Tin planting net with composite heat dissipation structure

Abstract

The utility model relates to the technical field of tin planting tools, in particular to a tin planting net with a composite heat dissipation structure, which comprises a main body plate, a tin planting area used for placing a chip and carrying out tin planting operation is arranged in the middle of the main body plate, a plurality of tin planting holes corresponding to chip pins in position are arranged in the tin planting area, and an air cooling part is fixedly arranged at the edge of the tin planting area. A water cooling component is arranged in the main body plate, and a plurality of radiating fins are mounted on the top surface of the main body plate and located on the periphery of the tin planting area. According to the tin planting net with the composite heat dissipation structure, air cooling, water cooling and the heat dissipation fins are combined, multi-dimensional and all-directional heat dissipation is achieved, heat can be rapidly taken away, accumulation is avoided, and rapid cooling is achieved. The water cooling pipeline is distributed in a snake shape, the fan supplies air accurately, and the radiating fins are scientific in layout; and the heat conduction and convection heat exchange efficiency is improved through the material and thickness design of the water cooling pipe and the micro-nano coating of the radiating fins. Excessive melting of soldering tin is avoided, welding spots are regular, connection is strong, damage of high temperature to pins is reduced, tin planting quality is improved, and the service life of a chip is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of tin-retaining tools, and more specifically, to a tin-retaining mesh with a composite heat dissipation structure. Background Technology

[0002] In the manufacturing and maintenance of electronic devices, chip soldering is a crucial process. Its quality directly affects the stability of the connection between the chip and the circuit board, and has a profound impact on the overall performance of the electronic device. In traditional chip soldering operations, the soldering process generates a large amount of heat. If heat dissipation is not timely or sufficient, the temperature of the soldering area will rise sharply, leading to numerous problems.

[0003] Currently, some solder meshes on the market use a single heat dissipation method. For example, the "Solder Mesh with Heat Dissipation Gaps" patent application number CN209216924U relies solely on these gaps for heat dissipation. This single heat dissipation method is extremely inefficient when facing the high heat generated during the soldering process. As the soldering operation continues, heat accumulates, and the temperature in the soldering area rises continuously, easily causing over-melting of the solder. This results in irregular solder joint shapes, insufficient connection strength, and may even damage chip pins, severely affecting the quality and precision of the soldering, and consequently impacting the performance and stability of electronic devices. Therefore, developing a more efficient heat dissipation structure to meet the heat dissipation requirements during the chip soldering process is particularly urgent. Utility Model Content

[0004] The purpose of this invention is to provide a soldering mesh with a composite heat dissipation structure to solve the problem that the single heat dissipation method mentioned in the background art is extremely inefficient when facing the high heat generated during the soldering process.

[0005] To achieve the above objectives, this utility model provides a soldering mesh with a composite heat dissipation structure, including a main board. The main board has a soldering area in the middle for placing chips and performing soldering operations. The soldering area has multiple soldering holes corresponding to the chip pin positions. An air-cooling component is fixedly installed at the edge of the soldering area. A water-cooling component is installed inside the main board. Several heat dissipation fins are installed on the top surface of the main board around the soldering area.

[0006] The main board features a soldering area and soldering holes in the center, which can accurately match the chip pins to complete the soldering operation. The air-cooled components at the edge of the soldering area, the water-cooled components inside the main board, and the heat dissipation fins around the soldering area form a composite heat dissipation structure. This multi-mode coordinated heat dissipation quickly reduces the temperature of the soldering area, avoids high temperature affecting the soldering quality, and improves the accuracy and reliability of soldering.

[0007] Preferably, the tin-planting area has a rectangular groove structure, and the tin-planting holes are distributed in a matrix at the bottom of the tin-planting area.

[0008] This setting is compatible with various chip pin layouts, improves the versatility of the solder mesh, meets the soldering needs of different chips, and reduces tool usage costs.

[0009] Preferably, the water-cooling component includes a water-cooling pipe with an inlet at one end and an outlet at the other end. The water-cooling pipe is distributed in a serpentine pattern inside the main body plate near the soldering area. Both the inlet and outlet extend to the outside of the main body plate and are connected to an external water tank. The coolant circulating inside the water-cooling pipe can efficiently absorb the heat generated in the soldering area, achieving a good heat dissipation effect.

[0010] This setting enables stable and efficient heat dissipation, providing a low-temperature environment for tinning operations.

[0011] Preferably, one side of the external water tank is connected to an outlet pipe and an inlet pipe. A water pump is installed on the outlet pipe. The outlet pipe is connected to the inlet end of the water-cooling pipe, and the inlet pipe is connected to the outlet end of the water-cooling pipe.

[0012] This setup includes an external water tank, outlet pipe, inlet pipe, and water pump, forming a coolant circulation system to ensure a continuous and stable flow of coolant.

[0013] Preferably, the air-cooling component includes a miniature fan, which is mounted on the inner side of the solder patch via a bracket, and the air outlet of the miniature fan faces the solder patch.

[0014] This feature involves installing a miniature fan on the side of the solder patch with its outlet facing the patch, which accelerates airflow within the patch area.

[0015] Preferably, the heat dissipation fins are integrally formed with the main body plate or are fixedly connected by welding.

[0016] This feature ensures that the heat dissipation fins are integrally formed or welded to the main plate, providing a firm and reliable connection and guaranteeing stable operation of the heat dissipation fins.

[0017] Preferably, the surface of the heat dissipation fins is provided with a micro-nano structure coating to increase the convective heat transfer coefficient between the heat dissipation fins and the air.

[0018] This feature incorporates a micro-nano structure coating on the surface of the heat dissipation fins, which significantly increases the convective heat transfer coefficient with the air, accelerates heat dissipation, and significantly improves heat dissipation efficiency under air cooling, thus optimizing the heat dissipation performance of the tin-coated mesh.

[0019] Preferably, the water-cooled pipe is made of a metal material with a thermal conductivity of not less than 400 W / (m・K) and a wall thickness of 0.3-0.8 mm, so as to improve heat conduction efficiency while ensuring strength.

[0020] This design uses high thermal conductivity metal materials and appropriately sets the pipe wall thickness to maximize heat transfer efficiency while ensuring pipe strength. This allows the water-cooled pipes to quickly absorb and transfer heat, improving the heat dissipation effect of the water-cooled components.

[0021] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0022] This tin-retaining mesh with a composite heat dissipation structure combines air cooling, water cooling, and heat dissipation fins for multi-dimensional, all-around heat dissipation, quickly removing heat and preventing heat buildup for rapid cooling. The serpentine distribution of water-cooling pipes, precise fan airflow, and scientifically laid-out heat dissipation fins, along with the water-cooling pipe material and thickness design and the micro-nano coating on the heat dissipation fins, enhance heat conduction and convection heat transfer efficiency. It prevents excessive solder melting, resulting in regular, strong solder joints, reducing high-temperature damage to pins, and improving tin-retaining quality and chip lifespan. The design of the tin-retaining area and holes is compatible with various chips; the water-cooling and air-cooling components facilitate coolant replacement and equipment maintenance. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0024] Figure 2 This is a schematic diagram of the internal structure of the present invention;

[0025] Figure 3 This is a schematic diagram of the cross-sectional structure of the present invention;

[0026] The meanings of the labels in the diagram are as follows:

[0027] 1. Main board; 2. Soldering area; 21. Soldering hole; 3. Heat dissipation fins; 4. Water cooling components; 5. External water tank; 51. Water outlet pipe; 52. Water inlet pipe; 53. Water pump; 6. Air cooling components. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] This utility model provides a tin-coated mesh with a composite heat dissipation structure, such as... Figures 1-3As shown, the system includes a main board 1, a soldering area 2 for placing chips and performing soldering operations is provided in the middle of the main board 1, a plurality of soldering holes 21 corresponding to the chip pin positions are provided in the soldering area 2, an air-cooling component 6 is fixedly installed at the edge of the soldering area 2, a water-cooling component 4 is provided inside the main board 1, and a plurality of heat dissipation fins 3 are installed on the top surface of the main board 1 around the soldering area 2.

[0030] The main board 1 serves as the foundational support structure for the entire soldering mesh. The soldering area 2 in its center provides a specific placement space for the chip, ensuring its stable position during the soldering process. The soldering holes 21 within the soldering area 2 correspond one-to-one with the chip pin positions, allowing solder to adhere accurately to the chip pins during soldering, ensuring precision and improving the reliability of the chip-to-circuit board connection. The air-cooled component 6 at the edge of the soldering area 2, the water-cooled component 4 within the main board 1, and the heat dissipation fins 3 around the soldering area 2 together constitute a composite heat dissipation structure. The air-cooled component 6 quickly removes some heat through airflow, the water-cooled component 4 efficiently absorbs a large amount of heat using coolant circulation, and the heat dissipation fins 3 increase the heat dissipation area, accelerating heat dissipation. These three heat dissipation methods work together to form a comprehensive, multi-layered heat dissipation system, effectively preventing problems such as excessive solder melting and chip pin damage caused by heat accumulation during soldering, thus improving the quality and efficiency of the soldering process.

[0031] In this embodiment, as Figure 1 , Figure 2 As shown, the tin-planting area 2 is a rectangular groove structure, and the tin-planting holes 21 are distributed in a matrix at the bottom of the tin-planting area 2.

[0032] The regular rectangular slots and matrix hole distribution make chip placement more convenient and accurate. Operators can more easily align chip pins and solder holes when performing soldering operations, improving the convenience and efficiency of operation and reducing soldering errors caused by improper operation.

[0033] Specifically, such as Figure 1 As shown, the water-cooled component 4 includes water-cooled pipes. One end of the water-cooled pipe is provided with a water inlet, and the other end is provided with a water outlet. The water-cooled pipes are distributed in a serpentine pattern inside the main body plate 1 near the soldering area 2. Both the water inlet and the water outlet extend to the outside of the main body plate 1 and are connected to the external water tank 5. The coolant circulating inside the water-cooled pipes can efficiently absorb the heat generated by the soldering area 2, achieving a good heat dissipation effect.

[0034] The water-cooling pipes are arranged in a serpentine pattern inside the main board 1, near the solder pad 2. This design allows the water-cooling pipes to be as close to the heat source as possible, increasing the contact area and contact time between the coolant and the solder pad 2. During the circulation process, the coolant can quickly and efficiently absorb the large amount of heat generated in the solder pad 2, transferring the heat from the high-temperature area to the external water tank 5 for heat dissipation. A closed coolant circulation system is formed by connecting the inlet and outlet ends to the external water tank 5. The continuous circulation of coolant within the system ensures the stability and sustainability of the heat dissipation effect. Even during prolonged, high-intensity solder pad operations, the temperature of the solder pad 2 can be effectively controlled within a reasonable range, preventing adverse effects on the chip and solder quality due to excessive temperature.

[0035] Furthermore, such as Figure 2 As shown, an outlet pipe 51 and an inlet pipe 52 are connected to one side of the external water tank 5. A water pump 53 is installed on the outlet pipe 51. The outlet pipe 51 is connected to the inlet end of the water cooling pipe, and the inlet pipe 52 is connected to the outlet end of the water cooling pipe.

[0036] A water pump 53 is installed on the outlet pipe 51, providing power for the circulation of the coolant. Through the operation of the water pump 53, the coolant in the external water tank 5 is transported through the outlet pipe 51 to the inlet end of the water-cooling pipe. After absorbing heat in the water-cooling pipe, the coolant flows back to the external water tank 5 through the inlet pipe 52. This forced circulation method ensures that the coolant can flow continuously and stably in the water-cooling system, improving heat dissipation efficiency. The external water tank 5 serves as a storage and heat dissipation device for the coolant. The coolant in the tank can exchange heat with the outside air, dissipating the absorbed heat. Through continuous circulation, the coolant can maintain a low temperature, thus ensuring the continuous heat dissipation effect of the water-cooled component 4 on the solder pad area 2.

[0037] Furthermore, such as Figure 3 As shown, the air-cooled component 6 includes a miniature fan, which is mounted on the inner side of the solder patch 2 via a bracket, and the air outlet of the miniature fan faces the solder patch 2.

[0038] A miniature fan is installed on the inner side of the solder patch 2 with its air outlet facing the solder patch 2, enabling direct air cooling of the solder patch 2. The high-speed airflow generated by the fan accelerates the airflow around the solder patch 2, carrying away heat from the surface of the solder patch 2 and achieving rapid localized cooling. This targeted air cooling method can reduce the temperature of the solder patch 2 in a short time, reducing the impact of high temperatures on the soldering process. The air-cooled component 6 works in conjunction with the water-cooled component 4 and the heat sink fins 3 to form a synergistic heat dissipation effect. Air cooling can remove some heat, reducing the heat dissipation burden of the water-cooled component 4, while accelerating the airflow around the heat sink fins 3, improving the heat dissipation efficiency of the heat sink fins 3. The combined effect of these three heat dissipation methods further enhances the overall heat dissipation performance of the solder patch.

[0039] Furthermore, such as Figure 1 , Figure 3 As shown, the heat dissipation fins 3 are integrally formed with the main body plate 1 or are fixedly connected by welding.

[0040] The integral molding or welding connection method ensures a firm and reliable connection between the heat sink fins 3 and the main plate 1. During the soldering process, the heat sink fins 3 will not loosen or fall off due to vibration or other external forces, ensuring the stability and reliability of the heat dissipation structure. This tight connection method allows heat to be quickly transferred from the main plate 1 to the heat sink fins 3. The integral molding structure eliminates contact thermal resistance, and the welding connection also minimizes contact thermal resistance, thereby improving the efficiency of heat transfer and enabling the heat sink fins 3 to better perform their heat dissipation function and accelerate heat dissipation.

[0041] Furthermore, the surface of the heat dissipation fins 3 is coated with a micro-nano structure to increase the convective heat transfer coefficient between the heat dissipation fins and the air.

[0042] The micro-nano structure coating increases the surface roughness and microstructure of the heat dissipation fins 3, resulting in more turbulence when air flows over them, thus increasing the convective heat transfer coefficient between the fins and the air. This means that under the same temperature difference and airflow conditions, the heat dissipation fins 3 can transfer heat to the surrounding air more efficiently, improving heat dissipation efficiency. Combined with the function of the air-cooling component 6, the micro-nano structure coating further enhances the heat dissipation effect of the heat dissipation fins 3. Air cooling accelerates the airflow over the surface of the heat dissipation fins 3, while the micro-nano structure coating allows for more complete heat exchange between the air and the fins, effectively reducing the temperature of the solder patch 2 and ensuring solder patch quality.

[0043] Furthermore, the water-cooled pipes are made of metal materials with a thermal conductivity of not less than 400 W / (m・K) and a wall thickness of 0.3-0.8 mm to improve heat transfer efficiency while ensuring strength.

[0044] The water-cooled pipes are made of a metal material with a thermal conductivity of not less than 400 W / (m·K), ensuring rapid and efficient heat transfer between the coolant and the solder-coated zone 2. The high thermal conductivity of the material allows heat to be quickly transferred from the solder-coated zone 2 to the coolant, improving the heat absorption capacity of the water-cooled component 4 and effectively reducing the temperature of the solder-coated zone 2. The pipe wall thickness is set between 0.3 and 0.8 mm, ensuring sufficient strength to withstand the pressure of the coolant and the impact during circulation, without increasing thermal resistance due to excessive wall thickness, thus avoiding impact on heat transfer efficiency. This reasonable thickness design maximizes heat conduction efficiency while ensuring pipe strength, optimizing the heat dissipation performance of the water-cooled component 4.

[0045] When using the tin-retaining mesh with composite heat dissipation structure of this utility model, first place the chip at the bottom of the tin-retaining area 2 in the middle of the main board 1. Since the tin-retaining area 2 is a rectangular groove structure, the tin-retaining holes 21 are distributed in a matrix at its bottom, and the chip pins can accurately correspond to the tin-retaining holes 21. Then check whether the water inlet and outlet of the water-cooling component 4 are correctly connected to the external water tank 5, whether the water pump 53 on the water outlet pipe 51 is working properly, and whether the miniature fan of the air-cooling component 6 can operate normally.

[0046] The soldering process begins. During soldering, the chip and solder generate a large amount of heat, causing the temperature of the soldering area 2 to rise rapidly. Water pump 53 starts, providing power for the circulation of coolant. Coolant in the external water tank 5 is transported to the inlet of the water-cooling pipes through the outlet pipe 51. The water-cooling pipes are arranged in a serpentine pattern inside the main board 1 near the soldering area 2. The coolant makes full contact with the soldering area 2 during its flow, efficiently absorbing the large amount of heat generated. After absorbing heat, the coolant flows back to the external water tank 5 through the outlet of the water-cooling pipes and the inlet pipe 52. In the external water tank 5, the coolant exchanges heat with the outside air, dissipating the heat, and is then pumped back into the water-cooling pipes by water pump 53, forming a circulating cooling system that ensures the stability and continuity of the cooling effect. The miniature fan of the air-cooling component 6 is mounted on the inner side of the soldering area 2 via a bracket, with its air outlet facing the soldering area 2. The operation of the miniature fan generates airflow, accelerating the airflow around the solder pad 2 and directly carrying away the heat from the surface of the solder pad 2, achieving rapid local cooling. At the same time, the air cooling accelerates the airflow around the heat dissipation fins 3, assisting the heat dissipation fins 3 in dissipating heat.

[0047] The heat dissipation fins 3 are mounted on the top surface of the main body plate 1 around the tin-plating area 2, and are integrally formed with the main body plate 1 or fixedly connected by welding. Heat can be quickly transferred from the main body plate 1 to the heat dissipation fins 3. The surface of the heat dissipation fins 3 is coated with a micro-nano structure, which increases the convective heat transfer coefficient with the air. Under the action of air cooling, more turbulence is formed on the surface of the heat dissipation fins 3, making the heat exchange between the air and the heat dissipation fins 3 more complete and accelerating the dissipation of heat.

[0048] After the soldering operation is completed, turn off the water pump 53 and the miniature fan of the air-cooling component 6. After the soldering mesh has cooled naturally, remove the chip to complete the entire soldering process.

[0049] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A tin-coated mesh with a composite heat dissipation structure, comprising a main board (1), characterized in that: The main board (1) has a soldering area (2) in the middle for placing chips and performing soldering operations. The soldering area (2) has multiple soldering holes (21) corresponding to the chip pin positions. A wind-cooling component (6) is fixedly installed at the edge of the soldering area (2). A water-cooling component (4) is installed inside the main board (1). Several heat dissipation fins (3) are installed on the top surface of the main board (1) around the soldering area (2).

2. The tin-coated mesh with composite heat dissipation structure according to claim 1, characterized in that: The tin-planting area (2) is a rectangular groove structure, and the tin-planting holes (21) are distributed in a matrix at the bottom of the tin-planting area (2).

3. The tin-coated mesh with composite heat dissipation structure according to claim 1, characterized in that: The water-cooled component (4) includes a water-cooled pipe. One end of the water-cooled pipe is provided with a water inlet, and the other end is provided with a water outlet. The water-cooled pipe is distributed in a serpentine pattern inside the main body plate (1) near the tin-plating area (2). Both the water inlet and the water outlet extend to the outside of the main body plate (1) and are connected to an external water tank (5). The coolant circulating inside the water-cooled pipe can efficiently absorb the heat generated by the tin-plating area (2) and achieve a good heat dissipation effect.

4. The tin-coated mesh with composite heat dissipation structure according to claim 3, characterized in that: The external water tank (5) is connected to an outlet pipe (51) and an inlet pipe (52) on one side. A water pump (53) is installed on the outlet pipe (51). The outlet pipe (51) is connected to the inlet end of the water-cooled pipe, and the inlet pipe (52) is connected to the outlet end of the water-cooled pipe.

5. The tin-coated mesh with composite heat dissipation structure according to claim 1, characterized in that: The air-cooled component (6) includes a miniature fan, which is mounted on the inner side of the tin-plating area (2) via a bracket, and the air outlet of the miniature fan faces the tin-plating area (2).

6. The tin-coated mesh with composite heat dissipation structure according to claim 1, characterized in that: The heat dissipation fins (3) are integrally formed with the main body plate (1) or fixedly connected by welding.

7. The tin-coated mesh with a composite heat dissipation structure according to claim 6, characterized in that: The surface of the heat dissipation fins (3) is provided with a micro-nano structure coating to increase the convective heat transfer coefficient between the heat dissipation fins and the air.

8. The tin-coated mesh with composite heat dissipation structure according to claim 3, characterized in that: The water-cooled pipe is made of a metal material with a thermal conductivity of not less than 400 W / (m・K) and a wall thickness of 0.3-0.8 mm to improve heat transfer efficiency while ensuring strength.

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