Static phase modulation device
By incorporating dedicated heat dissipation and fan components within the static phase adjustment device, the safety risks and heat dissipation issues arising from externally mounted bypass switch components are resolved, resulting in a compact and reliable static phase adjustment device.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GUANGDONG MINGYANG LONGYUAN POWER ELECTRONICS
- Filing Date
- 2025-04-27
- Publication Date
- 2026-05-08
AI Technical Summary
The bypass switch assembly of traditional static phase adjustment devices is located externally, posing a risk of accidental damage or electric shock, and the heat dissipation problem has not been effectively solved.
A dedicated heat dissipation component and a fan component are installed inside the housing to guide airflow through the switch tube assembly, ensuring effective heat dissipation. At the same time, the capacitor assembly and the bypass switch assembly do not affect the heat dissipation efficiency, and the on/off state of the bypass switch assembly is controlled by the driven component.
A compact and reliable static phase adjustment device was developed, ensuring the heat dissipation requirements of the switching transistor group and capacitor assembly, and reducing the risk of accidental electric shock.
Smart Images

Figure CN224217969U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of power equipment technology, and in particular to a static phase adjustment device. Background Technology
[0002] The static phase-regulating device has a supercapacitor inside as a capacitor component to charge and discharge energy, providing active power support for the power grid system.
[0003] When a static phase-changing device is connected to the power grid, a bypass switch assembly can be installed at the input end. When the bypass switch assembly is turned on, the static phase-changing device is disconnected from the power grid; when the bypass switch assembly is turned off, the static phase-changing device is connected to the power grid. Since the static phase-changing device contains power devices, heat dissipation needs to be considered. In traditional static phase-changing devices, the bypass switch assembly is located outside the device. However, during use, there is a risk that external objects may accidentally touch the bypass switch assembly, causing damage to the bypass switch assembly or electric shock. Utility Model Content
[0004] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a static phase-adjusting device that is compact in structure, reliable in operation, and ensures adequate heat dissipation.
[0005] A static phase-adjusting device according to a first aspect embodiment of the present invention includes: a housing having a cavity, the housing having a first vent and a second vent, both communicating with the cavity, the first vent and the second vent being disposed opposite to each other; a fan assembly disposed within the housing and close to the first vent, the fan assembly being used to guide airflow sequentially through the first vent, the cavity, and the second vent, or to guide airflow sequentially through the second vent, the cavity, and the first vent; a heat dissipation assembly disposed within the housing and located between the first vent and the second vent; and a switching tube assembly disposed within the heat dissipation assembly and... The heat from the switching transistor assembly can be transferred to the heat dissipation assembly; the capacitor assembly is disposed inside the housing, along the airflow direction, located on one side of the heat dissipation assembly, and connected to the switching transistor assembly; the bypass switch assembly is disposed inside the housing and near the second vent, along the airflow direction, located at one end of the capacitor assembly and connected to the capacitor assembly; the housing is provided with an operating port communicating with the cavity; the bypass switch assembly is provided with a driven member capable of driving the bypass switch assembly to switch on / off states, and the driven member is exposed at the operating port.
[0006] A static phase-adjusting device according to an embodiment of the present invention has at least the following beneficial effects:
[0007] This utility model of a static phase-adjusting device includes a dedicated heat dissipation component within the housing for the switching transistor assembly, which experiences significant heat generation. A fan assembly guides airflow between the first and second ventilation openings, passing through the heat dissipation component. Since the capacitor assembly and bypass switch assembly are not positioned in the path of the airflow passing through the heat dissipation component, they do not significantly impact its heat dissipation efficiency. The heat from the switching transistor assembly is transferred to the heat dissipation component, and then from the heat dissipation component to the airflow, ensuring stable operation of the switching transistor assembly. Some airflow also passes through the capacitor assembly, ensuring its normal heat dissipation needs. Furthermore, when it is necessary to control the on / off state of the bypass switch assembly, the user can control the switching of the bypass switch assembly by manipulating the driven component exposed within the housing. This design is compact, reliable in operation, and ensures adequate heat dissipation.
[0008] According to some embodiments of the present invention, the heat dissipation assembly includes a heat exchange plate and multiple heat dissipation fins disposed on the lower surface of the heat exchange plate, with a flow channel formed between two adjacent heat dissipation fins, the flow channel being arranged along the airflow direction, and the switching tube assembly being disposed on the upper surface of the heat exchange plate.
[0009] According to some embodiments of the present invention, the capacitor assembly includes a plurality of elongated capacitors, which are vertically disposed on one side of the heat dissipation assembly. The plurality of capacitors are disposed along the airflow direction, and the switching transistor group is connected to each of the capacitors through a stacked busbar.
[0010] According to some embodiments of the present invention, a manifold is provided between the fan assembly and the heat dissipation assembly. One end of the manifold is connected to the housing, and the other end of the manifold is connected to the heat dissipation assembly. The manifold is used to guide the airflow into the ventilation duct.
[0011] According to some embodiments of the present invention, the housing is provided with an input port, the switch tube group is connected to one end of the input busbar, and the other end of the input busbar extends to the input port and protrudes from the cavity.
[0012] According to some embodiments of the present invention, the housing is provided with an output port, the capacitor assembly is connected to one end of the output busbar, and the other end of the output busbar extends to the output port and protrudes from the cavity.
[0013] According to some embodiments of the present invention, a middle layer plate and a control module are further provided inside the housing. The control module is connected to the switch transistor group and is disposed on the middle layer plate. The middle layer plate is located between the switch transistor group and the control module to separate the switch transistor group and the control module.
[0014] According to some embodiments of this utility model, the housing is further provided with an optical fiber interface, and the communication end of the control module is connected to the optical fiber interface.
[0015] According to some embodiments of the present invention, a power supply module is further provided inside the housing. The power supply module is disposed on the middle layer plate and is connected to the control module to supply power to the control module.
[0016] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0017] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:
[0018] Figure 1 This is a perspective view of one embodiment of the static phase adjustment device of this utility model;
[0019] Figure 2 This is an exploded view of one embodiment of the static phase adjustment device of this utility model;
[0020] Figure 3 for Figure 2 An enlarged schematic diagram of part A of one embodiment of the static phase adjustment device of this utility model.
[0021] Figure label:
[0022] Housing 100; Cavity 110; First vent 120; Second vent 130; Operation port 140; Input port 150; Output port 160; Middle layer plate 170; Fiber optic interface 180; Busbar 190; Fan assembly 200; Heat dissipation assembly 300; Heat exchange plate 310; Heat dissipation fins 320; Airflow duct 330; Switch tube assembly 400; Capacitor assembly 500; Laminated busbar 510; Bypass switch assembly 600; Driven component 610; Input busbar 710; Output busbar 720; Positive busbar 721; Negative busbar 722; Positive terminal block 723; Negative terminal block 724; Control module 800; Power supply module 900. Detailed Implementation
[0023] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.
[0024] In the description of this utility model, it should be understood that the directional descriptions, such as the terms "up," "down," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0025] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.
[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0027] like Figures 1 to 3As shown, a static phase-adjusting device according to a first aspect embodiment of the present invention includes a housing 100, a fan assembly 200, a heat dissipation assembly 300, a switch tube assembly 400, a capacitor assembly 500, and a bypass switch assembly 600. The housing 100 has a cavity 110. The housing 100 is provided with a first ventilation port 120 and a second ventilation port 130, both communicating with the cavity 110. The first ventilation port 120 and the second ventilation port 130 are arranged opposite to each other. The fan assembly 200 is disposed inside the housing 100 and close to the first ventilation port 120. The fan assembly 200 is used to guide airflow sequentially through the first ventilation port 120, the cavity 110, and the second ventilation port 130, or to guide airflow sequentially through the second ventilation port 130, the cavity 110, and the first ventilation port 120. The heat dissipation assembly 300 is disposed inside the housing 100 and located between the first ventilation port 120 and the second ventilation port 130. Between 30 and 30, the switching transistor assembly 400 is disposed in the heat dissipation assembly 300 and the heat of the switching transistor assembly 400 can be transferred to the heat dissipation assembly 300. The capacitor assembly 500 is disposed in the housing 100. Along the airflow direction, the capacitor assembly 500 is located on one side of the heat dissipation assembly 300. The capacitor assembly 500 is connected to the switching transistor assembly 400. The bypass switch assembly 600 is disposed in the housing 100 and close to the second vent 130. Along the airflow direction, the bypass switch assembly 600 is located at one end of the capacitor assembly 500 and the bypass switch assembly 600 is connected to the capacitor assembly 500. The housing 100 is provided with an operation port 140 communicating with the cavity 110. The bypass switch assembly 600 is provided with a driven member 610 that can drive the bypass switch assembly 600 to switch on and off states. The driven member 610 is exposed at the operation port 140.
[0028] The housing 100 can be formed by multiple sheet metal parts. The housing 100 can be in the shape of a cuboid or a cylinder. Taking the housing 100 as a cuboid as an example, the first ventilation opening 120 and the second ventilation opening 130 can be located at both ends of the length direction of the housing 100. Specifically, the first ventilation opening 120 can be set at the tail end of the housing 100, while the second ventilation opening 130 can be set at the front end of the housing 100. The operating port 140 can also be set at the front end of the housing 100 to facilitate user operation.
[0029] It is understandable that the heat dissipation component 300 can be rectangular and can be directly opposite the first vent 120 but with a certain distance. Taking the airflow passing through the first vent 120, the cavity 110 and the second vent 130 in sequence as an example, most of the airflow will flow through the heat dissipation component 300 and out of the second vent 130. A small part of the airflow, after passing through the first vent 120, can flow through the capacitor component 500 and out of the second vent 130.
[0030] It should be noted that in a typical static phase adjustment device, the switching transistor group 400 includes multiple semiconductor switching transistors, such as IGBTs and MOSFETs, thereby forming a power module. The power grid is connected to the AC terminal of the power module, and then the DC terminal of the power module is connected to the capacitor assembly 500. The bypass switch assembly 600 is connected in parallel to the AC terminal of the power module.
[0031] The bypass switch assembly 600 may include a relay coil, a relay switch, and a push-button switch. The relay switch is connected in parallel to the AC terminal of the power module. When the relay coil is energized, it can control the conduction of the relay switch. The relay coil and the push-button switch are connected to form a drive branch. The power supply is connected to the drive branch to supply power to the relay coil when the drive branch is on. The driven element 610 is disposed on the push-button switch. The user can apply force to the driven element 610 to turn the push-button switch on and off.
[0032] This utility model's static phase adjustment device includes a dedicated heat dissipation component 300 within the housing 100 for the high-heat-generating switch assembly 400. The fan assembly 200 guides airflow between the first vent 120, cavity 110, and second vent 130, passing through the heat dissipation component 300. Since the capacitor assembly 500 and bypass switch assembly 600 are not positioned along the airflow path through the heat dissipation component 300, they do not significantly impact the heat dissipation efficiency of the heat dissipation component 300. The heat from the switch assembly 400 can be transferred to the heat dissipation component 300 and then to the airflow, ensuring stable operation of the switch assembly 400. Some airflow can also pass through the capacitor assembly 500, ensuring its normal heat dissipation needs. Furthermore, when it is necessary to control the on / off state of the bypass switch assembly 600, the user can control its switching by manipulating the driven component 610 exposed in the cavity 110. This design is compact, reliable in operation, and ensures adequate heat dissipation.
[0033] In some embodiments of this utility model, such as Figure 2 , 3 As shown, the heat dissipation assembly 300 includes a heat exchange plate 310 and multiple heat dissipation fins 320 disposed on the lower surface of the heat exchange plate 310. A flow channel 330 is formed between two adjacent heat dissipation fins 320. The flow channel 330 is disposed along the airflow direction. The switch tube assembly 400 is disposed on the upper surface of the heat exchange plate 310.
[0034] The heat exchange plate 310 and the heat dissipation fins 320 can be made of alloys with high thermal conductivity. Multiple heat dissipation fins 320 are arranged in sequence, and airflow channels 330 are formed between each pair of heat dissipation fins 320. The airflow channels 330 can be curved or straight. Airflow flows through the airflow channels 330 and can fully exchange heat with the heat dissipation fins 320.
[0035] In some embodiments of this utility model, such as Figure 2 As shown, the capacitor assembly 500 includes multiple elongated capacitors, which are vertically arranged on one side of the heat dissipation assembly 300. The multiple capacitors are arranged along the airflow direction, and the switch tube group 400 is connected to each of the capacitors through a stacked busbar 510.
[0036] The capacitors are arranged along the airflow direction, which facilitates the connection between each capacitor and the switching transistor group 400 arranged on the heat dissipation assembly 300, and also reduces the size of the housing 100.
[0037] In some embodiments of this utility model, such as Figure 2 As shown, a manifold 190 is provided between the fan assembly 200 and the heat dissipation assembly 300. One end of the manifold 190 is connected to the housing 100, and the other end of the manifold 190 is connected to the heat dissipation assembly 300. The manifold 190 is used to guide the airflow to the ventilation duct 330.
[0038] The manifold 190 can guide the direction of airflow, such as... Figure 2 In the middle, the busbar 190 is located at the top between the fan assembly 200 and the heat dissipation assembly 300, which can restrict the airflow to flow upward after passing through the fan assembly 200. Most of the airflow directly enters the various airflow channels 330, and a small part of the airflow flows to the side capacitor assembly 500, thereby ensuring heat dissipation efficiency.
[0039] In some embodiments of this utility model, the housing 100 is provided with an input port 150, the switch tube group 400 is connected to one end of the input busbar 710, and the other end of the input busbar 710 extends to the input port 150 and protrudes from the cavity 110. Users can connect the other end of the busbar protruding from the cavity 110 to the power grid system, which is convenient and reliable to use.
[0040] In some embodiments of this utility model, the housing 100 is provided with an output port 160, the capacitor assembly 500 is connected to one end of the output busbar 720, and the other end of the output busbar 720 extends to the output port 160 and protrudes from the cavity 110. Similarly, the other end of the output busbar 720 protruding from the cavity 110 can also be directly connected to the load, which is convenient and reliable to use.
[0041] Specifically, the output busbar 720 can lead out a positive busbar 721 and a negative busbar 722. Near the output port 160 of the housing, a positive terminal block 723 and a negative terminal block 724 can also be provided. The positive busbar 721 is connected to the positive terminal block 723, and the negative busbar 722 is connected to the negative terminal block 724. External devices can be connected to the positive terminal block 723 and the negative terminal block 724 respectively through wires to draw power.
[0042] In some embodiments of this utility model, such as Figure 2 , 3 As shown, the housing 100 also includes a middle layer plate 170 and a control module 800. The control module 800 is connected to the switching transistor group 400 and is disposed on the middle layer plate 170. The middle layer plate 170 is located between the switching transistor group 400 and the control module 800 to separate the switching transistor group 400 and the control module 800.
[0043] The control module 800 includes processors such as MCU, CPU or PLC and their auxiliary circuits. The middle layer board 170 can separate the control module 800 and the switching transistor group 400. The control module 800 is then connected to the controlled terminals of each switching transistor in the switching transistor group 400 through wires to control its operation, thereby preventing short circuits and isolating the heat generated by the switching transistors from affecting the operation of the control module 800 to a certain extent.
[0044] In some embodiments of this utility model, the housing 100 is further provided with an optical fiber interface 180, and the communication end of the control module 800 is connected to the optical fiber interface 180.
[0045] The monitoring center can send control commands to the control modules 800 of each static phase modulation device at high speed via optical fiber. The control modules 800 then control the operation of each switch tube according to the control commands. In terms of connection method, users can directly connect the optical fiber to the optical fiber interface 180 on the housing 100, which is convenient and reliable.
[0046] In some embodiments of this utility model, a power supply module 900 is further provided inside the housing 100. The power supply module 900 is disposed on the middle layer plate 170. The power supply module 900 is connected to the control module 800 to supply power to the control module 800. The input terminal of the power supply module 900 can be connected to a power supply. The power supply module 900 can modulate the output of the power supply and then supply power to the control module 800. Specifically, the power supply module 900 may include a rectifier filter circuit and a voltage regulation circuit.
[0047] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0048] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.
Claims
1. A static phase-adjusting device, characterized in that, include: The housing has a cavity, and the housing is provided with a first vent and a second vent, both of which are in communication with the cavity, and the first vent and the second vent are arranged opposite to each other. A fan assembly is disposed within the housing and close to the first vent. The fan assembly is used to guide airflow sequentially through the first vent, the cavity, and the second vent, or to guide airflow sequentially through the second vent, the cavity, and the first vent. A heat dissipation component is disposed within the housing and located between the first vent and the second vent; A switching transistor assembly is disposed on the heat dissipation component, and the heat of the switching transistor assembly can be transferred to the heat dissipation component; A capacitor assembly is disposed inside the housing along the airflow direction, the capacitor assembly is located on one side of the heat dissipation assembly, and the capacitor assembly is connected to the switching transistor group; A bypass switch assembly is disposed inside the housing and near the second vent. Along the airflow direction, the bypass switch assembly is located at one end of the capacitor assembly and is connected to the capacitor assembly. The housing is provided with an operating port communicating with the cavity. The bypass switch assembly is provided with a driven member capable of driving the bypass switch assembly to switch on / off states. The driven member is exposed at the operating port.
2. The static phase-adjusting device according to claim 1, characterized in that: The heat dissipation assembly includes a heat exchange plate and multiple heat dissipation fins disposed on the lower surface of the heat exchange plate. A flow channel is formed between two adjacent heat dissipation fins. The flow channel is arranged along the airflow direction. The switching tube assembly is disposed on the upper surface of the heat exchange plate.
3. A static phase-adjusting device according to claim 2, characterized in that: The capacitor assembly includes multiple elongated capacitors, which are vertically arranged on one side of the heat dissipation assembly. The multiple capacitors are arranged along the airflow direction, and the switching transistor group is connected to each capacitor through a stacked busbar.
4. A static phase-adjusting device according to claim 2, characterized in that: A manifold is provided between the fan assembly and the heat dissipation assembly. One end of the manifold is connected to the housing, and the other end of the manifold is connected to the heat dissipation assembly. The manifold is used to guide the airflow into the ventilation duct.
5. A static phase-adjusting device according to claim 1, characterized in that: The housing is provided with an input port, the switch tube group is connected to one end of the input busbar, and the other end of the input busbar extends to the input port and protrudes from the cavity.
6. A static phase-adjusting device according to claim 1, characterized in that: The housing is provided with an output port, the capacitor assembly is connected to one end of the output busbar, and the other end of the output busbar extends to the output port and protrudes from the cavity.
7. A static phase-adjusting device according to claim 1, characterized in that: The housing also includes a middle layer plate and a control module. The control module is connected to the switching transistor group and is mounted on the middle layer plate. The middle layer plate is located between the switching transistor group and the control module to separate them.
8. A static phase-adjusting device according to claim 7, characterized in that: The housing is also provided with an optical fiber interface, and the communication end of the control module is connected to the optical fiber interface.
9. A static phase-adjusting device according to claim 7, characterized in that: The housing also includes a power supply module, which is mounted on the middle layer plate and is connected to the control module to supply power to the control module.