Communication equipment capable of preventing components from falling off

Abstract

The utility model provides communication equipment for preventing components from falling off, which comprises an upper shell, a substrate and a lower shell, the substrate is arranged between the upper shell and the lower shell, the upper shell, the substrate and the lower shell are fixedly connected, and a first component is arranged on the substrate; a first cavity is arranged between the upper shell and the top layer of the substrate, the first component is located in the first cavity, a first insulator is filled between the first component and the inner wall surface of the upper shell, and the first component is located in the first cavity under the fixed pressure effect of the upper shell. The first insulator generates a first stress in the vertical direction towards the substrate along the first component. According to the utility model, the first insulator is filled between the first component on the substrate and the inner wall surface of the upper shell, so that after the upper shell, the substrate and the lower shell are fixedly connected, the first component can be firmly fixed by the first stress generated by the first insulator towards the substrate along the first component, thereby avoiding the falling-off phenomenon.

Description

Technical Field

[0001] This utility model relates to the field of electronic technology, and in particular to a communication device for preventing components from falling off. Background Technology

[0002] ISO 16750-3 is a recent standard published by the International Organization for Standardization (ISO). This standard specifies the requirements and test methods for mechanical loads on electrical and electronic equipment in road vehicles. The wireless vehicle-mounted equipment has built-in LTE functionality and requires two drop tests on each side of the entire product according to ISO 16750-3, for a total of 12 drop tests. The PCB (Printed Circuit Board) antenna used as the LTE (Long-Term Evolution) antenna experienced component detachment, meaning the drop test results for the wireless vehicle-mounted equipment did not meet design requirements. Inspection revealed that the PCB antenna, with a thickness of 3.2mm, is a relatively large and heavy component, making it prone to detachment during drop tests. While the mainboard RF pads in the wireless vehicle-mounted equipment remained intact, the pads on the PCB antenna did detach. In existing conventional solutions, the PCB-mounted antenna is simply soldered onto the PCB board using a high-temperature reflow oven without any other measures. Therefore, when performing drop tests or vibration tests on the entire product, the PCB-mounted antenna can easily detach from the PCB board, causing the wireless vehicle-mounted equipment to become unusable. Utility Model Content

[0003] The technical problem to be solved by this utility model is to overcome the defect of PCB board-mounted antennas being easy to fall off the PCB board in the prior art, and to provide a communication device that prevents components from falling off.

[0004] The present invention solves the above-mentioned technical problems through the following technical solution:

[0005] This utility model provides a communication device, including an upper shell, a substrate and a lower shell, wherein the substrate is disposed between the upper shell and the lower shell, and the upper shell, the substrate and the lower shell are fixedly connected, and a first component is provided on the substrate;

[0006] A first cavity is provided between the top layer of the upper shell and the substrate. The onboard antenna is located in the first cavity. A first insulator is filled between the first component and the inner wall of the upper shell. Under the fixing pressure of the upper shell, the first insulator generates a first stress in the vertical direction along the first component toward the substrate.

[0007] Optionally, a second insulator is filled between the bottom layer of the substrate and the inner wall of the lower shell, and the projections of the first component and the second insulator on the inner wall of the lower shell at least partially overlap, and the second insulator generates a second stress in the opposite direction to the first stress toward the substrate.

[0008] Optionally, the upper shell is provided with a first screw hole, the substrate is provided with a second screw hole, and the lower shell is provided with a third screw hole;

[0009] The upper shell, the base plate, and the lower shell are fixedly connected by screws that pass through the first screw hole, the second screw hole, and the third screw hole in sequence.

[0010] Optionally, the lower shell is further provided with a stud, and the screw is fixed to the stud to raise the substrate and generate a third stress in the opposite direction to the first stress.

[0011] Optionally, the first insulator is an inner wall protrusion of the upper shell provided on the inner wall surface of the upper shell, and the inner wall protrusion of the upper shell is integrally formed with the upper shell.

[0012] Optionally, the second insulator is a protrusion on the inner wall of the lower shell, which is integrally formed with the lower shell.

[0013] Optionally, the first insulator is an insulating block.

[0014] Optionally, the second insulator is an insulating block.

[0015] Optionally, a second cavity is provided between the lower shell and the bottom layer of the substrate, and some components on the substrate are located in the second cavity.

[0016] Optionally, the electronic device is a vehicle-mounted device.

[0017] Based on common knowledge in the field, the above optional conditions can be combined arbitrarily to obtain various preferred embodiments of this utility model.

[0018] The positive and progressive effects of this utility model are as follows: by filling the space between the first component on the substrate and the inner wall of the upper shell with a first insulator, after the upper shell, the substrate and the lower shell are fixedly connected, the first insulator generates a first stress in the vertical direction along the first component toward the substrate. The first stress can firmly fix the first component, thereby preventing it from falling off. Attached Figure Description

[0019] Figure 1 A cross-sectional view in the vertical direction of a plastic upper shell, a PCB board, and a plastic lower shell provided for this utility model.

[0020] Figure 2 A top view of a plastic lower shell and a PCB board in the horizontal direction provided by this utility model.

[0021] Figure 3 A cross-sectional view in the vertical direction of a plastic upper shell, a PCB board, and a plastic lower shell provided for this utility model.

[0022] Figure 4 This utility model provides a top view of another plastic upper shell, PCB board, and plastic lower shell in the horizontal direction.

[0023] Figure 5 This utility model provides another top view of a plastic lower shell and PCB board in the horizontal direction.

[0024] Figure 6 This utility model provides a cross-sectional view of another plastic upper shell, PCB board, and plastic lower shell in the vertical direction.

[0025] Figure 7 This utility model provides a cross-sectional view of a plastic upper shell, PCB board, and plastic lower shell in the vertical direction.

[0026] Figure 8 This utility model provides another top view of a plastic lower shell and PCB board in the horizontal direction.

[0027] Figure 9 This utility model provides a top view of a plastic upper shell, PCB board, and plastic lower shell in the horizontal direction.

[0028] Figure 10 A cross-sectional view in the horizontal direction of another plastic upper shell, PCB board and plastic lower shell provided by this utility model. Detailed Implementation

[0029] The following description, in conjunction with the accompanying drawings, illustrates exemplary embodiments of the present invention, including various details to aid understanding. These embodiments should be considered merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present invention. Similarly, for clarity and brevity, descriptions of well-known functions and structures are omitted in the following description.

[0030] It should be noted that the terms "first," "second," etc., used in this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0031] In this embodiment, the substrate includes printed circuit boards, System-in-Package (SIP), integrated circuit boards, etc. SIP (System-in-Package) is a packaging concept that integrates all or most of the electronic functions of a system or subsystem within an integrated substrate, with chips bonded to the integrated substrate in 2D or 3D methods. SIP can not only assemble multiple chips, but can also function as a dedicated processor, DRAM, flash memory, and passive components such as resistors, capacitors, connectors, and antennas, all mounted on the same substrate. A complete functional unit can be built into a multi-chip package; therefore, a small number of external components are needed to make it work. The integrated substrate connects the chip wafer to a high-density substrate via gold wires, such as WLCSP (Wafer Level Chip Scale Package), a packaging technology that combines wafer-level packaging (WLP) and chip-scale packaging (CSP). Printed circuit boards, also known as PCBs, are important electronic components, serving as the support for electronic components and providing the wiring connections for electronic components.

[0032] The communication equipment involved in this embodiment can be various electronic products, communication equipment, medical devices, vehicle-mounted equipment, industrial equipment, mining equipment, and wireless network equipment such as routers, wireless vehicle-mounted equipment, and portable electronic devices.

[0033] This embodiment provides a communication device, including an upper shell, a substrate, and a lower shell. The substrate is disposed between the upper shell and the lower shell, and the upper shell, the substrate, and the lower shell are fixedly connected. A first component is disposed on the substrate. In a specific implementation, an onboard antenna can be fixed to the substrate by welding.

[0034] A first cavity is provided between the upper shell and the top layer of the substrate. The first component is located in the first cavity. A first insulator is filled between the first component and the inner wall of the upper shell. Under the fixed pressure of the upper shell, the first insulator generates a first stress in the vertical direction along the first component toward the substrate.

[0035] Understandably, both the upper and lower shells mentioned above are made of insulating materials, such as a plastic upper shell and a plastic lower shell.

[0036] In this embodiment, a first insulator is filled between the first component on the substrate and the inner wall of the upper shell. After the upper shell, substrate, and lower shell are fixedly connected, the upper shell transmits the fixing pressure to the first insulator. The first stress generated by the first insulator along the first component towards the substrate can firmly fix the first component, thereby preventing it from falling off. It should be noted that the larger the overlap area between the first insulator and the first component, the larger the stress-bearing area, and the less likely the first component is to fall off.

[0037] In practice, the first component can be a component that is easily detached from the substrate, usually a component that is large in size or heavy in weight, such as a PCB-mounted antenna.

[0038] In one optional embodiment, a second cavity is provided between the lower shell and the bottom layer of the substrate, and some components on the substrate are located in the second cavity.

[0039] In specific implementations, the substrate may also be provided with other components, such as communication modules, control chips, memory, power chips, filter capacitors, etc. These components may be located in the first cavity or in the second cavity.

[0040] In one optional embodiment, a second insulator is filled between the bottom layer of the substrate and the inner wall of the lower shell, and the projections of the first component and the second insulator on the inner wall of the lower shell at least partially overlap, and the second insulator generates a second stress in the opposite direction to the first stress toward the substrate.

[0041] In this embodiment, the second insulator can support the bottom layer of the substrate, and the second stress generated towards the substrate can balance the first stress. This ensures that the first component is firmly fixed between the substrate and the first insulator, while preventing the substrate from bending or deforming. It should be noted that the larger the overlapping area of ​​the projections of the first component and the second insulator on the inner wall of the lower shell, the larger the stress-bearing area, and the less likely the first component is to detach.

[0042] In one optional embodiment, the upper shell has a first screw hole, the substrate has a second screw hole, and the lower shell has a third screw hole; the upper shell, the substrate, and the lower shell are fixedly connected by screws passing sequentially through the first screw hole, the second screw hole, and the third screw hole. In specific implementations, to improve structural stability, multiple first screw holes, second screw holes, and third screw holes can be provided. It should be noted that the positions of the first screw hole, the second screw hole, and the third screw hole correspond to each other.

[0043] In one optional embodiment, the lower housing is further provided with a stud, and the screw is fixed to the stud to raise the substrate and generate a third stress in the opposite direction to the first stress. In this embodiment, the third stress can balance the first stress, thus ensuring that the first component is firmly fixed between the substrate and the first insulator and will not shift vertically.

[0044] In one optional embodiment, the first insulator is an inner wall protrusion of the upper shell, which is integrally formed with the upper shell. In another optional embodiment, the second insulator is an inner wall protrusion of the lower shell, which is integrally formed with the lower shell.

[0045] The following detailed example illustrates the following: the first component is a PCB-mounted antenna, the first insulator is a protrusion on the inner wall of the upper shell, and the second insulator is a protrusion on the inner wall of the lower shell. Figure 1 A vertical cross-sectional view of a plastic upper shell, a PCB board, and a plastic lower shell is provided. Figure 2 A top view of the plastic lower shell and PCB board in the horizontal direction is given. Figure 3 A vertical cross-sectional view of a plastic upper shell, a PCB board, and a plastic lower shell is provided.

[0046] See Figure 1-3The vehicle-mounted equipment consists of a plastic upper shell 8, a PCB board 11, a plastic lower shell 9, screws 5, screws 6, etc. The PCB board 11 is positioned between the plastic upper shell 8 and the plastic lower shell 9. A cavity A is formed between the top layer of the plastic upper shell 8 and the TOP layer of the PCB board 11, and a cavity B is formed between the bottom layer of the plastic lower shell 9 and the BOT layer of the PCB board 11. A PCB-onboard antenna 7 and other components (such as an LTE module, MCU, DDR chips, power chips, etc.) are located between the plastic upper shell 8 and the TOP layer of the PCB board 11. In other words, the PCB-onboard antenna 7 and other components on the TOP layer of the PCB board 11 are all located within cavity A. Other components (such as MCU power pin filter capacitors, DDR chip power pin filter capacitors, etc.) are located between the bottom shell 9 and the BOT layer of the PCB board 11. In this case, the other components on the BOT layer of the PCB board 11 are all located within cavity B. The TOP layer corresponds to the top layer, and the BOT layer corresponds to the bottom layer.

[0047] A screw hole 1 is provided at the top left corner of the upper plastic shell 8 (near the end where the -X and Z directions intersect). The projection of the upper shell screw hole 1 onto the PCB board 11 is a PCB board screw hole 10. The projection of the upper shell screw hole 1 onto the lower plastic shell 9 is a lower shell screw hole 13. The upper shell screw hole 1 corresponds one-to-one with the PCB board screw hole 10 and the lower shell screw hole 13, and their centers are basically on a vertical line. The screw shank of the screw 5 (not shown in the figure) passes through the upper shell screw hole 1, the PCB board screw hole 10, and the lower shell screw hole 13. The screw head of the screw 5 is engaged with the upper shell screw hole 1, and the thread in the screw shank of the screw 5 (not shown in the figure) is tightly engaged with the thread in the lower shell screw hole 13, so that the upper plastic shell 8, the PCB board 11, and the lower plastic shell 9 are firmly locked by the screw 5. A screw hole 2 is provided at the upper right corner of the upper plastic shell 8 (near the end where the X and Z directions intersect). The projection of the upper shell screw hole 2 onto the PCB board 11 is a PCB board screw hole 112. The projection of the upper shell screw hole 2 onto the lower plastic shell 9 is a lower shell screw hole 14. The upper shell screw hole 2 corresponds one-to-one with the PCB board screw hole 112 and the lower shell screw hole 14, and their centers are basically on a vertical line. The screw shank of the screw 6 (not shown in the figure) passes through the upper shell screw hole 2, the PCB board screw hole 112, and the lower shell screw hole 14. The screw head in the screw 6 is engaged with the upper shell screw hole 2, and the thread in the screw shank of the screw 6 (not shown in the figure) is tightly engaged with the thread in the lower shell screw hole 14, so that the upper plastic shell 8, the PCB board 11, and the lower plastic shell 9 are firmly locked by the screw 6.

[0048] A PCB-onboard antenna 7 is set on the TOP layer of the PCB board 11 near the Z-direction end. At the same time, a clearance area for the antenna is set on the TOP layer of the PCB board 11 near the Z-direction end, so that the PCB-onboard antenna 7 can radiate in a direction away from the PCB board 11 and above the plastic upper shell 8 and below the plastic lower shell 9, thereby generating an external electromagnetic field.

[0049] An inner wall protrusion 12 is provided on the inner wall surface C1 of the plastic upper shell 8. The inner wall protrusion 12 and the plastic upper shell 8 are integrally formed (that is, the material of the inner wall protrusion 12 and the plastic upper shell 8 is the same). In this way, during the mold making process, the inner wall surface C1 of the plastic upper shell 8 and the inner wall protrusion 12 are formed in one mold, without the need for separate processing. This saves processing steps, simplifies processing, and eliminates the need for additional processing steps, resulting in low cost and high efficiency. The inner wall protrusion 12 is located at the end of the plastic upper shell 8 near the Z-direction, and corresponds one-to-one with the position of the PCB board antenna 7 located on the TOP layer of the PCB board 11 near the Z-direction end. That is, the projection of the inner wall protrusion 12 on the TOP layer of the PCB board 11 overlaps with the PCB board antenna 7 by at least 30%, preferably at least 80%.

[0050] The PCB onboard antenna 7 is located on the TOP layer of the PCB board 11, near the end in the Z direction. The PCB board screw hole 10 is located at the intersection of the end in the -X direction and the end in the Z direction of the PCB board 11. The PCB board screw hole 112 is located at the intersection of the end in the X direction and the end in the Z direction of the PCB board 11. That is, the PCB board screw hole 10 and the PCB board screw hole 112 are located on both sides of the PCB onboard antenna 7: the PCB board screw hole 10 is located on the left side of the PCB onboard antenna 7 (near the end in the -X direction), and the PCB board screw hole 112 is located on the right side of the PCB onboard antenna 7 (near the end in the X direction).

[0051] The inner wall protrusion 12 of the upper shell is located on the inner wall surface C1 of the plastic upper shell 8, near the end in the Z direction. The upper shell screw hole 1 is located at the intersection of the end in the -X direction and the end in the Z direction of the plastic upper shell 8. The upper shell screw hole 2 is located at the intersection of the end in the X direction and the end in the Z direction of the plastic upper shell 8. That is, the upper shell screw hole 1 and the upper shell screw hole 2 are located on both sides of the inner wall protrusion 12 of the upper shell: the upper shell screw hole 1 is located on the left side of the inner wall protrusion 12 of the upper shell (near the end in the -X direction), and the upper shell screw hole 2 is located on the right side of the inner wall protrusion 12 of the upper shell (near the end in the X direction).

[0052] The inner wall protrusion 12 of the upper shell is attached to the PCB board antenna 7 of the TOP layer of the PCB board 11. When the screw 5 passes through the upper shell screw hole 1, the PCB board screw hole 10, and the lower shell screw hole 13, the screw head of the screw 5 is engaged with the upper shell screw hole 1, and the thread of the screw 5 is tightly engaged with the thread of the lower shell screw hole 13. When the screw 6 passes through the upper shell screw hole 2, the PCB board screw hole 112, and the lower shell screw hole 14, the screw head of the screw 6 is engaged with the upper shell screw hole 2, and the thread of the screw 6 is tightly engaged with the thread of the lower shell screw hole 14. At this time, the plastic upper shell 8, the PCB board 11, and the plastic lower shell 9 are firmly locked by the screws 5 and 6.

[0053] At this time, the pressure transmitted from the plastic upper shell 8 perpendicular to the PCB board 11 directly presses the inner wall protrusion 12 of the upper shell against the PCB board-mounted antenna 7. The inner wall protrusion 12 of the upper shell generates a vertical downward (-Y direction) stress along the PCB board-mounted antenna 7 toward the PCB board 11. The end of the PCB board 11 near the -X direction and the end in the Z direction are raised by the lower shell stud 21 in the plastic lower shell 9, and the PCB board screw hole 10 is fixed to the lower shell stud 21 by the screw 5; the end of the PCB board 11 near the X direction and the end in the Z direction are raised by the lower shell stud 22 in the plastic lower shell 9, and the PCB board screw hole 112 is fixed to the lower shell stud 22 by the screw 6; the lower shell stud 21 and the lower shell stud 22 raise the PCB board 11 and generate an upward stress (Y direction). The vertical downward (-Y direction) stress generated by the protrusion 12 on the inner wall of the upper shell along the PCB-on-board antenna 7 towards the PCB board 11 interacts with the upward (Y direction) stress generated by the lower shell studs 21 and 22 lifting the PCB board 11, eventually reaching equilibrium. This ensures that the PCB-on-board antenna 7 is firmly fixed between the PCB board 11 and the protrusion 12 on the inner wall of the upper shell, preventing vertical displacement in the Y direction. Furthermore, the PCB-on-board antenna 7 has pins, and the PCB board 11 has pads for the PCB-on-board antenna 7. These two components can be firmly soldered together using solder paste in a high-temperature reflow oven, meaning that the PCB-on-board antenna 7 will not shift laterally in the X direction.

[0054] Continue reading Figure 1-3Screw 5 passes through the upper shell screw hole 1, PCB board screw hole 10, and lower shell screw hole 13 of the plastic upper shell 8, pressing the upper shell stud 16 against the PCB board screw hole 10 and the TOP layer PCB board 11 around it; the lower shell stud 21 of the plastic lower shell 9 presses against the PCB board screw hole 10 and the BOT layer PCB board 11 around it; screw 6 passes through the upper shell screw hole 2, PCB board screw hole 112, and lower shell screw hole 14 of the plastic upper shell 8, pressing the upper shell stud 17 against the PCB board screw hole 112 and the TOP layer PCB board 11 around it; the lower shell stud 22 of the plastic lower shell 9 presses against the PCB board screw hole 112 and the BOT layer PCB board 11 around it; screw 18 passes through... The upper shell screw hole 30, PCB board screw hole 26, and lower shell screw hole (not shown in the figure) of the plastic upper shell 8 are used to press the upper shell stud 29 with the PCB board 11 around the PCB board screw hole 26 and the TOP layer PCB board. The lower shell stud 23 of the plastic lower shell 9 is used to press the PCB board 11 around the PCB board screw hole 26 and the BOT layer PCB board. The screw 19 passes through the upper shell screw hole 131, PCB board screw hole 27, and lower shell screw hole (not shown in the figure) of the plastic upper shell 8 to press the upper shell stud 28 with the PCB board 11 around the PCB board screw hole 27 and the TOP layer PCB board. The lower shell stud 24 of the plastic lower shell 9 is used to press the PCB board 11 around the PCB board screw hole 27 and the BOT layer PCB board. The PCB board 11 can be firmly fixed between the upper shell stud 16 of the plastic upper shell 8 and the lower shell stud 21 of the plastic lower shell 9, between the upper shell stud 17 of the plastic upper shell 8 and the lower shell stud 22 of the plastic lower shell 9, between the upper shell stud 29 of the plastic upper shell 8 and the lower shell stud 23 of the plastic lower shell 9, and between the upper shell stud 28 of the plastic upper shell 8 and the lower shell stud 24 of the plastic lower shell 9. This ensures that the PCB board 11 will not swing in the vertical (Y direction) and horizontal (X direction) directions between the plastic upper shell 8 and the plastic lower shell 9, and also provides a fixed support platform for the PCB board-mounted antenna 7 set on the TOP layer of the PCB board 11.

[0055] When using a PCB-mounted antenna 7 as an LTE antenna, its height H1 in the Y direction generally needs to exceed the PCB board 11 by about 3mm or more. Given that LTE antennas operate at low frequencies up to 700MHz, the length of the radiator (not shown in the figure) mounted on the PCB-mounted antenna 7 (single-ended antenna) must meet the requirement of λ / 4, i.e., 1 / 4 wavelength. The length L1 of the PCB-mounted antenna 7 is significantly longer than that of a similar WIFI antenna, making it a relatively large and heavy component. Electronic products or devices, such as automotive equipment, require tests such as 1-meter drop tests, 500 drop cycles, or 300,000 vibration cycles. Conventional methods simply involve soldering the PCB-mounted antenna 7 onto the PCB board 11 using a high-temperature reflow oven without any additional precautions. During these tests, the antenna 7 is highly likely to detach from the PCB board 11, rendering the electronic product or device unusable. When the above-mentioned solution provided in this embodiment is used, when factory workers fix the plastic upper shell 8 and plastic lower shell 9 with screws, not only can the plastic upper shell 8, plastic lower shell 9 and PCB board 11 be firmly fixed, but also the PCB board-mounted antenna 7 on the TOP layer of PCB board 11 can be firmly fixed. After a 1-meter height test, 500 drop tests or 300,000 vibration tests, no detachment will occur, and the problem is completely solved.

[0056] The overlapping area between the inner wall protrusion 12 of the upper shell and the PCB-on-board antenna 7 can be of any shape and is not limited. Taking a rectangular overlapping area as an example, the relationship between the length L3 of the inner wall protrusion 12 of the upper shell and the length L1 of the PCB-on-board antenna 7, and the length L6 of the overlapping area 3 of the inner wall protrusion 12 and the PCB-on-board antenna 7, satisfies: L6≤L3, L6≤L1; the relationship between the width L2 of the PCB-on-board antenna 7 and the width L5 of the inner wall protrusion 12 of the upper shell, and the width L4 of the overlapping area 3 of the inner wall protrusion 12 and the PCB-on-board antenna 7, satisfies: L4≤L2, L4≤L5. Preferably, the inner wall protrusion 12 of the upper shell and the PCB-on-board antenna 7 are overlapped as completely as possible to maximize the pressure between them and effectively avoid the problem of the PCB-on-board antenna 7 falling off during tests of 1 meter height, 500 drops, or 300,000 vibrations.

[0057] When the inner wall protrusion 12 of the upper shell and the PCB-onboard antenna 7 are fully pressed together, the height of the PCB-onboard antenna 7 from the inner wall surface C1 of the plastic upper shell 8 is the thickness H2 of the inner wall protrusion 12 of the upper shell. The cavity A is set between the TOP layer of the PCB board 11 and the inner wall surface C1 of the plastic upper shell 8 to reserve appropriate space for placing the PCB-onboard antenna 7 of the TOP layer of the PCB board 11 and other components (such as LTE modules, MCUs, DDR chips, power chips, etc.), so as to avoid interference between the components or assemblies of the TOP layer of the PCB board 11 and the inner wall surface C1 of the plastic upper shell 8 when the PCB board 11 is assembled in the plastic upper shell 8 and the plastic lower shell 9.

[0058] The lower shell studs 21 and 22, supporting the BOT layer of the PCB board 11, are distributed on the left and right sides (the ends in the -X direction and the X direction) of the PCB board 11. When screw 5 is injected into the PCB board screw 11 and lower shell screw 13 through the upper shell screw hole 1 of the plastic upper shell 8, and screw 6 is injected into the PCB board screw 12 and lower shell screw 14 through the upper shell screw hole 2 of the plastic upper shell 8, the vertical downward (-Y direction) stress generated by the protrusion 12 of the inner wall of the upper shell along the PCB board antenna 7 towards the PCB board 11 is approximately... The uneven stress on the PCB board 11, directed towards its center, can easily cause it to bend and deform downwards (in the -Y direction) when a certain threshold is exceeded. If the TOP or BOT layers of the PCB board 11 contain high-density dual-row QFN devices (or triple-row QFN devices) or high-density BGA devices, bending and deformation of the PCB board 11 can easily lead to the pins of the dual-row QFN devices (or triple-row QFN devices) or high-density BGA devices detaching from their pads, causing the product or equipment to malfunction. Therefore, a protrusion 4 on the inner wall of the plastic lower shell 9 needs to be added to the area where the antenna 7 on the PCB board is projected onto the PCB board.

[0059] When the lower shell studs 21 and 22 and the PCB board 11 are fully pressed together, the height from the BOT layer of the PCB board 11 to the inner wall surface C2 of the plastic lower shell 9 is the thickness H3 of the lower shell studs 21 and 22. The cavity B between the BOT layer of the PCB board 11 and the inner wall surface C2 of the plastic lower shell 9 is provided to reserve appropriate space for placing other components of the BOT layer of the PCB board 11 (such as MCU power pin filter capacitors, DDR chip power pin filter capacitors, etc.), thus preventing interference between the components or assemblies of the BOT layer of the PCB board 11 and the inner wall surface C2 of the plastic lower shell 9 when the PCB board 11 is assembled inside the plastic upper shell 8 and plastic lower shell 9.

[0060] Upper shell studs 16 are positioned around upper shell screw holes 1 on the inner wall of the plastic upper shell 8, and upper shell studs 17 are positioned around upper shell screw holes 2 on the inner wall of the plastic upper shell 8. When the upper shell studs 16, lower shell studs 17, and PCB board 11 are fully pressed together, the height of the upper shell stud 16 is the sum of the height H1 of the PCB board-mounted antenna 7 and the thickness H2 of the upper shell inner wall protrusion 12; the height of the upper shell stud 17 is the sum of the height H1 of the PCB board-mounted antenna 7 and the thickness H2 of the upper shell inner wall protrusion 12. The heights of the upper shell studs 16 and 17 are also the height of the cavity A between the TOP layer of the PCB board 11 and the inner wall surface C1 of the plastic upper shell 8.

[0061] The inner wall protrusion 4 of the lower shell is located at the end of the inner wall of the plastic lower shell 9 along the Z direction. The projection of the inner wall protrusion 4 and the PCB-onboard antenna 7 on the inner wall of the plastic lower shell 9 has an overlap area of ​​at least 30%, preferably more than 80%, to increase the area for bearing force. The left end (the end in the -X direction) of the inner wall protrusion 4 of the lower shell is provided with a lower shell screw hole 13, and the right end (the end in the X direction) of the inner wall protrusion 4 of the lower shell is provided with a lower shell screw hole 14; that is, the inner wall protrusion 4 of the lower shell is located between the lower shell screw hole 13 and the lower shell screw hole 14, and the inner wall protrusion 4 of the lower shell and the PCB-onboard antenna 7 have an overlap area of ​​at least 30%, preferably more than 80%, in the vertical direction (Y direction) to increase the area for bearing force.

[0062] The overlapping area between the protrusion 4 on the inner wall of the lower shell and the PCB-on-board antenna 7 can be of any shape and is not restricted. Taking a rectangular overlapping area as an example, the following relationships satisfy the following: The length L7 of the protrusion 4 on the inner wall of the lower shell, the length L1 of the PCB-on-board antenna 7, and the length L10 of the overlapping area of ​​the protrusion 4 on the inner wall of the lower shell and the PCB-on-board antenna 7: L10≤L7, L10≤L1; The width L2 of the PCB-on-board antenna 7, the width L8 of the protrusion 4 on the inner wall of the lower shell, and the width L9 of the overlapping area of ​​the protrusion 4 on the inner wall of the lower shell and the PCB-on-board antenna 7: L9≤L2, L9≤L8. Preferably, the protrusion 4 on the inner wall of the lower shell, the PCB-onboard antenna 7, and the protrusion 12 on the inner wall of the upper shell are overlapped as much as possible to maximize the pressure between the three and avoid the PCB-onboard antenna 7 from falling off during a 1-meter height, 500-times drop test, or 300,000-times vibration test, while also preventing the PCB board 11 from bending or deforming.

[0063] When screw 5 is injected into PCB board screw 11 and lower shell screw 13 through upper shell screw hole 1 of plastic upper shell 8, and screw 6 is injected into PCB board screw 12 and lower shell screw 14 through upper shell screw hole 2 of plastic upper shell 8, the vertical downward (-Y direction) stress generated by the inner wall protrusion 12 of upper shell along PCB board antenna 7 toward PCB board 11 is approximately toward the center of PCB board 11. The inner wall protrusion 4 of lower shell directly supports the BOT layer of PCB board 11 in plastic lower shell, generating stress along the Y direction of PCB board 11. The PCB board antenna 7 is directly soldered to the TOP layer of PCB board 11. Since the inner wall protrusion 4 of lower shell, PCB board antenna 7, and inner wall protrusion 12 of upper shell overlap in at least 30% of the area perpendicular to PCB board 11 (Y direction), the stress between them reaches equilibrium and cancels each other out. Therefore, when subjected to a 1-meter height test, 500 drop tests, or 300,000 vibration tests, the PCB-mounted antenna 7 is not prone to falling off, and at the same time, it will not cause the PCB board 11 to bend or deform.

[0064] The projection of the PCB-onboard antenna 7 onto the inner wall protrusion 4 of the plastic lower shell 9 is integrally formed with the plastic lower shell 9 (that is, the material of the inner wall protrusion 4 and the plastic lower shell 9 is the same). Thus, during mold making, the inner wall surface C2 of the plastic lower shell 9 and the inner wall protrusion 4 are formed in one mold, eliminating the need for separate processing. This saves processing steps, simplifies processing, and reduces costs while increasing efficiency. The inner wall protrusion 4 is located at the end of the plastic lower shell 9 near the Z-direction, corresponding one-to-one with the position of the PCB-onboard antenna 7 located on the TOP layer of the PCB board 11 near the Z-direction end. That is, the projection of the inner wall protrusion 4 onto the TOP layer of the PCB board 11 overlaps with the PCB-onboard antenna 7 by at least 30%, preferably at least 80%.

[0065] In other embodiments, the first insulator may be an insulating block, and the second insulator may be an insulating block.

[0066] The following example illustrates the situation in detail, using a PCB-based antenna as the first component and insulating blocks as both the first and second insulators. Figure 4 Another top view of the plastic upper shell, PCB board, and plastic lower shell in the horizontal direction is given. Figure 5 Another top view of the plastic lower shell and PCB board in the horizontal direction is given. Figure 6 Another cross-sectional view of the plastic upper shell, PCB board, and plastic lower shell in the vertical direction is given. Figure 4-6 The scheme shown is based on the above Figure 1-3Based on the proposed solution, the protrusion 4 on the inner wall of the lower shell 9 region projected by the PCB-onboard antenna 7 is replaced with an insulating block 15, and the protrusion 12 on the inner wall of the upper shell 8 region projected by the PCB-onboard antenna 7 is replaced with an insulating block 31.

[0067] See Figure 4-6 An insulating block 31 is filled between the TOP layer PCB board 11 onboard antenna 7 and the inner wall C1 of the plastic upper shell 8. Figure 1-3 The function of the inner wall protrusion 12 of the upper shell in the design is the same: to prevent the PCB-on-board antenna 7 from falling off during 1-meter height, 500-cycle drop tests, or 300,000-cycle vibration tests in the Y direction perpendicular to the PCB board 11. The position and size (length, width, thickness) of the insulating block 31 are the same as those of the inner wall protrusion 12 of the upper shell. This design is mainly because the plastic upper shell 8 has already been molded, and remolding would increase the cost and time of molding the plastic upper shell 8. Filling the inner wall C1 of the PCB-on-board antenna 7 with an insulating block 31 can achieve the same effect without increasing the cost and time of molding the plastic upper shell 8.

[0068] The projection of the PCB-onboard antenna 7 onto the BOT layer of the PCB board 11 onto the inner wall surface C2 of the plastic lower shell 9 fills an insulating block 15, which is related to... Figure 1-3 The function of the inner wall protrusion 4 of the lower shell in the design is the same: to prevent the PCB-on-board antenna 7 from falling off during 1-meter height, 500-cycle drop tests, or 300,000-cycle vibration tests in the Y direction perpendicular to the PCB board 11. The position and size (length, width, thickness) of the insulating block 15 are the same as those of the inner wall protrusion 4 of the lower shell. This design is mainly because the plastic lower shell 9 has already been molded, and remolding would increase the cost and time of mold opening and repair. Directly filling an insulating block 15 on the inner wall surface C2 from the PCB-on-board antenna 7 to the plastic lower shell 9 can achieve the same effect without increasing the cost and time of mold opening and repair for the plastic lower shell 9.

[0069] It should be noted that, Figure 4-6 The scheme shown is the same as Figure 1-3 Apart from the differences mentioned above, the schemes shown are basically the same in other aspects, and will not be described again.

[0070] The transmission and reception conversion efficiency of the PCB-on-board antenna 7 is highest when its length is 1 / 4 of the radio signal wavelength. Therefore, the length of the PCB-on-board antenna 7 is determined by the frequency, i.e., the wavelength, of the transmitted and received signals. Knowing the center frequencies of the corresponding transmission and reception signals allows calculation of the corresponding radio signal wavelength. Dividing the calculated wavelength by 4 gives the optimal length of the PCB-on-board antenna 7. The conversion formula between frequency and wavelength is: wavelength = 300,000 km / frequency = 300,000,000 m / frequency.

[0071] In the conventional design, the space between the PCB-on-board antenna 7 and the inner wall C1 of the plastic upper shell 8 is filled with air, and the dielectric constant of air is εr = 1.00053. The length of the PCB-on-board antenna 7 needs to be approximately one-quarter of the antenna's operating wavelength λ, resulting in a very long radiator, especially since the lowest operating frequency for LTE antennas is 700MHz. Using the calculation method described above, λ = 300,000,000 meters / 700MHz ≈ 4.2857142857 × 10⁻⁶ meters. -4 The length of the radiator when the PCB-on-board antenna 7 is used in an LTE antenna takes up a lot of the overall size of the PCB-on-board antenna 7. In addition, the large clearance area makes it impossible to implement in a compact, high-density PCB board.

[0072] and Figure 1-3 In the design, an inner wall protrusion 12 is provided on the inner wall surface C1 of the plastic upper shell 8 and the PCB-onboard antenna 7, so that the inner wall protrusion 12 completely covers the PCB-onboard antenna 7 (that is, the projection of the PCB-onboard antenna 7 onto the inner wall protrusion 12 falls entirely on the inner wall protrusion 12). Since the PCB-onboard antenna 7 needs to radiate electromagnetic waves, the plastic upper shell 8 and the inner wall protrusion 12 cannot be made of conductive materials such as metal. Otherwise, the PCB-onboard antenna 7 will be reflected or absorbed by the conductive material upper shell when radiating electromagnetic waves, causing the PCB-onboard antenna 7 to malfunction. Therefore, the materials of the plastic upper shell 8 and the inner wall protrusion 12 are generally non-conductive materials such as PC (polycarbonate), ABS plastic, and ceramic. The relative permittivity εr of PC (polycarbonate) is typically between 2.9 and 3.3, while that of ABS plastic is typically between 2.4 and 4.1. This means that filling the space between the PCB-on-board antenna 7 and the inner wall surface C1 of the plastic upper shell 8 with the inner wall protrusion 12 will change the electrical parameters of the PCB-on-board antenna 7. This can shorten the length of the radiator in the PCB-on-board antenna 7, thus saving space and reducing the overall size of the PCB-on-board antenna 7 when used in LTE antennas. This allows the application of the PCB-on-board antenna 7 in LTE antennas to be realized in products or equipment with compact, high-density PCB boards.

[0073] and Figure 4-6 In the design, an insulating block 31 is set on the inner wall surface C1 of the plastic upper shell 8 and the PCB board-mounted antenna 7, so that the insulating block 31 completely covers the PCB board-mounted antenna 7 (that is, the projection of the PCB board-mounted antenna 7 onto the insulating block 31 falls entirely on the insulating block 31). Since the PCB board-mounted antenna 7 needs to radiate electromagnetic waves, the plastic upper shell 8 and the insulating block 31 cannot be made of conductive materials such as metal. Otherwise, when the PCB board-mounted antenna 7 radiates electromagnetic waves, it will be reflected or absorbed by the conductive material upper shell and the insulating block 31, causing the PCB board-mounted antenna 7 to malfunction. Therefore, the materials of the plastic upper shell 8 and the insulating block 31 are generally non-conductive materials such as PC (polycarbonate), ABS plastic, and ceramic. The relative permittivity εr of PC (polycarbonate) is typically between 2.9 and 3.3, while that of ABS plastic is typically between 2.4 and 4.1. This means that filling the space between the PCB-on-board antenna 7 and the inner wall C1 of the plastic upper shell 8 with an insulating block 31 will change the electrical parameters of the PCB-on-board antenna 7, thus shortening the length of the radiator in the PCB-on-board antenna 7 and saving on the size of the PCB-on-board antenna 7.

[0074] At microwave frequencies, a larger relative permittivity εr is desirable for miniaturizing radio frequency devices (such as PCB-mounted antennas). According to microwave transmission theory, at the same resonant frequency, a larger εr results in a smaller dielectric resonator size, allowing electromagnetic energy to be more concentrated within the dielectric and less affected by the surrounding environment. This benefits both the miniaturization and high quality of dielectric resonators.

[0075] In conventional designs, the area between the PCB-mounted antenna 7 and the inner wall C2 of the plastic lower shell 9, projected onto the PCB board 11, is filled with air. The thickness of the PCB board 11 is typically between 0.8mm and 1.6mm. Figure 1-3 The plastic lower shell 9 and the inner wall protrusion 4 (which overlaps with the Y-direction projection of the PCB-mounted antenna 7) must be made of non-conductive materials, such as PC (polycarbonate), ABS plastic, ceramics, etc. Otherwise, when the PCB-mounted antenna 7 radiates electromagnetic waves, it will be reflected or absorbed by the conductive material of the lower shell and the inner wall protrusion 4, causing the PCB-mounted antenna 7 to malfunction. The plastic lower shell 9 and the inner wall protrusion 4 can save the size of the PCB-mounted antenna 7, thus shortening the length of the radiator when the PCB-mounted antenna 7 is used in an LTE antenna, reducing the overall size of the PCB-mounted antenna 7, and enabling the application of the PCB-mounted antenna 7 in LTE antennas in compact, high-density PCB products or equipment.

[0076] Figure 4-6The plastic lower shell 9 and insulating block 15 (which overlaps with the Y-direction projection of the PCB-on-board antenna 7) must be made of non-conductive materials, such as PC (polycarbonate), ABS plastic, ceramic, etc. Otherwise, when the PCB-on-board antenna 7 radiates electromagnetic waves, the conductive material of the lower shell and insulating block 15 will reflect or absorb the waves, causing the PCB-on-board antenna 7 to malfunction. The plastic lower shell 9 and insulating block 15 can save space in the PCB-on-board antenna 7, thus shortening the length of the radiator when the PCB-on-board antenna 7 is used in an LTE antenna, reducing the overall size of the PCB-on-board antenna 7. This allows the application of the PCB-on-board antenna 7 in LTE antennas to be realized in products or equipment with compact, high-density PCB boards.

[0077] Figure 7 Another cross-sectional view of a plastic upper shell, PCB board, and plastic lower shell in the vertical direction is given. Figure 8 Another top view of the plastic lower shell and PCB board in the horizontal direction is given. Figure 9 Another top view of a plastic upper shell, PCB board, and plastic lower shell in the horizontal direction is given. Figure 10 Another cross-sectional view of a plastic upper shell, PCB board, and plastic lower shell in the horizontal direction is given. Figure 7 that is Figure 8 The plastic lower shell and PCB board are located in the middle. Figure 9 A cross-sectional view of the plastic upper shell and PCB board along the horizontal direction of the e1-e2 section. Figure 10 that is Figure 8 The plastic lower shell and PCB board are located in the middle. Figure 9 A cross-sectional view of the plastic upper shell and PCB board along the horizontal direction of the e3-e4 section.

[0078] like Figure 7-9 The scheme shown is based on the above Figure 4-6Based on this, at the end of PCB 11 along the Z direction (near the PCB-on-board antenna 7), PCB 11 is separated from the upper shell stud 16, lower shell stud 21, upper shell stud 17, and lower shell stud 22. The end of PCB 11 along the Z direction (near the PCB-on-board antenna 7) is convex. Where it overlaps with the upper shell stud 16 and lower shell stud 21, an "L"-shaped notch is made on PCB 11; where it overlaps with the upper shell stud 17 and lower shell stud 22, an "L"-shaped notch is made on PCB 11, that is, at P... At the Z-direction end of CB board 11 (near the PCB board antenna 7), PCB board 11 is offset from upper shell stud 16, lower shell stud 21, upper shell stud 17, and lower shell stud 22, and they are not in contact with each other. The PCB board antenna 7 is set on the TOP layer at the Z-direction end of PCB board 11. An insulating block 31 is filled between the PCB board antenna 7 and the inner wall surface C1 of the plastic upper shell 8. An insulating block 15 is filled between the projection position of the PCB board antenna 7 on the BOT layer of PCB board 11 and the inner wall surface C2 of the plastic lower shell 9. Figure 7-9 Insulating block 31, insulating block 15 and Figure 4-6 The insulating blocks 31 and 15 in the middle have the same function.

[0079] like Figure 10 As shown, when the plastic upper shell 8 is not installed, when the PCB board 11 is placed inside the plastic lower shell 9, the screw holes 110 in the PCB board 11 are aligned with the studs 211 and screw holes 151 in the plastic lower shell 9, and the screw holes 120 in the PCB board 11 are aligned with the studs 221 and screw holes 141 in the plastic lower shell 9. Screws 51 are inserted into the screw holes 110 in the PCB board 11, the studs 211 and screw holes 151 in the plastic lower shell 9, and screws 61 are inserted into the screw holes 120 in the PCB board 11, the studs 221 and screw holes 141 in the plastic lower shell 9, which can firmly fix the PCB board 11 to the studs 211 and studs 221 in the plastic lower shell 9.

[0080] like Figure 7-9As shown, when screw 5 is inserted into screw hole 1 of upper shell stud 16 and screw hole 13 of lower shell stud 21, and screw 6 is inserted into screw hole 2 of upper shell stud 17 and screw hole 14 of lower shell stud 21, the plastic upper shell 8 and plastic lower shell 9 can be firmly fixed. Because screw 5 is inserted into screw hole 1 of upper shell stud 16 and screw hole 13 of lower shell stud 21, it will apply downward stress (-Y direction) to plastic upper shell 8. The downward stress (-Y direction) generated by plastic upper shell 8 along the e1-e1 cross section is applied to insulating block 31 and TOP layer of PCB board 11, while plastic lower shell 9 applies upward stress (Y direction). The upward stress (Y direction) generated by plastic lower shell 9 along the e1-e1 cross section is applied to insulating block 15 and BOT layer of PCB board 11. After the stress of the two reaches equilibrium, they cancel each other out. Screws 5 and 6 firmly fix plastic upper shell 8, insulating block 31, PCB board antenna 7, PCB board 11, insulating block 15, and plastic lower shell 9 into a whole, avoiding the problem of PCB board antenna 7 falling off when performing a 1-meter height, 500-time drop test or 300,000-time vibration test.

[0081] Figure 7-9 The insulating block 15 and insulating block 31 in the scheme shown are Figure 4-6 In the scheme shown, the positions and dimensions of insulating block 15 and insulating block 31 are the same. Figure 4-6 The scheme shown is the same as Figure 7-9 Apart from the differences mentioned above, the schemes shown are basically the same in other aspects, and will not be described again.

[0082] To demonstrate the rationality and practicality of this embodiment, Figure 1 Taking the application of the complete solution shown in the diagram in a wireless vehicle-mounted device as an example, the efficiency of the PCB-mounted antenna 7 in the wireless vehicle-mounted device in each frequency band from 700MHz to 2690MHz is presented in Table 1.

[0083] Table 1. Efficiency of PCB-mounted antenna 7 in various frequency bands from 800 MHz to 2.7 GHz

[0084]

[0085] When the PCB-onboard antenna 7 operates in the range of 700MHz to 2690MHz, its efficiency is 51.03% to 80.95%. The efficiency of the PCB-onboard antenna 7 in the LTE frequency range meets the design requirements. Specifically, the projection of the lower shell inner wall protrusion 4 between the BOT layer of the PCB board 11 and the inner wall surface C2 of the plastic lower shell 9, and the projection of the upper shell inner wall protrusion 12 between the TOP layer of the PCB board antenna 7 and the inner wall surface C1 of the plastic upper shell 8, not only meets the strict ISO 16750-3 detachment test standard, but also does not affect the performance indicators of the PCB-onboard antenna 7 in various aspects, proving that the solution of this embodiment is reasonable and scientific.

[0086] While specific embodiments of this utility model have been described above, those skilled in the art should understand that these are merely illustrative examples, and the scope of protection of this utility model is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of this utility model, but all such changes and modifications fall within the scope of protection of this utility model.

Claims

1. A communication device, characterized in that, It includes an upper shell, a substrate, and a lower shell, the substrate being disposed between the upper shell and the lower shell, the upper shell, the substrate, and the lower shell being fixedly connected, and a first component being disposed on the substrate; A first cavity is provided between the upper shell and the top layer of the substrate. The first component is located in the first cavity. A first insulator is filled between the first component and the inner wall of the upper shell. Under the fixed pressure of the upper shell, the first insulator generates a first stress in the vertical direction along the first component toward the substrate.

2. The communication device as described in claim 1, characterized in that, A second insulator is filled between the bottom layer of the substrate and the inner wall of the lower shell. The projections of the first component and the second insulator on the inner wall of the lower shell at least partially overlap. The second insulator generates a second stress in the opposite direction to the first stress toward the substrate.

3. The communication device as described in claim 1 or 2, characterized in that, The upper shell is provided with a first screw hole, the base plate is provided with a second screw hole, and the lower shell is provided with a third screw hole; The upper shell, the base plate, and the lower shell are fixedly connected by screws that pass through the first screw hole, the second screw hole, and the third screw hole in sequence.

4. The communication device as described in claim 3, characterized in that, The lower shell is also provided with a stud, and the screw is fixed to the stud so that the substrate is raised and a third stress is generated in the opposite direction to the first stress.

5. The communication device as described in claim 1, characterized in that, The first insulator is an inner wall protrusion of the upper shell, which is integrally formed with the upper shell.

6. The communication device as described in claim 2, characterized in that, The second insulator is a protrusion on the inner wall of the lower shell, which is integrally formed with the lower shell.

7. The communication device as described in claim 1, characterized in that, The first insulator is an insulating block.

8. The communication device as described in claim 2, characterized in that, The second insulator is an insulating block.

9. The communication device as described in claim 1, characterized in that, A second cavity is provided between the lower shell and the bottom layer of the substrate, and some components on the substrate are located in the second cavity.

10. The communication device as described in claim 1, characterized in that, The communication device is a wireless vehicle-mounted device.

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