Wafer double-sided automatic detection device

Abstract

The utility model discloses a wafer double-sided automatic detection device, which comprises a base, a turntable, a first visual detection lens, a second visual detection lens and a third visual detection lens, a rotation driving mechanism is arranged on the base, and the turntable is horizontally arranged on the rotation driving mechanism. A plurality of positioning grooves corresponding to wafers are formed in the top face of the rotary disc in an annular array mode, through holes extending to the bottom face of the rotary disc are formed in the bottoms of the positioning grooves, the first visual inspection lens is suspended above the a positioning groove, and the second visual inspection lens is arranged below the through hole of the b positioning groove. A lifting driving mechanism located below the through hole of the c positioning groove is arranged on the base, a telescopic rod pointing to the upper portion is arranged on the lifting driving mechanism, a tray located below the top is concentrically arranged on the telescopic rod, and third visual inspection lenses are arranged on the tray in an annular array and point to the upper portion; automatic visual detection of the front and back surfaces of the wafer is realized, and the automation level is improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer inspection technology, and in particular to an automatic wafer double-sided inspection device. Background Technology

[0002] During the wafer fabrication process, visual inspection is required. Visual inspection lenses are used to capture images of the front and back of the wafer. By comparing these images with standard wafer images in a database, it is determined whether the inspected wafer is qualified.

[0003] To ensure the accuracy of visual inspection, the wafer needs to be positioned first, for example, by designing positioning slots on the carrier and placing the wafer into the slots for inspection. However, this only allows for visual inspection of the front side of the wafer, as the edges of the back side are obscured by the positioning slots. To enable inspection of the back side of the wafer, it is necessary to flip the wafer, which is cumbersome and affects the efficiency of inspection, requiring improvement. Utility Model Content

[0004] The purpose of this invention is to provide an automatic double-sided wafer inspection device for performing double-sided visual inspection of wafers and improving inspection efficiency.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] An automated wafer double-sided inspection device includes: a base, a turntable, a first vision inspection lens, a second vision inspection lens, and a third vision inspection lens. A rotation drive mechanism is mounted on the base. The turntable is horizontally mounted on the rotation drive mechanism. A ring array of positioning slots corresponding to the wafers is arranged on the top surface of the turntable. Through holes extending to the bottom surface of the turntable are provided at the bottom of each positioning slot. The first vision inspection lens is suspended above the a-th positioning slot. The second vision inspection lens is positioned below the through hole of the b-th positioning slot. A lifting drive mechanism is mounted on the base below the through hole of the c-th positioning slot. An upward-pointing telescopic rod is mounted on the lifting drive mechanism. A tray located below the top is concentrically mounted on the telescopic rod. The third vision inspection lens is arranged in a ring array on the tray and points upward.

[0007] The rotary drive mechanism employs a cam divider.

[0008] The positioning groove is a circular groove, and the diameter of the through hole is smaller than the diameter of the positioning groove.

[0009] The base has a column located on one side of the turntable, a sliding sleeve is provided on the column, and a cantilever extending above the first visual inspection lens is provided on the sliding sleeve. The first visual inspection lens is located at the bottom of the cantilever.

[0010] The sliding sleeve is provided with fastening screws pointing towards the column.

[0011] The number of positioning slots is at least four.

[0012] A silicone pad is provided at the top of the telescopic rod.

[0013] The number of the third vision detection lenses is at least three.

[0014] The base is provided with a pad located below the second vision detection lens.

[0015] The beneficial effects of this utility model are as follows: A wafer double-sided automatic inspection device allows for the following: After a manual or robotic arm places the wafer in a positioning slot, the wafer is moved to the area below a first vision inspection lens by the rotation of a turntable, where an image of the top surface of the wafer is acquired. Then, the turntable continues to rotate by an angle, moving the wafer to the area above a second vision inspection lens, where an image of the center of the bottom surface of the wafer is acquired. The turntable continues to rotate by an angle, moving the wafer to the area above a third vision inspection lens. The wafer is first lifted upwards by a telescopic rod to remove it from the positioning slot, and then an image of the edge of the bottom surface of the wafer is acquired by the third vision inspection lens. This achieves automatic visual inspection of the front and back sides of the wafer, improving the level of automation and inspection efficiency. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this utility model;

[0017] Figure 2 yes Figure 1 A schematic diagram of the structure of the rising third vision detection lens. Detailed Implementation

[0018] The following is combined Figures 1-2 The technical solution of this utility model will be further illustrated through specific embodiments.

[0019] like Figure 1 The wafer double-sided automatic inspection device shown includes: a base 1, a turntable 3, a first vision inspection lens 11, a second vision inspection lens 12 and a third vision inspection lens 13. A rotary drive mechanism 2 is provided on the base 1, and the turntable 3 is horizontally arranged on the rotary drive mechanism 2. In this embodiment, the rotary drive mechanism 2 adopts a cam divider, which can be controlled by a PLC to realize the rotation drive of the turntable 3 by 90 degrees each time.

[0020] like Figure 2As shown, the top surface of the turntable 3 is arranged in a ring array with several positioning slots 17 corresponding to the wafer 4. In this embodiment, there are 4 positioning slots 17. The 4 positioning slots 17 meet the needs of cyclic loading and unloading and inspection of the wafer 4. For example, the first 3 positioning slots correspond to the three inspection stations, and the 4th positioning slot corresponds to the loading and unloading station. The 4 positioning slots 17 are cyclically switched.

[0021] The wafer 4 is placed in the positioning groove 17 by manual labor or a robotic arm for automatic positioning. A through hole 10 extending to the bottom of the turntable 3 is provided at the bottom of the positioning groove 17. In this embodiment, the positioning groove 17 is a circular groove to achieve precise positioning of the wafer 4. The diameter of the through hole 10 is smaller than the diameter of the positioning groove 17, forming a step to prevent the wafer 4 from falling out.

[0022] The first visual inspection lens 11 is suspended above the first positioning slot to acquire images of the top surface of the wafer 4 in the positioning slot. To fix the first visual inspection lens 11, a column 9 is provided on the base 1 located on one side of the turntable 3. A sliding sleeve 8 is provided on the column 9, and a cantilever 6 extending above the first visual inspection lens 11 is provided on the sliding sleeve 8. The first visual inspection lens 11 is located at the bottom of the cantilever 6 and can be fixed with screws, making it easy to install and remove.

[0023] The position and height of the cantilever 6 and the first vision detection lens 11 can be adjusted by sliding the sliding sleeve 8 on the column 9. The sliding sleeve 8 is provided with a fastening screw 7 pointing towards the column, and the adjusted sliding sleeve 8 is fixed by the fastening screw 7.

[0024] The second visual inspection lens 12 is located below the through hole of the second positioning groove. The base 1 is provided with a pad 5 located below the second visual inspection lens 12. The second visual inspection lens 12 is fixed to the pad 5 with screws. By replacing the pad 5 with different thicknesses, the height of the second visual inspection lens 12 can be adjusted. The second visual inspection lens 12 is used to acquire images of the center of the bottom surface of the wafer in the upper positioning groove.

[0025] A lifting drive mechanism 14 is provided on the base 1, located below the through hole of the third positioning slot. The lifting drive mechanism 14 is equipped with an upward-pointing telescopic rod 18. In this embodiment, the lifting drive mechanism 14 uses a cylinder or an electric telescopic rod, and its extension and retraction are controlled by a PLC, resulting in high flexibility. Figure 2 As shown, the wafer is lifted upwards and removed from the positioning slot by the telescopic rod 18.

[0026] In this embodiment, a silicone pad 16 is provided at the top of the telescopic rod 18, and the bottom of the silicone pad 16 is fixed to the top of the telescopic rod 18 with glue, resulting in a relatively stable structure. The silicone pad 16 contacts the bottom surface of the wafer, preventing damage to the wafer. Furthermore, the silicone pad 16 has good anti-slip properties, preventing the wafer from slipping off the top surface of the silicone pad 16.

[0027] A tray 15 is concentrically arranged on the telescopic rod 18, located below the top. The tray 15 can be fixed to the telescopic rod 18 with screws to prevent slippage. The third vision inspection lenses 13 are arranged in a circular array on the tray 15, pointing upwards. In this embodiment, there are three third vision inspection lenses 13. Each third vision inspection lens 13 acquires images within a range of 120° or more from the edge of the wafer bottom surface to avoid omissions.

[0028] The wafer is fed to the first inspection station (the first vision inspection lens 11) by the rotation of turntable 3, where the top surface of the wafer is captured. Then, turntable 3 rotates 90 degrees to the second inspection station (the second vision inspection lens 12), where the bottom center of the wafer is captured. The turntable rotates 90 degrees to the third inspection station (the third vision inspection lens 13), where the wafer is first lifted upwards by telescopic rod 18 to remove it from the positioning slot 17, and then the bottom edge of the wafer is captured by the third vision inspection lens 13. This achieves automatic visual inspection of the front and back of the wafer, improving the level of automation and inspection efficiency.

[0029] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of ​​this utility model. The content of this specification should not be construed as a limitation of this utility model.

Claims

1. A wafer double-sided automatic inspection device for visual inspection of wafers, characterized in that, include: The device comprises a base, a turntable, a first vision inspection lens, a second vision inspection lens, and a third vision inspection lens. The base is equipped with a rotation drive mechanism. The turntable is horizontally mounted on the rotation drive mechanism. The top surface of the turntable has a ring array of positioning slots corresponding to the wafers. Each positioning slot has a through-hole extending to the bottom surface of the turntable. The first vision inspection lens is suspended above the a-th positioning slot. The second vision inspection lens is positioned below the through-hole of the b-th positioning slot. The base is equipped with a lifting drive mechanism located below the through-hole of the c-th positioning slot. The lifting drive mechanism has an upward-pointing telescopic rod. A tray is concentrically mounted on the telescopic rod, positioned below the top. The third vision inspection lens is arranged in a ring array on the tray, pointing upwards.

2. The automatic wafer double-sided inspection device according to claim 1, characterized in that, The rotary drive mechanism employs a cam divider.

3. The automatic wafer double-sided inspection device according to claim 1, characterized in that, The positioning groove is a circular groove, and the diameter of the through hole is smaller than the diameter of the positioning groove.

4. The automatic wafer double-sided inspection device according to claim 1, characterized in that, The base is provided with a column located on one side of the turntable, the column is provided with a sliding sleeve, and the sliding sleeve is provided with a cantilever extending above the first visual inspection lens, the first visual inspection lens being located at the bottom of the cantilever.

5. The automatic wafer double-sided inspection device according to claim 4, characterized in that, The sliding sleeve is equipped with fastening screws that point towards the column.

6. The automatic wafer double-sided inspection device according to claim 1, characterized in that, The number of positioning slots is at least four.

7. The automatic wafer double-sided inspection device according to claim 1, characterized in that, A silicone pad is provided at the top of the telescopic rod.

8. The automatic wafer double-sided inspection device according to claim 1, characterized in that, The number of the third vision detection lenses is at least three.

9. The automatic wafer double-sided inspection device according to claim 1, characterized in that, The base is provided with a pad located below the second vision detection lens.

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