Composite busbar structure with high heat conduction performance

Abstract

The utility model relates to the technical field of power electronics, and discloses a composite busbar structure with high heat conduction performance, which comprises a substrate, a plurality of conductive plates are fixedly arranged on the ground of the substrate, a heat conduction box is fixedly arranged among the conductive plates, heat conduction silica gel is arranged in the heat conduction box, a hollow plate is arranged in the heat conduction box, and the hollow plate is fixedly arranged on the substrate. A fixing seat is fixedly connected to one side of the heat conduction box, an installation assembly is arranged in the fixing seat and comprises telescopic springs, an abutting plate and an installation rod, the two telescopic springs are arranged in the fixing seat, the abutting plate is movably installed in the fixing seat, and the bottom face of the abutting plate is connected with the telescopic springs. According to the utility model, the heat conduction box is arranged among the plurality of conductive plates, and the heat conduction silica gel is arranged in the heat conduction box, so that the overall heat dissipation effect of the device can be enhanced, and heat dissipation parts in the heat conduction box can be conveniently dismounted and maintained through the arrangement of the installation assembly.

Description

A composite busbar structure with high thermal conductivity Technical Field

[0001] This utility model relates to the field of power electronics technology, and in particular to a composite busbar structure with high thermal conductivity. Background Technology

[0002] Composite busbars are suitable for high-performance power electronic equipment, such as frequency converters, inverters, and power supplies, where efficient heat dissipation is required. With the rapid development of power electronics technology, the application of composite busbars in high-performance power electronic equipment is becoming increasingly widespread. Composite busbars not only need to undertake the task of current transmission but also need to have good heat dissipation performance to ensure the stable operation of the equipment. Currently, common heat dissipation methods include using large-area heat sinks and high-efficiency fans for forced cooling. However, although these methods can improve the heat dissipation effect to a certain extent, they still have problems such as low heat dissipation efficiency, complex structure, and high cost. Traditional heat dissipation methods often can only dissipate heat on the surface of the busbar and cannot effectively utilize the internal heat conduction performance of the busbar, resulting in limited heat dissipation effect.

[0003] A search revealed Chinese Patent Publication No. CN213905771U, which discloses a composite busbar device. This device includes a main body with multiple copper busbars. A Hall effect sensor is disposed between each layer of copper busbars. The copper busbars and Hall effect sensors, as well as the Hall effect sensors themselves, are fixed together by heat-pressing with an adhesive insulating film. The copper busbars include a first, second, third, fourth, and fifth copper busbar. The Hall effect sensors are disposed between the first and second copper busbars, between the second and third copper busbars, on the side of the first copper busbar furthest from the second copper busbar, and on the side of the third copper busbar furthest from the second copper busbar. This invention enables the Hall effect sensor to be heat-pressed together with the copper busbars even when the distance between them is less than 0.2 mm, achieving insulation and solving the technical problem that insulation cannot be achieved when the distance between copper busbars is too small.

[0004] The device heat-presses multiple copper busbars together to solve the insulation problem. However, the copper busbars generate a lot of heat when conducting electricity. Under high temperature operation, this will affect the efficiency of current transmission. The device does not have an effective heat dissipation system for the busbars as a whole, which will affect the service life of the busbars. Summary of the Invention

[0005] To overcome the above shortcomings, this utility model provides a composite busbar structure with high thermal conductivity, aiming to improve the problems of poor heat dissipation and complex structure of composite busbars in existing devices.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a composite busbar structure with high thermal conductivity, comprising a substrate, a plurality of conductive plates fixedly installed on the ground of the substrate, a heat-conducting box fixedly installed between the conductive plates, thermally conductive silicone being provided inside the heat-conducting box, a perforated plate being provided inside the heat-conducting box, a fixing seat being fixedly connected to one side of the heat-conducting box, and an installation component being provided inside the fixing seat.

[0007] Through the above technical solution: the heat conduction box uses a metal with high thermal conductivity, so it can transfer the heat generated by the conductive plate during operation. The thermally conductive silicone inside can absorb the heat and transfer it upward, thereby improving the overall heat dissipation performance of the device. The surface of the substrate and the conductive sheet are coated with a layer of high thermal conductivity coating, which can further improve the heat conduction performance.

[0008] As a further description of the above technical solution:

[0009] The mounting assembly includes a telescopic spring, a stop plate, and a mounting rod. The two telescopic springs are disposed inside the fixed base. The stop plate is movably mounted inside the fixed base, and the bottom surface of the stop plate is connected to the telescopic springs. The mounting rod is fixedly mounted on the top surface of the stop plate, and the top end of the mounting rod extends upward a certain distance.

[0010] The above technical solution allows the tension spring to push the abutment upwards, thus ensuring the initial position of the abutment and the mounting rod. By allowing the abutment to slide inside the fixed seat, the directionality and stability of the mounting rod during movement can be guaranteed.

[0011] As a further description of the above technical solution:

[0012] A mounting block is fixedly connected to one side of the perforated plate. The bottom surface of the mounting block has a mounting hole, and the mounting rod is inserted into the mounting hole.

[0013] The above technical solution allows for the following: by inserting the mounting rod into the mounting hole, the mounting block can be fixed to one side of the heat conduction box, and the perforated plate can be fixed inside the heat conduction box. By removing the mounting rod from the mounting hole, the perforated plate and the mounting block can be released from their fixed state, thus facilitating the removal and maintenance of the perforated plate.

[0014] As a further description of the above technical solution:

[0015] A connecting block is fixedly connected to one side of the abutment, and a lever is fixedly connected to one side of the connecting block, with the lever positioned on the outside of the fixed base.

[0016] With the above technical solution: the paddle is set on the outside of the fixed base. By pressing down the paddle, the paddle can drive the abutment plate to move down through the connecting block, which makes it easier to adjust the position of the mounting rod.

[0017] As a further description of the above technical solution:

[0018] The fixed base has a movable groove on one side, and the connecting block is movably installed inside the movable groove.

[0019] Through the above technical solution: when the paddle is pressed down, the paddle can drive the connecting block to move inside the moving groove, thereby further ensuring the stability and directionality of the plate during movement.

[0020] As a further description of the above technical solution:

[0021] The heat-conducting box has an installation groove on one side, and the perforated plate extends into the interior of the installation groove.

[0022] The above technical solution allows for the initial positioning of the perforated plate inside the heat conduction box by extending the perforated plate into the installation groove, thus preventing the perforated plate from tilting or deviating during installation.

[0023] As a further description of the above technical solution:

[0024] The inner wall of the heat conduction box is provided with a positioning hole, and a positioning rod is fixedly connected to one side of the hollow plate, and the positioning rod is inserted into the positioning hole.

[0025] The above technical solution allows for the initial positioning of the perforated plate by inserting the positioning rod into the positioning hole, thus ensuring the stability of the perforated plate installed inside the heat conduction box.

[0026] As a further description of the above technical solution:

[0027] The substrate has multiple heat pipes inside and multiple heat dissipation fins installed on the bottom surface of the substrate.

[0028] The above technical solution involves adding a thermally conductive medium inside the heat pipe. This medium absorbs the heat generated by the substrate during operation, and the heat is dissipated through external natural or forced convection. Combined with heat dissipation fins, the heat dissipation area is increased, further improving the overall heat dissipation effect of the device.

[0029] This utility model has the following beneficial effects:

[0030] 1. This utility model features a heat-conducting box positioned between multiple conductive plates, with thermally conductive silicone inside the box. The silicone absorbs the heat generated by the substrate and conductive plates during operation, and the absorbed heat is discharged to the outside through a perforated plate on the top of the box. This enhances the overall heat dissipation performance of the device. Furthermore, the installation assembly allows for the removal of the perforated plate, facilitating the cleaning of dust adhering to its surface and ensuring proper heat dissipation from the heat-conducting box. Removing the perforated plate also allows for the replacement of the internal thermally conductive silicone, further enhancing the device's practicality.

[0031] 2. This utility model has a heat pipe installed inside the substrate, with one end of the heat pipe extending to the outside. By installing heat-conducting oil inside the heat pipe, the extended part can quickly remove heat through natural convection or forced convection, further enhancing the heat dissipation effect. By installing multiple heat dissipation fins on the bottom surface of the substrate, the overall heat dissipation effect of the device can be further improved. Attached Figure Description

[0032] Figure 1 is a three-dimensional structural diagram of a composite busbar structure with high thermal conductivity proposed in this utility model;

[0033] Figure 2 is a bottom view of a composite busbar structure with high thermal conductivity proposed in this utility model.

[0034] Figure 3 is a cross-sectional view of the fixing seat of a composite busbar structure with high thermal conductivity proposed in this utility model.

[0035] Figure 4 is a schematic diagram of the mounting hole positions of a composite busbar structure with high thermal conductivity proposed in this utility model.

[0036] Figure 5 is a schematic diagram of the positioning hole position structure of a composite busbar structure with high thermal conductivity proposed in this utility model.

[0037] Legend:

[0038] 1. Substrate; 2. Conductive plate; 3. Heat conduction box; 4. Perforated plate; 5. Heat pipe; 6. Mounting block; 7. Fixing base; 8. Heat dissipation fins; 9. Moving slot; 10. Mounting slot; 11. Thermal conductive silicone; 12. Positioning hole; 13. Mounting hole; 14. Positioning rod; 15. Paddle; 16. Connecting block; 17. Mounting assembly; 1701. Telescopic spring; 1702. Support plate; 1703. Mounting rod. Detailed Implementation

[0039] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0040] Referring to Figures 1 and 5, one embodiment of the present invention is provided: a composite busbar structure with high thermal conductivity, including a substrate 1, a plurality of conductive plates 2 fixedly installed on the ground of the substrate 1, a heat conduction box 3 fixedly installed between the conductive plates 2, thermally conductive silicone 11 provided inside the heat conduction box 3, a hollow plate 4 provided inside the heat conduction box 3, a fixing seat 7 fixedly connected to one side of the heat conduction box 3, and an installation component 17 provided inside the fixing seat 7.

[0041] Specifically, both the substrate 1 and the conductive plate 2 are made of high thermal conductivity materials, such as copper or aluminum. Gaps are left between multiple conductive plates 2, and the heat conduction box 3 is placed between these gaps. The heat conduction box 3 is made of a material with good thermal conductivity. When the conductive plate 2 generates heat during the conduction process, the heat is transferred to the surface of the heat conduction box 3. The heat generated during operation can be absorbed by the thermally conductive silicone 11 inside the heat conduction box 3. The absorbed heat can be dissipated upwards through the opening of the top perforated plate 4, thereby enhancing the overall heat dissipation performance of the device. Furthermore, the perforated plate 4 enhances the ventilation inside the heat conduction box 3, and the heat dissipation effect of the heat conduction box 3 can be further enhanced through natural convection.

[0042] Referring to Figure 3, the mounting assembly 17 includes a telescopic spring 1701, a stop plate 1702, and a mounting rod 1703. The two telescopic springs 1701 are disposed inside the fixed base 7. The stop plate 1702 is movably mounted inside the fixed base 7, and the bottom surface of the stop plate 1702 is connected to the telescopic springs 1701. The mounting rod 1703 is fixedly mounted on the top surface of the stop plate 1702, and the top end of the mounting rod 1703 extends upward a certain distance.

[0043] Specifically, the upward-extending portion of the mounting rod 1703 is inserted into the interior of the fixing base 7, and the insertion end of the mounting rod 1703 is movably connected to the fixing base 7. This allows the abutment plate 1702 to be pressed down, and the abutment plate 1702 can drive the mounting rod 1703 to move downward. The abutment plate 1702 contacts the inner wall of the fixing base 7, and the abutment plate 1702 is slidably connected to the inner wall of the fixing base 7. This ensures the stability and directionality of the abutment plate 1702 when it moves downward, while also ensuring the directionality of the mounting rod 1703 when it moves downward, preventing the mounting rod 1703 from deviating during its downward movement.

[0044] Referring to Figures 3 and 4, a mounting block 6 is fixedly connected to one side of the hollow plate 4. The bottom surface of the mounting block 6 has a mounting hole 13, and the mounting rod 1703 is inserted into the mounting hole 13. A connecting block 16 is fixedly connected to one side of the abutment plate 1702. A lever 15 is fixedly connected to one side of the connecting block 16, and the lever 15 is located on the outside of the fixing seat 7.

[0045] Specifically, the size and shape of the mounting rod 1703 correspond to the size and shape of the mounting hole 13. When the mounting rod 1703 is inserted into the mounting hole 13, the position of the mounting block 6 can be fixed. After the position of the mounting block 6 is fixed, the perforated plate 4 can be fixedly installed inside the heat conduction box 3. When the mounting rod 1703 is removed from the mounting hole 13, the fixed state of the mounting block 6 can be released. At this time, the mounting block 6 can be pulled outward, and the perforated plate 4 can be pulled out from the inside of the heat conduction box 3. After the perforated plate 4 is pulled out, the dust adhering to its surface can be cleaned to ensure the heat dissipation effect of the heat conduction box 3. At the same time, it is also convenient to replace the thermal conductive silicone 11 inside the heat conduction box 3, ensuring the subsequent heat dissipation effect and increasing the practicality of this device. The lever 15 is set on the outside of the fixed base 7. By moving the lever 15, the lever 15 can press down the abutment plate 1702 through the connecting block 16. The abutment plate 1702 can then drive the mounting rod 1703 to move down.

[0046] Referring to Figure 1, a movable groove 9 is provided on one side of the fixed base 7, and the connecting block 16 is movably installed inside the movable groove 9;

[0047] Specifically, when the paddle 15 is turned, the paddle 15 can drive the connecting block 16 to move inside the moving groove 9, thereby ensuring the stability of the abutment 1702 when it moves.

[0048] Referring to Figures 4 and 5, a mounting groove 10 is provided on one side of the heat conduction box 3, and the hollow plate 4 extends into the interior of the mounting groove 10; a positioning hole 12 is provided on the inner wall of the heat conduction box 3, and a positioning rod 14 is fixedly connected to one side of the hollow plate 4, and the positioning rod 14 is inserted into the interior of the positioning hole 12.

[0049] Specifically, the size and shape of the positioning rod 14 are relative to the size and shape of the positioning hole 12. The perforated plate 4 can be inserted into the mounting groove 10, so that the perforated plate 4 can be installed inside the heat conduction box 3. After the heat conduction plate is installed inside the heat conduction box 3, the position of the positioning rod 14 can be aligned with the positioning hole 12. At this time, the perforated plate 4 can be continuously pushed, so that the positioning rod 14 can be inserted into the positioning hole 12, and the perforated plate 4 can be initially installed inside the heat conduction box 3.

[0050] Referring to Figures 1 and 2, the substrate 1 has multiple heat pipes 5 inside, and multiple heat dissipation fins 8 are installed on the bottom surface of the substrate 1.

[0051] Specifically, one end of the heat pipe 5 extends out of the outer side of the substrate 1. In use, the interior of the heat pipe 5 can be filled with a heat-conducting medium, such as liquid metal or heat-conducting oil. Through natural convection with the external environment via the extended end of the heat pipe 5 or through forced convection from the outside, the heat-conducting medium inside the heat pipe 5 can be cooled. At the same time, the heat-conducting medium inside the heat pipe 5 can absorb heat from the substrate 1, thereby further enhancing the overall heat dissipation effect of the device. By setting the heat dissipation fins 8, the heat dissipation area of ​​the substrate 1 can be increased, further improving the overall heat dissipation effect of the device.

[0052] Working principle: When using this device, the substrate 1 can be installed in a designated position. By filling the heat pipe 5 with a heat-conducting medium, the heat-conducting medium can absorb the heat generated by the substrate 1 during operation. Through natural or forced convection at the extension end of the heat pipe 5, the heat-conducting medium inside the heat pipe 5 can be cooled, increasing the heat dissipation effect of the substrate 1. The heat dissipation fins 8 can increase the heat dissipation area of ​​the substrate 1. The heat-conducting box 3 can transfer the heat generated by the conductive plate 2 during operation. The heat-conducting silicone 11 inside the heat-conducting box 3 can absorb the heat. The heat can be discharged to the outside through the opening of the top hollow plate 4.

[0053] By moving the lever 15, the lever 15 can drive the abutment 1702 to move inside the fixed base 7 via the connecting block 16. When the abutment 1702 moves, it can drive the mounting rod 1703 to move, disengaging the mounting rod 1703 from the inside of the mounting hole 13, thus releasing the fixing state of the mounting block 6. At this time, the mounting block 6 can be pulled outward, and the perforated plate 4 can be pulled out from the inside of the heat conduction box 3. The removed perforated plate 4 makes it easy to clean the dust adhering to its surface and to replace the thermal conductive silicone 11 inside the heat conduction box 3. When using this device, it increases the overall heat dissipation performance of the device and also facilitates the maintenance of the heat dissipation components.

[0054] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A composite busbar structure with high thermal conductivity, comprising a substrate (1), characterized in that: Multiple conductive plates (2) are fixedly installed on the ground of the substrate (1). A heat-conducting box (3) is fixedly installed between the conductive plates (2). The heat-conducting box (3) is provided with thermal conductive silicone (11) inside. The heat-conducting box (3) is provided with a hollow plate (4) inside. A fixing seat (7) is fixedly connected to one side of the heat-conducting box (3). An installation component (17) is provided inside the fixing seat (7).

2. The composite busbar structure with high thermal conductivity according to claim 1, characterized in that: The mounting assembly (17) includes a telescopic spring (1701), a stop plate (1702), and a mounting rod (1703). The two telescopic springs (1701) are disposed inside the fixed base (7). The stop plate (1702) is movably mounted inside the fixed base (7), and the bottom surface of the stop plate (1702) is connected to the telescopic springs (1701). The mounting rod (1703) is fixedly mounted on the top surface of the stop plate (1702), and the top end of the mounting rod (1703) extends upward a certain distance.

3. The composite busbar structure with high thermal conductivity according to claim 2, characterized in that: A mounting block (6) is fixedly connected to one side of the hollow plate (4). The bottom surface of the mounting block (6) is provided with a mounting hole (13), and the mounting rod (1703) is inserted into the mounting hole (13).

4. The composite busbar structure with high thermal conductivity according to claim 2, characterized in that: A connecting block (16) is fixedly connected to one side of the abutment (1702), and a lever (15) is fixedly connected to one side of the connecting block (16), and the lever (15) is located on the outside of the fixed seat (7).

5. A composite busbar structure with high thermal conductivity according to claim 1, characterized in that: The fixed base (7) has a movable groove (9) on one side, and the connecting block (16) is movably installed inside the movable groove (9).

6. The composite busbar structure with high thermal conductivity according to claim 1, characterized in that: The heat-conducting box (3) has an installation groove (10) on one side, and the hollow plate (4) extends into the interior of the installation groove (10).

7. The composite busbar structure with high thermal conductivity according to claim 1, characterized in that: The inner wall of the heat-conducting box (3) is provided with a positioning hole (12), and a positioning rod (14) is fixedly connected to one side of the hollow plate (4), and the positioning rod (14) is inserted into the positioning hole (12).

8. The composite busbar structure with high thermal conductivity according to claim 1, characterized in that: The substrate (1) has multiple heat pipes (5) inside and multiple heat dissipation fins (8) installed on the bottom surface of the substrate (1).

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