Test auxiliary device of SSD board card

Abstract

The utility model discloses a testing auxiliary device of an SSD board card, and relates to the field of testing devices of SSD board cards. The cold conduction device comprises a bottom plate, a supporting mechanism, a cold conduction mechanism and a placement mechanism, the placement mechanism comprises a second plate body, a threaded hole and two sliding holes are formed in the two sides of the second plate body, an adjusting screw rod, a dovetail groove, a sliding rod and a placement base are arranged, the adjusting screw rod drives the placement base to conduct linear displacement so as to be matched with board cards of different specifications, and the placement mechanism is simple in structure and convenient to use. A sliding rod restrains a moving track to prevent deviation, standardized and high-compatibility assembly of the SSD testing device is achieved, the SSD testing device can be matched with rapid clamping and positioning of SSDs of mainstream specifications, the customization transformation cost is remarkably reduced, adaptive adjustment is completed before testing, only an SSD board card needs to be placed on site, and an adjusting screw rod needs to be locked, so that the SSD testing device is convenient to use. The problems that a traditional testing device is poor in adaptability, low in universality and high in maintenance cost due to rigid positioning of the cooling fins are effectively solved.

Description

Technical Field

[0001] This utility model relates to the field of testing devices for SSD boards, specifically an auxiliary testing device for SSD boards. Background Technology

[0002] Currently, signal integrity verification of NAND Flash chips on SSD boards needs to be performed under business operation. When running business applications, SSDs operate under extreme pressure, significantly increasing their operating temperature. Furthermore, since most test points are often located on the bottom of the SSD, the main controller chip may not receive effective heat dissipation. This can easily lead to the drive failing due to overheating during testing. If effective heat dissipation is not provided in a timely manner, it may cause SSD speed degradation, business interruption, or even SSD failure during testing. Therefore, effective heat dissipation of the SSD during testing is crucial.

[0003] However, current SSD board testing auxiliary devices, such as the "An Auxiliary Device for Testing an SSD Board" application with application number "202421431784.9", use a support column to connect to a base. The upper surface of the fixing plate has nut holes and cable fixing components. The nut holes are connected to the positioning holes of the SSD board under test by screws. The cable fixing components are used to fix the test cables. The fixing plate includes a hollow area with a heat sink embedded in it, which contacts the chip position of the SSD board under test. The base includes multiple fans. Using this device, the fan module can effectively dissipate heat from the chips on the SSD board and fix the SSD board and test cables. However, this application still has significant problems. For example, the heat sink and the fixing plate are rigidly fixed, and their positions are rigidly aligned with the SSD chips. Due to the differences in chip layout and size between different SSD models, the compatibility is poor, causing the hollow slots of the fixing plate to not effectively fit the SSD board. Utility Model Content

[0004] Based on this, the purpose of this utility model is to provide a testing auxiliary device for SSD boards to solve the technical problems of poor compatibility and low versatility of testing devices caused by the rigid correspondence between the heat sink and the SSD chip position.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a testing auxiliary device for an SSD board, comprising a base plate, a support mechanism, a cold conduction mechanism, and a placement mechanism. The placement mechanism includes a second plate, on both sides of which are provided a threaded hole and two sliding holes. An adjusting screw is screwed into the threaded hole, and a sliding rod is slidably connected in the sliding hole.

[0006] The second plate body is arranged in a "C" - shaped structure. The inner end of the adjusting screw rod is rotatably connected with a placement seat through a bearing, and both sides of the placement seat are fixedly connected with slide rods. A dovetail groove is arranged inside the placement seat, and a carrier board of the SSD board card is clamped and slidably engaged in the dovetail groove.

[0007] By adopting the above technical solutions, rapid positioning and stable clamping of the SSD board card are achieved. The dovetail groove structure improves the installation accuracy, and the bearing connection reduces the adjustment resistance.

[0008] Furthermore, the adjusting screw rods of the two placement seats are adjusted by displacement to achieve the adapted loading of multi - specification SSD carrier boards, thereby improving the compatibility of the device.

[0009] By adopting the above technical solutions, bilateral synchronous adjustment adapts to various SSD specifications, significantly improving the versatility of the device.

[0010] Furthermore, a plurality of heat conduction plates are arranged at the bottom of the bottom plate, and a cold conduction mechanism is arranged at the bottom of the plurality of heat conduction plates.

[0011] By adopting the above technical solutions, the heat conduction plates and the cold conduction mechanism cooperate to strengthen the heat dissipation path and improve the heat conduction efficiency.

[0012] Furthermore, the cold conduction mechanism includes an installation frame. A plurality of fixing frames at the same positions as the heat conduction plates are arranged at the top of the installation frame, and the fixing frames are fixedly connected with the heat conduction plates through bolts.

[0013] By adopting the above technical solutions, the bolted connection ensures the stable contact of the cold conduction components and avoids the failure of the thermal interface.

[0014] Furthermore, a liquid - cooled copper tube is arranged inside the installation frame, including at least one of a serpentine winding structure, a multi - loop nested structure, or a spiral coiling structure.

[0015] By adopting the above technical solutions, the multi - structure of the liquid - cooled copper tube adapts to the heat dissipation requirements and enhances the environmental adaptability.

[0016] Furthermore, a support mechanism is arranged between the bottom plate and the placement mechanism. The support mechanism includes a threaded sleeve rod. A first mounting head is arranged at the bottom of the threaded sleeve rod, a screw rod is screwed on the top of the threaded sleeve rod, and a second mounting head is arranged at the top of the screw rod.

[0017] By adopting the above technical solutions, the adjustable - height support mechanism adapts to different test scenarios and improves the flexibility of the device.

[0018] Furthermore, the base plate includes a first plate body, with first mounting holes at the four corners of the top of the first plate body, and a rotating groove in the middle of the top of the first plate body. A rotating plate is rotatably connected to the rotating groove through a damping rotating shaft. Multiple cooling fans are mounted on the rotating plate, and the multiple cooling fans are arranged in a linear array at equal intervals. Threaded annular grooves are opened on the outer side of the multiple cooling fans, and a filter screen is screwed into the threaded annular grooves.

[0019] By adopting the above technical solutions, the combination of multiple cooling fans enhances airflow circulation, and the detachable filter design facilitates maintenance.

[0020] Furthermore, the second plate has multiple second mounting holes on its top outer side. The first mounting hole is screwed to the first mounting head, the second mounting head passes through the second mounting hole and is screwed to the fixing nut, and the bottom of the fixing nut abuts against the second plate.

[0021] By adopting the above technical solution, modular installation interfaces enable rapid assembly and reduce maintenance complexity.

[0022] In summary, the present invention has the following main advantages:

[0023] 1. This utility model, by setting an adjusting screw, dovetail groove, slide bar, and insertion seat, allows the adjusting screw to drive the insertion seat to linearly displace and adapt to different specifications of SSD cards. The slide bar constrains the movement trajectory to prevent deviation, the dovetail groove engages with the edge of the card to ensure installation stability, and the bearing connection structure reduces adjustment friction resistance. This achieves standardized and highly compatible assembly of the SSD testing device, enabling rapid clamping and positioning of mainstream SSD specifications, significantly reducing customization and modification costs. Through the adjustable displacement mechanism and snap-fit ​​fixing design, adaptation and adjustment can be completed before testing. On-site, only the SSD card needs to be placed and the adjusting screw needs to be locked, effectively solving the pain points of poor adaptability, low versatility, and high maintenance costs caused by the rigid positioning of heat sinks in traditional testing devices.

[0024] 2. This utility model achieves efficient heat conduction and dissipation of SSD chips by setting up a cold conduction machine. The cold conduction mechanism achieves efficient heat conduction and dissipation of SSD chips through a heat conduction plate and liquid-cooled copper pipes. The serpentine or multi-turn copper pipe layout can fully cover the heat-generating areas of SSDs of different specifications, ensuring heat dissipation adaptability. The bolt-fixed bracket structure provides stable contact pressure and avoids loosening of the thermal interface. Attached Figure Description

[0025] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0026] Figure 2 This is a bottom-view three-dimensional structural diagram of the present invention;

[0027] Figure 3 This utility model Figure 1 Enlarged structural diagram at point A;

[0028] Figure 4 This utility model Figure 2 A magnified structural diagram at point B in the middle.

[0029] In the diagram: 1. Base plate; 101. First plate; 102. First mounting hole; 103. Rotating plate; 104. Cooling fan; 105. Threaded annular groove; 106. Filter screen; 2. Support mechanism;

[0030] 201. Threaded sleeve; 202. First mounting head; 203. Screw; 204. Second mounting head; 3. Cold conduction mechanism; 301. Mounting bracket; 302. Fixing bracket; 303. Liquid-cooled copper tube; 4. Placement mechanism; 401. Second plate; 402. Second mounting hole; 403. Heat-conducting plate; 404. Adjusting screw; 405. Dovetail groove; 406. Slide rod; 407. Insert seat; 5. Fixing nut. Detailed Implementation

[0031] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0032] Example 1:

[0033] A testing auxiliary device for SSD boards, such as Figure 1-4 As shown, it includes a base plate 1, a support mechanism 2, a cold conduction mechanism 3, and a placement mechanism 4. The placement mechanism 4 includes a second plate 401. The second plate 401 has a threaded hole and two sliding holes on both sides. An adjusting screw 404 is screwed into the threaded hole, and a sliding rod 406 is slidably connected in the sliding hole.

[0034] The second plate body 401 is arranged in a "C" - shaped structure. The inner end of the adjusting screw rod 404 is rotatably connected with a placement seat 407 through a bearing. The two sides of the placement seat 407 are fixedly connected with the slide rods 406. A dovetail groove 405 is arranged inside the placement seat 407, and a carrier board of the SSD board card is engaged and slidable in the dovetail groove 405. Through the linkage design of the adjusting screw rod 404 and the slide rod 406, an accurate linear displacement of the placement seat 407 on the second plate body 401 is realized. When the adjusting screw rod 404 is rotated, the bearing connection structure eliminates rotational friction, enabling the placement seat 407 to move smoothly along the slide rod 406. The inclined - plane guiding characteristic of the dovetail groove 405 guides the SSD carrier board to slide into the position at a preset angle. The "C" - shaped structure of the second plate body 401 forms a three - way constraint space, restricting the displacement of the SSD board card in the horizontal direction and suppressing vibration offset through the cooperation of the sliding holes and the slide rods 406 in the vertical direction, ensuring the constant position of the board card during the test process.

[0035] Refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 , through displacement adjustment of the adjusting screw rods 404 of the two placement seats 407, the adaptation and loading of multi - specification SSD carrier boards are achieved, improving the compatibility of the device. The design of the independent adjusting screw rods 404 for the bilateral placement seats 407 supports the application of balanced clamping forces on both sides of the SSD board card. By rotating the screws on both sides respectively, SSD specifications of different lengths such as 2280 / 22110 can be adapted. The precise fit between the slide rod 406 and the slide hole ensures that the placement seat 407 moves along a straight - line trajectory, avoiding skew caused by uneven stress. The engagement depth of the dovetail groove 405 can be automatically adapted according to the thickness of the board card, achieving compatible fixation from ultra - thin to thickened SSDs.

[0036] Embodiment 2:

[0037] Refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 , a plurality of heat - conducting plates 403 are arranged at the bottom of the bottom plate 1. A cold - conduction mechanism 3 is arranged at the bottom of the plurality of heat - conducting plates 403. The heat - conducting plates 403 are in direct contact with the bottom surface of the SSD board card, conducting the heat of the chip to the cold - conduction mechanism 3 through a large - area metal contact surface. The multiple heat - conducting plates 403 are distributed according to the heat - generating areas such as the SSD main control chip and NAND particles, forming a directional heat - conduction path. The cold - conduction mechanism 3 and the heat - conducting plates 403 are stacked vertically, constructing an efficient heat - dissipation channel to ensure the rapid transfer of heat from the chip to the external environment.

[0038] Refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4The cold conduction mechanism 3 includes a mounting bracket 301. Multiple fixing brackets 302, positioned at the same location as the heat-conducting plate 403, are mounted on the top of the mounting bracket 301. The fixing brackets 302 are fixedly connected to the heat-conducting plate 403 by bolts, providing a continuous and stable contact pressure and eliminating the gap thermal resistance problem of traditional clip-on radiators. The frame structure of the mounting bracket 301 provides uniform support for the liquid-cooled copper pipe 303, preventing deformation and dislocation due to thermal expansion and contraction. The bolted connection method allows for quick assembly and disassembly of the cold conduction mechanism 3, facilitating maintenance or upgrades.

[0039] See Figure 1 , Figure 2 , Figure 3 , Figure 4 The mounting bracket 301 has a liquid-cooled copper tube 303 inside, including but not limited to at least one of a serpentine, multi-turn nested, or spiral winding structure. The threaded connection between the threaded sleeve 201 and the screw 203 enables stepless adjustment of the support height, adapting to the testing needs of SSD boards of different thicknesses. The stepped shaft design of the first mounting head 202 and the second mounting head 204 ensures the axial alignment accuracy of the base plate 1 and the placement mechanism 4, preventing stress concentration caused by misalignment. The self-locking characteristic of the threaded pair ensures the stability of the height after adjustment, preventing the device from loosening during testing.

[0040] See Figure 1 , Figure 2 , Figure 3 , Figure 4 A support mechanism 2 is provided between the base plate 1 and the placement mechanism 4. The support mechanism 2 includes a threaded sleeve 201, with a first mounting head 202 at the bottom of the threaded sleeve 201. A screw 203 is screwed to the top of the threaded sleeve 201, and a second mounting head 204 is provided at the top of the screw 203. The linear array arrangement of the cooling fans 104 forms a uniform airflow layer, fully covering the surface of the SSD board. The rotating plate 103 achieves angle adjustment through a damped rotating shaft, optimizing the airflow direction to match different heat dissipation requirements. The threaded annular groove 105 of the filter 106 is designed to support quick and easy manual installation and removal, facilitating the cleaning of accumulated dust and preventing airflow blockage. The combined design of the cooling fans 104 and the filter 106 achieves both efficient heat dissipation and dust protection.

[0041] See Figure 1 , Figure 2 , Figure 3 , Figure 4The base plate 1 includes a first plate body 101. First mounting holes 102 are formed at the four corners of the top of the first plate body 101. A rotating groove is formed in the center of the top of the first plate body 101, and a rotating plate 103 is rotatably connected to the rotating groove via a damping shaft. Multiple cooling fans 104 are mounted on the rotating plate 103, arranged in a linear array at equal intervals. Threaded annular grooves 105 are formed on the outer sides of the multiple cooling fans 104, and filter screens 106 are screwed into the threaded annular grooves 105. The corresponding layout of the first mounting holes 102 and the second mounting holes 402 allows for modular assembly of the base plate 1, support mechanism 2, and placement mechanism 4 via fixing nuts 5. The shoulder structure of the stepped mounting head restricts axial displacement of the components, ensuring precise alignment of each part. The abutment design of the fixing nuts 5 disperses locking stress, avoids local deformation, and improves the overall structural rigidity.

[0042] See Figure 1 , Figure 2 , Figure 3 , Figure 4 The top outer side of the second plate 401 is provided with a plurality of second mounting holes 402. The first mounting hole 102 is screwed to the first mounting head 202. The second mounting head 204 passes through the second mounting hole 402 and is screwed to the fixing nut 5. The bottom of the fixing nut 5 abuts against the second plate 401.

[0043] The implementation principle of this embodiment is as follows: The edge of the SSD board under test is embedded into the dovetail groove 405 of the insertion seat 407. Rotating the adjusting screws 404 on both sides drives the insertion seat 407 to move synchronously inward along the slide bar 406. The SSD board is locked and positioned by the inclined guide effect of the dovetail groove 405. After being fully embedded, the adjusting screws 404 are continuously tightened so that the insertion seat 407 and the edge of the board form a three-point contact rigid clamp. The cooperation between the slide bar 406 and the sliding hole constrains the lateral displacement, ensuring that the SSD does not shift during the test.

[0044] The overall height is adjusted by the threaded sleeve 201 and screw 203 of the support mechanism 2, and the extension length of the second mounting head 204 is changed by rotating the screw 203 to adapt to SSD cards of different thicknesses. Stable support is achieved by the threaded locking of the first mounting hole 102 and the first mounting head 202.

[0045] During heat dissipation, the heat from the SSD chip is transferred to the second board 401 via the mounting plate, and then introduced into the liquid-cooled copper pipe 303 through the bolted connection interface between the heat-conducting plate 403 and the fixing bracket 302 of the cold conduction mechanism 3. The serpentine or multi-loop structure of the liquid-cooled copper pipe 303 increases the heat dissipation area, and the airflow circulation of the cooling fan 104 accelerates heat dissipation. The filter 106 can be removed and cleaned through the threaded annular groove 105, and the damping shaft adjusts the angle of the rotating plate 103 to optimize the airflow, ultimately creating a stable and controllable test heat dissipation environment.

[0046] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, and variations are within the scope of the claims of the present invention and are protected by patent law.

Claims

1. A testing auxiliary device for SSD boards, characterized in that: It includes a bottom plate (1), a support mechanism (2), a cold conduction mechanism (3) and a placement mechanism (4). The placement mechanism (4) includes a second plate body (401). On both sides of the second plate body (401), there is a threaded hole and two sliding holes. A regulating screw (404) is screwed in the threaded hole, and a sliding rod (406) is slidably connected in the sliding hole; The second plate body (401) is arranged in a "C" - shaped structure. The inner end of the regulating screw (404) is rotatably connected to a placement seat (407) through a bearing, and both sides of the placement seat (407) are fixedly connected to the sliding rod (406). A燕尾槽(405) is arranged inside the placement seat (407), and a carrier board of the SSD board card is snap - fitted and slidably engaged in the燕尾槽(405).

2. The testing auxiliary device for SSD boards according to claim 1, characterized in that: By adjusting the displacement of the regulating screws (404) of the two placement seats (407), the adaptation and loading of multi - specification SSD carrier boards are realized, improving the compatibility of the device.

3. The testing auxiliary device for SSD boards according to claim 1, characterized in that: A plurality of heat conduction plates (403) are arranged at the bottom of the bottom plate (1), and a cold conduction mechanism (3) is arranged at the bottom of the plurality of heat conduction plates (403).

4. The testing auxiliary device for SSD boards according to claim 1, characterized in that: The cold conduction mechanism (3) includes a mounting frame (301). At the top of the mounting frame (301), there are a plurality of fixing frames (302) in the same positions as the heat conduction plates (403). The fixing frames (302) are fixedly connected to the heat conduction plates (403) by bolts.

5. The testing auxiliary device for SSD boards according to claim 4, characterized in that: Inside the mounting frame (301), there is a liquid - cooled copper tube (303), including at least one of, but not limited to, a serpentine structure, a multi - loop nested structure or a spiral coiling structure.

6. The testing auxiliary device for SSD boards according to claim 1, characterized in that: A support mechanism (2) is arranged between the bottom plate (1) and the placement mechanism (4). The support mechanism (2) includes a threaded sleeve rod (201). At the bottom of the threaded sleeve rod (201), there is a first mounting head (202). A screw rod (203) is screwed on the top of the threaded sleeve rod (201), and a second mounting head (204) is arranged at the top of the screw rod (203).

7. The testing auxiliary device for SSD boards according to claim 6, characterized in that: The bottom plate (1) includes a first plate body (101). At the four corners of the top of the first plate body (101), there are first mounting holes (102). In the middle of the top of the first plate body (101), there is a rotating groove, and a rotating plate (103) is rotatably connected in the rotating groove through a damping rotating shaft. A plurality of groups of heat dissipation fans (104) are installed on the rotating plate (103), and the plurality of groups of heat dissipation fans (104) are arranged at equal intervals in a linear array. A threaded ring groove (105) is arranged outside the plurality of groups of heat dissipation fans (104), and a filter screen (106) is screwed in the threaded ring groove (105).

8. The testing auxiliary device for SSD boards according to claim 7, characterized in that: A plurality of second mounting holes (402) are arranged on the outer side of the top of the second plate body (401). The first mounting holes (l02) are screwed with the first mounting heads (202). The second mounting head (204) passes through the second mounting holes (402) and is screwed with a fixing nut (5), and the bottom of the fixing nut (5) abuts against the second plate body (401).

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