm; and / or,

[0017] The thickness of the electrode block along the first direction is greater than or equal to 0.5 mm and less than or equal to 3.5 mm.

[0018] In one embodiment, the projections of the electrode block and the insulating pad are located within the projection range of the piezoelectric layer in a projection plane perpendicular to the first direction.

[0019] In one embodiment, the insulating assembly further includes an insulating sleeve, the insulating sleeve and the insulating pad forming an insulating cavity, the insulating sleeve being disposed in the receiving cavity, and the piezoelectric layer being located at one end of the electrode block along the first direction and the electrode block being located in the insulating cavity.

[0020] In one embodiment, a portion of the housing assembly is open to form a first through-hole, and a portion of one side of the insulating sleeve along a second direction is open to form a second through-hole. The second through-hole communicates with the first through-hole and the insulating cavity, respectively. The conductive component passes through the first through-hole and the second through-hole to be electrically connected to the electrode block.

[0021] In one embodiment, the piezoelectric layer is a quartz sheet; and / or,

[0022] The electrode block is a copper block.

[0023] This application provides a piezoelectric sensor, which includes a housing assembly, a piezoelectric layer, an electrode block, an insulating component, and a conductive component. The piezoelectric layer is electrically connected to the housing assembly on one side along a first direction, and the electrode block is disposed on the other side of the piezoelectric layer along the first direction and is electrically connected to the piezoelectric layer. The insulating component includes an insulating pad located within a receiving cavity, disposed between the electrode block and the housing assembly, and located on the side of the electrode block facing away from the piezoelectric layer. Thus, when the piezoelectric sensor is subjected to force, charges are formed on the outer surfaces of opposite sides of the piezoelectric layer along the first direction. The charge on one side is transferred to the housing assembly, while the charge on the other side is output through the electrode block. The insulating pad between the electrode block and the housing assembly prevents direct electrical connection between them, thus preventing short circuits. Furthermore, since the piezoelectric sensor of this application uses a single piezoelectric layer configuration—that is, a piezoelectric layer is only disposed on one side of the electrode block—the thickness of the piezoelectric sensor along the first direction can be reduced, thereby reducing its size and achieving better miniaturization. On the other hand, the thickness of the electrode block along the first direction is greater than the thickness of the insulating pad along the first direction, and the conductive component has a connection end electrically connected to the electrode block and an output end extending outside the housing assembly. Therefore, by controlling the thickness of the insulating pad to be less than the thickness of the electrode block, the thickness dimension of the piezoelectric sensor along the first direction can be further reduced. Simultaneously, using an electrode block with a thickness greater than the insulating pad, rather than an electrode sheet, facilitates the electrical connection between the connection end of the conductive component and the electrode block, minimizing the manufacturing difficulties arising from an excessively thin electrode block during the electrical connection process. Thus, the piezoelectric sensor of this application can reduce size while facilitating manufacturing. Attached Figure Description

[0024] Figure 1 is a schematic diagram of the structure of a piezoelectric sensor according to an embodiment of this application;

[0025] Figure 2 is a cross-sectional view of the piezoelectric sensor in Figure 1;

[0026] Figure 3 is a schematic diagram of the electrode block in Figure 2;

[0027] Figure 4 is an exploded view of the piezoelectric sensor in Figure 1;

[0028] Figure 5 is a schematic diagram of the cooperation relationship between the electrode block and the conductive component in Figure 4;

[0029] Figure 6 is a schematic diagram of the structure of the electrode block in Figure 5.

[0030] Explanation of reference numerals in the attached figures

[0031] 10. Housing assembly; 10a. Receiving cavity; 10b. First through hole; 20. Piezoelectric layer; 30. Electrode block; 30a. Connecting cavity; 30b. Insertion port; 30c. Opening; 30d. Adhesive cavity; 40. Insulating assembly; 40a. Insulating cavity; 41. Insulating pad; 42. Insulating sleeve; 42a. Second through hole; 50. Conductive assembly; 51. Connecting end; 52. Output end. Detailed Implementation

[0032] In this application, the orientations or positional relationships of "first direction" and "second direction" are based on the orientations or positional relationships shown in Figure 1. It should be understood that these orientational terms are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this application.

[0033] In the description of the embodiments of this application, technical terms such as "first," "second," and "third" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0034] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0035] A piezoelectric sensor is a sensor based on the piezoelectric effect, capable of converting mechanical energy (such as pressure, vibration, and impact) into an electrical signal and outputting it. When the piezoelectric layer inside the sensor is subjected to an external force, the internal crystal lattice structure deforms, causing an electric charge to be generated on the surface of the piezoelectric layer. Once the external force is removed, the charge disappears, thus enabling the conversion of mechanical energy into electrical energy.

[0036] The piezoelectric sensor in this embodiment employs a single piezoelectric layer 20 configuration. Compared to piezoelectric sensors in related technologies, this reduces the number of piezoelectric layers, significantly decreasing the sensor's thickness and enabling further miniaturization. This allows the piezoelectric sensor to be suitable for applications with tight space requirements and the need to measure and monitor minute changes. For example, in fields such as automotive, aerospace, structural health monitoring, biomedicine, robotics, and research and development, there are critical nodes where assembly space is limited, making sensor deployment difficult. These areas place high demands on the size of the piezoelectric sensor, requiring it to be miniaturized as much as possible. Examples include joint torque feedback in robotics and precision clamping force monitoring of end effectors; force feedback for minimally invasive surgical instruments, mechanical analysis of implantable devices, and force control in drug delivery systems in biomedicine; force monitoring in semiconductor packaging processes, microelectromechanical systems (MEMS) testing, and force control in the assembly of small components in precision manufacturing and testing; and health monitoring of lightweight structures and thrust measurement of micro-thrusters in aerospace. For example, in the field of basic scientific research, this includes characterizing the micromechanical properties of materials and measuring surface / interfacial forces.

[0037] One embodiment of this application provides a piezoelectric sensor. Please refer to Figures 1, 2 and 4. The piezoelectric sensor includes a housing assembly 10, a piezoelectric layer 20, an electrode block 30, an insulating assembly 40 and a conductive assembly 50.

[0038] The housing assembly 10 has a receiving cavity 10a.

[0039] The piezoelectric layer 20 is located inside the receiving cavity 10a, and one side of the piezoelectric layer 20 along the first direction is electrically connected to the housing assembly 10.

[0040] The electrode block 30 is located inside the receiving cavity 10a. The electrode block 30 is disposed on the other side of the piezoelectric layer 20 along the first direction and is electrically connected to the piezoelectric layer 20.

[0041] The insulating assembly 40 includes an insulating pad 41 located within the receiving cavity 10a. The insulating pad 41 is disposed between the electrode block 30 and the housing assembly 10, and is located on the side of the electrode block 30 facing away from the piezoelectric layer 20. The thickness of the electrode block 30 along the first direction is greater than the thickness of the insulating pad 41 along the first direction.

[0042] The conductive component 50 has a connection end 51 that is electrically connected to the electrode block 30, and an output end 52 that extends outside the housing assembly 10.

[0043] Specifically, the housing assembly 10 is the housing structure of the piezoelectric sensor, which has a receiving cavity 10a for accommodating the piezoelectric layer 20, electrode block 30, insulating component 40, etc.

[0044] The specific structural shape of the housing assembly 10 is not limited.

[0045] For example, housing assembly 10 includes a pressure head and a crystal box. The pressure head and the crystal box enclose a receiving cavity 10a.

[0046] A portion of the crystal box near the pressure head protrudes to form a stepped surface, and the side of the pressure head near the crystal box rests against the stepped surface.

[0047] A portion of the insulating component 40 is located within the crystal cell, while another portion is located within the pressure head. The piezoelectric layer 20 contacts the pressure head to form an electrical connection. This allows for further reduction in the thickness of the piezoelectric sensor, enabling better miniaturization of the piezoelectric sensor.

[0048] It should be noted that the external force is applied to the piezoelectric sensor from one side of the piezoelectric layer 20 along the first direction. As a result, charges are formed on the outer surfaces of the opposite sides of the piezoelectric layer 20 along the first direction.

[0049] The piezoelectric layer 20 is a piezoelectric material layer with piezoelectric effect, and its specific material is not limited.

[0050] For example, the piezoelectric layer 20 is a quartz sheet. This allows for a good piezoelectric effect while also reducing the thickness of the piezoelectric sensor.

[0051] The piezoelectric layer 20 is electrically connected to the housing assembly 10 on the side opposite to the electrode block 30 along the first direction. The two can be in direct contact to form an electrical connection, which facilitates miniaturization. Alternatively, other structural layers can be disposed between the two to form an indirect electrical connection.

[0052] The piezoelectric layer 20 is electrically connected to the electrode block 30 on the other side along the first direction, so that the electrode block 30 can output the charge of the piezoelectric layer 20 on the side close to the electrode block 30. Similarly, the two can be in direct contact to form an electrical connection, which facilitates miniaturization. Of course, other structural layers can also be disposed between the two to indirectly form an electrical connection.

[0053] It should be noted that the electrode block 30 and the housing assembly 10 are not electrically connected; they are separated by an insulating assembly 40.

[0054] The insulating pad 41 is located on the side of the electrode block 30 facing away from the piezoelectric layer 20. That is, along the first direction, the piezoelectric layer 20, the electrode block 30, and the insulating pad 41 are arranged in sequence.

[0055] The specific material of electrode block 30 is not limited.

[0056] For example, electrode block 30 is made of copper. This provides good electrical conductivity and facilitates manufacturing.

[0057] The electrode block 30 is a load-bearing block with an electrode structure of a certain thickness along the first direction. Specifically, along the first direction, the thickness of the electrode block 30 is greater than the thickness of the insulating pad 41. That is, while ensuring good insulation between the electrode block 30 and the housing assembly 10, the thickness of the insulating pad 41 is minimized to reduce the overall thickness of the piezoelectric sensor along the first direction. Furthermore, using an electrode block 30 that is thicker than the insulating pad 41 to collect charge, rather than a thinner electrode sheet, facilitates electrical connection between the electrode block 30 and the conductive component 50, reducing manufacturing difficulty.

[0058] The conductive component 50 is a conductive structure with good guiding effect. The connection end 51 of the conductive component 50 is the end close to the electrode block 30 and is used for electrical connection with the electrode block 30. The output end 52 of the conductive component 50 is the end extending outside the housing assembly 10 and is used for outputting electrical signals.

[0059] It should be noted that the specific dimensions of electrode block 30 can be set according to actual needs.

[0060] For example, the thickness of the electrode block 30 along the first direction is greater than or equal to 0.5 mm and less than or equal to 3.5 mm. Examples include 0.5 mm, 1 mm, 1.2 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm, or 3.5 mm. The thickness of the electrode block 30 along the first direction should not be too large, as this would increase the overall thickness of the piezoelectric sensor, making miniaturization difficult. Conversely, the thickness of the electrode block 30 along the first direction should not be too small either, as this would significantly increase the difficulty of electrical connection between the electrode block 30 and the conductive component 50. Controlling the thickness within the aforementioned range allows for both miniaturization of the piezoelectric sensor and ease of manufacturing.

[0061] The thickness dimension of the piezoelectric sensor along the first direction can also be set according to actual needs.

[0062] For example, the thickness of the piezoelectric sensor along the first direction is greater than or equal to 2.5 mm and less than or equal to 12 mm. Examples include 2.5 mm, 3.5 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, 11 mm, or 12 mm. Similarly, the thickness of the piezoelectric sensor along the first direction should not be too large, as this would make it difficult to meet the miniaturization requirements of different application scenarios. Of course, the thickness of the piezoelectric sensor along the first direction should also not be too small, as this would significantly increase the difficulty of manufacturing the piezoelectric sensor. Controlling the thickness within the above-mentioned range allows for both miniaturization requirements and ease of manufacturing. In reality, however, it is difficult to achieve a thickness of less than 6 mm for piezoelectric sensors using dual quartz plates and electrode plates in related technologies.

[0063] In the piezoelectric sensor of this embodiment, the piezoelectric layer 20 is electrically connected to the housing assembly 10 on one side along the first direction, and the electrode block 30 is disposed on the other side of the piezoelectric layer 20 along the first direction and is electrically connected to the piezoelectric layer 20. The insulating assembly 40 includes an insulating pad 41 located within the receiving cavity 10a. The insulating pad 41 is disposed between the electrode block 30 and the housing assembly 10, and is located on the side of the electrode block 30 facing away from the piezoelectric layer 20. Thus, when the piezoelectric sensor is subjected to force, charges are formed on the outer surfaces of the opposite sides of the piezoelectric layer 20 along the first direction, with the charge on one side being transferred to the housing assembly 10 and the charge on the other side being output through the electrode block 30. The insulating pad 41 between the electrode block 30 and the housing assembly 10 can prevent direct electrical connection between the electrode block 30 and the housing assembly 10, thus preventing short circuits. Meanwhile, since the piezoelectric sensor of this application adopts a single piezoelectric layer 20 configuration, that is, the piezoelectric layer 20 is only set on one side of the electrode block 30, the thickness of the piezoelectric sensor along the first direction can be reduced, thereby achieving the effect of size reduction and better realizing the miniaturization of the piezoelectric sensor. On the other hand, the thickness of the electrode block 30 along the first direction is greater than the thickness of the insulating pad 41 along the first direction, and the conductive component 50 has a connection end 51 electrically connected to the electrode block 30 and an output end 52 extending outside the housing assembly 10. Thus, by controlling the thickness of the insulating pad 41 to be less than the thickness of the electrode block 30, the thickness dimension of the piezoelectric sensor along the first direction can be further reduced. At the same time, using an electrode block 30 with a thickness greater than that of the insulating pad 41, rather than an electrode sheet, facilitates the electrical connection of the connection end 51 of the conductive component 50 with the electrode block 30, and can minimize the problem of difficult manufacturing during the electrical connection process with the conductive component 50 due to the electrode block 30 being too thin. It can be seen that the piezoelectric sensor of this application can reduce size while facilitating manufacturing.

[0064] In one embodiment, referring to Figures 2 to 4, the electrode block 30 has a connecting cavity 30a located between the piezoelectric layer 20 and the insulating pad 41, and the connecting end 51 passes through the connecting cavity 30a.

[0065] In other words, a cavity is formed in a portion of the electrode block 30 between the piezoelectric layer 20 and the insulating pad 41 for mounting the connection end 51 of the conductive component 50. The connection end 51 passes through the region of the electrode block 30 between the piezoelectric layer 20 and the insulating pad 41.

[0066] Compared to extending the length of the electrode block 30 along the second direction (perpendicular to the first direction) to extend it outside the area between the piezoelectric layer 20 and the insulating pad 41 for connection with the conductive component 50, this embodiment directly extends the connection end 51 between the piezoelectric layer 20 and the insulating pad 41, which can reduce the size of the piezoelectric sensor along the second direction and is more conducive to the miniaturization of the piezoelectric sensor.

[0067] Meanwhile, the connection method of extending the connection end 51 into the connection cavity 30a makes the electrical connection between the conductive component 50 and the electrode block 30 more stable.

[0068] In one embodiment, referring to Figures 2 and 3, the electrode block 30 has an inlet 30b on one side along the second direction and an opening 30c on the other side along the second direction. The two opposite ends of the connecting cavity 30a are connected to the inlet 30b and the opening 30c, respectively. The connecting end 51 extends from the inlet 30b into the connecting cavity 30a and extends to the opening 30c. The second direction is perpendicular to the first direction.

[0069] In other words, the two opposite ends of the connecting cavity 30a are respectively connected to the outer side of the electrode block 30 along the second direction. In fact, the connecting cavity 30a is a through hole penetrating the electrode block 30. By adopting the through hole setting method, it is easier for the connecting end 51 of the conductive component 50 to pass through, and at the same time, it can improve the stability of the electrical connection between the conductive component 50 and the electrode block 30.

[0070] It should be noted that the connecting cavity 30a may extend along the second direction, or, depending on the actual situation, the connecting cavity 30a may form a certain angle with the second direction. However, both ends of the connecting cavity 30a are connected to the inlets 30b and the openings 30c on both sides of the electrode block 30 along the second direction.

[0071] In one embodiment, referring to Figures 3, 5 and 6, the electrode block 30 is recessed in at least a portion of the area around the opening 30c to form an adhesive cavity 30d communicating with the connecting cavity 30a.

[0072] Specifically, the opening size of the adhesive cavity 30d is larger than the opening size of the open mouth 30c, so that a stepped surface can be formed at the junction of the two.

[0073] The adhesive cavity 30d is a cavity used for filling adhesive to glue and fix the connecting end 51 and the electrode block 30. By forming a stepped surface, the adhesive stability of the connecting end 51 and the electrode block 30 can be improved, and the stability of the electrical connection between the connecting end 51 and the electrode block 30 can be further improved.

[0074] In one embodiment, the conductive component 50 includes a coaxial cable having an output end 52 and a connection end 51, wherein the copper wires of the coaxial cable pass through a connection cavity 30a at the connection end 51. This facilitates the output of electrical signals by the electrode plates.

[0075] In one specific embodiment, the cross-sectional dimensions of the copper wire of the cable extending into the connection cavity 30a are matched with the cross-sectional dimensions of the connection cavity 30a, thereby greatly improving the stability of the electrical connection between the conductive component 50 and the electrode block 30.

[0076] In one embodiment, referring to FIG2, the projections of the electrode block 30 and the insulating pad 41 are located within the projection range of the piezoelectric layer 20 in a projection plane perpendicular to the first direction.

[0077] In other words, along the first direction, both the electrode block 30 and the insulating pad 41 are located within the shielding area of ​​the piezoelectric layer 20. This allows for a reduction in the size of the piezoelectric sensor along the second direction, facilitating its miniaturization.

[0078] It should be noted that the projections of the electrode block 30, the insulating pad 41, and the piezoelectric layer 20 can be completely overlapping, or the projections of the electrode block 30 and / or the insulating pad 41 can be smaller than the projection of the piezoelectric layer 20.

[0079] In one embodiment, referring to Figures 2 and 4, the insulating assembly 40 further includes an insulating sleeve 42. The insulating sleeve 42 and the insulating pad 41 enclose an insulating cavity 40a. The insulating sleeve 42 is disposed in the receiving cavity 10a, and the piezoelectric layer 20 is located at one end near the electrode block 30 along a first direction, and the electrode block 30 is located in the insulating cavity 40a. This prevents electrical connection between the electrode block 30 and the housing assembly 10, and prevents the charge collected by the electrode block 30 from leaking through the housing assembly 10.

[0080] Specifically, the insulating pad 41 is arranged around the outer periphery of the electrode block 30, so that together with the insulating pad 41, the electrode block 30 is surrounded within the insulating cavity 40a. Furthermore, the end of the piezoelectric layer 20 closest to the electrode block 30 along the first direction is also located within the insulating cavity 40a, so that the electrode block 30 can better collect and transfer the charge from the piezoelectric layer 20.

[0081] In one embodiment, referring to Figures 2 and 4, a portion of the housing assembly 10 is open to form a first through hole 10b, and a portion of the insulating sleeve 42 is open on one side along the second direction to form a second through hole 42a. The second through hole 42a communicates with the first through hole 10b and the insulating cavity 40a, respectively. The conductive assembly 50 passes through the first through hole 10b and the second through hole 42a to be electrically connected to the electrode block 30.

[0082] In other words, both the housing assembly 10 and the insulating sleeve 42 are provided with a through hole, the two through holes are interconnected and communicate with the insulating cavity 40a. Thus, the conductive component 50 can easily extend into the insulating cavity 40a through the first through hole 10b and the second through hole 42a to make an electrical connection with the electrode block 30.

[0083] In the description of this application, the references to terms such as "in one embodiment," "in some embodiments," "in a specific embodiment," or "exemplary," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the embodiments of this application. In this application, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine the different embodiments or examples described in this application, as well as the features of the different embodiments or examples.

[0084] The above description is merely a preferred embodiment of this application and is not intended to limit the application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application are included within the scope of protection of this application.

Claims

1. A piezoelectric sensor, characterized in that, include: A housing assembly having a receiving cavity; a piezoelectric layer located within the receiving cavity, the piezoelectric layer being electrically connected to the housing assembly on one side along a first direction; An electrode block located within the receiving cavity, the electrode block being disposed on the other side of the piezoelectric layer along the first direction and electrically connected to the piezoelectric layer; an insulating component comprising an insulating pad located within the receiving cavity, the insulating pad being disposed between the electrode block and the housing assembly, and located on the side of the electrode block facing away from the piezoelectric layer; the thickness of the electrode block along the first direction being greater than the thickness of the insulating pad along the first direction; and a conductive component having a connection end electrically connected to the electrode block and an output end extending outside the housing assembly.

2. The piezoelectric sensor according to claim 1, characterized in that, The electrode block has a connection cavity located between the piezoelectric layer and the insulating pad, and the connection end passes through the connection cavity.

3. The piezoelectric sensor according to claim 2, characterized in that, The electrode block has an inlet on one side along the second direction and an opening on the other side along the second direction. The two opposite ends of the connecting cavity are respectively connected to the inlet and the opening. The connecting end extends from the inlet into the connecting cavity and extends to the opening. The second direction is perpendicular to the first direction.

4. The piezoelectric sensor according to claim 3, characterized in that, The electrode block is recessed in at least a portion of the area around the opening to form an adhesive cavity communicating with the connecting cavity.

5. The piezoelectric sensor according to any one of claims 2-4, characterized in that, The conductive component includes a coaxial cable having the output end and the connection end, wherein the copper wires of the coaxial cable pass through the connection cavity at the connection end.

6. The piezoelectric sensor according to any one of claims 1-4, characterized in that, The thickness of the piezoelectric sensor along the first direction is greater than or equal to 2.5 mm and less than or equal to 12 mm; and / or, the thickness of the electrode block along the first direction is greater than or equal to 0.5 mm and less than or equal to 3.5 mm.

7. The piezoelectric sensor according to any one of claims 1-4, characterized in that, Within a projection plane perpendicular to the first direction, the projections of the electrode block and the insulating pad lie within the projection range of the piezoelectric layer.

8. The piezoelectric sensor according to any one of claims 1-4, characterized in that, The insulating assembly further includes an insulating sleeve, which and the insulating pad together form an insulating cavity. The insulating sleeve is disposed in the cavity, and the piezoelectric layer is located at one end of the electrode block along the first direction, and the electrode block is located in the insulating cavity.

9. The piezoelectric sensor according to claim 8, characterized in that, A portion of the housing assembly is open to form a first through-hole, and a portion of the insulating sleeve is open on one side along a second direction to form a second through-hole. The second through-hole communicates with the first through-hole and the insulating cavity, respectively. The conductive component passes through the first through-hole and the second through-hole to be electrically connected to the electrode block.

10. The piezoelectric sensor according to any one of claims 1-4, characterized in that, The piezoelectric layer is a quartz sheet; and / or, the electrode block is a copper block.

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