Photovoltaic power adapter structure of light stacking system

Abstract

The utility model discloses a photovoltaic power adapter structure of a light stacking system. The photovoltaic power adapter structure comprises a plastic back plate, a control plate, a power plate, an aluminum alloy heat dissipation shell, a plastic bottom cover, a plastic upper cover, an output power cable and an input power cable. The whole aluminum alloy heat dissipation shell is in a groove shape, the plastic back plate, the plastic upper cover and the plastic bottom cover are all installed on the aluminum alloy heat dissipation shell and form a containing space, the control plate and the power plate are arranged in the containing space, the power plate is an aluminum substrate, and the power plate is fixed to the aluminum alloy heat dissipation shell in a screw fastening mode. The smooth back face of the power board is tightly attached to the aluminum alloy heat dissipation shell, the power board is electrically connected with the control board, the output power cable and the input power cable are arranged on the plastic bottom cover, and a sponge sealing ring for protection is arranged at the position of a dial switch of the control board. The whole structure is simple, only one set of plastic mold and one set of profile mold are needed, and the earlier-stage investment cost can be saved.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic power adapter technology, and in particular to a structure of a photovoltaic power adapter for a cascaded photovoltaic system. Background Technology

[0002] The structure of the photovoltaic power adapter in the existing base station photovoltaic system is generally as follows: all circuits are mounted on a single fiberglass PCB board. The heat-generating semiconductor devices conduct internal heat through their own plastic shells, and then the heat is transferred to the aluminum alloy heat sink in the outer shell through thermal conductive materials such as thermal grease and insulating ceramics to complete the heat dissipation. The outer shell includes a plastic shell and an aluminum alloy heat sink. From a cross-sectional perspective, the whole structure is a stacked structure including: aluminum alloy heat sink, plastic shell, potting compound, circuit board, plastic shell, and metal mounting plate. Existing photovoltaic power adapters have the following drawbacks: 1. Numerous and complex molds are required, leading to high mold-making costs; 2. The components are nested and layered, resulting in complex processing techniques, high processing difficulty, and difficulties in quality control, production of defective products, and after-sales repair; 3. The single-layer circuit board structure design results in a large design size; 4. Thermal conductivity relies on semiconductor encapsulation materials, which have poor thermal conductivity, and the complex heat dissipation principle and structure affect product performance and lifespan; 5. Thermal conductivity depends on potting compound, requiring high-quality potting process and high-performance potting compound, and controlling the leakage prevention during production is difficult.

[0003] Therefore, existing technologies have shortcomings and need to be improved. Utility Model Content

[0004] The purpose of this invention is to overcome at least some of the shortcomings of the prior art and to provide a photovoltaic power adapter structure for a cascaded photovoltaic system.

[0005] The technical solution of this utility model is as follows: This utility model provides a photovoltaic power adapter structure for a photovoltaic system, including: a plastic back plate, a control board, a power board, an aluminum alloy heat sink, a plastic bottom cover, a plastic top cover, an output power cable, and an input power cable;

[0006] The aluminum alloy heat sink is generally groove-shaped. The plastic back plate, plastic top cover, and plastic bottom cover are all installed on the aluminum alloy heat sink and form an accommodating space. The control board and power board are disposed in the accommodating space. The power board is an aluminum substrate and is fixed to the aluminum alloy heat sink by screws. The smooth back of the power board is in close contact with the aluminum alloy heat sink. The power board is electrically connected to the control board. The output power cable and input power cable are disposed on the plastic bottom cover. The control board has a sponge sealing ring for protection at the DIP switch. A first sponge sealing gasket is provided between the plastic bottom cover and the aluminum alloy heat sink. A second sponge sealing gasket is provided between the plastic top cover and the aluminum alloy heat sink. The accommodating space is filled with thermally conductive potting compound.

[0007] Furthermore, the plastic bottom cover includes a first bottom cover and a second bottom cover connected by ultrasonic welding, and the first bottom cover and the second bottom cover respectively have matching bottom cover grooves and bottom cover protrusions at the connection point.

[0008] Furthermore, the aluminum alloy heat sink has several track holes, and the plastic bottom cover and the plastic top cover are fixed to the aluminum alloy heat sink by rivets set in the track holes.

[0009] Furthermore, a number of heat dissipation fins are formed on the aluminum alloy heat sink.

[0010] Furthermore, the plastic back plate has Z-shaped guide rail mounting holes.

[0011] Furthermore, the control board and the power board are fixed together by screws. The power board is provided with a socket, and the control board is electrically connected to the socket of the power board by means of pins.

[0012] The advantages of this utility model using the above solution are as follows: 1. The overall structure is simplified, requiring only one set of plastic mold and one set of profile mold, which can save on initial investment costs. 2. Apart from potting compound used to meet sealing and protection requirements, there are no other adhesive application processes or layering assembly processes. The process is visible to the naked eye, facilitating quality process inspection and control, and making it convenient for repairing defective products and after-sales products, which is beneficial for cost control in the production process and after-sales service. 3. The power board and control board are designed separately. The two circuit boards are rationally designed and laid out to achieve efficient use of the space between the two boards, effectively improving the power density design of the whole machine. While achieving miniaturization of the whole machine design, it also saves the amount of potting compound to be added, which is beneficial for saving unit cost and transportation cost. 4. The semiconductor heating device conducts core heat to the aluminum-based power board through its own metal electrodes, and then the aluminum-based power board directly transfers it to the aluminum alloy heat sink. Finally, the heat is radiated into the air through the aluminum alloy heat sink. The thermal conductivity is extremely high, maximizing the superior performance of the semiconductor device, possessing high reliability, easily coping with complex external working environments, and enhancing the design and service life of the whole machine. 5. Its excellent thermal conductivity eliminates the need for specific requirements on the thermal conductivity and filler fullness of the potting compound material; only sealing and waterproofing are required. This reduces costs in material selection and manufacturing processes. 6. The introduction of a sponge sealing ring solves the problem of leak-proof potting compound with minimal material and processing costs. 7. The aluminum alloy heat sink provides a stable, encapsulating structure and exhibits excellent drop resistance. Attached Figure Description

[0013] Figure 1 This is a structural schematic diagram of an embodiment of the present utility model.

[0014] Figure 2 This is an exploded view of an embodiment of the present invention.

[0015] Figure 3 A cross-sectional view of an embodiment of the present utility model. Figure 1 .

[0016] Figure 4 This is a schematic diagram of the aluminum alloy heat sink, power board, and control board according to an embodiment of the present invention.

[0017] Figure 5 A cross-sectional view of an embodiment of the present utility model. Figure 2 .

[0018] Figure 6 for Figure 5 Enlarged view of point A in the middle.

[0019] Figure 7 for Figure 5 Enlarged view of point B in the middle.

[0020] Figure 8 This is a schematic diagram of the installation of the plastic top cover and the sponge sealing gasket according to an embodiment of the present invention. Detailed Implementation

[0021] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0022] Please refer to the following: Figures 1 to 8 In this embodiment, the present invention provides a photovoltaic power adapter structure for a photovoltaic system, including: a plastic back plate 1, a control board 2, a power board 3, an aluminum alloy heat sink 4, a plastic bottom cover (including 5 and 13), a plastic top cover 7, an output power cable 10, and an input power cable 11.

[0023] The aluminum alloy heat sink 4 is generally groove-shaped and is made of aluminum alloy profile. The plastic backplate 1, plastic top cover 7, and plastic bottom cover are all mounted on the aluminum alloy heat sink 4 to form an accommodating space. The control board 2 and power board 3 are disposed within the accommodating space. The power board 3 is an aluminum substrate, and the control board 2 is a fiberglass board. The power board 3 is fixed to the aluminum alloy heat sink 4 by screws, and the smooth back of the power board 3 is in close contact with the surface 402 of the aluminum alloy heat sink 4. The power board 3 is electrically connected to the control board 2. The output power cable 10 and the input power cable 11 are disposed on the plastic bottom cover. A sponge sealing ring 6 is provided at the DIP switch 202 of the control board 2 for protection to prevent the glue applied later from seeping in. A first sponge sealing gasket 9 is provided between the plastic bottom cover and the aluminum alloy heat sink 4, and a second sponge sealing gasket 8 is provided between the plastic top cover 7 and the aluminum alloy heat sink 4. The accommodating space is filled with sealant 12, and the sponge sealing gaskets can prevent glue leakage.

[0024] Furthermore, the plastic bottom cover includes a first bottom cover 5 and a second bottom cover 13 connected by ultrasonic welding, and the first bottom cover 5 and the second bottom cover 13 have matching bottom cover grooves and bottom cover protrusions at the connection point to ensure good positioning and connection performance. The first bottom cover 5 and the second bottom cover 13 cooperate to clamp the output power cable 10 and the input power cable 11.

[0025] Furthermore, the aluminum alloy heat sink 4 has a plurality of track holes 401 formed thereon. The plastic bottom cover and the plastic top cover 7 are riveted and fixed to the aluminum alloy heat sink 4 by rivets 701 set on the track holes 401. The plastic back plate 1 is fixed to the aluminum alloy heat sink 4 by screw fastening.

[0026] Furthermore, the aluminum alloy heat sink 4 has a plurality of heat dissipation fins 403 formed on it, which can increase the contact area with air and effectively improve the heat conduction and heat dissipation effect.

[0027] Furthermore, the plastic back plate 1 has Z-shaped guide rail mounting holes 101, which facilitates the subsequent installation process by first fixing the screws and then sliding them into the screw positions through the mounting holes 101 before tightening them, thus simplifying the installation and fixing steps and reducing the difficulty of on-site construction.

[0028] Furthermore, the control board 2 and the power board 3 are fixed together by screws. The power board 3 is provided with a socket 301. The control board 2 achieves electrical connection with the power board 3 by the cooperation of the pins provided at the socket 201 with the socket 301.

[0029] The power adapter of this solution is assembled as follows: the power board 3 is installed and fixed to the aluminum alloy heat sink 4; the components formed by the input power cable 11, output power cable 10, plastic bottom shell 5 and 13 are connected to the sponge sealing ring 9 and the aluminum alloy heat sink 4; the OT type terminals of the input power cable 11 and output power cable 10 are fixed to the four power terminals of the power board 3 by screws; the control board 2 is connected and fixed to the power board 3; the plastic top cover 7 is connected to the sponge sealing ring 8 and the aluminum alloy heat sink 4; potting compound is added to the potting compound filling space 12; the plastic back plate 1 is installed and fixed to the aluminum alloy heat sink 4.

[0030] In summary, the beneficial effects of this solution are as follows: 1. The overall structure is simplified, requiring only one set of plastic mold and one set of profile mold, saving initial investment costs. 2. Apart from potting compound used to meet sealing and protection requirements, there are no other adhesive application processes or layering assembly processes. The process is visible to the naked eye, facilitating quality process inspection and control, and simplifying the repair of defective products and after-sales items, thus contributing to cost control in both production and after-sales processes. 3. The power board and control board are designed separately. The two circuit boards are rationally laid out to achieve efficient utilization of the space between them, effectively improving the overall power density design. While achieving miniaturization of the overall design, it also saves on the amount of potting compound needed, which helps save on unit costs and transportation costs. 4. The semiconductor heating device conducts core heat to the aluminum-based power board through its own metal electrodes, and then the aluminum-based power board directly transfers the heat to the aluminum alloy heat sink. Finally, the heat is radiated into the air through the aluminum alloy heat sink, resulting in extremely high thermal conductivity. This maximizes the superior performance of the semiconductor device, ensuring high reliability, easily handling complex external working environments, and enhancing the overall design and service life of the device. 5. Its excellent thermal conductivity eliminates the need for specific requirements on the thermal conductivity and filler fullness of the potting compound material; only sealing and waterproofing are required. This reduces costs in material selection and manufacturing processes. 6. The introduction of a sponge sealing ring solves the problem of leak-proof potting compound with minimal material and processing costs. 7. The aluminum alloy heat sink provides a stable, encapsulating structure and exhibits excellent drop resistance.

[0031] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A stacked optical system photovoltaic power supply adapter structure, characterized by, include: The system comprises a plastic backplate, a control board, a power board, an aluminum alloy heat sink, a plastic bottom cover, a plastic top cover, output power cables, and input power cables. The aluminum alloy heat sink is generally groove-shaped. The plastic backplate, top cover, and bottom cover are all mounted on the aluminum alloy heat sink and form an accommodating space. The control board and power board are disposed within the accommodating space. The power board is an aluminum substrate and is fixed to the aluminum alloy heat sink by screws, with its smooth back surface tightly fitted to the heat sink. The power board is electrically connected to the control board. The output power cables and input power cables are disposed on the plastic bottom cover. A protective sponge sealing ring is provided at the DIP switch of the control board. A first sponge sealing gasket is provided between the plastic bottom cover and the aluminum alloy heat sink, and a second sponge sealing gasket is provided between the plastic top cover and the aluminum alloy heat sink. The accommodating space is filled with thermally conductive potting compound.

2. The stacked optical system photovoltaic power supply adapter structure according to claim 1, characterized in that, The plastic bottom cover includes a first bottom cover and a second bottom cover connected by ultrasonic welding, and the first bottom cover and the second bottom cover have matching bottom cover grooves and bottom cover protrusions at the connection point, respectively.

3. The photovoltaic power adapter structure for a tandem photovoltaic system according to claim 1, characterized in that, The aluminum alloy heat sink has several track holes, and the plastic bottom cover and plastic top cover are fixed to the aluminum alloy heat sink by rivets set in the track holes.

4. The photovoltaic power adapter structure for a tandem photovoltaic system according to any one of claims 1 to 3, characterized in that, The aluminum alloy heat sink has several heat dissipation fins formed on it.

5. The photovoltaic power adapter structure for a tandem photovoltaic system according to any one of claims 1 to 3, characterized in that, The plastic backplate has Z-shaped guide rail mounting holes.

6. The photovoltaic power adapter structure for a tandem photovoltaic system according to any one of claims 1 to 3, characterized in that, The control board and the power board are fixed together by screws. The power board is provided with a socket, and the control board is electrically connected to the socket of the power board by means of pins.

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