Cold plate module meeting standard 3U6U size and heat dissipation structure
By using heat pipes and copper plate transition structures in the cold plate module, the heat dissipation problem of high heat density components in the standard chassis is solved, realizing rapid heat transfer and efficient heat dissipation, meeting the design requirements of 3U and 6U cold plate modules, and improving the stability and heat dissipation performance of the equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUNAN AEROSPACE JIECHENG ELECTRONIC EQUIP CO LTD
- Filing Date
- 2025-05-26
- Publication Date
- 2026-05-01
AI Technical Summary
In existing technologies, high-heat-density components such as power boards, motherboards, graphics cards, AI cards, and switching boards in standard chassis cannot be effectively cooled, resulting in heat not being transferred in time and affecting equipment stability.
It adopts a structure of heat pipes, copper adapter plates and cold plates. The heat pipes are embedded into the cold plates by brazing and extend to the locking strip. Combined with high-heat chips and PCB boards, it can achieve rapid heat transfer and heat dissipation, and meet the design requirements of standard 3U and 6U cold plate modules.
It improves heat conduction and heat dissipation efficiency, ensuring that the heat from high-temperature chips can be quickly transferred to the outside of the casing, meeting the VITA48.2 specification standard, while also improving the stability and heat dissipation of the device.
Smart Images
Figure CN224190471U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of computer and server technology, and in particular to a cold plate module and heat dissipation structure that meets the standard 3U & 6U size. Background Technology
[0002] With the development of the computer industry, customers have increasingly higher demands for product functionality and performance, leading to higher product integration and greater heat density. For example, previously, a standard chassis only needed to accommodate one standard 3U or 6U power supply board and motherboard to meet usage requirements. Now, a standard chassis needs to accommodate two standard 3U or 6U power supply boards, multiple standard motherboards, graphics cards, AI cards, switching boards, and other functional boards simultaneously. Due to the limited space in standard chassis, it is impossible to allow each board to be mounted close to the wall for heat dissipation. Standard spacing mounting with locking edges for cooling is necessary, but the distance between the locking edges and the heat-generating chips is too great, hindering timely and effective heat transfer.
[0003] Therefore, there is an urgent need for a cold plate module and heat dissipation structure that meets the standard 3U and 6U dimensions. Utility Model Content
[0004] This invention provides a cold plate module and heat dissipation structure that meet standard 3U & 6U dimensions to solve the technical problems mentioned in the background art.
[0005] To achieve the above objectives, the technical solution of this utility model is implemented as follows:
[0006] This utility model provides a cold plate module that meets the standard 3U & 6U size, including a cold plate, heat pipe, adapter copper sheet, high-heat chip, PCB board and cover plate;
[0007] The heat pipe is laid in the mounting slot opened in the cold plate; the high-heat chip is surface-mounted on the PCB board, the adapter copper sheet is mounted on the cold plate, the PCB board is fixedly mounted on the cold plate, and the upper and lower sides of the adapter copper sheet abut against the high-heat chip and the heat pipe respectively; the cover plate is fixed on the cold plate, and the PCB board is arranged in the mounting cavity formed by the cold plate and the cover plate.
[0008] Furthermore, the cold plate module also includes a connector that is crimped onto the PCB board and electrically connected to components on the PCB board.
[0009] Furthermore, the cold plate module also includes a puller, which is fixedly mounted on the cold plate.
[0010] Furthermore, the cold plate module also includes a guide connection unit, which includes two guide sleeves and two locking strips;
[0011] Both guide sleeves are fixed to the PCB board, and the two locking strips are fixed to the opposite sides of the cold plate.
[0012] Furthermore, there are two heat pipes, with one end of each heat pipe positioned in the middle of the cold plate and the other end extending towards the two locking strips, to achieve heat conduction from the middle of the cold plate to the two locking strips.
[0013] Furthermore, the heat pipe is L-shaped or C-shaped.
[0014] Furthermore, the number of high-heat chips is one, and the high-heat chip is a CPU.
[0015] Furthermore, the number of high-heat chips is two, namely a CPU and a GPU.
[0016] Furthermore, thermally conductive silicone grease is coated on the surface of the adapter copper sheet and / or the high-temperature chip.
[0017] In another aspect, this utility model also provides a heat dissipation structure, including multiple cold plate modules and a housing. The housing has multiple slots, and the multiple cold plate modules are respectively arranged in the multiple slots. A heat dissipation strip is formed on the outer side of the housing. The outer surfaces of the multiple cold plate modules are in direct or indirect contact with the heat dissipation strip to achieve heat conduction.
[0018] The beneficial effects of this utility model are:
[0019] This invention provides a cold plate module that meets standard 3U & 6U dimensions, with built-in heat pipes. The heat pipes can quickly transfer the heat generated by high-heat chips, resulting in better heat conduction and heat dissipation.
[0020] Furthermore, this invention incorporates a heat pipe that is brazed into the cold plate and extends to the locking strip. This not only ensures the VITA48.2 standard dimensions but also effectively transfers heat to the area where the locking strip is located. In other words, the heat generated by the high-heat chip can be dissipated through the outer wall of the cold plate and also quickly conducted to the external casing through the locking strip area on both sides of the cold plate, where the heat is then dissipated. Compared to traditional cold plate modules, this invention has better heat conduction and heat dissipation. Attached Figure Description
[0021] Figure 1 This is an exploded view of the cold plate module of this utility model;
[0022] Figure 2 This is a front view of the cold plate module of this utility model;
[0023] Figure 3 This is a front view of the heat dissipation structure in this utility model;
[0024] Figure 4 This is a schematic diagram of the back of the heat dissipation structure in this utility model;
[0025] Figure 5 for Figure 4 A magnified view of part A in the middle.
[0026] Explanation of reference numerals in the attached figures:
[0027] 10. Cold-rolled steel plate; 11. Mounting groove;
[0028] 20. Heat pipe;
[0029] 30. Copper adapter plate;
[0030] 40. High-heat chip;
[0031] 50. PCB board;
[0032] 60. Cover plate;
[0033] 70. Connector;
[0034] 80. Puller;
[0035] 90. Guide connecting unit; 91. Guide sleeve; 92. Locking strip;
[0036] 100. Chassis; 101. Heat sink. Detailed Implementation
[0037] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. The drawings illustrate preferred embodiments of this utility model. However, this utility model can be implemented in many other different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.
[0038] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.
[0039] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0040] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.
[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0042] It should also be noted that in the embodiments of this application, the same reference numerals are used to represent the same component or part. For the same part in the embodiments of this application, the reference numerals may only be used to mark one part or component as an example. It should be understood that the reference numerals are also applicable to other identical parts or components.
[0043] Reference Figure 1 and Figure 2 This application provides a cold plate module that meets the standard 3U & 6U size, including a cold plate 10, a heat pipe 20, an adapter copper sheet 30, a high-heat chip 40, a PCB board 50 and a cover plate 60; the 3U & 6U cold plate module refers to a cold plate module that meets the standard 3U and 6U size.
[0044] The heat pipe 20 is soldered into the mounting groove 11 of the cold plate 10; the high-heat chip 40 is surface-mounted on the PCB board 50, and the adapter copper sheet 30 is mounted on the cold plate 10. Specifically, the high-heat chip 40 is fixed to the PCB board 50 by soldering; the adapter copper sheet 30 is fixed to the cold plate 10 by screws, and the PCB board 50 is fixed to the cold plate 10 by screws. The upper and lower sides of the adapter copper sheet 30 abut against the high-heat chip 40 and the heat pipe 20 respectively, ensuring that the upper and lower sides of the adapter copper sheet 30 are in close contact with the high-heat chip 40 and the heat pipe 20 respectively, so that the heat of the high-heat chip 40 can be well conducted to the heat pipe 20 through the adapter copper sheet 30; the cover plate 60 is fixed on the cold plate 10, and the PCB board 50 is arranged in the mounting cavity formed by the cold plate 10 and the cover plate 60.
[0045] This utility model has a built-in heat pipe 20, which can quickly transfer the heat generated by the high-heat chip 40, resulting in better heat conduction and heat dissipation.
[0046] Furthermore, this invention brazes the heat pipe 20 into the cold plate 10 and extends it to the locking strip 92, ensuring the VITA 48.2 standard dimensions while effectively transferring heat to the area where the locking strip 92 is located. That is, the heat generated by the high-heat chip 40 can be dissipated through the outer wall of the cold plate 10 and can also be quickly conducted to the outer casing 100 through the area where the locking strips 92 are located on both sides of the cold plate 10, and then dissipated through the outer casing 100. Compared with the traditional cold plate module, this invention has better heat conduction and heat dissipation.
[0047] In some embodiments, the cold plate module further includes a connector 70, which is pressed onto the PCB board 50 and electrically connected to the components on the PCB board 50; the connector 70 is provided with multiple interfaces, including power interfaces and signal interfaces, to facilitate electrical connection between the PCB board 50 and external boards and signal output.
[0048] In some embodiments, the cold plate module further includes a puller 80, which is fixedly mounted on the cold plate 1 by screws. The addition of the puller 80 makes it easier for the user to remove the current cold plate module that meets the standard 3U & 6U size from the outer housing 100.
[0049] In some embodiments, the cold plate module further includes a guide connection unit 90, which includes two guide sleeves 91 and two locking strips 92;
[0050] Both guide sleeves 91 are fixed to the PCB board 50 with screws, and the two locking strips 92 are fixed to opposite sides of the cold plate 10. A protrusion is provided on the inner bottom surface of the slot on the outer housing 100 corresponding to the position of the guide sleeve 91. The guide sleeve 91 and the corresponding protrusion are adapted to guide and position the current cold plate module. The two locking strips 92 are provided with locking parts to fix the current cold plate module in the slot of the outer housing 100.
[0051] In some embodiments, there are two heat pipes 20, with one end of each heat pipe 20 located in the middle of the cold plate 10 and the other end extending toward the two locking strips 92, respectively, to achieve heat conduction from the middle of the cold plate 10 to the area where the two locking strips 92 are located.
[0052] In some embodiments, the heat pipe 20 is L-shaped or C-shaped.
[0053] In some embodiments, the number of high-heat chips 40 is one, and the high-heat chip 40 is a CPU.
[0054] In some embodiments, the number of high-heat chips 40 is two, and the two high-heat chips 40 are a CPU and a GPU, respectively.
[0055] In some embodiments, thermal grease is coated on the surface of the adapter copper sheet 30 and / or the high-temperature chip 40.
[0056] The following example illustrates the use of the cold plate module:
[0057] Example 1: For VPX computers;
[0058] The heat generated during VPX computer operation mainly originates from the CPU, GPU, and power supply module. Therefore, addressing the heat accumulation at the CPU, GPU, and power supply module locations is sufficient to ensure stable and reliable operation of the VPX computer. The CPU and GPU within the VPX computer are designated as two high-heat-generating chips 40 in this invention.
[0059] Based on the above, the internal components of the VPX computer are first rationally arranged. Both the CPU and GPU are placed within the cold plate module. The main heat transfer points between the cold plate module and the VPX computer chassis are the two locking strips 92 on both sides of the cold plate 10. When designing the VPX computer, the positions of the CPU and GPU need to be clearly defined first. After determining the positions, heat pipe slots are created in the projection area of the high-heat chip 40 on the cold plate 10, and heat pipes 20 are embedded into the cold plate 10 using brazing to reduce thermal resistance. Simultaneously, another section of the heat pipe 20 is extended to the area where the locking strips 92 are located. The more area covered by heat pipes in the area where the locking strips 92 are located, the better, while also considering manufacturing processes. A copper adapter plate (i.e., adapter copper plate 30) is installed between the PU and GPU and the cold plate 10. The copper adapter plate and the cold plate 10 are fastened together with screws. Thermal grease is applied between the CPU and GPU and the copper adapter plate. After actual measurement and verification, after the thermal grease is applied to the heat pipe 20 at a height of 3 mm and a width of 8 mm, the temperature difference between the CPU and GPU core temperature and the area where the locking strip 92 is located in the cold plate module is less than 8°C. In the cold plate module without heat pipe 20, the temperature difference between the CPU and GPU core temperature and the area where the locking strip 92 is located reaches 17°C. Therefore, the solution of this utility model greatly improves the heat transfer efficiency and ensures the standardization of each module.
[0060] Reference Figures 3 to 5 In another aspect, this utility model also provides a heat dissipation structure, including multiple cold plate modules and a housing 100. The housing 100 has multiple slots, and the multiple cold plate modules are respectively arranged in the multiple slots. A heat dissipation strip 101 is formed on the outer surface of the housing 100. The outer surfaces of the multiple cold plate modules are in direct or indirect contact with the heat dissipation strip 101 to achieve heat conduction.
[0061] The working principle of the heat dissipation structure is as follows:
[0062] First, the heat generated by the high-heat chip 40 during operation is rapidly transferred to the adapter copper plate 30 through conduction. The heat on the adapter copper plate 30 is then rapidly transferred to the heat pipe 20 and the cold plate 10 through conduction. The heat transferred to the heat pipe 20 is then rapidly transferred to the area where the two locking strips 92 are located on both sides of the cold plate 10 through conduction. The heat in the area where the two locking strips 92 are located is transferred to the housing 100 through the part that is in close contact with the housing 100. The heat in the housing 100 is then rapidly transferred to the atmosphere through heat exchange, ultimately achieving the heat dissipation function.
[0063] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Furthermore, the technical solutions of the various embodiments of this utility model can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope claimed by this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.
Claims
1. A cold plate module that meets standard 3U & 6U dimensions, characterized in that, It includes a cold plate (10), a heat pipe (20), a copper adapter sheet (30), a high-heat chip (40), a PCB board (50), and a cover plate (60); The heat pipe (20) is laid in the mounting groove (11) opened in the cold plate (10); the high-heat chip (40) is surface-mounted on the PCB board (50), the adapter copper sheet (30) is installed on the cold plate (10), the PCB board (50) is fixedly installed on the cold plate (10), and the upper and lower sides of the adapter copper sheet (30) abut against the high-heat chip (40) and the heat pipe (20) respectively; the cover plate (60) is fixed on the cold plate (10), and the PCB board (50) is arranged in the mounting cavity formed by the cold plate (10) and the cover plate (60).
2. The cold plate module meeting standard 3U & 6U dimensions according to claim 1, characterized in that, It also includes a connector (70) that is crimped onto the PCB board (50) and electrically connected to components on the PCB board (50).
3. The cold plate module meeting standard 3U & 6U dimensions according to claim 1, characterized in that, It also includes a puller (80), which is fixedly mounted on the cold plate (1).
4. The cold plate module meeting standard 3U & 6U dimensions according to claim 1, characterized in that, It also includes a guide connection unit (90), which includes two guide sleeves (91) and two locking bars (92); Both guide sleeves (91) are fixed on the PCB board (50), and the two locking strips (92) are fixed on opposite sides of the cold plate (10).
5. The cold plate module meeting standard 3U & 6U dimensions according to claim 4, characterized in that, The number of heat pipes (20) is two. One end of the two heat pipes (20) is arranged in the middle of the cold plate (10), and the other end extends to the two locking strips (92) respectively, so as to realize the heat conduction from the middle of the cold plate (10) to the two locking strips (92).
6. The cold plate module meeting standard 3U & 6U dimensions according to claim 1, characterized in that, The heat pipe (20) is L-shaped or C-shaped.
7. The cold plate module meeting standard 3U & 6U dimensions according to claim 1, characterized in that, The number of high-heat chips (40) is one, and the high-heat chip (40) is a CPU.
8. The cold plate module meeting standard 3U & 6U dimensions according to claim 1, characterized in that, The number of high-heat chips (40) is two, namely CPU and GPU.
9. The cold plate module meeting standard 3U & 6U dimensions according to claim 1, characterized in that, The surfaces of the adapter copper sheet (30) and / or the high-temperature chip (40) are coated with thermal grease.
10. A heat dissipation structure, characterized in that, The device includes a plurality of cold plate modules as described in any one of claims 1 to 9 and a housing (100). The housing (100) has a plurality of slots, and the plurality of cold plate modules are respectively arranged in the plurality of slots. A heat dissipation strip (101) is formed on the outer side of the housing (100). The outer surfaces of the plurality of cold plate modules are in direct or indirect contact with the heat dissipation strip (101) to achieve heat conduction.