Adjustable special-shaped module forming die

By adjusting the thickness of the heat sink and setting structures such as clearance grooves and venting grooves using an adjustable irregular module forming mold, the problem of difficulty in determining the thickness of the heat sink caused by substrate production tolerances is solved, and stable heat dissipation performance and component protection are achieved.

CN224197121UActive Publication Date: 2026-05-05SHANDONG SENSPIL SEMICON CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHANDONG SENSPIL SEMICON CO LTD
Filing Date
2025-03-06
Publication Date
2026-05-05

AI Technical Summary

Technical Problem

In the production process of existing irregular molds, the thickness of the heat sink is difficult to determine due to the large production tolerance of the product substrate. This results in the heat sink being too thin to be exposed or too thick to compress the components, affecting heat dissipation performance and causing damage to the components.

Method used

An adjustable irregular-shaped module forming mold is adopted. By inserting shims into the shim groove, the distance between the heat sink and the lower inlay surface is adjusted to control the thickness of the heat sink. The mold is also equipped with clearance grooves, venting grooves and vacuum suction grooves to prevent the substrate pins from being crushed and the components from being damaged.

Benefits of technology

Effective control of heat sink thickness prevents degradation of heat dissipation performance and damage to components, ensuring the stability and precision of substrate production.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of special-shaped module forming dies, and discloses an adjustable special-shaped module forming die which comprises a lower die pressing plate, an upper die pressing plate is arranged above the lower die pressing plate, a base plate and the lower die pressing plate are arranged between the lower die pressing plate and the upper die pressing plate, two lower inlaying holes are formed in the bottom face of the lower die pressing plate, and two lower inlaying holes are formed in the bottom face of the lower die pressing plate. An upper inlaying hole is formed in the top face of the upper mold pressing plate, and a cushion groove is formed in the lower inlaying hole. According to the utility model, the gasket is arranged at the position of the gasket groove, so that the thinner extension part of the lower insert is cushioned on the gasket, and the distance between the radiating fin and the lower insert surface is adjusted by increasing or reducing the gasket, thereby controlling the thickness of the radiating fin, and effectively preventing the problem that the thickness of the radiating fin is difficult to determine due to larger production tolerance of a substrate; the problems that the radiating fins cannot be exposed when being too thin, the radiating performance is influenced, and the radiating fins are too thick to extrude the components, and the components are damaged are solved.
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Description

Technical Field

[0001] This utility model relates to the field of irregular module forming mold technology, and in particular to an adjustable irregular module forming mold. Background Technology

[0002] In modern manufacturing, with the increasing complexity of product design, traditional mold manufacturing methods can no longer meet the requirements for complex shapes and high precision. Especially in industries such as electronics, automobiles and aerospace, the shapes of product parts are becoming more and more diverse, and traditional mold manufacturing processes face many challenges. In order to solve these problems, irregular module molding molds have emerged. These molds use advanced manufacturing technologies, such as 3D printing and laser sintering, which makes the internal water channel design of the mold more flexible and better able to adapt to the needs of complex-shaped products.

[0003] In the production of existing irregularly shaped template products, the thickness of the heat sink is difficult to determine due to the large manufacturing tolerance of the substrate. Thicker substrates have a larger manufacturing tolerance range, while the heat sink needs to be exposed. This results in the following situation: if the heat sink is too thin, the heat sink cannot be exposed; if it is too thick, the heat sink will squeeze the components, thereby causing damage to the components. Therefore, this utility model is proposed. Utility Model Content

[0004] The purpose of this utility model is to address the shortcomings of existing technologies by proposing an adjustable irregular-shaped module forming mold.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] An adjustable irregular-shaped module forming mold includes a lower mold plate, an upper mold plate is provided above the lower mold plate, a base plate is provided between the lower mold plate and the upper mold plate, the lower mold plate has two lower inlay holes on its bottom surface, the upper mold plate has an upper inlay hole on its top surface, and a pad groove is provided inside the lower inlay hole.

[0007] As a further embodiment of this utility model, a lower insert is embedded in the lower insert hole, an upper insert is embedded in the upper insert hole, and an extension is provided at the front end of the lower insert, the extension of the lower insert being embedded in the inside of the pad groove.

[0008] As a further embodiment of this utility model, the bottom surface of the substrate is provided with pins near the left and right ends, and both the top and bottom surfaces of the substrate are fitted with plastic seals. A heat sink is installed on the top surface of the plastic seals, and a clearance groove is provided on the top surface of the lower molding plate at the position corresponding to the pins of the substrate.

[0009] As a further embodiment of this utility model, an exhaust groove is provided on the top surface of the lower molding plate at the position corresponding to the plastic sealant.

[0010] As a further embodiment of this utility model, a vacuum suction groove is provided on the top surface of the lower molding plate at the left and right ends corresponding to the bottom surface of the substrate.

[0011] As a further embodiment of this utility model, a positioning pin seat is installed through the bottom surface of the lower molding plate, and a positioning pin body is detachably installed inside the positioning pin seat. A positioning hole is opened on the base plate at the position corresponding to the positioning pin body, and the positioning pin body is inserted into the positioning hole.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] By inserting shims into the shims at the shims' locations, the thinner extension of the lower insert rests on the shims. The distance between the heat sink and the lower insert surface can be adjusted by adding or removing shims, thereby controlling the thickness of the heat sink. This effectively prevents the heat sink thickness from being difficult to determine due to large substrate manufacturing tolerances, which could result in the heat sink being too thin to be exposed, affecting heat dissipation performance, or the heat sink being too thick, causing it to squeeze components and damage them. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of an adjustable irregular-shaped module forming mold proposed in this utility model;

[0015] Figure 2 This is a three-dimensional disassembled structural diagram of an adjustable irregular-shaped module forming mold proposed in this utility model;

[0016] Figure 3 This is a three-dimensional structural diagram of the lower mold platen of an adjustable irregular-shaped module forming mold proposed in this utility model.

[0017] Figure 4 This is a three-dimensional structural diagram of the groove of an adjustable irregular-shaped module forming mold proposed in this utility model.

[0018] In the diagram: 1. Lower mold plate; 101. Lower insert hole; 102. Pad groove; 103. Lower insert; 104. Clearance groove; 105. Exhaust groove; 106. Vacuum suction groove; 107. Positioning pin seat; 108. Positioning pin body; 2. Upper mold plate; 201. Upper insert hole; 202. Upper insert; 3. Base plate; 301. Molded part; 302. Heat sink; 303. Positioning hole. Detailed Implementation

[0019] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0020] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0021] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," and "connected," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0022] like Figures 1-4 As shown, an adjustable irregular module forming mold includes a lower mold plate 1, an upper mold plate 2 is provided above the lower mold plate 1, a base plate 3 is provided between the lower mold plate 1 and the upper mold plate 2, the lower mold plate 1 has two lower inlay holes 101 on its bottom surface, the upper mold plate 2 has an upper inlay hole 201 on its top surface, and a pad groove 102 is provided inside the lower inlay hole 101.

[0023] like Figures 2-4 As shown, in this embodiment, a lower insert 103 is embedded inside the lower insert hole 101, and an upper insert 202 is embedded inside the upper insert hole 201. The front end of the lower insert 103 is provided with an extension portion, which is embedded inside the pad groove 102. By placing a shim at the position of the pad groove 102, the thinner extension portion of the lower insert 103 is placed on the shim. The distance between the heat sink 302 and the surface of the lower insert 103 is adjusted by increasing or decreasing the shim, thereby controlling the thickness of the heat sink 302. This effectively prevents the heat sink 302 from being difficult to determine due to the large manufacturing tolerance of the substrate 3, which would cause the heat sink 302 to be too thin and unable to be exposed, affecting heat dissipation performance. Conversely, if the heat sink 302 is too thick, it would squeeze the components and cause damage to the components.

[0024] like Figures 2-4As shown in this embodiment, the bottom surface of the substrate 3 is provided with pins near the left and right ends. Both the top and bottom surfaces of the substrate 3 are equipped with molding compounds 301. The top surface of the molding compounds 301 is equipped with heat sinks 302. The top surface of the lower molding plate 1 is provided with a relief groove 104 at the position corresponding to the pins of the substrate 3. By providing the relief groove 104, the pins of the substrate 3 can be avoided, preventing damage to the pins and excess glue on the pins.

[0025] like Figures 2-4 As shown in this embodiment, an exhaust groove 105 is provided on the top surface of the lower mold plate 1 at the position corresponding to the molding compound 301. By providing the exhaust groove 105, gas can be quickly discharged when the molding compound 301 abuts against the lower mold plate 1, so that the molding compound 301 can quickly abut against the top surface of the lower mold plate 1.

[0026] like Figures 2-4 As shown, in this embodiment, the top surface of the lower molding plate 1 is provided with vacuum suction grooves 106 at the left and right ends of the bottom surface of the substrate 3. By setting the vacuum suction grooves 106, it is convenient to use an adsorption device to quickly adsorb and fix the substrate 3.

[0027] like Figures 2-4 As shown in this embodiment, a positioning pin seat 107 is installed through the bottom surface of the lower molding plate 1. A positioning pin body 108 is detachably installed inside the positioning pin seat 107. A positioning hole 303 is opened at the position of the positioning pin body 108 on the substrate 3. The positioning pin body 108 is inserted into the positioning hole 303. The positioning pin body 108 can be used to position the substrate 3 by setting the positioning pin body 108.

[0028] From the above description, it can be seen that the above embodiments of this utility model achieve the following technical effects: By inserting a shim at the position of the shim groove 102, the thinner extension of the lower insert 103 rests on the shim. By increasing or decreasing the shim, the distance between the heat sink 302 and the surface of the lower insert 103 is adjusted, thereby controlling the thickness of the heat sink 302. This effectively prevents the heat sink 302 from being too thin and unable to be exposed due to the large manufacturing tolerance of the substrate 3, thus affecting the heat dissipation performance. 2. Excessive thickness can cause components to be squeezed and damaged. By setting the relief groove 104, the pins of the substrate 3 can be avoided, preventing damage to the pins and excess glue on the pins. By setting the venting groove 105, the molded part 301 can quickly expel gas when it abuts against the lower mold plate 1, so that the molded part 301 can quickly abut against the top surface of the lower mold plate 1. By setting the vacuum suction groove 106, the substrate 3 can be quickly adsorbed and fixed by an adsorption device. By setting the positioning pin body 108, the substrate 3 can be positioned.

[0029] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. An adjustable irregular-shaped module forming mold, comprising a lower mold plate (1), characterized in that, An upper mold plate (2) is provided above the lower mold plate (1), and a base plate (3) is provided between the lower mold plate (1) and the upper mold plate (2). The lower mold plate (1) has two lower inlay holes (101) on its bottom surface, and the upper mold plate (2) has an upper inlay hole (201) on its top surface. A pad groove (102) is provided inside the lower inlay hole (101).

2. The adjustable irregular-shaped module forming mold according to claim 1, characterized in that, The lower insert (103) is embedded in the lower insert hole (101), the upper insert (202) is embedded in the upper insert hole (201), the front end of the lower insert (103) is provided with an extension, and the extension of the lower insert (103) is embedded in the inside of the pad groove (102).

3. The adjustable irregular-shaped module forming mold according to claim 2, characterized in that, The bottom surface of the substrate (3) is provided with pins near the left and right ends. The top and bottom surfaces of the substrate (3) are both equipped with plastic seals (301). The top surface of the plastic seals (301) is equipped with heat sinks (302). The top surface of the lower molding plate (1) is provided with clearance grooves (104) at the positions corresponding to the pins of the substrate (3).

4. The adjustable irregular-shaped module forming mold according to claim 3, characterized in that, The top surface of the lower molding plate (1) is provided with an exhaust groove (105) at the position corresponding to the plastic sealant (301).

5. The adjustable irregular-shaped module forming mold according to claim 4, characterized in that, Vacuum suction grooves (106) are provided on the top surface of the lower molding plate (1) at the left and right ends of the bottom surface of the substrate (3).

6. The adjustable irregular-shaped module forming mold according to claim 5, characterized in that, The bottom surface of the lower molding plate (1) is through-mounted with a positioning pin seat (107). The positioning pin seat (107) is detachably mounted with a positioning pin body (108). The base plate (3) is provided with a positioning hole (303) at the position corresponding to the positioning pin body (108). The positioning pin body (108) is inserted into the positioning hole (303).