Wafer in-out position detection device for ion implantation machine

By installing a high-precision non-contact displacement sensor on the ion implanter, the wafer position offset is monitored in real time and an alarm is triggered, which solves the problem of collision during wafer transport, improves detection accuracy and equipment stability, and reduces the risk of equipment damage.

CN224204095UActive Publication Date: 2026-05-05BEIJING CORE SOURCE TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
BEIJING CORE SOURCE TECH CO LTD
Filing Date
2025-05-09
Publication Date
2026-05-05

AI Technical Summary

Technical Problem

Existing ion implantation equipment cannot monitor minute offsets in real time during wafer transport, which makes the wafer prone to collisions with robotic arms or sealed doors, posing safety hazards and resulting in poor equipment stability.

Method used

Employing a high-precision non-contact displacement sensor, it monitors wafer position offset in real time and provides alarms via a PLC control cabinet and touch screen. Combined with a multi-directional adjustable bracket, it adapts to different machine structures, ensuring detection accuracy and sensitivity.

Benefits of technology

It enables high-precision detection of wafer position, reduces the risk of wafer collision, improves equipment stability and safety, simplifies the installation and commissioning process, and facilitates fault analysis and process optimization.

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Abstract

The utility model discloses a wafer inlet and outlet position detection device for an ion implantation machine in the technical field of semiconductor manufacturing equipment, which comprises a sensor support fixed above a lifting platform, a central groove is arranged on the surface of the sensor support, a plurality of detection grooves are distributed on the peripheral side of the central groove, and the detection grooves are communicated with the lifting platform. A plurality of displacement sensors matched with the detection grooves are fixed to the sensor support through a mounting frame, each displacement sensor is located above the detection grooves, and the mounting frame comprises an L-shaped main mounting frame and an L-shaped auxiliary mounting frame mounted on one side of the L-shaped main mounting frame; and the displacement sensor is installed on the surface of the L-shaped auxiliary installation frame through a sensor installation support, the displacement sensor is electrically connected with a PLC control cabinet, and the PLC control cabinet is electrically connected with the machine table and the touch screen. According to the utility model, tiny deviation of the wafer in the transmission process can be monitored in real time and alarm is triggered, so that collision between the wafer and a manipulator or a sealing door is avoided, and production safety and equipment stability are guaranteed.
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Description

Technical Field

[0001] This utility model relates to a wafer entry / exit position detection device for an ion implantation machine, belonging to the field of semiconductor manufacturing equipment technology. Background Technology

[0002] Ion implanters are a type of high-voltage miniature accelerator with the widest range of applications. They obtain the desired ions from an ion source, accelerate them to produce an ion beam with energy of several hundred kiloelectron volts, and use them for ion implantation of semiconductor materials, large-scale integrated circuits and devices, as well as for surface modification and film formation of metallic materials.

[0003] During wafer transfer, ion implantation equipment requires the coordinated operation of an outer sealing door, a lifting platform, an inner sealing door, and internal and external robotic arms to move the wafer in and out. In existing technologies, the wafer remains in a lifting state during the multiple transfers by the robotic arms. If a positional shift occurs, the wafer is prone to colliding with the robotic arms or the sealing door, leading to wafer damage or equipment downtime. Traditional methods rely on manual visual inspection or low-precision sensors, which cannot detect minute shifts in real time, posing safety hazards. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a wafer entry and exit position detection device for ion implantation equipment. This device can monitor the slight deviation of the wafer during the transmission process in real time and trigger an alarm, thereby avoiding the problem of the wafer colliding with the robot or sealing door due to position deviation and ensuring production safety and equipment stability.

[0005] To achieve the above objectives, this utility model employs the following technical solution:

[0006] In a first aspect, this utility model provides a wafer entry / exit position detection device for an ion implantation machine, including a sensor bracket fixed above a lifting platform. The surface of the sensor bracket has a central groove, and multiple detection grooves are distributed around the periphery of the central groove. The sensor bracket has multiple displacement sensors that match the detection grooves fixed to it by a mounting bracket, and each displacement sensor is located above a detection groove. The mounting bracket includes an L-shaped main mounting bracket and an L-shaped auxiliary mounting bracket for mounting one side of the L-shaped main mounting bracket. The displacement sensors are mounted on the surface of the L-shaped auxiliary mounting bracket by the sensor mounting bracket. The displacement sensors are electrically connected to a PLC control cabinet, and the PLC control cabinet is electrically connected to the machine and a touch screen. A viewing window is installed on the bottom surface of the sensor bracket, and the top surface of the lifting platform extends outward in a trapezoidal step.

[0007] Furthermore, the bottom and sides of the L-shaped main mounting bracket are provided with a set of elongated holes, and each set of elongated holes is perpendicular to each other. The elongated holes at the bottom of the L-shaped main mounting bracket are fixed to the surface of the sensor bracket by screws, and the elongated holes on the sides are fixed to the L-shaped auxiliary mounting bracket by bolts.

[0008] Furthermore, the surface of the L-shaped auxiliary mounting bracket is provided with a set of symmetrical oblique holes and mounting holes, and the sensor mounting bracket is fixedly connected to the oblique holes and mounting holes through connectors.

[0009] Furthermore, U-shaped grooves are provided at both the upper and lower ends of the L-shaped auxiliary mounting bracket.

[0010] Furthermore, the displacement sensor is a high-precision non-contact sensor with a repeatability accuracy of 0.02 mm.

[0011] Furthermore, the number of displacement sensors and detection slots is four.

[0012] Furthermore, a strip-shaped groove is provided on the side of the sensor bracket.

[0013] Compared with the prior art, the beneficial effects achieved by this utility model are as follows:

[0014] This solution achieves high-precision wafer position detection, significantly improving detection sensitivity through the use of high-precision displacement sensors; the multi-directional adjustable bracket supports rapid adaptation to different machine structures, reducing installation and debugging time; real-time monitoring and early warning mechanisms effectively avoid wafer collisions, reducing the risk of equipment damage; and the touchscreen records historical data for traceability, facilitating fault analysis and process optimization. Attached Figure Description

[0015] The accompanying drawings, which form part of this specification, are used to provide a further understanding of this utility model. The illustrative embodiments and descriptions of this utility model are used to explain this utility model and do not constitute an undue limitation thereof. In the drawings:

[0016] Figure 1 A three-dimensional schematic diagram of a wafer entry / exit position detection device for an ion implantation machine provided in this embodiment of the present invention. Figure 1 ;

[0017] Figure 2 A three-dimensional schematic diagram of a wafer entry / exit position detection device for an ion implantation machine provided in this embodiment of the present invention. Figure 2 ;

[0018] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0019] Figure 4A front view of a wafer entry / exit position detection device for an ion implantation machine provided in an embodiment of this utility model;

[0020] Figure 5 for Figure 4 Enlarged view at point B in the middle;

[0021] In the diagram: 1. Sensor bracket; 2. Mounting bracket; 3. Displacement sensor; 4. Detection slot; 5. Center slot; 6. Strip slot; 7. Viewing window; 8. Lifting platform; 9. Step; 10. Notch; 11. Wafer; 201. L-shaped main mounting bracket; 202. L-shaped auxiliary mounting bracket; 203. Bolt; 204. Sensor bracket; 2011. Long hole; 2021. Angled hole; 2022. U-shaped groove; 2023. Connector. Detailed Implementation

[0022] The present invention will now be described in detail with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0023] The following detailed description is exemplary and intended to provide further detailed explanation of the present invention. Unless otherwise specified, all technical terms used in this invention have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this invention is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this invention.

[0024] Example:

[0025] Please see Figures 1 to 5This embodiment proposes a wafer entry / exit position detection device for an ion implantation machine, including a sensor support 1. The surface of the sensor support 1 has a central groove 5 and four detection grooves 4, distributed around the periphery of the central groove 5. A strip-shaped groove 6 is formed on the side of the sensor support 1. A displacement sensor 3 is located above the detection grooves 4 and is fixedly mounted to the surface of the sensor support 1 via a mounting bracket 2. A viewing window 7 is installed on the bottom surface of the sensor support 1. A lifting platform 8 is provided below the sensor support 1. The top surface of the lifting platform 8 extends outwards in a trapezoidal step 9, and a wafer 11 is placed inside the step 9. A set of symmetrically arranged notches 10 are also formed on the upper sidewall of the lifting platform 8. In this embodiment, the displacement sensor 3 is a high-precision non-contact sensor with a repeatability accuracy of 0.02 mm, used to detect the vertical distance from four evenly distributed points on the outer ring of the wafer 11 to the sensor. Displacement sensor 3 is electrically connected to the PLC control cabinet, which in turn is electrically connected to the machine tool and the touchscreen. The touchscreen uses a human-machine interface for setting reference distance values ​​and alarm thresholds, displaying real-time data, and providing alarm feedback. In actual use, the PLC control cabinet receives data from displacement sensor 3, and its built-in algorithm performs linear compensation on the sensor data to eliminate environmental interference errors. When wafer 11 moves in and out, displacement sensor 3 continuously detects the distance value, and the PLC control cabinet calculates the vertical deviation value of wafer 11 in real time. If the deviation exceeds the limit, the PLC immediately stops the machine tool and triggers an alarm signal, which is sent to the touchscreen. Operation resumes after manual reset.

[0026] It should be noted that the mounting bracket 2 is composed of an L-shaped main mounting bracket 201, an L-shaped auxiliary mounting bracket 202, and a sensor mounting bracket 204. The L-shaped main mounting bracket 201 has a set of elongated holes 2011 on its bottom and sides, and each set of elongated holes 2011 is perpendicularly fitted to each other, allowing for adjustment along the contact surface in all directions and rotation. The elongated holes 2011 on the bottom of the L-shaped main mounting bracket 201 are fixed to the surface of the sensor bracket 1 with screws. The L-shaped auxiliary mounting bracket 202 is fixed to the elongated holes 2011 on the side of the L-shaped main mounting bracket 201 with bolts 203. The displacement sensor 3 is mounted via the sensor bracket 204. 4. The sensor is fixedly installed with the L-shaped auxiliary mounting bracket 202. The surface of the L-shaped auxiliary mounting bracket 202 has a set of symmetrical oblique holes 2021 and mounting holes. The sensor mounting bracket 204 is fixedly connected to the oblique holes 2021 and mounting holes through the connector 2023. Both the upper and lower ends of the L-shaped auxiliary mounting bracket 202 have U-shaped grooves 2022. The above structure facilitates the adjustment of the vertical angle of the sensor. These features enable the sensor to have eight-way adjustment function (up and down, left and right, front and back, and horizontal and vertical angle adjustment), adapting to different machine structures and detection requirements, and ensuring that the displacement sensor 3 is aligned with the four detection points on the outer ring of the wafer 11.

[0027] The working principle of this technical solution is as follows:

[0028] Sensor bracket 1 is fixed above lifting platform 8. The number and position of displacement sensors 3 are determined according to the size and distribution of viewing window 7. For machines with large viewing windows, four displacement sensors are selected and installed at 90° intervals around the center of wafer 11. The displacement sensors 3 are aligned with the evenly distributed detection points on the outer ring of wafer 11 through viewing window 7. The displacement sensors 3 measure the distance data of the four detection points in real time and transmit it to the PLC control cabinet. The PLC control cabinet then performs linear correction on the data and calculates the vertical deviation value of each point. Since the outer edge of lifting platform 8 is a trapezoidal step 9, and the inner edge of step 9 forms a 60-degree angle with the bottom surface, when wafer 11 shifts, the edge in the shift direction will be close to the inner edge slope. When wafer 11 is located at the center of lifting platform 8, the entire wafer 11 is measured to be at its lowest point and in a horizontal state. When wafer 11 shifts, wafer 11 is supported by step 9 in the shift direction. The vertical displacement is positively correlated with the horizontal displacement. The horizontal displacement is calculated by calculating the vertical displacement deviation of wafer 11. The reference values ​​of the four detection points distance sensors are L1-L4. If the wafer is offset, the distance value will deviate (ΔL1-ΔL4). When the deviation value of any detection point exceeds the preset threshold (e.g., ±0.1mm), the PLC control cabinet will immediately trigger an alarm signal, control the machine to stop running, and display the fault location on the touch screen.

[0029] Compared to existing technologies, this solution achieves high-precision wafer position detection, employing a displacement sensor with 0.02mm accuracy, significantly improving detection sensitivity. An eight-way adjustable bracket supports rapid adaptation to different machine structures, reducing installation and debugging time. Real-time monitoring and early warning mechanisms effectively prevent wafer collisions, reducing the risk of equipment damage. The touchscreen records historical data for traceability, facilitating fault analysis and process optimization.

[0030] As is known from common technical knowledge, this utility model can be implemented through other embodiments that do not depart from its spirit or essential characteristics. Therefore, the disclosed embodiments described above are merely illustrative in all respects and are not the only ones. All modifications within the scope of this utility model or its equivalents are included in this utility model.

[0031] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and not to limit it. Although the utility model has been described in detail with reference to the above embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the specific implementation of this utility model. Any modifications or equivalent substitutions that do not depart from the spirit and scope of this utility model should be covered within the protection scope of the claims of this utility model.

Claims

1. A wafer entry / exit position detection device for an ion implantation machine, characterized in that, The system includes a sensor bracket (1) fixed above the lifting platform (8). The sensor bracket (1) has a central groove (5) on its surface and multiple detection grooves (4) distributed around the central groove (5). The sensor bracket (1) is fixed with multiple displacement sensors (3) that match the detection grooves (4) by a mounting bracket (2). Each displacement sensor (3) is located above the detection groove (4). The mounting bracket (2) includes an L-shaped main mounting bracket (201) and an L-shaped auxiliary mounting bracket (202) on one side of the L-shaped main mounting bracket (201). The displacement sensor (3) is mounted on the surface of the L-shaped auxiliary mounting bracket (202) by a sensor mounting bracket (204). The displacement sensor (3) is electrically connected to a PLC control cabinet, and the PLC control cabinet is electrically connected to the machine and the touch screen. A viewing window (7) is installed on the bottom surface of the sensor bracket (1). The top surface of the lifting platform (8) extends outward into a trapezoidal step (9).

2. The wafer entry / exit position detection device for an ion implantation machine according to claim 1, characterized in that, The L-shaped main mounting bracket (201) has a set of elongated holes (2011) on its bottom and sides, and each set of elongated holes (2011) is perpendicular to each other. The elongated holes (2011) at the bottom of the L-shaped main mounting bracket (201) are fixed to the surface of the sensor bracket (1) by screws, and the elongated holes (2011) on the side are fixed to the L-shaped auxiliary mounting bracket (202) by bolts (203).

3. The wafer entry / exit position detection device for an ion implantation machine according to claim 1, characterized in that, The L-shaped auxiliary mounting bracket (202) has a set of symmetrical oblique holes (2021) and mounting holes on its surface, and the sensor mounting bracket (204) is fixedly connected to the oblique holes (2021) and mounting holes through a connector (2023).

4. The wafer entry / exit position detection device for an ion implantation machine according to claim 1, characterized in that, The L-shaped auxiliary mounting bracket (202) has U-shaped grooves (2022) at both the top and bottom ends.

5. The wafer entry / exit position detection device for an ion implantation machine according to claim 1, characterized in that, The displacement sensor (3) is a high-precision non-contact sensor with a repeatability accuracy of 0.02 mm.

6. The wafer entry / exit position detection device for an ion implantation machine according to claim 1, characterized in that, The number of displacement sensors (3) and detection slots (4) are both four.

7. The wafer entry / exit position detection device for an ion implantation machine according to claim 1, characterized in that, The sensor bracket (1) has a strip groove (6) on its side.